JP6741276B2 - 埋め込まれた不正開封反応センサを含む回路基板および電子パッケージ - Google Patents
埋め込まれた不正開封反応センサを含む回路基板および電子パッケージ Download PDFInfo
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- JP6741276B2 JP6741276B2 JP2018511403A JP2018511403A JP6741276B2 JP 6741276 B2 JP6741276 B2 JP 6741276B2 JP 2018511403 A JP2018511403 A JP 2018511403A JP 2018511403 A JP2018511403 A JP 2018511403A JP 6741276 B2 JP6741276 B2 JP 6741276B2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/16—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying resistance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0275—Security details, e.g. tampering prevention or detection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/86—Secure or tamper-resistant housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Security & Cryptography (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Description
Claims (14)
- 電子回路であって、
多層回路基板と、
前記多層回路基板内に埋め込まれた不正開封反応センサと
を備え、
前記不正開封反応センサが、前記多層回路基板に関連付けられた安全な空間を少なくとも部分的に定め、前記多層回路基板内の複数の不正開封反応層を備え、
前記複数の不正開封反応層のうちの少なくとも1つの不正開封反応層が、複数の個別の不正開封反応回路ゾーンを含み、前記複数の個別の不正開封反応回路ゾーンを含んでいる前記少なくとも1つの不正開封反応層が、前記安全な空間内のモニタ回路に電気的に接続される、電子回路。 - 電子回路であって、
多層回路基板と、
前記多層回路基板内に埋め込まれた不正開封反応センサと
を備え、
前記不正開封反応センサが、前記多層回路基板に関連付けられた安全な空間を少なくとも部分的に定め、前記多層回路基板内の複数の不正開封反応層を備え、
前記複数の不正開封反応層のうちの少なくとも2つの不正開封反応層がそれぞれ、複数の個別の不正開封反応回路ゾーンを含み、前記少なくとも2つの不正開封反応層のうちの異なる不正開封反応層内の少なくとも2つの不正開封反応回路ゾーンが、前記安全な空間内の共通のモニタ回路に電気的に接続される、電子回路。 - 電子回路であって、
多層回路基板と、
前記多層回路基板内に埋め込まれた不正開封反応センサと
を備え、
前記不正開封反応センサが、前記多層回路基板に関連付けられた安全な空間を少なくとも部分的に定め、前記多層回路基板内の複数の不正開封反応層を備え、
前記安全な空間が前記多層回路基板内で少なくとも部分的に定められ、
前記複数の不正開封反応層のうちの少なくとも1つの不正開封反応層が、前記多層回路基板内の前記安全な空間を少なくとも部分的に定める少なくとも1つの不正開封反応フレームである、電子回路。 - 前記複数の不正開封反応層のうちの少なくとも1つの他の不正開封反応層が、少なくとも1つの不正開封反応マット層を含み、前記少なくとも1つの不正開封反応フレームが、前記少なくとも1つの不正開封反応マット層の上の前記多層回路基板内に配置され、前記少なくとも1つの不正開封反応フレームが、前記多層回路基板内に延びる前記安全な空間の側面を定め、前記少なくとも1つの不正開封反応マット層が、前記多層回路基板内の前記安全な空間のベース部分を定める、請求項3に記載の電子回路。
- 前記多層回路基板が、前記多層回路基板内に埋め込まれた外部信号層を含み、前記外部信号層が、前記安全な空間内の少なくとも1つの電子コンポーネントに電気的に接続され、かつ、前記少なくとも1つの不正開封反応マット層の上に少なくとも部分的に存在する、請求項4に記載の電子回路。
- 前記複数の不正開封反応層のうちの少なくとも2つの不正開封反応層が、少なくとも2つの不正開封反応フレームであり、前記少なくとも2つの不正開封反応フレームが、前記多層回路基板内に延びている前記安全な空間の外縁を少なくとも部分的に定める、請求項3に記載の電子回路。
- 前記安全な空間が前記多層回路基板内に少なくとも部分的に延び、前記多層回路基板内に埋め込まれた前記不正開封反応センサが、前記多層回路基板内の前記安全な空間の外縁を定める、請求項1〜3のいずれか1項に記載の電子回路。
- 電子パッケージであって、
多層回路基板と、
前記多層回路基板に関連付けられた少なくとも1つの電子コンポーネントと、
前記多層回路基板に取り付けられ、前記多層回路基板に関連付けられた安全な空間を定めることを容易にする筐体であって、前記少なくとも1つの電子コンポーネントが前記安全な空間内に存在する、前記筐体と、
前記多層回路基板内に埋め込まれた不正開封反応センサであって、前記不正開封反応センサが、前記多層回路基板に関連付けられた前記安全な空間を少なくとも部分的に定める、前記不正開封反応センサと
を備え、
前記不正開封反応センサが、前記多層回路基板内の複数の不正開封反応層を備え、
前記複数の不正開封反応層のうちの少なくとも1つの不正開封反応層が、複数の個別の不正開封反応回路ゾーンを含み、前記複数の個別の不正開封反応回路ゾーンを含んでいる前記少なくとも1つの不正開封反応層が、前記多層回路基板に関連付けられた前記安全な空間内のモニタ回路に電気的に接続される、電子パッケージ。 - 電子パッケージであって、
多層回路基板と、
前記多層回路基板に関連付けられた少なくとも1つの電子コンポーネントと、
前記多層回路基板に取り付けられ、前記多層回路基板に関連付けられた安全な空間を定めることを容易にする筐体であって、前記少なくとも1つの電子コンポーネントが前記安全な空間内に存在する、前記筐体と、
前記多層回路基板内に埋め込まれた不正開封反応センサであって、前記不正開封反応センサが、前記多層回路基板に関連付けられた前記安全な空間を少なくとも部分的に定める、前記不正開封反応センサと
を備え、
前記不正開封反応センサが、前記多層回路基板内の複数の不正開封反応層を備え、
前記複数の不正開封反応層のうちの少なくとも2つの不正開封反応層がそれぞれ、複数の個別の不正開封反応回路ゾーンを含み、前記少なくとも2つの不正開封反応層のうちの異なる不正開封反応層内の少なくとも2つの不正開封反応回路ゾーンが、前記多層回路基板に関連付けられた前記安全な空間内の共通のモニタ回路に電気的に接続される、電子パッケージ。 - 電子パッケージであって、
多層回路基板と、
前記多層回路基板に関連付けられた少なくとも1つの電子コンポーネントと、
前記多層回路基板に取り付けられ、前記多層回路基板に関連付けられた安全な空間を定めることを容易にする筐体であって、前記少なくとも1つの電子コンポーネントが前記安全な空間内に存在する、前記筐体と、
前記多層回路基板内に埋め込まれた不正開封反応センサであって、前記不正開封反応センサが、前記多層回路基板に関連付けられた前記安全な空間を少なくとも部分的に定める、前記不正開封反応センサと
を備え、
前記不正開封反応センサが、前記多層回路基板内の複数の不正開封反応層を備え、
前記安全な空間が前記多層回路基板内で少なくとも部分的に定められ、
前記複数の不正開封反応層のうちの少なくとも1つの不正開封反応層が、前記多層回路基板内の前記安全な空間を少なくとも部分的に定める少なくとも1つの不正開封反応フレームである、電子パッケージ。 - 前記複数の不正開封反応層のうちの少なくとも1つの他の不正開封反応層が、少なくとも1つの不正開封反応マット層を含み、前記少なくとも1つの不正開封反応フレームが、前記少なくとも1つの不正開封反応マット層の上の前記多層回路基板内に配置され、前記少なくとも1つの不正開封反応フレームが、前記多層回路基板内に延びる前記安全な空間の側面を定め、前記少なくとも1つの不正開封反応マット層が、前記多層回路基板内の前記安全な空間のベース部分を定める、請求項10に記載の電子パッケージ。
- 前記多層回路基板が、前記多層回路基板内に埋め込まれた外部信号層を含み、前記外部信号層が、前記安全な空間内の前記少なくとも1つの電子コンポーネントに電気的に接続され、かつ、前記少なくとも1つの不正開封反応マット層の上に少なくとも部分的に存在する、請求項11に記載の電子パッケージ。
- 製造方法であって、
電子回路を製造することを含み、前記製造することが、
多層回路基板を形成することを含み、前記形成することが、
前記多層回路基板内に埋め込まれた不正開封反応センサを提供することを含み、前記不正開封反応センサが、前記多層回路基板内の複数の不正開封反応層を備え、前記複数の不正開封反応層のうちの少なくとも1つの不正開封反応層が、少なくとも1つの不正開封反応フレームであり、前記複数の不正開封反応層のうちの少なくとも1つの他の不正開封反応層が、少なくとも1つの不正開封反応マット層であり、前記少なくとも1つの不正開封反応フレームが、前記少なくとも1つの不正開封反応マット層の上の前記多層回路基板内に配置され、前記不正開封反応センサが、前記多層回路基板に関連付けられた安全な空間を少なくとも部分的に定めることを容易にする、製造方法。 - 前記複数の不正開封反応層のうちの1つまたは複数の不正開封反応層がそれぞれ、複数の個別の不正開封反応回路ゾーンを含み、前記形成することが、前記複数の個別の不正開封反応回路ゾーンを含んでいる不正開封反応層に電気的に接続されたモニタ回路を提供することをさらに含む、請求項13に記載の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US14/865,610 US10175064B2 (en) | 2015-09-25 | 2015-09-25 | Circuit boards and electronic packages with embedded tamper-respondent sensor |
US14/865,610 | 2015-09-25 | ||
PCT/IB2016/055444 WO2017051281A1 (en) | 2015-09-25 | 2016-09-13 | Circuit boards and electronic packages with embedded tamper-respondent sensor |
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JP2018530056A JP2018530056A (ja) | 2018-10-11 |
JP6741276B2 true JP6741276B2 (ja) | 2020-08-19 |
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US (4) | US10175064B2 (ja) |
JP (1) | JP6741276B2 (ja) |
CN (1) | CN108141978B (ja) |
DE (1) | DE112016003031T5 (ja) |
GB (1) | GB2556294B (ja) |
WO (1) | WO2017051281A1 (ja) |
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CN108141978A (zh) | 2018-06-08 |
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WO2017051281A1 (en) | 2017-03-30 |
DE112016003031T5 (de) | 2018-03-22 |
GB2556294A (en) | 2018-05-23 |
JP2018530056A (ja) | 2018-10-11 |
US10378925B2 (en) | 2019-08-13 |
US10168185B2 (en) | 2019-01-01 |
CN108141978B (zh) | 2020-05-12 |
US20190017844A1 (en) | 2019-01-17 |
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