JP6781523B2 - スイッチから構成されるパワーモジュールの動作を制御するためのシステムおよび方法 - Google Patents
スイッチから構成されるパワーモジュールの動作を制御するためのシステムおよび方法 Download PDFInfo
- Publication number
- JP6781523B2 JP6781523B2 JP2017501423A JP2017501423A JP6781523B2 JP 6781523 B2 JP6781523 B2 JP 6781523B2 JP 2017501423 A JP2017501423 A JP 2017501423A JP 2017501423 A JP2017501423 A JP 2017501423A JP 6781523 B2 JP6781523 B2 JP 6781523B2
- Authority
- JP
- Japan
- Prior art keywords
- die
- power
- temperature
- controller
- controlling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
- H03K17/0822—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit in field-effect transistor switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/12—Modifications for increasing the maximum permissible switched current
- H03K17/122—Modifications for increasing the maximum permissible switched current in field-effect transistor switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/14—Modifications for compensating variations of physical values, e.g. of temperature
- H03K17/145—Modifications for compensating variations of physical values, e.g. of temperature in field-effect transistor switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/01—Details
- H03K3/011—Modifications of generator to compensate for variations in physical values, e.g. voltage, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0003—Details of control, feedback or regulation circuits
- H02M1/0009—Devices or circuits for detecting current in a converter
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
- H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Conversion In General (AREA)
- Electronic Switches (AREA)
- Dc-Dc Converters (AREA)
- Inverter Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
パワーダイの温度を検知する温度センサと、
パワーダイの検知された温度が、少なくとも1つのスイッチのパワーダイにわたる平均ダイ温度より高い場合には、ダイの導通時間を短縮するコントローラーと、
を備えることを特徴とする、デバイスに関する。
パワーダイの温度を検知するステップと、
パワーダイの検知された温度が少なくとも1つのスイッチのパワーダイにわたる平均ダイ温度より高い場合には、ダイの導通時間を短縮するステップと、
を含むことを特徴とする、方法に関する。
パワーダイを通って流れる電流を検知する電流センサと、
検知された電流が所定の電流閾値より高い場合には、パワーダイに与えられる信号を遮断するゲート遮断回路と、
をさらに備える。
Claims (8)
- スイッチから構成されるパワーモジュールの動作を制御するためのシステムであって、各スイッチは、並列に接続される複数のパワーダイから構成され、
該システムは、
前記パワーモジュールのパワーダイごとに前記パワーダイの温度を検知する温度センサと、
前記パワーダイの前記検知された温度に基づいて、前記パワーダイの導通時間を短縮する1つのコントローラーと
を備え、
前記1つのコントローラーによって、前記複数のパワーダイのそれぞれの温度検知結果を入力として取得し、前記検知された温度が、前記複数のパワーダイ全てにわたる平均ダイ温度より高いパワーダイに関して前記導通時間を短縮する制御を行う
ことを特徴とする、システム。 - 前記システムは、
前記パワーダイを通って流れる電流を検知する電流センサと、
検知された前記電流が所定の電流閾値より高い場合には、前記パワーダイに与えられる信号を遮断するゲート遮断回路と
をさらに備えることを特徴とする、請求項1に記載のシステム。 - 前記パワーダイの前記導通時間は、前記パワーダイに与えられる信号のデューティサイクルを変更することによって短縮されることを特徴とする、請求項1または2に記載のシステム。
- 前記信号は、ゲーティング信号であることを特徴とする、請求項3に記載のシステム。
- 前記システムは、前記検知された温度を変換するアナログ/デジタルコンバーターと、
前記検知された温度をスケーリングするスケーリングデバイスと
をさらに備えることを特徴とする、請求項1から4のいずれか1項に記載のシステム。 - 各パワーダイに与えられる信号は、それぞれの増幅器によって与えられることを特徴とする、請求項3から5のいずれか1項に記載のシステム。
- 前記1つのコントローラーは、ホストコントローラーによって与えられるデューティサイクルを変更することを特徴とする、請求項1または2に記載のシステム。
- スイッチから構成されるパワーモジュールの動作を制御するための方法であって、
各スイッチは、並列に接続される複数のパワーダイから構成され、
該方法は、1つのコントローラーにより前記パワーモジュールのパワーダイごとに実行され、
前記パワーダイの温度を検知するステップと、
前記パワーダイの前記検知された温度に基づいて、前記パワーダイの導通時間を短縮するステップと
を含み、
前記パワーダイの導通時間を短縮するステップは、前記1つのコントローラーによって、前記複数のパワーダイのそれぞれの温度検知結果を入力として取得し、前記検知された温度が、前記複数のパワーダイ全てにわたる平均ダイ温度より高いパワーダイに関して前記導通時間を短縮する制御を行う
ことを特徴とする、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14194940.4 | 2014-11-26 | ||
EP14194940.4A EP3026801B1 (en) | 2014-11-26 | 2014-11-26 | Device for controlling the operation of a multi-die power module |
