JP6761901B2 - 作業システム - Google Patents
作業システム Download PDFInfo
- Publication number
- JP6761901B2 JP6761901B2 JP2019515035A JP2019515035A JP6761901B2 JP 6761901 B2 JP6761901 B2 JP 6761901B2 JP 2019515035 A JP2019515035 A JP 2019515035A JP 2019515035 A JP2019515035 A JP 2019515035A JP 6761901 B2 JP6761901 B2 JP 6761901B2
- Authority
- JP
- Japan
- Prior art keywords
- feeder
- work
- loader
- control device
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/086—Supply management, e.g. supply of components or of substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0495—Mounting of components, e.g. of leadless components having a plurality of work-stations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/0895—Maintenance systems or processes, e.g. indicating need for maintenance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
Claims (4)
- 基板搬送ラインに沿って搬送される基板に対して所定の作業を行なう作業システムであって、
前記基板搬送ラインに沿って整列された複数の作業装置と、
干渉物の有無を検知するセンサを有し、該センサにより干渉物の有無を検知しながら前記基板搬送ラインと平行に移動して前記複数の作業装置に対してそれぞれ必要な部材を補給する補給装置と、
前記複数の作業装置のうち少なくとも1つを前記基板搬送ラインに沿う方向と直交する方向に引き出す引出装置と、
を備え、
前記補給装置は、前記作業装置の引き出し要請がなされたとき、前記センサの検知範囲が引き出し対象の作業装置の引き出し位置を含む位置まで移動して前記センサにより干渉物が検知されるか否かを判定し、干渉物が検知されない場合に前記引き出し対象の作業装置が引き出されるよう前記引出装置に直接または間接に信号を出力する自動引き出し処理を行なう、
作業システム。 - 請求項1記載の作業システムであって、
前記基板搬送ラインにおける最上流または最下流に、前記補給装置が補給する部材を保管するための部材保管庫を備え、
前記補給装置は、前記作業装置の引き出し要請がなされたとき、前記引き出し対象の作業装置の引き出し位置よりも前記部材保管庫側の位置であって前記センサの検知範囲が引き出し対象の作業装置の引き出し位置を含む位置に移動して前記センサにより干渉物が検知されるか否かを判定する、
作業システム。 - 請求項1または2記載の作業システムであって、
前記補給装置は、前記引き出し対象の作業装置が複数存在する場合、前記基板搬送ラインの上流側から下流側へ向かって又は下流側から上流側へ向かって一方向に移動しながら各引き出し対象の作業装置に対して前記自動引き出し処理を実行する、
作業システム。 - 請求項1ないし3いずれか1項に記載の作業システムであって、
前記引き出し要請は、段取り替えが発生したこと又は前記複数の作業装置のいずれかにエラーが発生したことに基づいてなされる、
作業システム。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/016996 WO2018198333A1 (ja) | 2017-04-28 | 2017-04-28 | 作業システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018198333A1 JPWO2018198333A1 (ja) | 2019-12-12 |
JP6761901B2 true JP6761901B2 (ja) | 2020-09-30 |
Family
ID=63918094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019515035A Active JP6761901B2 (ja) | 2017-04-28 | 2017-04-28 | 作業システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US10856461B2 (ja) |
EP (1) | EP3618599B1 (ja) |
JP (1) | JP6761901B2 (ja) |
CN (1) | CN110521294A (ja) |
WO (1) | WO2018198333A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019087392A1 (ja) * | 2017-11-06 | 2019-05-09 | 株式会社Fuji | 部品実装ライン |
EP3937606B1 (en) * | 2019-03-05 | 2023-04-26 | Fuji Corporation | Component mounting system |
CN113519207B (zh) * | 2019-03-12 | 2022-09-27 | 株式会社富士 | 管理装置、移动型作业装置、安装***以及管理方法 |
JP2021077792A (ja) * | 2019-11-12 | 2021-05-20 | 株式会社Fuji | 部品装着機 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4969256A (en) * | 1988-11-25 | 1990-11-13 | Matsushita Electric Industrial Co., Ltd. | Method of mounting electronic parts to circuit board |
JP3446844B2 (ja) * | 1994-07-29 | 2003-09-16 | 株式会社日立ハイテクインスツルメンツ | 作業装置 |
JPH11150399A (ja) * | 1997-11-19 | 1999-06-02 | Matsushita Electric Ind Co Ltd | 電子部品実装用装置 |
JP4320204B2 (ja) | 2002-07-19 | 2009-08-26 | 富士機械製造株式会社 | 対基板作業システム |
CN100508721C (zh) | 2002-06-25 | 2009-07-01 | 富士机械制造株式会社 | 对基板作业*** |
JP4767834B2 (ja) * | 2006-12-20 | 2011-09-07 | パナソニック株式会社 | 部品実装システムおよび部品実装ユニットの配列変更方法 |
JP5844171B2 (ja) * | 2012-02-02 | 2016-01-13 | 富士機械製造株式会社 | 対基板作業システム |
KR102266001B1 (ko) * | 2012-06-28 | 2021-06-16 | 유니버셜 인스트루먼츠 코퍼레이션 | 융통성 있는 조립 기계, 시스템 및 방법 |
EP3419403A1 (en) * | 2012-07-13 | 2018-12-26 | FUJI Corporation | Component mounting system |
WO2015121976A1 (ja) * | 2014-02-14 | 2015-08-20 | 富士機械製造株式会社 | フィーダー交換装置 |
EP3344027B1 (en) * | 2015-08-25 | 2022-12-14 | FUJI Corporation | Component mounting line |
-
2017
- 2017-04-28 JP JP2019515035A patent/JP6761901B2/ja active Active
- 2017-04-28 US US16/603,371 patent/US10856461B2/en active Active
- 2017-04-28 WO PCT/JP2017/016996 patent/WO2018198333A1/ja active Application Filing
- 2017-04-28 EP EP17906978.6A patent/EP3618599B1/en active Active
- 2017-04-28 CN CN201780089807.9A patent/CN110521294A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
EP3618599A1 (en) | 2020-03-04 |
US10856461B2 (en) | 2020-12-01 |
CN110521294A (zh) | 2019-11-29 |
EP3618599B1 (en) | 2022-03-23 |
EP3618599A4 (en) | 2020-04-22 |
US20200037480A1 (en) | 2020-01-30 |
WO2018198333A1 (ja) | 2018-11-01 |
JPWO2018198333A1 (ja) | 2019-12-12 |
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