JP6717559B2 - Solder alloy and solder powder - Google Patents
Solder alloy and solder powder Download PDFInfo
- Publication number
- JP6717559B2 JP6717559B2 JP2014142803A JP2014142803A JP6717559B2 JP 6717559 B2 JP6717559 B2 JP 6717559B2 JP 2014142803 A JP2014142803 A JP 2014142803A JP 2014142803 A JP2014142803 A JP 2014142803A JP 6717559 B2 JP6717559 B2 JP 6717559B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- ppm
- mass
- solder powder
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 107
- 229910045601 alloy Inorganic materials 0.000 title claims description 40
- 239000000956 alloy Substances 0.000 title claims description 40
- 239000000843 powder Substances 0.000 title claims description 40
- 239000002245 particle Substances 0.000 claims description 13
- 229910052738 indium Inorganic materials 0.000 claims description 9
- 229910052785 arsenic Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 229910052797 bismuth Inorganic materials 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 238000000691 measurement method Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 25
- 230000004907 flux Effects 0.000 description 22
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 11
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 11
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
- 239000012190 activator Substances 0.000 description 7
- 229910052725 zinc Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052787 antimony Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 239000002562 thickening agent Substances 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000013008 thixotropic agent Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 3
- 235000011613 Pinus brutia Nutrition 0.000 description 3
- 241000018646 Pinus brutia Species 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910020830 Sn-Bi Inorganic materials 0.000 description 2
- 229910018728 Sn—Bi Inorganic materials 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- OWRCNXZUPFZXOS-UHFFFAOYSA-N 1,3-diphenylguanidine Chemical compound C=1C=CC=CC=1NC(=N)NC1=CC=CC=C1 OWRCNXZUPFZXOS-UHFFFAOYSA-N 0.000 description 1
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- HAAZMOAXEMIBAJ-UHFFFAOYSA-N 4-chloro-2-methylquinazoline Chemical compound C1=CC=CC2=NC(C)=NC(Cl)=C21 HAAZMOAXEMIBAJ-UHFFFAOYSA-N 0.000 description 1
- VDQLTWSIHIWIFQ-UHFFFAOYSA-N 5-chloro-2-(3,4-dimethoxyphenyl)-2-propan-2-ylpentanenitrile Chemical compound COC1=CC=C(C(CCCCl)(C#N)C(C)C)C=C1OC VDQLTWSIHIWIFQ-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229910016334 Bi—In Inorganic materials 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910020935 Sn-Sb Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910008757 Sn—Sb Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- OLBVUFHMDRJKTK-UHFFFAOYSA-N [N].[O] Chemical compound [N].[O] OLBVUFHMDRJKTK-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000002156 adsorbate Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 235000013871 bee wax Nutrition 0.000 description 1
- 239000012166 beeswax Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000009689 gas atomisation Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- -1 hydroxystearic acid ethylene bisamide Chemical compound 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009692 water atomization Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
本発明は、半田ペーストを作製するための半田合金及び半田粉に関し、特にペースト作製後の粘度上昇を抑制し得る半田合金及び半田粉に関する。 The present invention relates to a solder alloy and solder powder for producing a solder paste, and more particularly to a solder alloy and solder powder capable of suppressing an increase in viscosity after the paste is produced.
電子部品の表面実装では、一般的にスクリーン印刷法やディスペンサ法等によってプリント回路基板に半田ペーストを印刷塗布或いは吐出塗布し、その上に表面実装部品を搭載し、リフロー炉等を用いて加熱溶融させて部品を接続する方法が採られている。また、バンプの原材料にも半田ペーストが用いられるなど、電子部品、電子モジュール、プリント配線板等の製造において、半田ペーストは極めて重要な役割を果たしている。 In the surface mounting of electronic components, solder paste is generally applied by printing or discharging by applying a screen printing method or a dispenser method, and then the surface mounting components are mounted on the printed circuit board and heated and melted using a reflow oven or the like. The method of connecting the parts is adopted. Further, solder paste is also used as a raw material for bumps, and the solder paste plays an extremely important role in the production of electronic components, electronic modules, printed wiring boards and the like.
この種の半田ペーストは、ロジン（松脂）、活性剤、増粘剤、溶剤などを混合して加熱溶融させ、自然放置若しくは攪拌しながら冷却して液状のフラックスを調製した後、フラックスの温度が室温まで下がった時点で、フラックスと半田粉とを混合及び攪拌して製造するのが一般的である。 This type of solder paste mixes rosin (pine resin), an activator, a thickener, a solvent, etc. and heats and melts it, and leaves it naturally or cooled with stirring to prepare a liquid flux. When the temperature is lowered to room temperature, the flux and the solder powder are generally mixed and stirred to manufacture.
ところが、この種の半田ペーストは、半田粉とフラックス中の活性剤等とが反応してペースト粘度が経時的に上昇し、印刷不良、ぬれ不良、接続不良などの様々な問題を招来するという課題を抱えていた。特に近年、環境問題等の観点からＳｎ−Ｐｂ系の半田から鉛フリー半田に移行しつつあり、鉛フリー半田の場合にはぬれ性等を確保するために活性の高いフラックスが用いられることが多いため、このような粘度上昇の問題はより一層深刻化したものであった。
また、電子部品の高密度化に伴い、印刷工程において狭ピッチ印刷性や連続印刷性（印刷寿命）等が求められるようになり、このような観点からも半田ペーストの粘度上昇抑制は重要な課題となりつつあった。
However, in this type of solder paste, the solder powder reacts with the activator in the flux to increase the paste viscosity over time, which causes various problems such as printing defects, poor wetting, and poor connection. Was holding. In particular, in recent years, from the viewpoint of environmental problems and the like, the transition from Sn—Pb based solder to lead-free solder has been progressing, and in the case of lead-free solder, a highly active flux is often used to ensure wettability and the like. Therefore, the problem of such viscosity increase has become more serious.
In addition, as the density of electronic components increases, narrow-pitch printability and continuous printability (printing life) are required in the printing process. From this viewpoint as well, it is an important issue to suppress the increase in solder paste viscosity. Was becoming.
そこで従来、半田ペーストの経時変化を防止するための方法として、次のような発明が提案されている。 Therefore, conventionally, the following invention has been proposed as a method for preventing the change of the solder paste with time.
例えば特許文献１（特開昭５５−９４７９３号公報）には、半田粉末とフラックスが直接に接触するのを防止する目的で、半田粉末をフラックスに対して難溶性で且つ熱により溶融または破壊される被覆剤（例えばゼラチン）で半田粉末を被覆する方法が開示されている。 For example, in Patent Document 1 (JP-A-55-94793), in order to prevent the solder powder and the flux from directly contacting each other, the solder powder is hardly soluble in the flux and is melted or destroyed by heat. A method of coating the solder powder with a coating agent (for example, gelatin) is disclosed.