PCT/JP2015/005657 WO2016084324A1 (en) | 2014-11-26 | 2015-11-12 | Device and method for controlling operation of power module composed of switches |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017521989A JP2017521989A (ja) | 2017-08-03 |
JP6781523B2 true JP6781523B2 (ja) | 2020-11-04 |
Family
ID=52006850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017501423A Active JP6781523B2 (ja) | 2014-11-26 | 2015-11-12 | スイッチから構成されるパワーモジュールの動作を制御するためのシステムおよび方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10707744B2 (ja) |
EP (1) | EP3026801B1 (ja) |
JP (1) | JP6781523B2 (ja) |
CN (1) | CN107005143A (ja) |
WO (1) | WO2016084324A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3208921B1 (en) * | 2016-02-16 | 2019-04-17 | Mitsubishi Electric R&D Centre Europe B.V. | A system and a method for controlling the operation of a multi-die power module |
EP3336499B1 (en) * | 2016-12-16 | 2019-12-11 | Mitsubishi Electric R & D Centre Europe B.V. | Method for controlling the temperature of a multi-die power module |
EP3382357B1 (en) * | 2017-03-31 | 2021-03-24 | Mitsubishi Electric R & D Centre Europe B.V. | Device and a method for controlling the temperature of a multi-die power module |
CN107248775B (zh) * | 2017-07-07 | 2021-05-14 | 维沃移动通信有限公司 | 一种无线充电方法和移动终端 |
EP3772168A1 (en) * | 2019-08-02 | 2021-02-03 | Schneider Electric Industries SAS | Detection of a failure of a power module based on operating conditions |
EP3923432B1 (en) * | 2020-06-11 | 2023-03-01 | Mitsubishi Electric R&D Centre Europe B.V. | Open-circuit self-diagnostic method for modular general purpose inverters |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000116149A (ja) | 1998-10-06 | 2000-04-21 | Meidensha Corp | 高周波電源装置 |
US7839201B2 (en) * | 2005-04-01 | 2010-11-23 | Raytheon Company | Integrated smart power switch |
JP5226248B2 (ja) * | 2006-08-02 | 2013-07-03 | ルネサスエレクトロニクス株式会社 | 温度検出回路及び半導体装置 |
JP2009148032A (ja) * | 2007-12-12 | 2009-07-02 | Tdk-Lambda Corp | 並列電源システム |
US7834598B1 (en) * | 2007-12-21 | 2010-11-16 | Maxim Integrated Products, Inc. | Thermally optimized architecture for switching regulators |
US8260474B2 (en) * | 2009-09-25 | 2012-09-04 | Intel Corporation | Sensor-based thermal specification enabling a real-time metric for compliance |
US8456096B2 (en) * | 2010-02-11 | 2013-06-04 | Dongbu Hitek Co., Ltd. | Thermally controlled driver/switching regulator, and methods of controlling and/or regulating a driver and/or switching regulator |
US20130038140A1 (en) | 2010-04-28 | 2013-02-14 | Honda Motor Co., Ltd. | Switching circuit |
US9088215B2 (en) * | 2011-06-08 | 2015-07-21 | Futurewei Technologies, Inc. | Power converter package structure and method |
CN202587484U (zh) * | 2012-03-14 | 2012-12-05 | 深圳市兆驰节能照明有限公司 | Led温度补偿控制电路 |
WO2014041922A1 (ja) * | 2012-09-14 | 2014-03-20 | 住友重機械工業株式会社 | 掘削機 |
CN103715863B (zh) * | 2012-09-29 | 2016-12-21 | 艾默生网络能源有限公司 | 一种变换器及其功率器件的均热控制方法 |
-
2014
- 2014-11-26 EP EP14194940.4A patent/EP3026801B1/en active Active
-
2015
- 2015-11-12 JP JP2017501423A patent/JP6781523B2/ja active Active
- 2015-11-12 CN CN201580063312.XA patent/CN107005143A/zh active Pending
- 2015-11-12 US US15/523,141 patent/US10707744B2/en active Active
- 2015-11-12 WO PCT/JP2015/005657 patent/WO2016084324A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US10707744B2 (en) | 2020-07-07 |
EP3026801B1 (en) | 2021-03-10 |
JP2017521989A (ja) | 2017-08-03 |
US20170324318A1 (en) | 2017-11-09 |
WO2016084324A1 (en) | 2016-06-02 |
CN107005143A (zh) | 2017-08-01 |
EP3026801A1 (en) | 2016-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6781523B2 (ja) | スイッチから構成されるパワーモジュールの動作を制御するためのシステムおよび方法 | |
DK177863B1 (en) | Intelligent gate drive unit | |
EP3447918B1 (en) | Multi-stage gate turn-off with dynamic timing | |
EP2445110B1 (en) | Gate driver unit for electrical switching device | |
EP2911191B1 (en) | Thermally balanced parallel operation of transistors | |
US9035689B2 (en) | Thermal controller for semiconductor switching power devices | |
EP2568268A1 (en) | Method for estimating the temperature of a semiconductor chip | |
US8363440B2 (en) | Power conversion circuit having off-voltage control circuit | |
US20170358512A1 (en) | Semiconductor device | |
US20170054439A1 (en) | Cooperative control method for power semiconductor elements connected in parallel, current balance control device, and power module | |
JP4786305B2 (ja) | インバータ | |
JP6452831B2 (ja) | マルチダイパワーモジュールを備えるシステム、及びマルチダイパワーモジュールのスイッチングを制御する方法 | |
CN107735950B (zh) | 包括多晶片功率模块的***和用于控制多晶片功率模块的操作的方法 | |
Ewanchuk et al. | A gate driver based approach to improving the current density in a power module by equalizing the individual die temperatures | |
KR102091397B1 (ko) | 멀티 다이 파워 모듈의 동작을 제어하는 방법 및 디바이스 | |
JP6430026B2 (ja) | マルチダイパワーモジュールを備えるシステム、およびマルチダイパワーモジュールの動作を制御する方法 | |
US20140145520A1 (en) | Circuit arrangement having a semiconductor switch and an associated actuation circuit | |
JP7099153B2 (ja) | 電力変換装置 | |
KR101898164B1 (ko) | 오프셋 제어에 의한 제로 전류 감지 센서 및 그 방법 | |
CN105553454A (zh) | 用于在重复热应力下操作的功率器件的改善的可靠性的方法和电路 | |
US11435395B2 (en) | Circuit and method to detect defects in a power switching device | |
WO2018100647A1 (ja) | ゲート駆動回路 | |
CN115004527A (zh) | 功率转换装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170112 Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170111 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170111 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180327 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20181113 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190115 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190611 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190911 |
|
C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20190911 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20190924 |
|
C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20191001 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191112 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191226 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20200522 |
|
C211 | Notice of termination of reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C211 Effective date: 20200526 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20200609 |
|
C302 | Record of communication |
Free format text: JAPANESE INTERMEDIATE CODE: C302 Effective date: 20200715 |
|
C13 | Notice of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: C13 Effective date: 20200728 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200730 |
|
C23 | Notice of termination of proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C23 Effective date: 20200908 |
|
C03 | Trial/appeal decision taken |
Free format text: JAPANESE INTERMEDIATE CODE: C03 Effective date: 20201013 |
|
C30A | Notification sent |
Free format text: JAPANESE INTERMEDIATE CODE: C3012 Effective date: 20201013 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201015 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6781523 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |