JP6783987B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP6783987B2 JP6783987B2 JP2017038517A JP2017038517A JP6783987B2 JP 6783987 B2 JP6783987 B2 JP 6783987B2 JP 2017038517 A JP2017038517 A JP 2017038517A JP 2017038517 A JP2017038517 A JP 2017038517A JP 6783987 B2 JP6783987 B2 JP 6783987B2
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 108
- 238000009877 rendering Methods 0.000 claims description 25
- 238000011156 evaluation Methods 0.000 description 11
- 238000002156 mixing Methods 0.000 description 11
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000000295 emission spectrum Methods 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 5
- 239000012190 activator Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- GXGJIOMUZAGVEH-UHFFFAOYSA-N Chamazulene Chemical group CCC1=CC=C(C)C2=CC=C(C)C2=C1 GXGJIOMUZAGVEH-UHFFFAOYSA-N 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Description
(発光装置の構成)
図1は、実施の形態に係る発光装置1の垂直断面図である。発光装置1は、凹部10aを有するケース10と、凹部10aの底部に露出するようにケース10に含まれるリードフレーム11と、リードフレーム11上に搭載された発光素子12と、リードフレーム11と発光素子12の電極を電気的に接続するボンディングワイヤー13と、凹部10a内に充填され、発光素子12を封止する封止樹脂14と、封止樹脂14中に含まれる粒子状の蛍光体15とを有する。
上記の実施の形態によれば、従来の発光装置よりも夕方の太陽光に近い演色性に優れた光を発する発光装置を提供することができる。
10 ケース
11 リードフレーム
12 発光素子
13 ボンディングワイヤー
14 封止樹脂
15 蛍光体
Claims (4)
- 445nm以上かつ490nm以下のピーク波長を有する蛍光を発する第1の蛍光体と、
491nm以上かつ600nm以下のピーク波長を有する蛍光を発する第2の蛍光体と、
601nm以上かつ670nm以下のピーク波長を有する蛍光を発する第3の蛍光体と、
前記第1の蛍光体の発する蛍光のピーク波長よりも短波長側にピーク波長を有する光を発する発光素子と、
を有し、
前記第1の蛍光体、前記第2の蛍光体、及び前記第3の蛍光体の質量の合計に対する、前記第1の蛍光体の質量の割合x、前記第2の蛍光体の質量の割合y、前記第3の蛍光体の質量の割合zが、0.586≦x≦0.734、0.017≦y≦0.081、0.239≦z≦0.384、x+y+z=1を満たし、
色温度が2800〜3200Kの光を基準光としたときの演色評価数Rf、RgがそれぞれRf≧85、93≦Rg≦107を満たす光を発する、
発光装置。 - 前記x、前記y、及び前記zが、0.664≦x≦0.734、0.017≦y≦0.047、0.239≦z≦0.288を満たす、
請求項1に記載の発光装置。 - 色温度が2800〜3200Kの光を基準光としたときの演色評価数Rf、RgがそれぞれRf≧94、99≦Rg≦101を満たす光を発する、
請求項2に記載の発光装置。 - 前記第1の蛍光体が、アルカリ土類ハロリン酸塩蛍光体を含み、
前記第2の蛍光体が、β−サイアロン蛍光体を含み、
前記第3の蛍光体が、CASON蛍光体を含む、
請求項1〜3のいずれか1項に記載の発光装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017038517A JP6783987B2 (ja) | 2017-03-01 | 2017-03-01 | 発光装置 |
US15/820,142 US10134959B2 (en) | 2017-03-01 | 2017-11-21 | Light emitting device excellent in color rendering property for emitting light closer to sunlight |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017038517A JP6783987B2 (ja) | 2017-03-01 | 2017-03-01 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018147929A JP2018147929A (ja) | 2018-09-20 |
JP6783987B2 true JP6783987B2 (ja) | 2020-11-11 |
Family
ID=63355850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017038517A Active JP6783987B2 (ja) | 2017-03-01 | 2017-03-01 | 発光装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10134959B2 (ja) |
JP (1) | JP6783987B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018093161A (ja) * | 2016-12-02 | 2018-06-14 | 豊田合成株式会社 | 発光装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2020053664A (ja) * | 2018-09-20 | 2020-04-02 | 豊田合成株式会社 | 発光装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100655894B1 (ko) * | 2004-05-06 | 2006-12-08 | 서울옵토디바이스주식회사 | 색온도 및 연색성이 우수한 파장변환 발광장치 |
JP2007204730A (ja) * | 2005-09-06 | 2007-08-16 | Sharp Corp | 蛍光体及び発光装置 |
JP2008274254A (ja) * | 2007-03-30 | 2008-11-13 | Mitsubishi Chemicals Corp | 蛍光体及びその製造方法、蛍光体含有組成物、発光装置、並びに画像表示装置及び照明装置 |
JP4930649B1 (ja) * | 2011-02-25 | 2012-05-16 | 三菱化学株式会社 | ハロリン酸塩蛍光体、及び白色発光装置 |
CN102959743B (zh) * | 2010-09-16 | 2015-06-17 | 株式会社东芝 | 发光装置和led灯泡 |
JP6384302B2 (ja) | 2014-12-05 | 2018-09-05 | 日亜化学工業株式会社 | 発光装置 |
CN105552198B (zh) * | 2016-01-25 | 2018-04-13 | 深圳市聚飞光电股份有限公司 | 一种使用MxSr1‑xTiO3:Eu2+,Mn2+蓝光荧光粉的高色域白光LED实现方法 |
JP6106307B2 (ja) | 2016-04-12 | 2017-03-29 | シャープ株式会社 | 発光装置、並びに、当該発光装置を用いた照明器具及び表示装置 |
-
2017
- 2017-03-01 JP JP2017038517A patent/JP6783987B2/ja active Active
- 2017-11-21 US US15/820,142 patent/US10134959B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018093161A (ja) * | 2016-12-02 | 2018-06-14 | 豊田合成株式会社 | 発光装置 |
Also Published As
Publication number | Publication date |
---|---|
US10134959B2 (en) | 2018-11-20 |
JP2018147929A (ja) | 2018-09-20 |
US20180254387A1 (en) | 2018-09-06 |
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