特許文献２（特開２００１−２９４９０１号公報）には、表面にリン酸系アニオン界面活性剤を設けたことを特徴とする半田粉末が提案されており、半田合金粉末のまわりにリン酸系アニオン界面活性剤で皮膜を形成し、半田粉末表面をカバーすることによりフラックス中へのＺｎの溶出を防止することができ、経時変化を少なくすることができる効果が示されている。 Patent Document 2 (Japanese Patent Laid-Open No. 2001-294901) proposes a solder powder characterized in that a phosphoric acid type anionic surfactant is provided on the surface thereof, and a phosphoric acid type anion is provided around the solder alloy powder. By forming a film with a surfactant and covering the surface of the solder powder, the elution of Zn into the flux can be prevented, and the effect of reducing the change over time is shown.
特許文献３（特開２００４−２０９４９４号公報）には、半田粒子表面に平均厚さ約２．５〜６ｎｍの酸化錫からなる酸化皮膜を形成することにより、ペースト作製後の経時的粘度上昇を抑制し得る半田ペースト用半田粉が開示されている。 In Patent Document 3 (JP 2004-209494 A), an oxide film made of tin oxide having an average thickness of about 2.5 to 6 nm is formed on the surface of solder particles to increase the viscosity over time after the paste is prepared. Solder powder for solder paste that can be suppressed is disclosed.
本発明は、半田ペーストを作製するための半田合金及び半田粉に関し、従来の技術思想とは異なる新たな技術思想に基づき、ペースト作製後の粘度上昇を抑制することができる、新たな半田合金及び半田粉を提案せんとするものである。 The present invention relates to a solder alloy and solder powder for producing a solder paste, based on a new technical idea different from the conventional technical idea, it is possible to suppress an increase in viscosity after paste preparation, and a new solder alloy and The idea is to propose solder powder.
本発明は、Ｓｎと、Ａｇ、Ｂｉ、Ｓｂ、Ｚｎ、Ｉｎ及びＣｕからなる群から選ばれる１種又は２種以上と、を含み、かつ、２０ｐｐｍ〜１００ｐｐｍのＡｓを含むことを特徴とする半田合金を提案する。 The present invention comprises Sn and one or more selected from the group consisting of Ag, Bi, Sb, Zn, In and Cu, and further contains 20 ppm to 100 ppm of As. Suggest an alloy.
本発明が提案する半田合金は、Ｓｎを主成分とするＳｎ系半田合金に微量のＡｓ（砒素）を含有させることで、半田ペースト作製後の粘度上昇を抑制することができるようにしたものである。 The solder alloy proposed by the present invention contains a small amount of As (arsenic) in a Sn-based solder alloy containing Sn as a main component, thereby suppressing an increase in viscosity after the solder paste is prepared. is there.
次に、実施の形態例に基づいて本発明を説明する。ただし、本発明が次に説明する実施形態に限定されるものではない。 Next, the present invention will be described based on the embodiments. However, the present invention is not limited to the embodiment described below.
＜本半田合金＞
本実施形態の一例に係る半田合金（「本半田合金」と称する）は、Ｓｎを主成分とし、微量のＡｓ（砒素）を含有していれば、他の構成元素は、半田として機能し得る金属原料の組合せからなるものであれば特に限定するものではない。
<Main solder alloy>
If the solder alloy according to the example of the present embodiment (hereinafter referred to as “the present solder alloy”) contains Sn as a main component and a small amount of As (arsenic), the other constituent elements can function as solder. There is no particular limitation as long as it is a combination of metal raw materials.
なお、「半田としての機能」とは、金属材料を接合（ろう付け）することができる機能、すなわち、接合する金属より低融点を有し、溶融し流動して固化することにより、金属材料どうしを接合できる機能を意味する。 The term "function as a solder" means a function capable of joining (brazing) metal materials, that is, having a lower melting point than the metals to be joined, and melting and flowing to solidify the metal materials. Means the ability to join.
Ｓｎ及びＡｓ（砒素）以外の他の組成としては、例えば、Ａｇ、Ｂｉ、Ｓｂ、Ｚｎ、Ｉｎ及びＣｕからなる群から選ばれる１種又は２種以上を含む組成であればよい。
具体的には、Ｓｎ−Ｓｂ系合金、Ｓｎ−Ｂｉ系合金、Ｓｎ−Ｚｎ系合金、Ｓｎ−Ｃｕ系合金、Ｓｎ−Ａｇ系合金或いはこれらの合金にＡｇ、Ｓｂ、Ｂｉ、Ｇａ、Ｇｅ、Ｚｎ、Ｃｕ、Ｚｎ、Ｉｎ等の他元素のいずれか一種又は二種以上を組み合わせた半田合金（例えばＳｎ−Ａｇ−Ｃｕ系合金、Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ系合金、Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ−Ｉｎ系合金、Ｓｎ−Ａｇ−Ｂｉ−Ｉｎ系合金など）、その他を採用することができる。
The composition other than Sn and As (arsenic) may be, for example, a composition containing one or more selected from the group consisting of Ag, Bi, Sb, Zn, In, and Cu.
Specifically, Sn-Sb-based alloys, Sn-Bi-based alloys, Sn-Zn-based alloys, Sn-Cu-based alloys, Sn-Ag-based alloys or Ag, Sb, Bi, Ga, Ge, Zn on these alloys. , Cu, Zn, In, or any other element, or a combination of two or more of them (for example, Sn-Ag-Cu-based alloy, Sn-Ag-Cu-Bi-based alloy, Sn-Ag-Cu-Bi) -In-based alloy, Sn-Ag-Bi-In-based alloy, etc.) and others can be adopted.
本半田合金においては、２０ｐｐｍ〜１００ｐｐｍのＡｓを含むことが重要である。Ａｓの含有量が多ければ多いほど、半田ペースト作製後の粘度上昇を抑制することができる一方、Ａｓの含有量が１００ｐｐｍより多くなっても、粘度上昇抑制効果が高まらず、逆に溶融し難くなるなどの問題が生じる可能性がある。
かかる観点から、Ａｓの含有量は、２０ｐｐｍ〜１００ｐｐｍであることが重要であり、中でも３０ｐｐｍ以上或いは９５ｐｐｍ以下、その中でも４０ｐｐｍ以上或いは９０ｐｐｍ以下であるのが好ましい。
In this solder alloy, it is important to contain 20 ppm to 100 ppm of As. The higher the As content is, the more the viscosity increase after the solder paste preparation can be suppressed. On the other hand, even if the As content is more than 100 ppm, the viscosity increase suppression effect does not increase, and conversely, it is difficult to melt. There is a possibility that such problems will occur.
From such a viewpoint, it is important that the As content is 20 ppm to 100 ppm, and is preferably 30 ppm or more or 95 ppm or less, and more preferably 40 ppm or more or 90 ppm or less.
より具体的な例としては、Ｓｎを９０．０〜９９．８ｗｔ％或いはそれ以上含有し、Ａｇを０．１〜６ｗｔ％含有し、Ａｓを３０ｐｐｍ〜１００ｐｐｍ含有し、残部がＢｉ、Ｓｂ、Ｚn、Ｉｎ及びＣｕからなる群から選ばれる１種又は２種以上である半田合金を挙げることができる。
このような半田合金の中でも、Ａｇ１００質量部に対して０．０６〜０．３０質量部のＡｓを含むことがより好ましく、中でも特に０．１０質量部以上或いは０．２９質量部以下、その中でも特に０．１１質量部以上或いは０．２９質量部以下の割合でＡｓを含むことがさらに好ましい。
As a more specific example, Sn is contained at 90.0 to 99.8 wt% or more, Ag is contained at 0.1 to 6 wt%, As is contained at 30 ppm to 100 ppm, and the balance is Bi, Sb, Zn. Examples of the solder alloy include one kind or two or more kinds selected from the group consisting of In, Cu and In.
Among such solder alloys, it is more preferable to contain 0.06 to 0.30 parts by mass of As to 100 parts by mass of Ag, and in particular, 0.10 parts by mass or more or 0.29 parts by mass or less, among them, In particular, it is more preferable to contain As in a ratio of 0.11 parts by mass or more or 0.29 parts by mass or less.
また、Ｓｎを９０．０〜９９．８ｗｔ％或いはそれ以上含有し、Ｃｕを０．１〜３．０ｗｔ％含有し、Ａｓを３０ｐｐｍ〜１００ｐｐｍ含有し、残部がＢｉ、Ｓｂ、Ｚn、Ｉｎ及びＡｇからなる群から選ばれる１種又は２種以上である半田合金を挙げることができる。
このような半田合金の中でも、Ｃｕ１００質量部に対して０．３０〜１．８０質量部のＡｓを含むことがより好ましく、中でも特に０．５０質量部以上或いは１．７５質量部以下、その中でも特に０．５５質量部以上或いは１．７０質量部以下の割合でＡｓを含むことがさらに好ましい。
Further, Sn is contained at 90.0 to 99.8 wt% or more, Cu is contained at 0.1 to 3.0 wt%, As is contained at 30 ppm to 100 ppm, and the balance is Bi, Sb, Zn, In and Ag. There may be mentioned one or more solder alloys selected from the group consisting of
Among such solder alloys, it is more preferable to contain 0.30 to 1.80 parts by mass of As with respect to 100 parts by mass of Cu, and in particular, 0.50 parts by mass or more or 1.75 parts by mass or less, among them, In particular, it is more preferable to contain As in a ratio of 0.55 parts by mass or more or 1.70 parts by mass or less.
なお、本半田合金は純度９９．５％以上、特に純度９９．９％以上のものが好ましい。本発明の効果が許められる範囲において不可避不純物の存在は許容されるものである。 The solder alloy having a purity of 99.5% or more, particularly 99.9% or more, is preferable. The presence of inevitable impurities is permissible within the range in which the effects of the present invention are permissible.
本半田合金の融点は、特に限定するものではなく、用途に応じて選択すればよい。一般的な半田付作業の条件を考慮すると、１２０〜３５０℃であるのが好ましく、例えばＳｎ−Ｂｉ系合金の場合には特に１４０〜２４０℃であるのが好ましい。 The melting point of the present solder alloy is not particularly limited and may be selected according to the application. Considering the conditions of general soldering work, the temperature is preferably 120 to 350°C, and particularly preferably 140 to 240°C in the case of Sn-Bi alloy.
（製造方法）
本半田合金の製法は、特に限定するものではない。あらかじめＡｓを微量含有する半田合金原料を溶融した後、微粉化処理することが好ましい。この際、微粉化処理としては、例えばガスアトマイズ法、ディスクアトマイズ法、水アトマイズ法、油アトマイズ法、真空アトマイズ法、回転電極法、回転冷却流体法、遠心噴霧法、超音波噴霧法など、溶融物を用いて乾式法或いは湿式法により微粉化された半田合金を用いることができる。
(Production method)
The method for producing the present solder alloy is not particularly limited. It is preferable that a solder alloy raw material containing a small amount of As is melted in advance and then subjected to a pulverization treatment. At this time, as the pulverization treatment, for example, a gas atomizing method, a disk atomizing method, a water atomizing method, an oil atomizing method, a vacuum atomizing method, a rotating electrode method, a rotating cooling fluid method, a centrifugal atomizing method, an ultrasonic atomizing method, a melt, etc. It is possible to use a solder alloy finely powdered by a dry method or a wet method.
＜本半田粉＞
本半田合金を用いてなる半田粉（「本半田粉」と称する）のＤ５０、すなわち、レーザー回折散乱式粒度分布測定法により測定して得られる体積基準粒度分布によるＤ５０は、印刷性の観点から、５μｍ〜５０μｍであるのが好ましく、特に１０μｍ以上或いは４０μｍ以下であるのが好ましい。
なお、本半田粉の粒径（Ｄ５０）は、レーザー回折・散乱式粒子径分布測定装置（日機装社 商品名：マイクロトラック）等により測定可能である。
<Main solder powder>
D50 of solder powder (referred to as “main solder powder”) using the present solder alloy, that is, D50 based on volume-based particle size distribution obtained by measurement by laser diffraction/scattering particle size distribution measurement method is from the viewpoint of printability. The thickness is preferably 5 μm to 50 μm, and more preferably 10 μm or more or 40 μm or less.
The particle diameter (D50) of the present solder powder can be measured by a laser diffraction/scattering particle size distribution measuring device (Nikkiso Co., Ltd. product name: Microtrac) or the like.
（比表面積）
本半田粉の比表面積は、ペーストの粘性、溶融性の観点から、０．０１〜０．１０ｍ２／ｇであるのが好ましく、中でも０．０２ｍ２／ｇ以上或いは０．０４ｍ２／ｇ以下であるのがより一層好ましい。
本半田粉の比表面積が上記範囲になるように調製する方法としては、例えば本半田粉の球形化度・粒度をコントロールする方法を挙げることができる。ただし、この方法に限定するものではない。
(Specific surface area)
The specific surface area of the solder powder, paste viscosity, from the viewpoint of melting property, it is preferably from 0.01~0.10m 2 / g, inter alia 0.02 m 2 / g or more or 0.04 m 2 / g or less Is even more preferable.
Examples of the method for adjusting the specific surface area of the present solder powder to fall within the above range include a method of controlling the sphericity and particle size of the present solder powder. However, the method is not limited to this.
（酸素濃度）
本半田粉の酸素濃度は、ペーストの粘性、溶融性の観点から、５０ｐｐｍ〜１５０ｐｐｍであるのが好ましく、中でも９１ｐｐｍ以上或いは１３３ｐｐｍ以下、その中でも９９ｐｐｍ以上或いは１２５ｐｐｍ以下であるのがより一層好ましい。
本半田粉の酸素濃度が上記範囲になるように調製する方法としては、例えば本半田粉球形化度・粒度をコントロールする方法を挙げることができる。ただし、この方法に限定するものではない。
(Oxygen concentration)
The oxygen concentration of the present solder powder is preferably 50 ppm to 150 ppm, more preferably 91 ppm or more or 133 ppm or less, and most preferably 99 ppm or more or 125 ppm or less, from the viewpoint of paste viscosity and meltability.
As a method for adjusting the oxygen concentration of the present solder powder to fall within the above range, for example, a method of controlling the sphericity and particle size of the present solder powder can be mentioned. However, the method is not limited to this.
＜本半田ペースト＞
本半田粉と、フラックスとを混合することにより、半田ペースト（以下「本半田ペースト」と称する。）を得ることができる。例えば、フラックス原料を混合して加熱溶融させ、自然放置若しくは攪拌しながら冷却してフラックスを調製した後、フラックスの温度が室温まで下がった時点で、本半田粉と混合及び攪拌して本半田ペーストを製造することができる。
<Main solder paste>
A solder paste (hereinafter referred to as "main solder paste") can be obtained by mixing the main solder powder and the flux. For example, the flux raw materials are mixed, heated and melted, and left to stand or cooled while being stirred to prepare the flux. When the temperature of the flux drops to room temperature, the flux is mixed with the solder powder and stirred to form the solder paste. Can be manufactured.
この際、本半田粉とフラックスの混合割合を特に限定するものではない。本半田合金８０〜９５質量部と、フラックス５〜２０質量部とを混合するのが一般的である。 At this time, the mixing ratio of the solder powder and the flux is not particularly limited. Generally, 80 to 95 parts by mass of the present solder alloy and 5 to 20 parts by mass of flux are mixed.
（フラックス）
本半田ペーストに用いるフラックスは、例えばロジン（松脂）、活性剤、増粘剤、溶剤などを混合して調製することができる。より具体的には、これらの成分を混合して加熱溶融させ、自然放置若しくは攪拌しながら冷却して調製することができる。
(flux)
The flux used in the present solder paste can be prepared by mixing, for example, rosin (pine resin), an activator, a thickener, a solvent and the like. More specifically, it can be prepared by mixing these components, heating and melting them, and leaving them to stand naturally or cooling while stirring.
フラックスは、一般的に、フラックスベースとしてのロジン（松脂）、活性剤、増粘剤（チキソ剤）、溶剤などから調製することができる。代表的組成例としては、ロジン４０〜６０質量％、活性剤０．５〜３質量％、増粘剤（チキソ剤）３〜８質量％、溶剤３０〜５０質量％である。但し、フラックスとして機能するものであれば特に限定するものではない。 Flux can be generally prepared from rosin (pine resin) as a flux base, an activator, a thickener (thixotropic agent), a solvent and the like. As a typical composition example, 40-60 mass% of rosin, 0.5-3 mass% of activator, 3-8 mass% of thickener (thixotropic agent), and 30-50 mass% of solvent. However, it is not particularly limited as long as it functions as a flux.
フラックスベースとしては、例えば、ガムロジン、重合ロジン、水添ロジン、不均化ロジン、その他各種ロジン誘導体や、ポリエステル樹脂、ポリアミド樹脂、フェノキシ樹脂、テルペン樹脂等の合成樹脂等のいずれか、或いはこれら二種以上の組合せからなる混合物を用いることができる。 As the flux base, for example, gum rosin, polymerized rosin, hydrogenated rosin, disproportionated rosin, other various rosin derivatives, or any of synthetic resins such as polyester resin, polyamide resin, phenoxy resin, and terpene resin, or these two Mixtures of more than one type can be used.
活性剤としては、例えば、アミンハロゲン化水素酸塩（例、ジフェニルグアニジンＨＢｒ、ジエチルアミン臭化水素酸塩、トリエタノールアミンＨＢｒ、シクロへキシルアミン塩酸塩等）などのアミンハロゲン化塩、或いは、蟻酸、酢酸、ミリスチン酸、パルミチン酸、ステアリン酸、安息香酸、乳酸等の有機モノカルボン酸、シュウ酸、マロン酸、琥珀酸、アジピン酸、フマル酸、マレイン酸、グルタミン酸等の有機ジカルボン酸、或いはこれらの無水物、またハロゲン化炭化水素などの誘導体のいずれか、或いはこれら二種以上の組合せからなる混合物を用いることができる。 Examples of the activator include amine halogenated salts such as amine hydrohalide (eg, diphenylguanidine HBr, diethylamine hydrobromide, triethanolamine HBr, cyclohexylamine hydrochloride, etc.), or formic acid, Organic monocarboxylic acids such as acetic acid, myristic acid, palmitic acid, stearic acid, benzoic acid and lactic acid, organic dicarboxylic acids such as oxalic acid, malonic acid, succinic acid, adipic acid, fumaric acid, maleic acid and glutamic acid, or these Either an anhydride or a derivative such as a halogenated hydrocarbon, or a mixture of two or more kinds of them can be used.
増粘剤（チキソ剤）としては、例えば、硬化ひまし油、蜜ロウ、カルナバワックス、ステアリン酸アミドなどの脂肪酸アミド、ヒドロキシステアリン酸エチレンビスアミド等のいずれか、或いはこれら二種以上の組合せからなる混合物を用いることができる。
その他、増粘目的で半田ペースト用に配合される材料であれば、チキソ剤として用いることができる。
Examples of the thickener (thixotropic agent) include hydrogenated castor oil, beeswax, carnauba wax, fatty acid amides such as stearic acid amide, hydroxystearic acid ethylene bisamide, and the like, or a mixture of two or more thereof. Can be used.
In addition, any material blended for solder paste for the purpose of thickening can be used as a thixotropic agent.
溶剤としては、例えばアルコール、ケトン、エステル、芳香族系の溶剤を用いることができる。より具体的には、例えばベンジルアルコール、エタノール、イソプロピルアルコール、ブタノール、エチルセロソルブ、ブチルセロソルブ、ブチルカルビトール、ターピネオール、トルエン、キシレン、テトラリン、プロピレングリコールモノフェニルエーテル、ジエチレングリコールモノヘキシルエーテルなどの一種又はこれらの二種以上の組合せから混合液を用いることができる。
その他、フラックスベース（ロジン）及び活性剤を溶解し得る媒体であれば、溶剤として用いることができる。
As the solvent, for example, alcohol, ketone, ester, aromatic solvent can be used. More specifically, for example, benzyl alcohol, ethanol, isopropyl alcohol, butanol, ethyl cellosolve, butyl cellosolve, butyl carbitol, terpineol, toluene, xylene, tetralin, propylene glycol monophenyl ether, diethylene glycol monohexyl ether, etc., or one of these. A mixed solution can be used from a combination of two or more kinds.
In addition, any medium that can dissolve the flux base (rosin) and the activator can be used as the solvent.
本半田ペーストは、常法にしたがって、例えばメタルマスク版等を通して半田印刷機を用いて基板上に半田印刷し、その上に、電子部品を実装してリフロー炉内を通過させることで、熱サイクル環境下に曝されても、熱応力を緩和することができる半田接合部を形成することができる。 This solder paste is subjected to a thermal cycle by a conventional method, for example, by solder-printing on a substrate using a solder printer through a metal mask plate or the like, mounting electronic components on it, and passing it through a reflow oven. It is possible to form a solder joint portion that can relieve thermal stress even when exposed to the environment.
＜用語の説明＞
本発明において「不可避不純物」とは、最終製品を得るまでの製造過程において，意図して導入するまでもなく含まれてくる成分の意味であり、１０ｐｐｍ未満の微量成分であって、製品の特性に影響を及ぼさないため、存在するままにされている不純物の意味である。例えば鉄（Ｆｅ）、鉛（Ｐｂ）、カドミウム（Ｃｄ）、ニッケル（Ｎｉ）、アルミニウム（Ａｌ）等が挙げられる。
<Explanation of terms>
In the present invention, “unavoidable impurities” means components that are included in the manufacturing process until the final product is obtained without intentional introduction, and are trace components of less than 10 ppm, which are characteristic of the product. It means impurities that are left to exist because they have no effect on. Examples thereof include iron (Fe), lead (Pb), cadmium (Cd), nickel (Ni), aluminum (Al), and the like.
本明細書において「Ｘ〜Ｙ」（Ｘ，Ｙは任意の数字）と表現する場合、特にことわらない限り「Ｘ以上Ｙ以下」の意と共に、「好ましくはＸより大きい」或いは「好ましくはＹより小さい」の意も包含する。
また、「Ｘ以上」（Ｘは任意の数字）或いは「Ｙ以下」（Ｙは任意の数字）と表現した場合、「Ｘより大きいことが好ましい」或いは「Ｙ未満であることが好ましい」旨の意図も包含する。
In the present specification, when expressed as “X to Y” (X and Y are arbitrary numbers), “preferably larger than X” or “preferably Y” is used together with “meaning X or more and Y or less” unless otherwise specified. It also means "less than".
When expressed as "X or more" (X is an arbitrary number) or "Y or less" (Y is an arbitrary number), it is preferably "greater than X" or "less than Y". It also includes intent.
以下、本発明の実施例について説明する。本発明が下記実施例に限定されるものではない。 Examples of the present invention will be described below. The present invention is not limited to the examples below.
＜実施例・比較例による半田粉の作製＞
表１の組成となるように、それぞれ塊状の純金属である純Ｓｎ（３Ｎ）、純Ａｇ（３Ｎ）、純Ｃｕ（３Ｎ）、純Ｂｉ（３Ｎ）、純Ｉｎ（３Ｎ）及び純Ａｓ（４Ｎ）を秤量して混合し、アルミナ坩堝を用いてＡｒ雰囲気下で熔解させた。熔解後、遠心噴霧によって、Ｄ５０を約２５μｍとした半田粉（サンプル）を作製した。
なお、作製した半田粉についてＩＣＰ分析を行い、表１の組成になったことを確かめた。また、不可避不純物である鉄（Ｆｅ）、鉛（Ｐｂ）、カドミウム（Ｃｄ）、ニッケル（Ｎｉ）及びアルミニウム（Ａｌ）の含有量はそれぞれ１０ｐｐｍ未満であることを同時に確認した。
<Production of Solder Powder by Examples and Comparative Examples>
As shown in the composition of Table 1, pure Sn(3N), pure Ag(3N), pure Cu(3N), pure Bi(3N), pure In(3N), and pure As(4N), which are bulk pure metals, respectively. ) Were weighed and mixed, and melted in an Ar atmosphere using an alumina crucible. After melting, centrifugal spraying was performed to prepare solder powder (sample) having D50 of about 25 μm.
The produced solder powder was subjected to ICP analysis to confirm that the composition was as shown in Table 1. Further, it was simultaneously confirmed that the contents of iron (Fe), lead (Pb), cadmium (Cd), nickel (Ni) and aluminum (Al) which are inevitable impurities were each less than 10 ppm.
＜Ｄ１０、Ｄ５０、Ｄ９０の測定＞
半田粉(サンプル)２ｇをＩＰＡ５０ｍＬ中に入れて超音波を照射して（３分間）分散させた後、粒度分布測定装置（日機装株式会社製「マイクロトラック（商品名）ＭＴ−３０００ＥＸII（型番）」）により、体積基準粒度分布によるＤ１０、Ｄ５０、Ｄ９０を測定した。
<Measurement of D10, D50, D90>
After placing 2 g of solder powder (sample) in 50 mL of IPA and irradiating it with ultrasonic waves (3 minutes) to disperse it, a particle size distribution measuring device (“Microtrac (trade name) MT-3000EXII (model number)” manufactured by Nikkiso Co., Ltd.) ), D10, D50, and D90 according to the volume-based particle size distribution were measured.
＜比表面積の測定＞
Ｍｏｕｎｔｅｃｈ社製の比表面積測定装置（Ｍａｃｓｏｒｂ（ＨＭ ｍｏｄｅｌ−１２０８）を用いて、ＪＩＳ Ｒ １６２６：１９９６（ファインセラミックス粉体の気体吸着ＢＥＴ法による比表面積の測定方法）の「６．２流動法の（３．５）一点法」に準拠して、半田粉のＢＥＴ比表面積（ＳＳＡ(ＢＥＴ））の測定を行った。その際、キャリアガスであるヘリウムと、吸着質ガスである窒素の混合ガスを使用した。
<Measurement of specific surface area>
Using the specific surface area measuring device manufactured by Mountech (Macsorb (HM model-1208), JIS R 1626: 1996 (method of measuring specific surface area by gas adsorption BET method of fine ceramic powder) The BET specific surface area (SSA(BET)) of the solder powder was measured in accordance with "(3.5) One-point method." At that time, a mixed gas of helium as a carrier gas and nitrogen as an adsorbate gas was measured. It was used.
＜酸素濃度の測定＞
半田粉(サンプル)の酸素濃度を、酸素窒素分析装置（堀場製作所社製 製品名「ＥＭＧＡ６２０」）を使用して測定した。
<Measurement of oxygen concentration>
The oxygen concentration of the solder powder (sample) was measured using an oxygen-nitrogen analyzer (product name "EMGA620" manufactured by Horiba Ltd.).
＜半田ペーストの作製及び粘度上昇率の測定＞
フラックス（アルコールベースのロジン系）１０質量部と、実施例・比較例で得られた半田粉９０質量部とを混合して攪拌して半田ペーストを作製し、粘度変化を測定した。
<Preparation of solder paste and measurement of viscosity increase rate>
Flux (alcohol-based rosin-based) 10 parts by mass and 90 parts by mass of the solder powder obtained in Examples and Comparative Examples were mixed and stirred to prepare a solder paste, and the change in viscosity was measured.
半田ペーストの粘度は、作製した半田ペーストを２５℃に保持し、スパイラル式粘度計（マルコム社製、商品名：ＰＣＵ−２０５）を使用して、回転数１０ｒｐｍの条件で初期粘度（単位：Ｐａ・ｓ）を測定した。
また、作製し半田ペーストを２５℃で２週間保持し、前記同様にスパイラル式粘度計（マルコム社製、商品名：ＰＣＵ−２０５）を使用して、回転数１０ｒｐｍの条件で２週間後の粘度（単位：Ｐａ・ｓ）を測定した。
そして、２週間後の粘度（単位：Ｐａ・ｓ）を初期粘度（単位：Ｐａ・ｓ）で除した値を粘度上昇率（％）とし、結果を表１に示した。
この際、２週間後の粘度上昇率（％）が、１７０（％）以上であった場合を「×（poor）」と評価し、１４０（％）以上１７０（％）未満であった場合を「○（:good）」と評価し、１４０（％）未満であった場合を「◎（：very good）と評価した。
Regarding the viscosity of the solder paste, the prepared solder paste was kept at 25° C. and a spiral viscometer (Malcom Co., Ltd., product name: PCU-205) was used to obtain an initial viscosity (unit: Pa) at a rotation speed of 10 rpm.・S) was measured.
The prepared solder paste was kept at 25° C. for 2 weeks, and a spiral viscometer (manufactured by Malcolm, trade name: PCU-205) was used in the same manner as above, and the viscosity after 2 weeks under the condition of a rotation speed of 10 rpm. (Unit: Pa·s) was measured.
The value obtained by dividing the viscosity (unit: Pa·s) after 2 weeks by the initial viscosity (unit: Pa·s) was taken as the viscosity increase rate (%), and the results are shown in Table 1.
At this time, when the viscosity increase rate (%) after 2 weeks was 170 (%) or more, it was evaluated as "x (poor)", and when it was 140 (%) or more and less than 170 (%) It was evaluated as "○ (:good)", and when it was less than 140 (%), it was evaluated as "⊚ (: very good)".
＜半田ペーストの溶融性評価＞
作製した半田ペーストを、リフロー炉（山陽精工製 ＳＭＴｓｃｏｐｅ ＳＫ−８０００）を用いて窒素雰囲気中で昇温速度１２０℃／ｍｉｎで２５０℃まで加熱した後、１００℃／ｍｉｎで室温まで冷却させ、生成された溶融物の外観を２０倍の顕微鏡で観察することにより溶融性を評価した。
この際、溶融しきれない半田粒子が観察されない場合を「○（:good）」、溶融しきれない半田粒子が観察された場合を「×（poor）」と評価した。
<Evaluation of meltability of solder paste>
The produced solder paste was heated to 250° C. at a heating rate of 120° C./min in a nitrogen atmosphere using a reflow furnace (SMTscope SK-8000 manufactured by Sanyo Seiko), and then cooled to room temperature at 100° C./min to generate the solder paste. The meltability was evaluated by observing the appearance of the melt obtained with a microscope of 20 times.
At this time, when the unmelted solder particles were not observed, “◯ (:good)” was evaluated, and when the unmelted solder particles were observed, “x (poor)” was evaluated.
上記試験及びこれまで発明者が行ってきた試験の結果、半田合金に微量、すなわち２０ｐｐｍ〜１００ｐｐｍ程度のＡｓを添加することで、半田ペースト作製後の粘度上昇を抑制することができることが分かった。
なお、上記実施例は、３種類の組成についての実施例であるが、これまで発明者が行ってきた試験の結果からすると、少なくとも、Ｓｎと、Ａｇ、Ｂｉ、Ｓｂ、Ｚｎ、Ｉｎ及びＣｕからなる群から選ばれる１種又は２種以上とを含む組成の半田合金については、上記実施例と同様の効果が得られるものと考えることができる。
As a result of the above test and the tests conducted by the inventors so far, it was found that the addition of a small amount of As, that is, about 20 ppm to 100 ppm As to the solder alloy can suppress the increase in viscosity after the solder paste is prepared.
The above-mentioned examples are examples of three kinds of compositions, but from the results of the tests conducted by the inventor up to now, at least Sn and Ag, Bi, Sb, Zn, In and Cu With respect to the solder alloy having a composition containing one or more selected from the group consisting of the following, it can be considered that the same effects as those in the above-described examples can be obtained.
Claims (5)
An electronic component using the solder paste according to claim 4 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014142803A JP6717559B2 (en) | 2013-10-16 | 2014-07-11 | Solder alloy and solder powder |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013215735 | 2013-10-16 | ||
| JP2013215735 | 2013-10-16 | ||
| JP2014142803A JP6717559B2 (en) | 2013-10-16 | 2014-07-11 | Solder alloy and solder powder |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019012696A Division JP6829272B2 (en) | 2013-10-16 | 2019-01-29 | Solder alloy and solder powder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015098052A JP2015098052A (en) | 2015-05-28 |
| JP6717559B2 true JP6717559B2 (en) | 2020-07-01 |
Family
ID=53375048
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014142803A Active JP6717559B2 (en) | 2013-10-16 | 2014-07-11 | Solder alloy and solder powder |
| JP2019012696A Active JP6829272B2 (en) | 2013-10-16 | 2019-01-29 | Solder alloy and solder powder |
| JP2021007657A Active JP7183314B2 (en) | 2013-10-16 | 2021-01-21 | Solder alloy and solder powder |
| JP2021007656A Active JP7183313B2 (en) | 2013-10-16 | 2021-01-21 | Solder alloy and solder powder |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019012696A Active JP6829272B2 (en) | 2013-10-16 | 2019-01-29 | Solder alloy and solder powder |
| JP2021007657A Active JP7183314B2 (en) | 2013-10-16 | 2021-01-21 | Solder alloy and solder powder |
| JP2021007656A Active JP7183313B2 (en) | 2013-10-16 | 2021-01-21 | Solder alloy and solder powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (4) | JP6717559B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019076958A (en) * | 2013-10-16 | 2019-05-23 | 三井金属鉱業株式会社 | Solder alloy and solder powder |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6671013B2 (en) * | 2017-11-24 | 2020-03-25 | 千住金属工業株式会社 | Discoloration resistant solder alloy and discoloration resistant solder joint |
| JP6691305B2 (en) * | 2018-07-20 | 2020-04-28 | 千住金属工業株式会社 | Solder materials, solder pastes, and solder joints |
| JP6691304B2 (en) * | 2018-07-20 | 2020-04-28 | 千住金属工業株式会社 | Solder materials, solder pastes, and solder joints |
| JP6678704B2 (en) * | 2018-07-20 | 2020-04-08 | 千住金属工業株式会社 | Solder materials, solder paste, and solder joints |
| US11344976B2 (en) | 2017-11-24 | 2022-05-31 | Senju Metal Industry Co., Ltd. | Solder material, solder paste, and solder joint |
| JP6722378B2 (en) * | 2018-07-20 | 2020-07-15 | 千住金属工業株式会社 | Solder material, solder paste, and solder joint |
| WO2019113208A1 (en) * | 2017-12-07 | 2019-06-13 | Ormet Circuits, Inc. | Metallurgical compositions with thermally stable microstructures for assembly in electronic packaging |
| JP6903037B2 (en) * | 2018-07-20 | 2021-07-14 | 千住金属工業株式会社 | Solder paste |
| JP6521160B1 (en) * | 2018-07-20 | 2019-05-29 | 千住金属工業株式会社 | Solder alloy, solder powder, solder paste, and solder joint using them |
| WO2020017049A1 (en) * | 2018-07-20 | 2020-01-23 | 日立化成株式会社 | Composition, bonding material, sintered compact, assembly, and method for producing assembly |
| JP6521161B1 (en) * | 2018-07-20 | 2019-05-29 | 千住金属工業株式会社 | Solder alloy, solder powder, solder paste, and solder joint using them |
| JP6555402B1 (en) * | 2018-07-27 | 2019-08-07 | 千住金属工業株式会社 | Solder paste |
| JP6849923B2 (en) * | 2018-07-27 | 2021-03-31 | 千住金属工業株式会社 | Solder paste |
| JP6880438B2 (en) * | 2018-07-27 | 2021-06-02 | 千住金属工業株式会社 | Solder paste |
| JP6643691B2 (en) * | 2018-07-27 | 2020-02-12 | 千住金属工業株式会社 | Solder paste |
| JP6573019B1 (en) | 2018-10-25 | 2019-09-11 | 千住金属工業株式会社 | Flux and solder paste |
| JP6734553B1 (en) * | 2019-03-29 | 2020-08-05 | 千住金属工業株式会社 | Solder paste |
| JP7013636B2 (en) * | 2019-04-02 | 2022-02-01 | 千住金属工業株式会社 | Discoloration resistant solder alloys and discoloration resistant solder joints |
| JP6646243B1 (en) * | 2019-05-27 | 2020-02-14 | 千住金属工業株式会社 | Solder paste and flux for solder paste |
| JP6810373B1 (en) * | 2019-05-27 | 2021-01-06 | 千住金属工業株式会社 | Solder alloys, solder pastes, solder balls, solder preforms, and solder fittings |
| JP6777872B1 (en) * | 2019-05-27 | 2020-10-28 | 千住金属工業株式会社 | Flux and solder paste |
| WO2020241318A1 (en) * | 2019-05-27 | 2020-12-03 | 千住金属工業株式会社 | Solder alloy, solder paste, solder ball, solder preform, soldered joint and circuit |
| JP6721850B1 (en) * | 2019-05-27 | 2020-07-15 | 千住金属工業株式会社 | Solder paste |
| JP6680992B1 (en) * | 2019-05-27 | 2020-04-15 | 千住金属工業株式会社 | Solder alloys, solder powders, solder pastes, solder balls, solder preforms, and solder joints |
| EP3978186A4 (en) * | 2019-05-27 | 2023-07-26 | Senju Metal Industry Co., Ltd. | Solder alloy, solder paste, solder ball, solder preform, solder joint, onboard electronic circuit, ecu electronic circuit, onboard electronic circuit device, and ecu electronic circuit device |
| JP6649597B1 (en) * | 2019-05-27 | 2020-02-19 | 千住金属工業株式会社 | Solder alloys, solder powders and solder joints |
| JP6690111B1 (en) * | 2019-05-27 | 2020-04-28 | 千住金属工業株式会社 | Solder composition for jet dispenser |
| JP6681566B1 (en) * | 2019-05-27 | 2020-04-15 | 千住金属工業株式会社 | Solder paste and flux |
| JP7057533B2 (en) * | 2019-05-27 | 2022-04-20 | 千住金属工業株式会社 | Solder paste and flux for solder paste |
| JP6690113B1 (en) * | 2019-05-27 | 2020-04-28 | 千住金属工業株式会社 | Solder composition for jet dispenser |
| JP6676242B1 (en) * | 2019-05-27 | 2020-04-08 | 千住金属工業株式会社 | Solder paste |
| JP6643744B1 (en) * | 2019-05-27 | 2020-02-12 | 千住金属工業株式会社 | Solder paste and flux for solder paste |
| JP6690112B1 (en) * | 2019-05-27 | 2020-04-28 | 千住金属工業株式会社 | Solder composition for jet dispenser |
| JP6638844B1 (en) * | 2019-05-27 | 2020-01-29 | 千住金属工業株式会社 | Solder paste |
| JP6643692B1 (en) * | 2019-05-27 | 2020-02-12 | 千住金属工業株式会社 | Solder paste |
| JP6638845B1 (en) * | 2019-05-27 | 2020-01-29 | 千住金属工業株式会社 | Solder paste |
| WO2020241574A1 (en) * | 2019-05-27 | 2020-12-03 | 千住金属工業株式会社 | Solder paste and flux for solder paste |
| JP6721849B1 (en) * | 2019-05-27 | 2020-07-15 | 千住金属工業株式会社 | Solder paste |
| JP6643746B1 (en) * | 2019-05-27 | 2020-02-12 | 千住金属工業株式会社 | Solder paste and flux for solder paste |
| JP6676244B1 (en) * | 2019-05-27 | 2020-04-08 | 千住金属工業株式会社 | Flux and solder paste |
| JP6643693B1 (en) * | 2019-05-27 | 2020-02-12 | 千住金属工業株式会社 | Solder paste |
| JP6681567B1 (en) * | 2019-05-27 | 2020-04-15 | 千住金属工業株式会社 | Solder paste and flux |
| US11813686B2 (en) * | 2019-05-27 | 2023-11-14 | Senju Metal Industry Co., Ltd. | Solder alloy, solder paste, solder ball, solder preform, solder joint, and substrate |
| JP6676243B1 (en) * | 2019-05-27 | 2020-04-08 | 千住金属工業株式会社 | Flux and solder paste |
| JP6649595B1 (en) * | 2019-05-27 | 2020-02-19 | 千住金属工業株式会社 | Solder alloy, solder powder, solder paste, and solder joints using these |
| JP6777873B1 (en) * | 2019-05-27 | 2020-10-28 | 千住金属工業株式会社 | Flux and solder paste |
| JP6643745B1 (en) * | 2019-05-27 | 2020-02-12 | 千住金属工業株式会社 | Solder paste and flux for solder paste |
| JP6649596B1 (en) | 2019-05-27 | 2020-02-19 | 千住金属工業株式会社 | Solder alloys, solder powders and solder joints |
| JP6773986B1 (en) * | 2019-05-28 | 2020-10-21 | 千住金属工業株式会社 | New rosin compound and its manufacturing method, flux, solder paste |
| JP2020011301A (en) * | 2019-08-07 | 2020-01-23 | 千住金属工業株式会社 | Solder material, solder paste, and solder joint |
| JP2020099950A (en) * | 2020-03-17 | 2020-07-02 | 千住金属工業株式会社 | Solder material, solder paste and solder joint |
| JP2020110843A (en) * | 2020-03-17 | 2020-07-27 | 千住金属工業株式会社 | Solder material, solder paste, and solder joint |
| CN115768591A (en) | 2020-04-10 | 2023-03-07 | 千住金属工业株式会社 | Solder alloy, solder powder, solder paste, solder ball, solder preform and solder joint |
| JP6836091B1 (en) | 2020-04-10 | 2021-02-24 | 千住金属工業株式会社 | Solder alloys, solder powders, solder pastes, solder balls, solder preforms and solder fittings |
| JP6928294B1 (en) * | 2020-10-02 | 2021-09-01 | 千住金属工業株式会社 | Solder paste |
| JP6928296B1 (en) | 2020-10-02 | 2021-09-01 | 千住金属工業株式会社 | Solder paste |
| DE112022001943T5 (en) | 2021-03-31 | 2024-01-18 | Sumitomo Heavy Industries, Ltd. | INJECTION MOLDING MACHINE |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6253988B1 (en) * | 1999-03-29 | 2001-07-03 | Antaya Technologies Corporation | Low temperature solder |
| JP2002224881A (en) * | 2001-02-05 | 2002-08-13 | Hitachi Metals Ltd | Solder ball |
| JP4777674B2 (en) * | 2004-12-03 | 2011-09-21 | 株式会社タムラ製作所 | Solder bath erosion reduction tool and soldering apparatus having the same |
| CN100509258C (en) * | 2005-07-14 | 2009-07-08 | 上海上电电容器有限公司 | Low-temperature welding material |
| JP2009131872A (en) | 2007-11-30 | 2009-06-18 | Mitsui Mining & Smelting Co Ltd | Solder paste, and manufacturing method of soldered part |
| JP2009154170A (en) | 2007-12-25 | 2009-07-16 | Arakawa Chem Ind Co Ltd | Soldering flux and solder paste |
| JP2010229501A (en) * | 2009-03-27 | 2010-10-14 | Mitsubishi Materials Corp | Solder powder and solder paste using the same |
| CN101579790B (en) * | 2009-06-03 | 2011-06-15 | 南京航空航天大学 | Sn-Ag-Cu lead-free solder containing Nd, Li, As and In |
| JP5966449B2 (en) * | 2012-03-06 | 2016-08-10 | 三菱マテリアル株式会社 | Solder alloy powder for bumps, solder paste for bumps and solder bumps |
| JP6717559B2 (en) * | 2013-10-16 | 2020-07-01 | 三井金属鉱業株式会社 | Solder alloy and solder powder |
-
2014
- 2014-07-11 JP JP2014142803A patent/JP6717559B2/en active Active
-
2019
- 2019-01-29 JP JP2019012696A patent/JP6829272B2/en active Active
-
2021
- 2021-01-21 JP JP2021007657A patent/JP7183314B2/en active Active
- 2021-01-21 JP JP2021007656A patent/JP7183313B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019076958A (en) * | 2013-10-16 | 2019-05-23 | 三井金属鉱業株式会社 | Solder alloy and solder powder |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021062410A (en) | 2021-04-22 |
| JP2019076958A (en) | 2019-05-23 |
| JP7183313B2 (en) | 2022-12-05 |
| JP7183314B2 (en) | 2022-12-05 |
| JP2015098052A (en) | 2015-05-28 |
| JP6829272B2 (en) | 2021-02-10 |
| JP2021073097A (en) | 2021-05-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7183313B2 (en) | Solder alloy and solder powder | |
| JP5018978B1 (en) | Conductive material, connection method using the same, and connection structure | |
| JP5533876B2 (en) | Solder paste, bonding method using the same, and bonding structure | |
| JP2014028391A (en) | Solder alloy, solder paste, and electronic circuit substrate | |
| JP6683244B2 (en) | Joining material and method for producing joined body | |
| WO2016039056A1 (en) | Metal composition and bonding material | |
| JP6905791B2 (en) | Solder composition for forming solder bumps and method for forming solder bumps | |
| JP6466361B2 (en) | Solder composition for forming solder bump and method for forming solder bump | |
| JP4084657B2 (en) | Solder powder for solder paste | |
| JP2020011286A (en) | Solder material, solder paste and solder joint | |
| JP2014213337A (en) | Solder alloy | |
| JP6678704B2 (en) | Solder materials, solder paste, and solder joints | |
| JP5273443B2 (en) | Method for forming minute solder bump and solder paste | |
| JP2009131872A (en) | Solder paste, and manufacturing method of soldered part | |
| JP2011083809A (en) | Flux, solder paste and joined part | |
| JP5272166B2 (en) | Solder paste composition | |
| JP6888900B2 (en) | Au-Sn alloy solder paste, method of manufacturing Au-Sn alloy solder layer, and Au-Sn alloy solder layer | |
| JPH0726191A (en) | Organic vehicle for electronic composition | |
| JP2016172914A (en) | Solder powder and solder paste using the powder | |
| JP2009131871A (en) | Solder paste, soldered part, and manufacturing method of soldered part | |
| JP2017177121A (en) | HIGH-TEMPERATURE Pb-FREE SOLDER PASTE AND MANUFACTURING METHOD THEREOF | |
| JP2020116637A (en) | Paste for joining and bump forming method and production method of joined body using the paste for joining | |
| JP4473677B2 (en) | Method for producing solder powder that improves wet spreadability | |
| JP4473678B2 (en) | Method for producing solder powder that improves wet spreadability | |
| JP2020011301A (en) | Solder material, solder paste, and solder joint |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170531 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180508 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180628 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20181127 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190129 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20190205 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20190315 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190409 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200116 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200611 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6717559 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |