JP6817828B2 - An exposure device, an LED head, and an image forming device equipped with the exposure device. - Google Patents

An exposure device, an LED head, and an image forming device equipped with the exposure device. Download PDF

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JP6817828B2
JP6817828B2 JP2017011166A JP2017011166A JP6817828B2 JP 6817828 B2 JP6817828 B2 JP 6817828B2 JP 2017011166 A JP2017011166 A JP 2017011166A JP 2017011166 A JP2017011166 A JP 2017011166A JP 6817828 B2 JP6817828 B2 JP 6817828B2
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JP2018120951A (en
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友希 猪狩
友希 猪狩
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株式会社沖データ
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Description

本発明は、発光素子を搭載した基板と発光素子からの光を集光するレンズとをホルダで支持する形態の露光装置およびＬＥＤヘッド並びにそれを備えた画像形成装置に関する。 The present invention relates to an exposure apparatus and an LED head in which a substrate on which a light emitting element is mounted and a lens that collects light from the light emitting element are supported by a holder, and an image forming apparatus including the exposure apparatus and the LED head.

従来のプリンタ等で用いられるＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）ヘッドは、複数のＬＥＤアレイチップを搭載した基板の両側端部を、ホルダに設けた当接面に押付けて組立てられている（例えば、特許文献１参照。）。 An LED (Light Emitting Diode) head used in a conventional printer or the like is assembled by pressing both end portions of a substrate on which a plurality of LED array chips are mounted against a contact surface provided on a holder (for example, Patent Document). See 1.).

特開２００９−７３０４１号公報（段落００２２、００３３、００４０、第１図）Japanese Unexamined Patent Publication No. 2009-73041 (paragraphs 0022, 0033, 0040, FIG. 1)

しかしながら、上述した従来のＬＥＤヘッドにおいては、基板をホルダに当接させるためのスペースを確保する必要があり、基板の幅が大きくなるため、１枚のワークボードから切り出せる基板数（取れ数という。）が減少してしまうという問題がある。
本発明は、上記の問題点を解決することを目的とする。 However, in the above-mentioned conventional LED head, it is necessary to secure a space for bringing the substrate into contact with the holder, and the width of the substrate becomes large. Therefore, the number of substrates that can be cut out from one work board (referred to as the number of substrates to be taken). There is a problem that.) Is reduced.
An object of the present invention is to solve the above problems.

本発明は、上記課題を解決するために、露光装置が、配列方向に複数の発光素子を搭載した基板と、前記発光素子からの光を集光する、前記配列方向に伸張するレンズと、前記基板と前記レンズを支持するホルダと、を備え、前記ホルダは、前記配列方向に配置され、前記基板に当接する複数の当接部を有し、前記基板は、前記配列方向の直交方向である幅方向の一端から、前記幅方向に突出する凸部と、前記一端の反対側の他端の前記凸部に対応する位置を前記幅方向に切欠いて形成された凹部と、を有し、前記ホルダの当接部に前記凸部を当接させて、前記基板を前記ホルダ内に配置したことを特徴とする。 In order to solve the above problems, the present invention comprises a substrate on which a plurality of light emitting elements are mounted in the arrangement direction, a lens that collects light from the light emitting elements and extends in the arrangement direction, and the above. A substrate and a holder for supporting the lens are provided, the holder is arranged in the arrangement direction, has a plurality of contact portions that abut on the substrate, and the substrate is orthogonal to the arrangement direction. It has a convex portion protruding in the width direction from one end in the width direction, and a concave portion formed by notching a position corresponding to the convex portion on the other end opposite to the one end in the width direction. It is characterized in that the convex portion is brought into contact with the contact portion of the holder and the substrate is arranged in the holder.

これにより、本発明は、１枚のワークボードから切出せる基板の取れ数を増加させることができるという効果が得られる。 As a result, the present invention has the effect that the number of substrates that can be cut out from one work board can be increased.

実施例１のプリンタを示す説明図Explanatory drawing which shows the printer of Example 1. 実施例１のＬＥＤヘッドを示す説明図Explanatory drawing which shows LED head of Example 1. 実施例１の基板を示す説明図Explanatory drawing which shows the substrate of Example 1. 実施例１の基板の組付方法を示す説明図Explanatory drawing which shows the assembly method of the substrate of Example 1. 実施例１の当接部の他の態様を示す説明図Explanatory drawing which shows other mode of contact part of Example 1. 実施例２の基板を示す説明図Explanatory drawing which shows the substrate of Example 2. 実施例２の基板の組付方法を示す説明図Explanatory drawing which shows the assembly method of the substrate of Example 2.

以下に、図面を参照して本発明による露光装置、ＬＥＤヘッドおよび画像形成装置の実施例について説明する。 Hereinafter, examples of the exposure apparatus, the LED head, and the image forming apparatus according to the present invention will be described with reference to the drawings.

以下に、図１ないし図５を用いて本実施例のＬＥＤヘッドおよびプリンタについて説明する。 Hereinafter, the LED head and the printer of this embodiment will be described with reference to FIGS. 1 to 5.

本実施例の画像形成装置としてのプリンタ１は、電子写真方式のプリンタであって、入力された印刷データに基づく画像を、媒体としての印刷用の用紙に印刷する機能等を有しており、図１に示す構成を備えている。 The printer 1 as the image forming apparatus of this embodiment is an electrophotographic printer, and has a function of printing an image based on the input print data on printing paper as a medium. It has the configuration shown in FIG.

プリンタ１には、その装置筐体の上面と下部とを略Ｓ字状に接続する用紙搬送路２が配置され、用紙搬送路２の下部側の一端には用紙を収容する、媒体収容部としての給紙カセット３が設けられ、他端には印刷済みの用紙を集積するスタッカ４が設けられている。
用紙搬送路２と給紙カセット３との接続部には、給紙カセット３から用紙搬送路２へ用紙を１枚毎に繰出すホッピングローラ５が設けられ、用紙搬送路２の用紙搬送方向（図１に示す矢印参照）の下流側には、搬送された用紙のスキュー等を修正するためのレジストローラ６が配置されている。 The printer 1 is provided with a paper transport path 2 that connects the upper surface and the lower portion of the apparatus housing in a substantially S shape, and serves as a medium accommodating portion for accommodating paper at one end on the lower side of the paper transport path 2. A paper cassette 3 is provided, and a stacker 4 for accumulating printed paper is provided at the other end.
A hopping roller 5 for feeding each sheet of paper from the paper feed cassette 3 to the paper transport path 2 is provided at the connection portion between the paper transport path 2 and the paper transport cassette 3, and the paper transport direction of the paper transport path 2 ( A resist roller 6 for correcting skew or the like of the conveyed paper is arranged on the downstream side (see the arrow shown in FIG. 1).

レジストローラ６の下流側には、搬送ベルト７、定着器８、排出ローラ９が用紙搬送方向に沿って順に配置されている。
定着器８は、加熱ローラ８ａ、バックアップローラ８ｂ等を備えており、現像剤像としてのトナー像を圧力と熱により用紙上に定着させる。 On the downstream side of the resist roller 6, a transport belt 7, a fixing device 8, and a discharge roller 9 are arranged in this order along the paper transport direction.
The fuser 8 includes a heating roller 8a, a backup roller 8b, and the like, and fixes a toner image as a developer image on paper by pressure and heat.

本実施例のプリンタ１には、４つの独立した画像形成ユニット１１ｋ、１１ｙ、１１ｍ、１１ｃが用紙搬送方向に沿ってトナー像を現像する順に配置され、これら４つの画像形成ユニット１１は、それぞれに設定された設定色、つまりＫ色（ブラック）、Ｙ色（イエロー）、Ｍ色（マゼンダ）、Ｃ色（シアン）以外は、同一の構成であるため、以下に一つの画像形成ユニット１１について説明する。 In the printer 1 of this embodiment, four independent image forming units 11k, 11y, 11m, and 11c are arranged in the order of developing a toner image along the paper transport direction, and these four image forming units 11 are respectively arranged. Since the configuration is the same except for the set set colors, that is, K color (black), Y color (yellow), M color (magenta), and C color (cyan), one image forming unit 11 will be described below. To do.

画像形成ユニット１１は、静電潜像が形成される、像担持体としての感光体ドラム１２、感光体ドラム１２を一様かつ均一に帯電させる、帯電手段としての帯電ローラ１３、感光体ドラム１２の外周面に形成された静電潜像に、現像剤としてのトナーを付着させて可視像であるトナー像を形成する、現像剤担持体としての現像ローラ１４、供給ローラ１５、設定色のトナーを収容した、現像剤収容器としてのトナーカートリッジ１６等で構成される。 The image forming unit 11 uniformly and uniformly charges the photoconductor drum 12 as an image carrier and the photoconductor drum 12 on which an electrostatic latent image is formed, and the charging roller 13 and the photoconductor drum 12 as charging means. A developing roller 14 as a developing agent carrier, a supply roller 15, and a set color, which adhere a toner as a developing agent to an electrostatic latent image formed on the outer peripheral surface of the developing agent to form a visible toner image. It is composed of a toner cartridge 16 or the like as a developer container containing toner.

現像剤供給部材としての供給ローラ１５は、現像ローラ１４の外周面を押圧しており、トナーカートリッジ１６から供給されたトナーを現像ローラ１４に供給する。
現像剤層規制部材としての現像ブレード１７は、現像ローラ１４の外周面を押圧しており、供給ローラ１５から現像ローラ１４上に供給されたトナーを薄層化する。 The supply roller 15 as the developer supply member presses the outer peripheral surface of the developing roller 14, and supplies the toner supplied from the toner cartridge 16 to the developing roller 14.
The developing blade 17 as a developer layer regulating member presses the outer peripheral surface of the developing roller 14, and thins the toner supplied from the supply roller 15 onto the developing roller 14.

クリーニング部材としてのクリーニングブレード１８は、感光体ドラム１２の外周面を押圧しており、転写後に感光体ドラム１２上に残留したトナーを掻き取って除去する。
転写装置としての転写ローラ１９は、各画像形成ユニット１１の感光体ドラム１２の搬送ベルト７を挟んだ反対側に対向配置され、用紙をトナーと逆極性に帯電させて感光体ドラム１２の表面に形成されたトナー像を用紙上に転写する。 The cleaning blade 18 as a cleaning member presses the outer peripheral surface of the photoconductor drum 12 and scrapes off the toner remaining on the photoconductor drum 12 after transfer.
The transfer roller 19 as a transfer device is arranged to face the opposite side of the photoconductor drum 12 of each image forming unit 11 with the transport belt 7 sandwiched between them, and charges the paper in the opposite polarity to the toner on the surface of the photoconductor drum 12. The formed toner image is transferred onto the paper.

露光装置としてのＬＥＤヘッド２０は、各画像形成ユニット１１の感光体ドラム１２の上方に対向配置され、各設定色の画像データに従って感光体ドラム１２を露光し、感光体ドラム１２上に静電潜像を形成する。 The LED head 20 as an exposure device is arranged above the photoconductor drum 12 of each image forming unit 11, exposes the photoconductor drum 12 according to the image data of each set color, and electrostatically lurks on the photoconductor drum 12. Form an image.

以下に、本実施例のプリンタ１による印刷動作について説明する。 The printing operation by the printer 1 of this embodiment will be described below.

図示しないパーソナルコンピュータ等の上位装置から印刷データを受信すると、プリンタ１は、印刷動作を開始し、用紙カセット３内の用紙をホッピングローラ５によって用紙搬送路２に繰出し、繰出した用紙をレジストローラ６へ搬送する。 Upon receiving print data from a higher-level device such as a personal computer (not shown), the printer 1 starts a printing operation, feeds the paper in the paper cassette 3 to the paper transport path 2 by the hopping roller 5, and feeds the fed paper to the registration roller 6. Transport to.

レジストローラ６に搬送された用紙はレジストローラ６から搬送ベルト７へ搬送され、搬送ベルト７の用紙搬送方向への回転に伴って、画像形成ユニット１１ｋ、１１ｙ、１１ｍ、１１ｃを順に通過する。
このとき、各画像形成ユニット１１では、感光体ドラム１２の表面が帯電ローラ１３により一様に帯電され、帯電した表面が画像データに応じて発光するＬＥＤヘッド２０によって露光され、静電潜像が形成される。 The paper conveyed to the resist roller 6 is conveyed from the resist roller 6 to the transfer belt 7, and passes through the image forming units 11k, 11y, 11m, and 11c in order as the transfer belt 7 rotates in the paper transfer direction.
At this time, in each image forming unit 11, the surface of the photoconductor drum 12 is uniformly charged by the charging roller 13, and the charged surface is exposed by the LED head 20 that emits light according to the image data, and an electrostatic latent image is produced. It is formed.

この静電潜像には、現像ローラ１４上で現像ブレード１７により薄層化されたトナーが静電的に付着し、各設定色のトナー像が形成される。
形成された各設定色のトナー像は、転写ローラ１９によって用紙に転写され、用紙上にカラーのトナー像が形成される。
転写後に感光体ドラム１２上に残留したトナーは、クリーニングブレード１８によって除去される。 Toner thinned by the developing blade 17 is electrostatically adhered to the electrostatic latent image on the developing roller 14, and a toner image of each set color is formed.
The formed toner images of the set colors are transferred to the paper by the transfer roller 19, and the color toner images are formed on the paper.
The toner remaining on the photoconductor drum 12 after the transfer is removed by the cleaning blade 18.

一方、カラーのトナー像が転写された用紙は定着器８へ搬送され、定着器８によってトナー像が用紙に定着され、用紙上にカラー画像が印刷される。
カラー画像が印刷された印刷済みの用紙は排出ローラ９に挟持されてスタッカ４上に排出される。 On the other hand, the paper on which the color toner image is transferred is conveyed to the fixing device 8, the toner image is fixed on the paper by the fixing device 8, and the color image is printed on the paper.
The printed paper on which the color image is printed is sandwiched between the ejection rollers 9 and ejected onto the stacker 4.

このようにして、本実施例のプリンタ１による印刷動作が行われる。 In this way, the printing operation by the printer 1 of this embodiment is performed.

上記したプリンタ１の各画像形成ユニット１１に搭載されるＬＥＤヘッド２０は、図２に示すように、ＬＥＤチップを複数並べて構成された、発光素子としてのＬＥＤアレイチップ２１やこれを駆動するドライブＩＣ等を搭載した基板２２、ＬＥＤアレイチップ２１からの光を集光するセルフォックレンズアレイ（セルフォックは日本板硝子株式会社の登録商標）等のレンズ２３、取付板２４、これらを支持するホルダ２５等から構成される。
なお、図２は、図４（ｂ）に示すＺ−Ｚ断面線に沿った断面を有する斜視図である。 As shown in FIG. 2, the LED head 20 mounted on each image forming unit 11 of the printer 1 described above includes an LED array chip 21 as a light emitting element and a drive IC for driving the LED array chip 21 composed of a plurality of LED chips arranged side by side. From the substrate 22 on which the above is mounted, the lens 23 such as the SELFOC lens array (SELFOC is a registered trademark of Nippon Plate Glass Co., Ltd.) that collects the light from the LED array chip 21, the mounting plate 24, the holder 25 that supports them, and the like It is composed.
Note that FIG. 2 is a perspective view having a cross section along the ZZ cross section shown in FIG. 4 (b).

ＬＥＤアレイチップ２１は、基板２２の中央部に用紙搬送方向の直交方向（配列方向という。）に沿って搭載され（図３参照）、ＬＥＤアレイチップ２１を構成する各ＬＥＤチップは、画像データを基に形成された画像データ信号に応じて発光する。 The LED array chip 21 is mounted on the central portion of the substrate 22 along a direction orthogonal to the paper transport direction (referred to as an arrangement direction) (see FIG. 3), and each LED chip constituting the LED array chip 21 receives image data. It emits light according to the image data signal formed on the basis.

基板２２の配列方向の直交方向（幅方向）の一方の側方には、複数のボンディングパッド２６が配置され、このボンディングパッド２６には、図示しないフレキシブルフラットケーブルを装着するコネクタ２６ａ（図５参照）からＬＥＤアレイチップ２１に画像データ信号等を伝達するワイヤ２６ｂが接続される。 A plurality of bonding pads 26 are arranged on one side of the substrate 22 in the direction orthogonal to the arrangement direction (width direction), and the bonding pads 26 are attached to a connector 26a (see FIG. 5) to which a flexible flat cable (not shown) is mounted. ) Is connected to the LED array chip 21 with a wire 26b for transmitting an image data signal or the like.

レンズ２３は、シリコーン樹脂、エポキシ系接着剤、アクリル系接着剤等からなる接着部２７により、ホルダ２５の下部の中央部のＬＥＤアレイチップ２１の下方に、配列方向に沿って取付けられる。
取付板２４は、シリコーン樹脂、エポキシ系接着剤、アクリル系接着剤等の接合剤からなる接合部２８により、ホルダ２５の両側の側板に取付けられる。
また、取付板２４には、基板２２上のコネクタ２６ａにフレキシブルフラットケーブルを接続するための、図示しないケーブル挿入穴が設けられている。 The lens 23 is attached along the arrangement direction below the LED array chip 21 in the central portion of the lower part of the holder 25 by an adhesive portion 27 made of a silicone resin, an epoxy adhesive, an acrylic adhesive, or the like.
The mounting plate 24 is attached to the side plates on both sides of the holder 25 by a joining portion 28 made of a joining agent such as a silicone resin, an epoxy adhesive, or an acrylic adhesive.
Further, the mounting plate 24 is provided with a cable insertion hole (not shown) for connecting the flexible flat cable to the connector 26a on the board 22.

本実施例のホルダ２５には、その両側の側板の一部を内側に曲折して形成された支持部２９が複数設けられ、その支持部２９上には、紫外線硬化型樹脂、エポキシ系接着剤、アクリル系接着剤等で形成された円柱状の当接部３１が設けられている。
この当接部３１の基板２２との当接面の高さは、レンズ２３とＬＥＤアレイチップ２１との間の距離が、レンズ２３固有の最適焦点値となるように決定される。 The holder 25 of this embodiment is provided with a plurality of support portions 29 formed by bending a part of the side plates on both sides inward, and an ultraviolet curable resin and an epoxy adhesive are provided on the support portions 29. , A columnar contact portion 31 formed of an acrylic adhesive or the like is provided.
The height of the contact surface of the contact portion 31 with the substrate 22 is determined so that the distance between the lens 23 and the LED array chip 21 becomes the optimum focal value peculiar to the lens 23.

図３は、ＬＥＤアレイチップ２１等を実装したＬＥＤヘッド搭載用の基板２２のワークボードからの切出し時の状態を示した図であり、（ａ）は従来の２枚の基板２２の切出し状態を示し、（ｂ）は本実施例の２枚の基板２２の切出し状態を示す。
従来の基板２２は、図３（ａ）に示すように、幅方向の両側の側端から距離Ａの位置にある中心線上に、ＬＥＤアレイチップ２１が配列方向に沿って複数配置され、その一方の側方に複数のボンディングパッド２６が配列方向に沿って配置されている。 FIG. 3 is a diagram showing a state when a substrate 22 for mounting an LED head on which an LED array chip 21 or the like is mounted is cut out from a work board, and FIG. 3A shows a state in which two conventional boards 22 are cut out. (B) shows the cut-out state of the two substrates 22 of this embodiment.
In the conventional substrate 22, as shown in FIG. 3A, a plurality of LED array chips 21 are arranged along the arrangement direction on the center line located at a distance A from the side ends on both sides in the width direction, and one of them. A plurality of bonding pads 26 are arranged along the arrangement direction on the side of the above.

また、基板２２の両側の側端部には、ホルダ２５の当接部３１に当接させるための当接エリア２２ａ（図３に２点鎖線で示した幅Ｂのエリアをいう。）がそれぞれ確保されている。
これは、基板２２のボンディングパッド２６にはワイヤ２６ｂが接続されるため（図２参照）、基板２２を直接ホルダ２５の当接部３１に当接させるためには、専用のエリアを設けることが必要になるからである。 Further, at the side ends on both sides of the substrate 22, a contact area 22a (referring to an area having a width B shown by a two-dot chain line in FIG. 3) for contacting the contact portion 31 of the holder 25 is provided. It is secured.
This is because the wire 26b is connected to the bonding pad 26 of the substrate 22 (see FIG. 2), so that a dedicated area may be provided in order to directly contact the substrate 22 with the contact portion 31 of the holder 25. Because it is necessary.

また、ＬＥＤアレイチップ２１を、基板２２の幅方向の中央部に配置するのは、ＬＥＤチップの発光時における発熱による幅方向の曲りを抑制するためである。
このため、従来の基板２２には、ボンディングパッド２６の反対側の側方に、電気的には必要のない領域が存在することになる。
なお、本実施例の従来の基板２２の幅方向の長さは、７〜８ｍｍ程度である。 Further, the LED array chip 21 is arranged at the center of the substrate 22 in the width direction in order to suppress bending in the width direction due to heat generation when the LED chip emits light.
Therefore, in the conventional substrate 22, there is an electrically unnecessary region on the side opposite to the bonding pad 26.
The length of the conventional substrate 22 of this embodiment in the width direction is about 7 to 8 mm.

このような従来のＬＥＤヘッド搭載用の基板２２は、所定の直径のルータを配列方向に移動させ、切断幅Ｃで切断して形成される。
この切断幅Ｃは、同じルータを幅方向の位置を変更しながら同じ経路で複数回移動させた結果として形成される。 Such a conventional substrate 22 for mounting an LED head is formed by moving a router having a predetermined diameter in the arrangement direction and cutting the router with a cutting width C.
This cutting width C is formed as a result of moving the same router a plurality of times along the same route while changing the position in the width direction.

一方、本実施例の基板２２は、図３（ｂ）に示すように、ＬＥＤアレイチップ２１およびボンディングパッド２６が従来と同様に配置され、基板２２の一方の側端には、幅Ｂの当接エリア２２ａを確保するために、基板２２の一端から幅方向に突出させた凸部３３が設けられている。 On the other hand, in the substrate 22 of this embodiment, as shown in FIG. 3B, the LED array chip 21 and the bonding pad 26 are arranged in the same manner as in the conventional case, and the width B is applied to one side end of the substrate 22. In order to secure the contact area 22a, a convex portion 33 projecting from one end of the substrate 22 in the width direction is provided.

また、基板２２の他方の側端の凸部３３に対応する位置には、基板２２を他端から幅方向に切欠いた凹部３４形成され、凹部３４を除く他端部は、幅Ｂの当接エリア２２ａとして用いられる。 Further, a recess 34 is formed in which the substrate 22 is cut out in the width direction from the other end at a position corresponding to the convex portion 33 at the other side end of the substrate 22, and the other end excluding the recess 34 is in contact with the width B. It is used as an area 22a.

なお、図３（ｂ）では、凸部３３と凹部３４をそれぞれ１箇所ずつ図示したが、実際には配列方向に沿ってそれぞれ複数設けられており、凹部３４間の当接エリア２２ａの配列方向の長さは、凸部３３の配列方向の長さより長くなっている。 In FIG. 3B, one convex portion 33 and one concave portion 34 are shown, but in reality, a plurality of convex portions 33 and concave portions 34 are provided along the arrangement direction, and the contact area 22a between the concave portions 34 is arranged in the arrangement direction. Is longer than the length of the convex portions 33 in the arrangement direction.

本実施例のＬＥＤアレイチップ２１は、幅方向の曲りを抑制するために、一方の側端からの距離Ｄ1と他方の側端からの距離Ｄ2とを同一に設定した中心線上に配置される。
この距離Ｄ1の設定は、基板２２の切断時にルータがボンディングパッド２６に干渉しないように、一方の側端からボンディングパッド２６端までの距離をＥとして設定される（本実施例ではＥは１００μｍ以上）。 The LED array chip 21 of this embodiment is arranged on a center line in which the distance D 1 from one side end and the distance D 2 from the other side end are set to be the same in order to suppress bending in the width direction. LED.
In the setting of this distance D 1, the distance from one side end to the end of the bonding pad 26 is set as E so that the router does not interfere with the bonding pad 26 when the substrate 22 is cut (E is 100 μm in this embodiment). that's all).

このような本実施例のＬＥＤヘッド搭載用の基板２２は、従来と同じ直径のルータを配列方向に移動させた後に、凸部３３の部分で一旦幅方向に幅Ｂ分移動させ、配列方向に移動させた後に幅方向に幅Ｂ分戻し再び配列方向に移動させて、従来と同じ切断幅Ｃで切断して形成される。 In the substrate 22 for mounting the LED head of this embodiment, after moving the router having the same diameter as the conventional one in the arrangement direction, the protrusion 33 is once moved by the width B in the width direction to move in the arrangement direction. After being moved, it is returned by the width B in the width direction, moved again in the arrangement direction, and cut with the same cutting width C as the conventional one.

これにより、本実施例の基板の幅方向の一端に凸部３３が形成され、他端の凸部３３と対応する位置に凹部３４が同時に形成される。
また、凹部３４の開口の配列方向の長さは、凸部３３の先端の長さより２Ｃ分長くなり、凸部３３の先端と凹部３４の底の間隔は、切断幅と同じＣになる。 As a result, the convex portion 33 is formed at one end in the width direction of the substrate of this embodiment, and the concave portion 34 is simultaneously formed at a position corresponding to the convex portion 33 at the other end.
Further, the length of the openings of the concave portions 34 in the arrangement direction is 2C longer than the length of the tip of the convex portion 33, and the distance between the tip of the convex portion 33 and the bottom of the concave portion 34 is C, which is the same as the cutting width.

なお、本実施例で、従来と同じルータを用いて同じ切断幅Ｃで切断するのは、２枚の基板２２間の間隔が広くなれば、ルータで切断する距離、時間が長くなり、また基板２２間の距離が狭くなれば、従来より直径の小さいルータを用いることになってルータの交換頻度が増える、または切断時のワークボードの重ね合わせ枚数が少なくなる等、基板制作時のコストが増加するからである。 In this embodiment, when cutting with the same cutting width C using the same router as before, if the distance between the two boards 22 is widened, the distance and time for cutting with the router will be long, and the boards will be cut. If the distance between the 22 is narrowed, a router with a smaller diameter than before will be used, and the frequency of router replacement will increase, or the number of work boards to be stacked at the time of cutting will decrease, and the cost of board production will increase. Because it does.

このように、本実施例の基板２２は、凸部３３の先端からＬＥＤアレイチップ２１の中心線までの距離がＡになり、中心線から基板２２の幅方向の両端までの距離が同一のＤ1とＤ2となるので、他端に幅Ｂの当接エリア２２ａを確保したとしても、凸部３３の先端から他端までの距離が、当接エリア２２ａの幅Ｂに相当する長さ分短くなり、１枚の基板制作に要する基板２２の幅を小さくすることが可能になる。 As described above, in the substrate 22 of the present embodiment, the distance from the tip of the convex portion 33 to the center line of the LED array chip 21 is A, and the distance from the center line to both ends of the substrate 22 in the width direction is the same D. Since 1 and D 2 , even if a contact area 22a having a width B is secured at the other end, the distance from the tip of the convex portion 33 to the other end is the length corresponding to the width B of the contact area 22a. It becomes shorter, and the width of the substrate 22 required for producing one substrate can be reduced.

上記のような本実施例の基板２２は、基板２２の幅の縮小に伴って製作された、図４（ａ）に示すホルダ２５内に搭載される。
なお、図４（ａ）は、ホルダ２５にレンズ２３を接着部２７により接着した状態を示す上面図である。 The substrate 22 of the present embodiment as described above is mounted in the holder 25 shown in FIG. 4A, which is manufactured as the width of the substrate 22 is reduced.
Note that FIG. 4A is a top view showing a state in which the lens 23 is adhered to the holder 25 by the adhesive portion 27.

このホルダ２５には、両側の側板に設けられた支持部２９およびその上の当接部３１が配列方向に沿って千鳥に、つまり、当接部３１同士が幅方向で対向せず、かつ凹部３４の形成位置と重ならない位置に配置されている。 In the holder 25, the support portions 29 provided on the side plates on both sides and the contact portions 31 above the support portions 29 are staggered along the arrangement direction, that is, the contact portions 31 do not face each other in the width direction and are recessed. It is arranged at a position that does not overlap with the formation position of 34.

このようなホルダ２５内に基板２２を配置するときは、図４（ｂ）に示すように、基板２２の幅方向の一端に設けた凸部３３を、それに対向する位置に設けられた当接部３１の当接面上に載置し、他端の凹部３４を避ける位置に設けられた当接部３１に他端部の当接エリア２２ａを載置し、この基板２２を取付板２４で押え、取付板２４とホルダ２５の側板との両側の隅部に接合剤により接合部２８を形成して固定する。
なお、基板２２のコネクタ２６ａの搭載領域の近傍の当接部３１の配置は、図５（ａ）（ｂ）に示す態様にするとよい。 When the substrate 22 is arranged in such a holder 25, as shown in FIG. 4B, the convex portion 33 provided at one end of the substrate 22 in the width direction is brought into contact with the convex portion 33 provided at a position facing the convex portion 33. The contact area 22a at the other end is placed on the contact area 31 which is placed on the contact surface of the portion 31 and is provided at a position avoiding the recess 34 at the other end, and the substrate 22 is mounted on the mounting plate 24. A joint portion 28 is formed and fixed at both corners of the presser foot and the mounting plate 24 and the side plate of the holder 25 with a bonding agent.
The arrangement of the contact portion 31 in the vicinity of the mounting area of the connector 26a on the substrate 22 may be in the manner shown in FIGS. 5A and 5B.

すなわち、コネクタ２６ａにはフレキシブルフラットケーブルの挿抜に伴う荷重がかかるため、基板２２のコネクタ２６ａの搭載領域の配列方向の中央部に、少なくとも一つの凸部３３とそれに当接させる当接部３１を設け、その幅方向の反対側の当接エリア２２ａには、当該当接エリア２２ａに当接させる当接部３１を２箇所設けるようにする。
この場合に、当接部３１の配置は、凸部３３を当接させる当接部３１を頂点とした２等辺三角形が形成される位置に反対側の２つの当接部３１を設けるようにするとよい。 That is, since a load is applied to the connector 26a due to the insertion and removal of the flexible flat cable, at least one convex portion 33 and an abutting portion 31 to be brought into contact with the convex portion 33 are provided at the central portion of the board 22 in the arrangement direction of the connector 26a mounting region. In the contact area 22a on the opposite side in the width direction, two contact portions 31 for contacting the contact area 22a are provided.
In this case, the arrangement of the abutting portions 31 is such that the two abutting portions 31 on the opposite sides are provided at the positions where the isosceles triangle with the abutting portion 31 abutting the convex portion 33 as the apex is formed. Good.

以上説明したように、本実施例では、ホルダ２５の当接部３１に当接させるための当接エリア２２ａを、基板２２の一端から突出させた凸部３３とし、ＬＥＤアレイチップ２１を基板２２の幅方向の中央部に配置したので、ＬＥＤアレイチップ２１の発熱に伴う基板２２の曲りを抑制しながら基板２２の幅を狭くすることができ、１枚のワークボードから切出せる基板２２の取れ数を増加させることができる。 As described above, in the present embodiment, the contact area 22a for contacting the contact portion 31 of the holder 25 is a convex portion 33 protruding from one end of the substrate 22, and the LED array chip 21 is the substrate 22. Since it is arranged in the central portion in the width direction of the LED array chip 21, the width of the substrate 22 can be narrowed while suppressing the bending of the substrate 22 due to the heat generation of the LED array chip 21, and the substrate 22 can be cut out from one work board. The number can be increased.

これにより、基板１枚当たりの単価を低減することができると共に、ＬＥＤヘッド２０の小型化を図ることができる他、ＬＥＤヘッドを構成する取付板２４等の構成部材のコスト低減を図ることができる。 As a result, the unit price per substrate can be reduced, the size of the LED head 20 can be reduced, and the cost of components such as the mounting plate 24 constituting the LED head can be reduced. ..

以下に、図６ないし図７を用いて本実施例のＬＥＤヘッドについて説明する。なお上記実施例１と同様の部分は、同一の符号を付してその説明を省略する。 The LED head of this embodiment will be described below with reference to FIGS. 6 to 7. The same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

図６は、ＬＥＤアレイチップ２１等を実装したＬＥＤヘッド搭載用の基板２２のワークボードからの切出し時の状態を示した図であり、（ａ）は従来の２枚の基板２２の切出し状態を示し、（ｂ）は本実施例の２枚の基板２２の切出し状態を示す。
図６（ａ）に示す従来の基板２２の構成は、上記実施例１と同様であるので、その説明を省略する。 FIG. 6 is a diagram showing a state when a substrate 22 for mounting an LED head on which an LED array chip 21 or the like is mounted is cut out from a work board, and FIG. 6A shows a state in which two conventional boards 22 are cut out. (B) shows the cut-out state of the two substrates 22 of this embodiment.
Since the configuration of the conventional substrate 22 shown in FIG. 6A is the same as that of the first embodiment, the description thereof will be omitted.

本実施例の基板２２は、図６（ｂ）に示すように、ＬＥＤアレイチップ２１およびボンディングパッド２６が従来と同様に配置され、基板２２の一方の側端には、上記実施例１と同様に、幅Ｂの当接エリア２２ａを確保するための凸部３３（以下、第１の凸部３３という。）が設けられている。 As shown in FIG. 6B, the substrate 22 of this embodiment has the LED array chip 21 and the bonding pad 26 arranged in the same manner as in the conventional case, and the substrate 22 is located on one side end of the substrate 22 in the same manner as in the first embodiment. Is provided with a convex portion 33 (hereinafter, referred to as a first convex portion 33) for securing a contact area 22a having a width B.

基板２２の他方の側端の第１の凸部３３の位置を避ける位置には、当該他端部の幅Ｂの当接エリア２２ａを確保するために、基板２２の他端から幅方向に突出させた第２の凸部４１が設けられ、第１の凸部３３と第２の凸部４１が互いに幅方向で対向しないようになっている。 At a position avoiding the position of the first convex portion 33 on the other side end of the substrate 22, it protrudes in the width direction from the other end of the substrate 22 in order to secure a contact area 22a having a width B of the other end portion. A second convex portion 41 is provided so that the first convex portion 33 and the second convex portion 41 do not face each other in the width direction.

本実施例のＬＥＤアレイチップ２１は、上記実施例１と同様に、幅方向の曲りを抑制するために、両側の側端からの距離Ｄ1とＤ2とを同一にした中心線上に配置される。
この距離Ｄ1を設定するための距離Ｅは、上記実施例１と同様である。 Similar to the first embodiment, the LED array chip 21 of this embodiment is arranged on a center line having the same distances D 1 and D 2 from the side ends on both sides in order to suppress bending in the width direction. LED.
The distance E for setting the distance D 1 is the same as that in the first embodiment.

このような本実施例のＬＥＤヘッド搭載用の基板２２は、従来と同じ直径のルータを配列方向に移動させた後に、第１の凸部３３の部分で一旦幅方向に幅Ｂ分移動させ、配列方向に移動させた後に幅方向に幅Ｂ分戻して再び配列方向に移動させ、ルータを戻すときに、第２の凸部４１の部分で一旦幅方向に幅Ｂ分移動させ、配列方向に移動させた後に幅方向に幅Ｂ分戻し再び配列方向に移動させて、従来と同じ切断幅Ｃで切断して形成される。 In the substrate 22 for mounting the LED head of this embodiment, after moving the router having the same diameter as the conventional one in the arrangement direction, the substrate 22 is once moved in the width direction by the width B at the portion of the first convex portion 33. After moving in the arrangement direction, it is moved back in the width direction by the width B and moved in the arrangement direction again, and when the router is returned, it is once moved in the width direction by the width B at the second convex portion 41 and then moved in the arrangement direction. After moving, it is returned by the width B in the width direction, moved again in the arrangement direction, and cut with the same cutting width C as the conventional one.

これにより、本実施例の基板の幅方向の一端に第１の凸部３３が形成され、他端の第１の凸部３３を避ける位置に、入れ子状態の第２の凸部４１が同時に形成される。 As a result, the first convex portion 33 is formed at one end in the width direction of the substrate of the present embodiment, and the nested second convex portion 41 is simultaneously formed at a position avoiding the first convex portion 33 at the other end. Will be done.

このように、本実施例の基板２２は、第１の凸部３３および第２の凸部４１のそれぞれの先端からＬＥＤアレイチップ２１の中心線までの距離がそれぞれＡになり、中心線から基板２２の幅方向の両端までの距離が同一のＤ1とＤ2となる。つまり、基板２２の両側の側端と、それに対向するホルダ２５の側板の内面との距離が略同一になる。 As described above, in the substrate 22 of the present embodiment, the distance from the tip of each of the first convex portion 33 and the second convex portion 41 to the center line of the LED array chip 21 is A, and the distance from the center line to the substrate is A. The distances to both ends of 22 in the width direction are the same D 1 and D 2 . That is, the distance between the side ends on both sides of the substrate 22 and the inner surface of the side plate of the holder 25 facing the side ends is substantially the same.

このため、第１の凸部３３および第２の凸部４１のそれぞれの先端間の距離は、従来と同様に２Ａになるが、第１の凸部３３と第２の凸部４１は、入れ子状態で形成するので、１枚目の基板２２の一方の側端と、２枚目の基板２２の他方の側端との間の距離Ｆが、当接エリア２２ａの幅Ｂと切断幅Ｃとの差の分短くなり、１枚のワークボードから切出せる基板２２の取れ数を増加させることができる。 Therefore, the distance between the tips of the first convex portion 33 and the second convex portion 41 is 2A as in the conventional case, but the first convex portion 33 and the second convex portion 41 are nested. Since it is formed in the state, the distance F between one side end of the first substrate 22 and the other side end of the second substrate 22 is the width B of the contact area 22a and the cutting width C. It becomes shorter by the difference between the two, and the number of boards 22 that can be cut out from one work board can be increased.

上記のような本実施例の基板２２は、図７（ａ）に示す従来のホルダ２５内に搭載される。 The substrate 22 of this embodiment as described above is mounted in the conventional holder 25 shown in FIG. 7A.

このホルダ２５には、上記実施例１と同様に、両側の側板に設けられた支持部２９およびその上の当接部３１が配列方向に沿って千鳥に、つまり、当接部３１同士が幅方向で対向せず、かつ第１の凸部３３と第２の凸部４１の形成位置と重なる位置に配置されている。 Similar to the first embodiment, the holder 25 has the support portions 29 provided on the side plates on both sides and the contact portions 31 on the support portions 31 in a staggered manner along the arrangement direction, that is, the contact portions 31 have widths. They are arranged at positions that do not face each other in the direction and overlap with the formation positions of the first convex portion 33 and the second convex portion 41.

このようなホルダ２５内に基板２２を配置するときは、図７（ｂ）に示すように、基板２２の幅方向の一端に設けた第１の凸部３３を、それに対向する位置に設けられた当接部３１の当接面上に載置し、他端の第２の凸部４１をそれに対向する位置に設けられた当接部３１に載置し、この基板２２を取付板２４で押える。 When the substrate 22 is arranged in such a holder 25, as shown in FIG. 7B, a first convex portion 33 provided at one end of the substrate 22 in the width direction is provided at a position facing the first convex portion 33. It is placed on the contact surface of the contact portion 31, and the second convex portion 41 at the other end is placed on the contact portion 31 provided at a position facing the contact portion 31, and the substrate 22 is mounted on the mounting plate 24. suppress.

そして、取付板２４の両側の側面と、ホルダ２５の側板の内面との間の両側の隙間から接合部２８を形成するための接合剤をノズル等を用いて流し込んで、基板２２の両側の側端とホルダ２５の側板の内面との間を接合剤により封止すると共に、取付板２４とホルダ２５の側板との両側の隅部に接合部２８を形成して固定する。 Then, a bonding agent for forming the joint portion 28 is poured from the gaps on both sides between the side surfaces on both sides of the mounting plate 24 and the inner surface of the side plate of the holder 25 using a nozzle or the like, and the side surfaces on both sides of the substrate 22. The end and the inner surface of the side plate of the holder 25 are sealed with a bonding agent, and the bonding portions 28 are formed and fixed at the corners on both sides of the mounting plate 24 and the side plate of the holder 25.

以上説明したように、本実施例では、第１の凸部３３と第２の凸部４１とを入れ子状態にして基板２２をワークボードから切出すようにしたので、１枚目の基板２２の一方の側端と、２枚目の基板２２の他方の側端との間の距離Ｆを、当接エリア２２ａの幅Ｂと、切断幅Ｃとの差の分短くすることができ、１枚のワークボードから切出せる基板２２の取れ数を増加させることができると共に、従来の基板２２との間の互換性を確保することができる。 As described above, in the present embodiment, the first convex portion 33 and the second convex portion 41 are nested to cut out the substrate 22 from the work board. Therefore, the first substrate 22 The distance F between one side end and the other side end of the second substrate 22 can be shortened by the difference between the width B of the contact area 22a and the cutting width C, and one substrate. It is possible to increase the number of substrates 22 that can be cut out from the work board of the above, and to ensure compatibility with the conventional substrate 22.

また、ホルダ２５内に基板２２を搭載すると、基板２２の両側の側端と、それに対向するホルダ２５の側板の内面との距離が略同一であるため、封止に用いる接合剤の量は一端側、他端側で等しくなり、かつ、ＬＥＤアレイチップ２１と基板２２の両側端までの距離Ｄ1とＤ2が同一であるので、ＬＥＤアレイチップ２１の発光に伴う熱量は、基板２２の一端側、他端側から均等にホルダ２５に放出され、基板２２の温度分布の均一性を高めて、ＬＥＤアレイチップ２１の発光時における曲りを更に抑制することができ、カラー印刷時の色ズレを抑制して、印刷品質の低下を防止することができる。 Further, when the substrate 22 is mounted in the holder 25, the distance between the side ends on both sides of the substrate 22 and the inner surface of the side plate of the holder 25 facing the substrate 22 is substantially the same, so that the amount of the bonding agent used for sealing is one end. Since the distances D 1 and D 2 between the LED array chip 21 and both side ends of the substrate 22 are the same on the side and the other end side, the amount of heat generated by the light emission of the LED array chip 21 is one end of the substrate 22. It is evenly discharged from the side and the other end side to the holder 25, the uniformity of the temperature distribution of the substrate 22 is enhanced, the bending of the LED array chip 21 at the time of light emission can be further suppressed, and the color deviation at the time of color printing can be prevented. It can be suppressed to prevent deterioration of print quality.

なお、上記各実施例においては、ＬＥＤアレイチップ２１を設ける位置は、両側の側端からの距離Ｄ1、Ｄ2を同一にした基板２２の中心線上であるとして説明したが、距離Ｄ1、Ｄ2は略同一であればよい。具体的には、距離Ｄ1は、距離Ｄ2の±１０％以内であれば、基板２２の曲りを抑制する効果が得られる。 In the above embodiments, the position of providing the LED array chip 21 has been described the distance D 1, D 2 from both sides of the side end as is on the center line of the substrate 22 which is the same, the distance D 1, D 2 may be substantially the same. Specifically, if the distance D 1 is within ± 10% of the distance D 2 , the effect of suppressing the bending of the substrate 22 can be obtained.

また、上記各実施例においては、基板２２が当接する当接部３１は、ホルダ２５の側板の一部を内側に曲折して形成された支持部２９上に紫外線硬化型樹脂等を用いて形成するとして説明したが、ホルダ２５をモールド樹脂等を用いて形成するときに、当接部３１を一体成型してもよく、アルミダイキャストの削り出し加工で形成するようにしてもよい。 Further, in each of the above embodiments, the contact portion 31 with which the substrate 22 abuts is formed by using an ultraviolet curable resin or the like on a support portion 29 formed by bending a part of the side plate of the holder 25 inward. However, when the holder 25 is formed by using a mold resin or the like, the contact portion 31 may be integrally molded, or may be formed by machined aluminum die casting.

更に、上記各実施例においては、媒体は、印刷用の用紙として説明したが、媒体は前記に限らず、ＯＨＰ用紙、封筒、複写紙、特殊紙等であってもよい。 Further, in each of the above embodiments, the medium has been described as printing paper, but the medium is not limited to the above, and may be OHP paper, envelopes, copying paper, special paper, or the like.

１ プリンタ
２ 用紙搬送路
３ 給紙カセット
４ スタッカ
５ ホッピングローラ
６ レジストローラ
７ 搬送ベルト
８ 定着器
９ 排出ローラ
１１、１１ｋ、１１ｙ、１１ｍ、１１ｃ 画像形成ユニット
１２ 感光体ドラム
１３ 帯電ローラ
１４ 現像ローラ
１５ 供給ローラ
１６ トナーカートリッジ
１７ 現像ブレード
１８ クリーニングブレード
１９ 転写ローラ
２０ ＬＥＤヘッド
２１ ＬＥＤアレイチップ
２２ 基板
２２ａ 当接エリア
２３ レンズ
２４ 取付板
２５ ホルダ
２６ ボンディングパッド
２６ａ コネクタ
２６ｂ ワイヤ
２７ 接着部
２８ 接合部
２９ 支持部
３１ 当接部
３３ 凸部（第１の凸部）
３４ 凹部
４１ 第２の凸部 1 Printer 2 Paper transport path 3 Paper feed cassette 4 Stacker 5 Hopping roller 6 Resist roller 7 Conveyor belt 8 Fixer 9 Discharge roller 11, 11k, 11y, 11m, 11c Image forming unit 12 Photoreceptor drum 13 Charging roller 14 Development roller 15 Supply Roller 16 Toner Cartridge 17 Development Blade 18 Cleaning Blade 19 Transfer Roller 20 LED Head 21 LED Array Chip 22 Board 22a Contact Area 23 Lens 24 Mounting Plate 25 Holder 26 Bonding Pad 26a Connector 26b Wire 27 Bonding 28 Bonding 29 Support 31 Contact part 33 Convex part (first convex part)
34 concave part 41 second convex part

Claims (7)

配列方向に複数の発光素子を搭載した基板と、
前記発光素子からの光を集光する、前記配列方向に伸張するレンズと、
前記基板と前記レンズを支持するホルダと、を備え、
前記ホルダは、
前記配列方向に配置され、前記基板に当接する複数の当接部を有し、
前記基板は、
前記配列方向の直交方向である幅方向の一端から、前記幅方向に突出する凸部と、
前記一端の反対側の他端の前記凸部に対応する位置を前記幅方向に切欠いて形成された凹部と、を有し、
前記ホルダの当接部に前記凸部を当接させて、前記基板を前記ホルダ内に配置したことを特徴とする露光装置。 A substrate with multiple light emitting elements mounted in the array direction,
A lens that collects light from the light emitting element and extends in the array direction,
The substrate and the holder for supporting the lens are provided.
The holder
It is arranged in the arrangement direction and has a plurality of contact portions that come into contact with the substrate.
The substrate is
A convex portion protruding in the width direction from one end in the width direction, which is orthogonal to the arrangement direction,
It has a concave portion formed by notching a position corresponding to the convex portion of the other end opposite to the one end in the width direction.
An exposure apparatus characterized in that the convex portion is brought into contact with the contact portion of the holder and the substrate is arranged in the holder. 請求項１に記載の露光装置において、
前記発光素子は、前記基板の一端からの距離と、前記基板の他端からの距離とが、略同一になる位置に配置されていることを特徴とする露光装置。 In the exposure apparatus according to claim 1,
The exposure device is characterized in that the light emitting element is arranged at a position where the distance from one end of the substrate and the distance from the other end of the substrate are substantially the same. 請求項１または請求項２に記載の露光装置において、
前記凹部の間に、前記当接部を当接させる当接エリアを設け、
前記当接エリアの配列方向の長さを、前記凸部の前記第１の凸部の配列方向の長さより長くしたことを特徴とする露光装置。 In the exposure apparatus according to claim 1 or 2.
A contact area for contacting the contact portion is provided between the recesses.
An exposure apparatus characterized in that the length of the contact area in the arrangement direction is made longer than the length of the convex portion in the arrangement direction of the first convex portion. 請求項１ないし請求項３のいずれか一項に記載の露光装置において、
前記発光素子と前記凸部との間に、前記配列方向に沿ってボンディングパッドを配置したことを特徴とする露光装置。 In the exposure apparatus according to any one of claims 1 to 3.
An exposure apparatus characterized in that a bonding pad is arranged along the arrangement direction between the light emitting element and the convex portion. 配列方向に複数の発光素子を搭載した基板と、
前記発光素子からの光を集光する、前記配列方向に伸張するレンズと、
前記基板と前記レンズを支持するホルダと、を備え、
前記ホルダは、
前記配列方向に配置され、前記基板に当接する複数の当接部を有し、
前記基板は、
前記配列方向の直交方向である幅方向の一端から、前記幅方向に突出する第１の凸部と、
前記一端の反対側の他端の、前記幅方向で前記第１の凸部に対向しない位置に設けられ、前記基板の他端から幅方向に突出する第２の凸部と、を有し、
前記ホルダの当接部に前記第１および第２の凸部を当接させて、前記基板を前記ホルダ内に配置したことを特徴とする露光装置。 A substrate with multiple light emitting elements mounted in the array direction,
A lens that collects light from the light emitting element and extends in the array direction,
The substrate and the holder for supporting the lens are provided.
The holder
It is arranged in the arrangement direction and has a plurality of contact portions that come into contact with the substrate.
The substrate is
A first convex portion protruding in the width direction from one end in the width direction which is orthogonal to the arrangement direction, and
The opposite end of the one end, provided at a position not opposed to the first convex portion in the width direction, and a second convex portion protruding from the other end of the substrate in the width direction,
An exposure apparatus characterized in that the first and second convex portions are brought into contact with the contact portion of the holder, and the substrate is arranged in the holder. 配列方向に複数のＬＥＤアレイチップを搭載した基板と、
前記発光素子からの光を集光する、前記配列方向に伸張するレンズと、
前記基板と前記レンズを支持するホルダと、を備え、
前記ホルダは、
前記配列方向に配置され、前記基板に当接する複数の当接部を有し、
前記基板は、
前記配列方向の直交方向である幅方向の一端から、前記幅方向に突出する凸部と、
前記一端の反対側の他端の前記凸部に対応する位置を前記幅方向に切欠いて形成された凹部と、を有し、
前記ホルダの当接部に前記凸部を当接させて、前記基板を前記ホルダ内に配置したことを特徴とするＬＥＤヘッド。 A board with multiple LED array chips mounted in the array direction,
A lens that collects light from the light emitting element and extends in the array direction,
The substrate and the holder for supporting the lens are provided.
The holder
It is arranged in the arrangement direction and has a plurality of contact portions that come into contact with the substrate.
The substrate is
A convex portion protruding in the width direction from one end in the width direction, which is orthogonal to the arrangement direction,
It has a concave portion formed by notching a position corresponding to the convex portion of the other end opposite to the one end in the width direction.
An LED head characterized in that the convex portion is brought into contact with the contact portion of the holder and the substrate is arranged in the holder. 請求項１ないし請求項５のいずれか一項に記載の露光装置、または請求項６に記載のＬＥＤヘッドを備えたことを特徴とする画像形成装置。
An image forming apparatus comprising the exposure apparatus according to any one of claims 1 to 5 or the LED head according to claim 6.
JP2017011166A 2017-01-25 2017-01-25 An exposure device, an LED head, and an image forming device equipped with the exposure device. Active JP6817828B2 (en)

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