JP6791817B2 - Circuit board and electronic circuit equipment - Google Patents

Circuit board and electronic circuit equipment Download PDF

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JP6791817B2
JP6791817B2 JP2017145595A JP2017145595A JP6791817B2 JP 6791817 B2 JP6791817 B2 JP 6791817B2 JP 2017145595 A JP2017145595 A JP 2017145595A JP 2017145595 A JP2017145595 A JP 2017145595A JP 6791817 B2 JP6791817 B2 JP 6791817B2
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pedestal
substrate
metal particles
metal
coating film
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JP2019029439A (en
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有平 松本
有平 松本
山元　泉太郎
泉太郎 山元
東　登志文
登志文 東
岡本　和弘
和弘 岡本
亜紀 北林
亜紀 北林
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Kyocera Corp
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Description

本開示は、回路基板およびそれを備えた電子回路装置に関する。 The present disclosure relates to a circuit board and an electronic circuit device including the circuit board.

従来、三次元の立体的形状に成形した基材の表面における必要箇所に導電回路が設けられた回路基板が提案されている（例えば、特許文献１を参照）。 Conventionally, a circuit board in which a conductive circuit is provided at a required position on the surface of a base material molded into a three-dimensional three-dimensional shape has been proposed (see, for example, Patent Document 1).

特開２０１７−８５０１２号公報JP-A-2017-85012

本開示の回路基板は、平板状の基板と、該基板のおもて面から突出した台座と、前記基板の表面から前記台座の表面にかけて配置された金属塗膜と、を有し、前記基板および前記台座は有機樹脂を母材とし、前記金属塗膜は針状または扁平状の金属粒子と樹脂成分とを含んでおり、前記金属塗膜のうち、前記基板および前記台座の表面が平坦な部位に配置された部分を平坦部膜としたときに、前記平坦部膜を構成する前記金属粒子は前記基板および前記台座の表面に沿う方向に配向しており、前記金属塗膜のうち、前記基板および前記台座のそれぞれの角部、ならびに前記基板から前記台座に移る移行部に配置された部分を屈曲部膜としたときに、該屈曲部膜中には、前記金属粒子が、前記基板および前記台座
の表面に沿う方向に配向している第１金属粒子、前記角部または前記移行部に対して法線方向に向いている第２金属粒子、および前記法線方向に対して前記第１金属粒子と前記第２金属粒子との間の範囲の角度を成すように向いている第３金属粒子として存在している。 The circuit board of the present disclosure includes a flat plate-shaped substrate, a pedestal protruding from the front surface of the substrate, and a metal coating film arranged from the surface of the substrate to the surface of the pedestal. The pedestal is made of an organic resin as a base material, and the metal coating material contains needle-like or flat metal particles and a resin component. Among the metal coating materials, the surface of the substrate and the pedestal is flat. When the portion arranged at the portion is a flat portion film, the metal particles constituting the flat portion film are oriented in a direction along the surfaces of the substrate and the pedestal, and among the metal coating films, the said When the corners of the substrate and the pedestal, and the portion arranged at the transition portion from the substrate to the pedestal are used as a bent portion film, the metal particles are contained in the substrate and the bent portion film. The pedestal
First metal particles oriented along the surface of the surface, second metal particles oriented in the normal direction with respect to the corner portion or the transition portion, and the first metal particle oriented in the normal direction. It exists as a third metal particle oriented so as to form an angle in the range between the second metal particle and the second metal particle .

本開示の電子回路装置は、上記の回路基板と、該回路基板の表面に形成された金属塗膜上に実装された電子部品とを備える。 The electronic circuit device of the present disclosure includes the above-mentioned circuit board and electronic components mounted on a metal coating film formed on the surface of the circuit board.

（ａ）は、本実施形態の回路基板を模式的に示す斜視図であり、（ｂ）は、（ａ）のＸ−Ｘ線断面図であり、（ｃ）は、（ａ）のＹ−Ｙ線断面図である。(A) is a perspective view schematically showing a circuit board of this embodiment, (b) is a sectional view taken along line XX of (a), and (c) is a Y- of (a). It is a cross-sectional view of Y line. （ａ）は、図１（ｂ）におけるＣ部を拡大して示した断面模式図であり、（ｂ）は、（ａ）における３Ａ部を拡大した断面模式図であり、（ｃ）は、（ａ）における３ＢＳ部を拡大した断面模式図である。(A) is a schematic cross-sectional view showing an enlarged portion C in FIG. 1 (b), (b) is an enlarged schematic cross-sectional view of a portion 3A in (a), and (c) is a schematic cross-sectional view. It is a cross-sectional schematic view which enlarged 3BS part in (a). （ａ）は、図１（ｂ）におけるＳ部を拡大して示した断面模式図であり、（ｂ）は、（ａ）における３Ａ部を拡大した断面模式図であり、（ｃ）は、（ａ）における３ＢＳ部を拡大した断面模式図である。(A) is a schematic cross-sectional view showing an enlarged portion S in FIG. 1 (b), (b) is an enlarged schematic cross-sectional view of a portion 3A in (a), and (c) is a schematic cross-sectional view. It is a cross-sectional schematic view which enlarged 3BS part in (a). 屈曲部膜内において金属粒子が互いに直行した配列を成す構造の断面模式図である。（ａ）は、回路基板の全体の断面図、（ｂ）は、基板から台座に移る移行部の拡大図、（ｃ）は、台座の角部の拡大図である。It is sectional drawing of the structure in which metal particles form an array orthogonal to each other in a bent part membrane. (A) is an overall cross-sectional view of the circuit board, (b) is an enlarged view of a transition portion moving from the substrate to the pedestal, and (c) is an enlarged view of a corner portion of the pedestal. （ａ）は、本実施形態の回路基板の他の態様を示すものであり、（ｂ）は（ａ）における３Ａ部を拡大した断面模式図である。(A) shows another aspect of the circuit board of this embodiment, and (b) is a schematic cross-sectional view which enlarged part 3A in (a). 本実施形態の電子回路装置を模式的に示す斜視図である。It is a perspective view which shows typically the electronic circuit apparatus of this embodiment. 本実施形態の回路基板の製造方法を示す模式図である。It is a schematic diagram which shows the manufacturing method of the circuit board of this embodiment.

従来例として挙げた上記の回路基板は、導体回路にめっき膜が用いられている。ところが、めっき膜は、導電性が高いものの、回路基板を構成する基材が有機樹脂によって形成されたものである場合には、両者の材料の違いから基材に対する導体回路の接着強度が低く、剥がれやすいという問題がある。 In the above circuit board given as a conventional example, a plating film is used for the conductor circuit. However, although the plating film has high conductivity, when the base material constituting the circuit board is formed of an organic resin, the adhesive strength of the conductor circuit to the base material is low due to the difference between the two materials. There is a problem that it is easy to peel off.

本実施形態の回路基板Ａは、下記の構成を成す基材１の表面１ａに金属塗膜３を有する。基材１は平板状の基板５と、該基板５のおもて面から突出した台座７とで構成されてい
る。基板５および台座７の表面５ａ、７ａのうち平坦な部位をそれぞれ平坦部５ａｆ、７ａｆとする。また、基板１から台座３に移る部位を移行部９とする。図１（ａ）（ｂ）において符号１１を付した部位は角部である。 The circuit board A of the present embodiment has a metal coating film 3 on the surface 1a of the base material 1 having the following configuration. The base material 1 is composed of a flat plate-shaped substrate 5 and a pedestal 7 protruding from the front surface of the substrate 5. Of the surfaces 5a and 7a of the substrate 5 and the pedestal 7, the flat portions are referred to as flat portions 5af and 7af, respectively. Further, the portion that moves from the substrate 1 to the pedestal 3 is designated as the transition portion 9. The portions marked with reference numerals 11 in FIGS. 1 (a) and 1 (b) are corners.

基材１は有機樹脂によって形成されている。金属塗膜３は針状または扁平状の金属粒子３ａと樹脂成分３ｂとを含んでいる。 The base material 1 is made of an organic resin. The metal coating film 3 contains needle-shaped or flat-shaped metal particles 3a and a resin component 3b.

ここで、金属塗膜３については、基板５および台座７の表面５ａ、７ａのうち平坦な部位（平坦部５ａｆ、７ａｆ）に形成された部分を平坦部膜３Ａとする。基板１から台座３に移る移行部９を覆うように形成された部分、ならびに基板１および台座３のそれぞれの角部１１を覆うように形成された部分を屈曲部膜３Ｂ（３ＢＳ、３ＢＣ）とする。 Here, with respect to the metal coating film 3, the portion formed on the flat portion (flat portion 5af, 7af) of the surfaces 5a and 7a of the substrate 5 and the pedestal 7 is referred to as the flat portion film 3A. The portion formed so as to cover the transition portion 9 moving from the substrate 1 to the pedestal 3 and the portion formed so as to cover the respective corner portions 11 of the substrate 1 and the pedestal 3 are referred to as a bent portion membrane 3B (3BS, 3BC). To do.

本実施形態の回路基板Ａでは、平坦部膜３Ａを構成する金属粒子３ａが基板５および台座７の表面５ａ、７ａに沿う方向に配向している。 In the circuit board A of the present embodiment, the metal particles 3a constituting the flat portion film 3A are oriented in the directions along the surfaces 5a and 7a of the substrate 5 and the pedestal 7.

本実施形態の回路基板Ａによれば、有機樹脂によって形成された基材１（基板５および台座７）上に形成されている金属塗膜３が針状または扁平状の金属粒子３ａと樹脂成分３ｂとの複合材料によって形成されたものであるため、基材１と金属塗膜３とが有機材料同士で接着することになり、高い接着強度を実現できる。 According to the circuit board A of the present embodiment, the metal coating film 3 formed on the base material 1 (the substrate 5 and the pedestal 7) formed of the organic resin has needle-like or flat metal particles 3a and a resin component. Since it is formed of a composite material with 3b, the base material 1 and the metal coating film 3 are bonded to each other, and high adhesive strength can be realized.

また、この金属塗膜３のうち、基板５および台座７の表面５ａ、７ａに位置する平坦部膜３Ａは、これら基材１の表面１ａ（基板５の表面５ａ、台座７の表面７ａ）に沿う方向に配向しているため、金属粒子５ａと基材１との接着面積が大きくなり、これによっても両者間で高い接着強度を得ることができる。 Further, among the metal coating films 3, the flat portion films 3A located on the surfaces 5a and 7a of the substrate 5 and the pedestal 7 are formed on the surface 1a of the base material 1 (the surface 5a of the substrate 5 and the surface 7a of the pedestal 7). Since the metal particles 5a are oriented in the direction along the line, the adhesive area between the metal particles 5a and the base material 1 becomes large, which also makes it possible to obtain high adhesive strength between the two.

この場合、金属塗膜３の一部は、基材１（基板５、台座７）に埋設されているのが良い。また、金属塗膜３は、その表面が基材１の表面１ａ（基板５の表面５ａ、台座７の表面７ａ）と同一高さとなり面一となるように埋設されているのが良い。金属塗膜３が基材１（基板５、台座７）に埋設され、しかもその表面が基材１の表面１ａ（基板５の表面５ａ、台座７の表面７ａ）と面一となる構造であると、金属塗膜３の基材１（基板５、台座７）に対する接着強度をさらに高めることが可能になる。 In this case, a part of the metal coating film 3 is preferably embedded in the base material 1 (the substrate 5, the pedestal 7). Further, the metal coating film 3 is preferably embedded so that its surface is flush with the surface 1a of the base material 1 (the surface 5a of the substrate 5 and the surface 7a of the pedestal 7). The metal coating film 3 is embedded in the base material 1 (the substrate 5, the pedestal 7), and the surface thereof is flush with the surface 1a of the base material 1 (the surface 5a of the substrate 5 and the surface 7a of the pedestal 7). This makes it possible to further increase the adhesive strength of the metal coating film 3 to the base material 1 (board 5, pedestal 7).

さらに、金属塗膜３のうち、基板５および台座７の平坦な表面５ａ、７ａに位置する平坦部膜３Ａでは、金属粒子３ａが基板５および台座７のそれぞれの表面５ａ、７ａに配向した構造となっていることから、基板５および台座７の表面５ａ、７ａに沿う方向に配列している金属粒子３ａの個数を少なくすることができる。これにより、単位長さにおいて、金属粒子３ａ間に存在する樹脂成分３ｂの割合を少なくすることができる。また、金属粒子３ａ同士、特に、金属粒子３ａの長手方向に対して垂直な短手方向における接触面積を大きくすることができるため、金属塗膜３Ａ中に樹脂成分３ｂが含まれていても導電率の高い平坦部膜３Ａ（金属塗膜３）を得ることができる。 Further, in the flat portion film 3A located on the flat surfaces 5a and 7a of the substrate 5 and the pedestal 7 of the metal coating film 3, the metal particles 3a are oriented toward the surfaces 5a and 7a of the substrate 5 and the pedestal 7, respectively. Therefore, the number of metal particles 3a arranged in the direction along the surfaces 5a and 7a of the substrate 5 and the pedestal 7 can be reduced. Thereby, the ratio of the resin component 3b existing between the metal particles 3a can be reduced in the unit length. Further, since the contact area between the metal particles 3a, particularly in the lateral direction perpendicular to the longitudinal direction of the metal particles 3a, can be increased, the metal coating film 3A is conductive even if the resin component 3b is contained. A flat portion film 3A (metal coating film 3) having a high rate can be obtained.

ここで、針状または扁平状の金属粒子３ａとは、回路基板を断面視して金属粒子３ａを観察したときに、金属粒子３ａの長手方向の長さＬＬが短手方向ＬＳよりも長いものを言い、その比（ＬＬ／ＬＳ）が１．５以上であるものを言う。ＬＬ／ＬＳ比の最大値としては、量産可能な金属粒子３ａの形状として５を例示できる。 Here, the needle-like or flat metal particles 3a, when observed metal particles 3a and sectional view of the circuit board, the longitudinal length L L of the metal particles 3a than the lateral direction L S refers to long, the ratio (L L / L S) says what is equal to or greater than 1.5. As the maximum value of the L L / L S ratio, 5 can be exemplified as the shape of the metal particles 3a that can be mass-produced.

平坦部膜３Ａを構成する金属粒子３ａが基板５および台座７の表面５ａ、７ａに配向している状態とは、回路基板Ａの断面を観察したときに、金属粒子３ａの長手方向が基板５および台座７の表面５ａ、７ａに沿う方向に向いている個数割合が６０％以上となっている状態のことを言う。この場合、金属粒子３ａは、例えば、図２（ｂ）に示すように、基
板５および台座７の表面５ａ、７ａに沿う方向の長さＬｘとし、表面５ａ、７ａに垂直な方向の長さをＬｙとしたときに、Ｌｘとして１０μｍの幅を選択し、Ｌｙを金属塗膜３の全厚みとしたときの面積内のものを計測すればよい。 The state in which the metal particles 3a constituting the flat portion film 3A are oriented toward the surfaces 5a and 7a of the substrate 5 and the pedestal 7 means that the longitudinal direction of the metal particles 3a is the substrate 5 when the cross section of the circuit board A is observed. In addition, it means a state in which the number ratio of the pedestals 7 facing in the direction along the surfaces 5a and 7a is 60% or more. In this case, as shown in FIG. 2B, for example, the metal particles 3a have a length Lx in the direction along the surfaces 5a and 7a of the substrate 5 and the pedestal 7, and the length in the direction perpendicular to the surfaces 5a and 7a. When L is, a width of 10 μm is selected as Lx, and the area within the area when Ly is the total thickness of the metal coating film 3 may be measured.

金属粒子３ａの長手方向が基板５および台座７の表面５ａ、７ａに沿う方向に向いている状態というのは、図２（ｃ）に示すように、例えば、基板５の表面５ａに沿って基準線Ｌｓｔを引いたときに、その基準線Ｌｓｔに対して、金属粒子３ａの長手方向の向きの角度θが±１０°以内に入っているものを言う。 As shown in FIG. 2C, the state in which the longitudinal direction of the metal particles 3a is oriented along the surfaces 5a and 7a of the substrate 5 and the pedestal 7 is, for example, a reference along the surface 5a of the substrate 5. When the line Lst is drawn, the angle θ in the longitudinal direction of the metal particles 3a is within ± 10 ° with respect to the reference line Lst.

基材１を構成する有機材料としては、種々の有機材料を適用できるが、加熱等によって変形しやすい有機材料が良い。例えば、エポキシ系樹脂、ポリエチレン系樹脂、ポリフェニレン系樹脂、アクリル系樹脂およびポリカーボネート系樹脂などを例として挙げることができる。この中で、溶剤を含まない場合でも粘度を変化させることが可能となる有機材料としてエポキシ系樹脂がより好適なものとなる。なお、基材１は有機材料と無機フィラーとを混合した複合材により形成しても良い。 As the organic material constituting the base material 1, various organic materials can be applied, but an organic material that is easily deformed by heating or the like is preferable. For example, epoxy resin, polyethylene resin, polyphenylene resin, acrylic resin, polycarbonate resin and the like can be mentioned as examples. Among these, epoxy resins are more suitable as organic materials whose viscosities can be changed even when they do not contain a solvent. The base material 1 may be formed of a composite material in which an organic material and an inorganic filler are mixed.

金属塗膜３は、上述したように、金属粒子３ａと樹脂成分３ｂとを含んでいるものであるが、ここで用いる樹脂成分３ｂとしては、基材１に適用される有機材料との相溶性の高いものが良い。例えば、金属塗膜３に含ませる樹脂成分３ｂと基材１を構成する有機材料とが同じ高分子材料を主成分とするものが良い。金属塗膜３を基材１の表面に形成する場合に、金属塗膜３に含ませる樹脂成分３ｂと基材１を構成する有機材料とを未硬化の状態で接着させて硬化させると、さらに高い接着強度を得ることができる。 As described above, the metal coating film 3 contains the metal particles 3a and the resin component 3b, but the resin component 3b used here is compatible with the organic material applied to the base material 1. Higher ones are better. For example, it is preferable that the resin component 3b contained in the metal coating film 3 and the organic material constituting the base material 1 contain the same polymer material as the main component. When the metal coating film 3 is formed on the surface of the base material 1, if the resin component 3b contained in the metal coating film 3 and the organic material constituting the base material 1 are adhered and cured in an uncured state, further High adhesive strength can be obtained.

金属粒子３ａを構成する金属材料としては、金、銀、白金、パラジウムなどの貴金属材料の他、ニッケルおよび銅などの卑金属材料を適用することができる。この場合、金属粒子３ａの形状として、種々のサイズで針状または扁平状のものを得やすいという点から銀が好適なものとなる。 As the metal material constituting the metal particles 3a, a noble metal material such as gold, silver, platinum and palladium, and a base metal material such as nickel and copper can be applied. In this case, silver is suitable as the shape of the metal particles 3a because it is easy to obtain needle-shaped or flat-shaped metal particles of various sizes.

また、本実施形態の回路基板Ａは、上述のように、基板１から台座３に移る移行部９または台座３の角部１１に屈曲部膜３Ｂ（３ＢＣ、３ＢＳ）を有する。この場合、屈曲部膜３Ｂは、図２（ｃ）および図３（ｃ）に示すように、基板５および台座７の表面に沿う方向に配向している第１金属粒子３ａ１と、移行部９または角部１１に対して法線方向（図２（ｃ）および図３（ｃ）において符号Ｌｎｓｔを付した線分）に向いている第２金属粒子３ａ２と、法線方向に対して、第１金属粒子３ａ１と第２金属粒子３ａ２との間の角度を有するように向いている第３金属粒子３ａ３とを含むのが良い。ここで、図２（ｃ）および図３（ｃ）に示す線分Ｌｎｓｔは、台座７の表面７ａと側面７ｂとが交わる部分の成す角度の１／２の角度の位置であり、円弧状を成す角部１１のほぼ中央から伸びている。 Further, as described above, the circuit board A of the present embodiment has a bent portion film 3B (3BC, 3BS) at the transition portion 9 that moves from the substrate 1 to the pedestal 3 or the corner portion 11 of the pedestal 3. In this case, as shown in FIGS. 2 (c) and 3 (c), the bent portion film 3B includes the first metal particles 3a1 oriented in the direction along the surfaces of the substrate 5 and the pedestal 7, and the transition portion 9. Alternatively, the second metal particles 3a2 facing the corner 11 in the normal direction (the line segment having the symbol Lnst in FIGS. 2 (c) and 3 (c)) and the second metal particle 3a2 in the normal direction. It is preferable to include a third metal particle 3a3 that is oriented so as to have an angle between the 1 metal particle 3a1 and the second metal particle 3a2. Here, the line segment Lnst shown in FIGS. 2 (c) and 3 (c) is a position at an angle of 1/2 of the angle formed by the intersection of the surface 7a and the side surface 7b of the pedestal 7, and has an arc shape. It extends from approximately the center of the corner portion 11 formed.

回路基板Ａにおいて、基板１から台座３に移る移行部９および台座３の角部１１に形成された屈曲部膜３Ｂは、図２（ｃ）および図３（ｃ）に示すように、基板１と台座３との成す角度、あるいは台座７の表面７ａと側面７ｂとの成す角度が直角もしくはそれに近い角度に依存して折れ曲がった形状となっている。 In the circuit board A, the transition portion 9 that moves from the substrate 1 to the pedestal 3 and the bent portion film 3B formed at the corner portion 11 of the pedestal 3 are formed on the substrate 1 as shown in FIGS. 2 (c) and 3 (c). The angle formed by the pedestal 3 and the pedestal 3 or the angle formed by the surface 7a and the side surface 7b of the pedestal 7 is a bent shape depending on a right angle or an angle close to the right angle.

台座７の角部９に形成された屈曲部膜３ＢＣが、例えば、図４に示すように、基板５の表面５ａまたは台座７の表面７ａにそれぞれ平行な方向に配向した金属粒子３ａ（第１金属粒子３ａ１）だけで形成されるような組織の場合には、金属粒子３ａ同士が接触する部分が金属粒子３ａの先端部３ａｐ付近に限られることになる。金属粒子３ａ同士がこのような配列構造を成している場合には、金属粒子３ａ同士の接触面積が小さくなることから、屈曲部膜３ＢＣにおける導電率が低くなる。 As shown in FIG. 4, for example, the bent portion film 3BC formed on the corner portion 9 of the pedestal 7 is a metal particle 3a (first) oriented in a direction parallel to the surface 5a of the substrate 5 or the surface 7a of the pedestal 7. In the case of a structure formed only of the metal particles 3a1), the portion where the metal particles 3a come into contact with each other is limited to the vicinity of the tip portion 3ap of the metal particles 3a. When the metal particles 3a have such an arrangement structure, the contact area between the metal particles 3a becomes small, so that the conductivity of the bent portion film 3BC becomes low.

これに対し、本実施形態における屈曲部膜３Ｂ（３ＢＣ、３ＢＳ）は、図２（ｃ）および図３（ｃ）に示すように、基板５および台座７の表面５ａ、７ａに沿う方向に配向している第１金属粒子３ａ１の他に、移行部９または角部１１に対して法線方向（図２（ｃ）および図３（ｃ）において符号Ｌｎｓｔを付した線分）に向いている第２金属粒子３ａ２とともに、その法線方向に対して、第１金属粒子３ａ１と第２金属粒子３ａ２との間の角度を有するように向いている第３金属粒子３ａ３とを含む組織構造を取っている。このような場合には、金属粒子３ａ同士が、例えば、第１金属粒子３ａ１と第３金属粒子３ａ３、第３金属粒子３ａ３と第２金属粒子３ａ２と言った組み合わせのように、接触する角度が少しずつ異なる金属粒子３ａ同士で接触しているため、金属粒子３ａ同士の接触面積を大きくすることができる。これにより高い導電率を有する屈曲部膜３Ｂ（３ＢＣ、３ＢＳ）を形成することができる。 On the other hand, the bent portion film 3B (3BC, 3BS) in the present embodiment is oriented in the direction along the surfaces 5a and 7a of the substrate 5 and the pedestal 7 as shown in FIGS. 2 (c) and 3 (c). In addition to the first metal particles 3a1, the metal particles 3a1 are oriented in the normal direction (the line segment having the symbol Lnst in FIGS. 2 (c) and 3 (c)) with respect to the transition portion 9 or the corner portion 11. A structure including the second metal particles 3a2 and the third metal particles 3a3 that are oriented so as to have an angle between the first metal particles 3a1 and the second metal particles 3a2 with respect to the normal direction thereof is taken. ing. In such a case, the angles at which the metal particles 3a come into contact with each other are different, for example, in a combination of the first metal particles 3a1 and the third metal particles 3a3, and the third metal particles 3a3 and the second metal particles 3a2. Since the metal particles 3a that are slightly different from each other are in contact with each other, the contact area between the metal particles 3a can be increased. This makes it possible to form a bent portion film 3B (3BC, 3BS) having high conductivity.

また、本実施形態の回路基板Ａでは、基板５および台座７の表面５ａ、７ａが凹凸状を成す表面構造であっても良い。基板５および台座７の表面５ａ、７ａが凹凸状を成す場合には、図５（ｂ）に示すように、その凹凸状の表面５ａ、７ａに沿って金属粒子３ａが接着するようになるため、基材１の表面１ａ（基板５の表面５ａ、台座７の表面７ａ）と金属塗膜３との間にアンカーとなる凹凸が形成される。これにより基材１（基板５、台座７）と金属塗膜３との間の接着強度を高めることができる。この場合、基材１の表面１ａ付近（基板５の表面５ａ付近および／または台座７の表面７ａ表面付近）では、金属粒子３ａが基準線Ｌｓｔの方向からわずかに角度の付いた状態（基準線Ｌｓｔから金属塗膜３の厚み方向に向いている）であるため、金属塗膜３の中で金属粒子３ａ同士が絡み合った状態となる。これにより金属粒子３ａ同士の接着強度をさらに高めることができる。 Further, the circuit board A of the present embodiment may have a surface structure in which the surfaces 5a and 7a of the substrate 5 and the pedestal 7 have an uneven shape. When the surfaces 5a and 7a of the substrate 5 and the pedestal 7 have an uneven shape, as shown in FIG. 5B, the metal particles 3a adhere to the uneven surfaces 5a and 7a. An unevenness serving as an anchor is formed between the surface 1a of the base material 1 (the surface 5a of the substrate 5 and the surface 7a of the pedestal 7) and the metal coating film 3. As a result, the adhesive strength between the base material 1 (the substrate 5, the pedestal 7) and the metal coating film 3 can be increased. In this case, in the vicinity of the surface 1a of the base material 1 (near the surface 5a of the substrate 5 and / or near the surface 7a of the pedestal 7), the metal particles 3a are slightly angled from the direction of the reference line Lst (reference line). Since it is oriented in the thickness direction of the metal coating film 3 from Lst), the metal particles 3a are in an entangled state in the metal coating film 3. As a result, the adhesive strength between the metal particles 3a can be further increased.

この場合、基材１の表面１ａ（基板５の表面５ａ、台座７の表面７ａ）の表面粗さ（Ｒａ）は０．２〜０．５μｍであるのが良い。 In this case, the surface roughness (Ra) of the surface 1a of the base material 1 (the surface 5a of the substrate 5 and the surface 7a of the pedestal 7) is preferably 0.2 to 0.5 μm.

また、その基準線Ｌｓｔに対して、金属粒子３ａの長手方向の向いている角度が１０°以上である金属粒子３ａが配列した厚みの割合は、金属塗膜３の全体の厚みを１としたときに、その厚みの１／３以下であるのが良い。 Further, the ratio of the thickness of the metal particles 3a in which the metal particles 3a are oriented at an angle of 10 ° or more in the longitudinal direction with respect to the reference line Lst is set to 1 for the entire thickness of the metal coating film 3. Sometimes it is better to be less than 1/3 of its thickness.

基材１の表面１ａ（基板５の表面５ａ、台座７の表面７ａ）の表面粗さ（Ｒａ）が０．５μｍ以下であり、かつ金属粒子３ａの長手方向の向く角度が１０°以上である金属粒子３ａの配列した厚みの割合が、金属塗膜３の全体の厚みの１／３以下である場合には、金属塗膜３の界面抵抗を小さくできる。これにより高周波において導電率の高い回路基板Ａを得ることができる。 The surface roughness (Ra) of the surface 1a of the base material 1 (the surface 5a of the substrate 5 and the surface 7a of the pedestal 7) is 0.5 μm or less, and the angle of the metal particles 3a in the longitudinal direction is 10 ° or more. When the ratio of the arranged thicknesses of the metal particles 3a is 1/3 or less of the total thickness of the metal coating film 3, the interfacial resistance of the metal coating film 3 can be reduced. As a result, a circuit board A having high conductivity at high frequencies can be obtained.

本実施形態の電子回路装置Ｂは、上記回路基板Ａと、該回路基板Ａの金属塗膜３上に実装された電子部品１３とを備えるものである。 The electronic circuit device B of the present embodiment includes the circuit board A and an electronic component 13 mounted on the metal coating film 3 of the circuit board A.

電子回路装置Ｂは、これを構成する回路基板Ａが、上述のように、基材１と金属塗膜３との接着強度が高いことから、電子部品１３の実装時および長期使用において、高い実装信頼性の高い電子回路装置Ｂを得ることができる。また、金属塗膜３自体の導電率が高いことから、金属塗膜３のサイズ（配線幅および厚み）を小さくすることができるため、回路基板Ａの小型化および電子回路装置Ｂの小型化を図ることができる。 In the electronic circuit device B, since the circuit board A constituting the electronic circuit device B has a high adhesive strength between the base material 1 and the metal coating film 3 as described above, the electronic circuit device B has a high mounting strength during mounting and long-term use of the electronic component 13. A highly reliable electronic circuit device B can be obtained. Further, since the metal coating film 3 itself has high conductivity, the size (wiring width and thickness) of the metal coating film 3 can be reduced, so that the circuit board A can be downsized and the electronic circuit device B can be downsized. Can be planned.

回路基板Ａとなる試料（表１の試料１）を図７（ａ）（ｂ）（ｃ）に示す手順によって作製した。まず、（ａ）工程として示しているように、基材１となる樹脂シート２１ａを作製した。樹脂シート２１ａは、エポキシ樹脂とシリカ粒子とを配合したスラリをＰＥＴフィルム２２上に塗布しシート状に成形して作製した。スラリはエポキシ樹脂を２０質量
％、シリカ粒子を８０質量％の割合とし、エポキシ樹脂とシリカ粒子との混合体１００質量部に対し、硬化剤を１質量部添加した組成とした。樹脂シート２１ａの厚みは４００μｍに調整した。 A sample to be the circuit board A (Sample 1 in Table 1) was prepared by the procedure shown in FIGS. 7 (a), (b), and (c). First, as shown in step (a), a resin sheet 21a to be a base material 1 was produced. The resin sheet 21a was produced by applying a slurry containing an epoxy resin and silica particles onto a PET film 22 and molding it into a sheet. The slurry was composed of 20% by mass of epoxy resin and 80% by mass of silica particles, and 1 part by mass of a curing agent was added to 100 parts by mass of a mixture of epoxy resin and silica particles. The thickness of the resin sheet 21a was adjusted to 400 μm.

金属塗膜３となる導体パターン２１ｂには、銀粒子を含む導体ペーストを用いた。導体ペーストは、アスペクト比が平均で３の扁平状をした銀粒子をエポキシ樹脂中に分散させて調製した。 A conductor paste containing silver particles was used for the conductor pattern 21b to be the metal coating film 3. The conductor paste was prepared by dispersing flat silver particles having an average aspect ratio of 3 in an epoxy resin.

次に、作製した樹脂シート２１ａのＰＥＴフィルム２２と反対側の表面に導体ペーストを印刷して導体パターン２１ｂを形成した。こうして、幅が３００μｍ導体パターン２１ｂを有するパターンシート２１を得た。導体パターン２１ｂの厚みは５０μｍとなるように調整した。作製した樹脂シート２１ａのＰＥＴフィルム２２と反対側の表面の表面粗さ（Ｒａ）は０．５μｍであった。 Next, a conductor paste was printed on the surface of the produced resin sheet 21a opposite to the PET film 22 to form a conductor pattern 21b. In this way, a pattern sheet 21 having a conductor pattern 21b having a width of 300 μm was obtained. The thickness of the conductor pattern 21b was adjusted to be 50 μm. The surface roughness (Ra) of the surface of the produced resin sheet 21a opposite to that of the PET film 22 was 0.5 μm.

次に、（ｂ）（ｃ）工程に示しているように、作製したパターンシート２１に対してモールド用金型（２３、２５、符号２３ａは空間）を用いて加圧加熱を行い、図１（ａ）に示すような回路基板Ａの予備硬化体を作製した。加圧加熱処理の条件としては、大気中にて、最高温度を７５℃とし、圧力を１５ＭＰａに設定し、５０秒保持する条件を採用した。モールド用金型（２３、２５）には、基板の面積が１ｍｍ×１ｍｍ、基板の厚みが０．１５ｍｍ、台座の面積が０．３ｍｍ×０．３ｍｍ、台座の高さが０．１５ｍｍとなるものを使用した。 Next, as shown in steps (b) and (c), the produced pattern sheet 21 is pressurized and heated using a molding die (23, 25, reference numerals 23a are spaces), and FIG. A pre-cured body of the circuit board A as shown in (a) was produced. As the conditions for the pressure heat treatment, a condition was adopted in which the maximum temperature was set to 75 ° C., the pressure was set to 15 MPa, and the pressure was held for 50 seconds in the atmosphere. For the molds (23, 25), the area of the substrate is 1 mm × 1 mm, the thickness of the substrate is 0.15 mm, the area of the pedestal is 0.3 mm × 0.3 mm, and the height of the pedestal is 0.15 mm. I used the one.

作製した回路基板Ａは、モールド用金型（２３、２５）による加圧加熱によって、基材１とともに金属塗膜３が可塑変形し、基材１に形成された金属塗膜３の中で、平坦部膜３Ａは金属粒子（銀粒子）３ａが基材１の表面１ａに配向していた。一方、角部１１および移行部９の覆う屈曲部膜３Ｂは、基板５および台座７の表面５ａ、７ａに沿う方向に配向している第１金属粒子３ａ１と、角部１１または移行部９に対して法線方向に向いている第２金属粒子３ａ２と、法線方向に対して、第１金属粒子３ａ１と第２金属粒子３ａ２との間の範囲の角度を成すように向いている第３金属粒子３ａ３とが混在している状態となっていた。 In the produced circuit board A, the metal coating film 3 is plastically deformed together with the base material 1 by pressure heating by the molding dies (23, 25), and the metal coating film 3 formed on the base material 1 is contained in the metal coating film 3. In the flat portion film 3A, metal particles (silver particles) 3a were oriented toward the surface 1a of the base material 1. On the other hand, the bent portion film 3B covering the corner portion 11 and the transition portion 9 is formed on the first metal particles 3a1 oriented along the surfaces 5a and 7a of the substrate 5 and the pedestal 7 and the corner portion 11 or the transition portion 9. On the other hand, the second metal particles 3a2 facing the normal direction and the third metal particles 3a2 facing the normal direction form an angle in the range between the first metal particles 3a1 and the second metal particles 3a2. It was in a state where the metal particles 3a3 were mixed.

また、作製した回路基板Ａに形成された金属塗膜３は基材１（基板５および台座７）の表面５ａ、７ａに面一になるように埋設された状態であった。金属塗膜３の厚みは平均で３０μｍであった。次に、作製した予備硬化体を、大気中にて、最高温度２００℃、無加圧下にて、保持時間６時間の条件で硬化させて回路基板Ａとなる試料を作製した。 Further, the metal coating film 3 formed on the produced circuit board A was in a state of being embedded so as to be flush with the surfaces 5a and 7a of the base material 1 (the substrate 5 and the pedestal 7). The thickness of the metal coating film 3 was 30 μm on average. Next, the prepared pre-cured product was cured in the air at a maximum temperature of 200 ° C. under no pressure under the condition of a holding time of 6 hours to prepare a sample to be a circuit board A.

次に、作製した試料を研磨して、図１（ｂ）（ｃ）に示すような断面が露出する試料を作製した。この試料を用いて基材１の表面粗さ（Ｒａ）と金属塗膜３の金属粒子３ａの配列状態を観察した。観察には走査型電子顕微鏡を用いた。 Next, the prepared sample was polished to prepare a sample having an exposed cross section as shown in FIGS. 1 (b) and 1 (c). Using this sample, the surface roughness (Ra) of the base material 1 and the arrangement state of the metal particles 3a of the metal coating film 3 were observed. A scanning electron microscope was used for observation.

次に、作製した回路基板Ａの金属塗膜３の表面に銅箔（厚みが０．２ｍｍ）を半田付けし、リードプル試験用の試料を作製した。リードプル試験は引き上げ速度を１０ｍｍ／秒の条件で行った。試料数は各試料１０個とした。 Next, a copper foil (thickness: 0.2 mm) was soldered to the surface of the metal coating film 3 of the prepared circuit board A to prepare a sample for a lead-pull test. The lead-pull test was carried out under the condition of a pulling speed of 10 mm / sec. The number of samples was 10 for each sample.

次に、金属塗膜３の導電性を評価した。金属塗膜３の導電性は、回路基板Ａの試料に温度サイクル試験を行って、前後の抵抗変化率を測定して評価した。表１に示す抵抗変化率（Ｒｖ）は、温度サイクル試験前の抵抗値をＲ０、温度サイクル試験後の抵抗値をＲ１としたときに、（Ｒ１−Ｒ０）／Ｒ０（％）で表される。温度サイクル試験の条件はＪＥＤＥＣ規格を適用した。その条件は、温度範囲が−５５〜１２５℃、昇降温の回数が１０００回である。試料数は各試料２０個とした。 Next, the conductivity of the metal coating film 3 was evaluated. The conductivity of the metal coating film 3 was evaluated by performing a temperature cycle test on the sample of the circuit board A and measuring the resistance change rate before and after. The resistance change rate (Rv) shown in Table 1 is represented by (R1-R0) / R0 (%) when the resistance value before the temperature cycle test is R0 and the resistance value after the temperature cycle test is R1. .. The JEDEC standard was applied as the conditions for the temperature cycle test. The conditions are a temperature range of −55 to 125 ° C. and an ascending / descending temperature of 1000 times. The number of samples was 20 for each sample.

また、試料１よりも基材１の表面粗さ（Ｒａ）の小さい試料を試料２として作製した。試料２は、樹脂シートのＰＥＴフィルム側の表面に導体パターンを形成したパターンシートを用いて作製した。基材１の表面粗さ（Ｒａ）は０．１μｍであった。 Further, a sample having a smaller surface roughness (Ra) of the base material 1 than that of the sample 1 was prepared as the sample 2. Sample 2 was prepared using a pattern sheet in which a conductor pattern was formed on the surface of the resin sheet on the PET film side. The surface roughness (Ra) of the base material 1 was 0.1 μm.

また、基板５の移行部９および台座７の角部１１付近に存在する金属粒子３ａが互いに直行する構造の屈曲部膜３Ｂを有する回路基板Ａを試料３として作製し、同様の評価を行った。まず、導体パターン２１ｂを形成していない樹脂シート２１ａ（厚みは４００μｍ）を準備し、この樹脂シート２１ａに対してモールド用金型を用いて加圧加熱を行い、図７（ｃ）に示した符号１の部分である無垢の成形体を作製した。このときの加圧加熱の条件は、最初に、最高温度を７５℃とし、圧力を１５ＭＰａに設定し、５０秒保持する条件を採用した。この後、この成形体の表面に上記と同様に導体パターン２１ｂを印刷によって形成し、最後にラバープレスを行って試料を作製した。ラバープレスは最高温度が２００℃、保持時間を６時間とした。 Further, a circuit board A having a bent portion film 3B having a structure in which the metal particles 3a existing in the vicinity of the transition portion 9 of the substrate 5 and the corner portion 11 of the pedestal 7 are orthogonal to each other was prepared as a sample 3, and the same evaluation was performed. .. First, a resin sheet 21a (thickness: 400 μm) on which the conductor pattern 21b is not formed was prepared, and the resin sheet 21a was pressurized and heated using a molding die, and is shown in FIG. 7 (c). A solid molded product, which is a part of reference numeral 1, was produced. As the conditions for pressurization and heating at this time, first, the maximum temperature was set to 75 ° C., the pressure was set to 15 MPa, and the condition was adopted for holding for 50 seconds. After that, a conductor pattern 21b was formed on the surface of this molded product by printing in the same manner as described above, and finally a rubber press was performed to prepare a sample. The rubber press had a maximum temperature of 200 ° C. and a holding time of 6 hours.

比較例（試料４）として、導体パターンを形成していない樹脂シート（厚みは４００μｍ）を準備し、この樹脂シートに対してモールド用金型を用いて加圧加熱を行い、図７（ｃ）に示した符号２７の部分である無垢の成形体を作製した。このときの加圧加熱の条件は、最高温度を７５℃とし、圧力を１５ＭＰａに設定し、５０秒保持する条件を採用した。次いで、最高温度を２００℃、保持時間を６時間として熱処理を行った。この後、この成形体の表面に、図１（ａ）の構造となるように銀のめっき膜を銀鏡反応によって形成した。 As a comparative example (Sample 4), a resin sheet (thickness: 400 μm) on which a conductor pattern was not formed was prepared, and the resin sheet was pressurized and heated using a molding die, and FIG. 7 (c) was shown. A solid molded body, which is a part of reference numeral 27 shown in the above, was produced. As the conditions for pressurization and heating at this time, the maximum temperature was set to 75 ° C., the pressure was set to 15 MPa, and the condition was adopted for holding for 50 seconds. Next, heat treatment was performed with a maximum temperature of 200 ° C. and a holding time of 6 hours. After that, a silver plating film was formed on the surface of the molded product by a silver mirror reaction so as to have the structure shown in FIG. 1 (a).

Figure 0006791817
Figure 0006791817

表１に結果から明らかなように、金属塗膜として銀のめっき膜を形成した試料（試料４）は、抵抗変化率は最も小さかったが、接着強度が０．１ｋｇ／ｍｍ２と低かった。 As is clear from the results in Table 1, the sample (Sample 4) in which the silver plating film was formed as the metal coating film had the smallest resistance change rate, but the adhesive strength was as low as 0.1 kg / mm 2 .

これに対し、金属塗膜を銀粒子の導体ペーストを用いて作製した試料（試料１〜３）は、抵抗変化率が５〜１５％、接着強度が０．３〜０．５Ｋｇ／ｍｍ２であった。 On the other hand, the samples (Samples 1 to 3) prepared by preparing the metal coating film using the conductor paste of silver particles had a resistance change rate of 5 to 15% and an adhesive strength of 0.3 to 0.5 kg / mm 2 . there were.

この中で、基材の表面粗さ（Ｒａ）を０．５μｍに調整した試料（試料１）は、接着強度が基材の表面粗さ（Ｒａ）を０．１μｍの試料（試料２）よりも高い値を示した。 Among these, the sample (Sample 1) in which the surface roughness (Ra) of the base material was adjusted to 0.5 μm is higher than the sample (Sample 2) having an adhesive strength of 0.1 μm in the surface roughness (Ra) of the base material. Also showed a high value.

Ａ・・・・・・・回路基板
Ｂ・・・・・・・電子回路装置
１・・・・・・・基材
１ａ・・・・・・（基材の）表面
３・・・・・・・金属塗膜
３ａ・・・・・・金属粒子
３ａ１・・・・・第１金属粒子
３ａ２・・・・・第２金属粒子
３ａ３・・・・・第３金属粒子
３ｂ・・・・・・樹脂成分
３Ａ・・・・・・平坦部膜
３Ｂ・・・・・・屈曲部膜
５・・・・・・・基板
５ａ・・・・・・（基板の）表面
７・・・・・・・台座
７ａ・・・・・・（台座の）表面
９・・・・・・・移行部
１１・・・・・・角部
１３・・・・・・電子部品
２１ａ・・・・・樹脂シート
２１ｂ・・・・・導体パターン
２２・・・・・・ＰＥＴフィルム
２３、２５・・・モールド用金型 A ... Circuit board B ... Electronic circuit device 1 ... Base material 1a ... Surface 3 (of the base material)・ ・ Metal coating film 3a ・ ・ ・ ・ ・ ・ Metal particles 3a1 ・ ・ ・ ・ ・ First metal particles 3a2 ・ ・ ・ ・ ・ Second metal particles 3a3 ・ ・ ・ ・ ・ Third metal particles 3b ・ ・ ・ ・ ・・ Resin component 3A ・ ・ ・ ・ ・ ・ Flat part film 3B ・ ・ ・ ・ ・ ・ Bent part film 5 ・ ・ ・ ・ ・ ・ Substrate 5a ・ ・ ・ ・ ・ ・ ・ ・ Surface 7 (of the substrate)・ ・ Pedestal 7a ・ ・ ・ ・ ・ ・ Surface 9 ・ ・ ・ ・ ・ ・ Transition part 11 ・ ・ ・ ・ ・ ・ Corner part 13 ・ ・ ・ ・ ・ ・ Electronic parts 21a ・ ・ ・ ・ ・ Resin Sheet 21b ・ ・ ・ ・ ・ Conductor pattern 22 ・ ・ ・ ・ ・ ・ PET film 23, 25 ・ ・ ・ Mold for molding

Claims (3)

平板状の基板と、該基板のおもて面から突出した台座と、
前記基板の表面から前記台座の表面にかけて配置された金属塗膜と、を有し、
前記基板および前記台座は有機樹脂を母材とし、
前記金属塗膜は針状または扁平状の金属粒子と樹脂成分とを含んでおり、
前記金属塗膜のうち、前記基板および前記台座の表面が平坦な部位に配置された部分を平坦部膜としたときに、前記平坦部膜を構成する前記金属粒子は前記基板および前記台座の表面に沿う方向に配向しており、
前記金属塗膜のうち、前記基板および前記台座のそれぞれの角部、ならびに前記基板から前記台座に移る移行部に配置された部分を屈曲部膜としたときに、該屈曲部膜中には、前記金属粒子が、前記基板および前記台座の表面に沿う方向に配向している第１金属粒子、前記角部または前記移行部に対して法線方向に向いている第２金属粒子、および前記法線方向に対して前記第１金属粒子と前記第２金属粒子との間の範囲の角度を成すように向いている第３金属粒子として存在している、回路基板。 A flat substrate and a pedestal protruding from the front surface of the substrate,
It has a metal coating film arranged from the surface of the substrate to the surface of the pedestal.
The substrate and the pedestal are made of an organic resin as a base material.
The metal coating film contains needle-like or flat metal particles and a resin component.
When a portion of the metal coating film in which the surfaces of the substrate and the pedestal are arranged on a flat portion is used as a flat portion film, the metal particles constituting the flat portion film are the surfaces of the substrate and the pedestal. It is oriented in a direction along the,
When the corners of the substrate and the pedestal and the portion arranged at the transition portion from the substrate to the pedestal of the metal coating film are used as the bent portion film, the bent portion film contains the bent portion film. The first metal particles in which the metal particles are oriented along the surfaces of the substrate and the pedestal, the second metal particles in the normal direction with respect to the corner portion or the transition portion, and the method. A circuit board that exists as a third metal particle that is oriented so as to form an angle in the range between the first metal particle and the second metal particle with respect to the linear direction . 前記基板および前記台座の表面が凹凸状を成している、請求項１に記載の回路基板。 The circuit board according to claim 1, wherein the surface of the substrate and the pedestal is uneven. 請求項１または２に記載の回路基板と、該回路基板の表面の金属塗膜上に実装された電子部品とを備える、電子回路装置。 An electronic circuit device comprising the circuit board according to claim 1 or 2 and an electronic component mounted on a metal coating film on the surface of the circuit board.
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