JP6714631B2 - 電磁波シールドフィルム及びシールドプリント配線板 - Google Patents

電磁波シールドフィルム及びシールドプリント配線板 Download PDF

Info

Publication number: JP6714631B2
Authority: JP; Japan
Prior art keywords: electromagnetic wave; shield; film; wave shielding; adhesive layer
Prior art date: 2018-03-15
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2018048087A

Other languages

English (en)

Japanese (ja)

Other versions

JP2019161101A (ja

Inventor

晃司高見

渡辺　正博

正博渡辺

上農　憲治

憲治上農

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Tatsuta Electric Wire and Cable Co Ltd

Original Assignee

Tatsuta Electric Wire and Cable Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-03-15

Filing date

2018-03-15

Publication date

2020-06-24

2018-03-15 Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd

2018-03-15 Priority to JP2018048087A priority Critical patent/JP6714631B2/ja

2018-10-24 Priority to TW107137515A priority patent/TWI720356B/zh

2019-03-01 Priority to CN201910156490.7A priority patent/CN110278701A/zh

2019-03-15 Priority to KR1020190029952A priority patent/KR102423541B1/ko

2019-09-19 Publication of JP2019161101A publication Critical patent/JP2019161101A/ja

2020-06-24 Application granted granted Critical

2020-06-24 Publication of JP6714631B2 publication Critical patent/JP6714631B2/ja

Status Active legal-status Critical Current

2038-03-15 Anticipated expiration legal-status Critical

Links

239000012790 adhesive layer Substances 0.000 claims description 97
239000010410 layer Substances 0.000 claims description 94
229910052751 metal Inorganic materials 0.000 claims description 39
239000002184 metal Substances 0.000 claims description 39
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239000011231 conductive filler Substances 0.000 claims description 21
239000004840 adhesive resin Substances 0.000 claims description 14
229920006223 adhesive resin Polymers 0.000 claims description 14
238000005452 bending Methods 0.000 claims description 3
239000010408 film Substances 0.000 description 183
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239000000203 mixture Substances 0.000 description 25
239000002245 particle Substances 0.000 description 23
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 22
239000000463 material Substances 0.000 description 20
239000003063 flame retardant Substances 0.000 description 19
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 14
229920005989 resin Polymers 0.000 description 14
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RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 13
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239000003822 epoxy resin Substances 0.000 description 8
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
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IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
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239000010935 stainless steel Substances 0.000 description 4
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239000005020 polyethylene terephthalate Substances 0.000 description 3
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
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239000004734 Polyphenylene sulfide Substances 0.000 description 2
239000002518 antifoaming agent Substances 0.000 description 2
239000003963 antioxidant agent Substances 0.000 description 2
230000003078 antioxidant effect Effects 0.000 description 2
239000011248 coating agent Substances 0.000 description 2
238000000576 coating method Methods 0.000 description 2
239000004020 conductor Substances 0.000 description 2
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229910052757 nitrogen Inorganic materials 0.000 description 2
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239000011574 phosphorus Substances 0.000 description 2
239000000049 pigment Substances 0.000 description 2
239000004014 plasticizer Substances 0.000 description 2
239000009719 polyimide resin Substances 0.000 description 2
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239000000843 powder Substances 0.000 description 2
230000036316 preload Effects 0.000 description 2
239000006097 ultraviolet radiation absorber Substances 0.000 description 2
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
229920000049 Carbon (fiber) Polymers 0.000 description 1
239000004593 Epoxy Substances 0.000 description 1
JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
229910001111 Fine metal Inorganic materials 0.000 description 1
239000004693 Polybenzimidazole Substances 0.000 description 1
239000004697 Polyetherimide Substances 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
239000004372 Polyvinyl alcohol Substances 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
229920001807 Urea-formaldehyde Polymers 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
239000000956 alloy Substances 0.000 description 1
229910052787 antimony Inorganic materials 0.000 description 1
WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
239000011324 bead Substances 0.000 description 1
230000005540 biological transmission Effects 0.000 description 1
239000002981 blocking agent Substances 0.000 description 1
150000001639 boron compounds Chemical class 0.000 description 1
GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
229910052794 bromium Inorganic materials 0.000 description 1
239000004917 carbon fiber Substances 0.000 description 1
239000002041 carbon nanotube Substances 0.000 description 1
229910021393 carbon nanotube Inorganic materials 0.000 description 1
210000004027 cell Anatomy 0.000 description 1
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239000011889 copper foil Substances 0.000 description 1
239000011162 core material Substances 0.000 description 1
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238000001035 drying Methods 0.000 description 1
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238000007772 electroless plating Methods 0.000 description 1
238000005530 etching Methods 0.000 description 1
239000000835 fiber Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
238000009413 insulation Methods 0.000 description 1
239000012948 isocyanate Substances 0.000 description 1
150000002513 isocyanates Chemical class 0.000 description 1
238000010030 laminating Methods 0.000 description 1
JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
229910000000 metal hydroxide Inorganic materials 0.000 description 1
150000004692 metal hydroxides Chemical class 0.000 description 1
239000002923 metal particle Substances 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
150000002903 organophosphorus compounds Chemical class 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
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229920001568 phenolic resin Polymers 0.000 description 1
238000007747 plating Methods 0.000 description 1
229920006122 polyamide resin Polymers 0.000 description 1
229920002480 polybenzimidazole Polymers 0.000 description 1
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229920001601 polyetherimide Polymers 0.000 description 1
229920001228 polyisocyanate Polymers 0.000 description 1
239000005056 polyisocyanate Substances 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
229920002451 polyvinyl alcohol Polymers 0.000 description 1
229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
239000001267 polyvinylpyrrolidone Substances 0.000 description 1
235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
230000005855 radiation Effects 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
239000000126 substance Substances 0.000 description 1
239000000758 substrate Substances 0.000 description 1
239000010409 thin film Substances 0.000 description 1
229910052718 tin Inorganic materials 0.000 description 1
239000011135 tin Substances 0.000 description 1
239000004034 viscosity adjusting agent Substances 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0064—Earth or grounding circuit

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Non-Metallic Protective Coatings For Printed Circuits (AREA)
Structure Of Printed Boards (AREA)
Laminated Bodies (AREA)

JP2018048087A 2018-03-15 2018-03-15 電磁波シールドフィルム及びシールドプリント配線板 Active JP6714631B2 (ja)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
JP2018048087A JP6714631B2 (ja)	2018-03-15	2018-03-15	電磁波シールドフィルム及びシールドプリント配線板
TW107137515A TWI720356B (zh)	2018-03-15	2018-10-24	電磁波屏蔽膜及屏蔽印刷配線板
CN201910156490.7A CN110278701A (zh)	2018-03-15	2019-03-01	电磁波屏蔽膜以及屏蔽印制线路板
KR1020190029952A KR102423541B1 (ko)	2018-03-15	2019-03-15	전자파 차폐 필름 및 차폐 프린트 배선판

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2018048087A JP6714631B2 (ja)	2018-03-15	2018-03-15	電磁波シールドフィルム及びシールドプリント配線板

Publications (2)

Publication Number	Publication Date
JP2019161101A JP2019161101A (ja)	2019-09-19
JP6714631B2 true JP6714631B2 (ja)	2020-06-24

Family

ID=67959016

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2018048087A Active JP6714631B2 (ja)	2018-03-15	2018-03-15	電磁波シールドフィルム及びシールドプリント配線板

Country Status (4)

Country	Link
JP (1)	JP6714631B2 (zh)
KR (1)	KR102423541B1 (zh)
CN (1)	CN110278701A (zh)
TW (1)	TWI720356B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI829973B (zh) *	2020-02-25	2024-01-21	日商拓自達電線股份有限公司	電磁波屏蔽膜

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* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2000223045A (ja) *	1998-11-27	2000-08-11	Matsushita Electronics Industry Corp	陰極線管内蔵抵抗体および陰極線管
JP2001031943A (ja) *	1999-07-26	2001-02-06	Tomoegawa Paper Co Ltd	半導体用接着剤及び半導体用接着テープ
JP4201548B2 (ja) *	2002-07-08	2008-12-24	タツタ電線株式会社	シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
CN101657512B (zh) *	2007-04-25	2014-05-28	日立化成株式会社	粘接片
JP2013145790A (ja) *	2012-01-13	2013-07-25	Hitachi Chemical Co Ltd	屈曲配線板、部品実装屈曲配線板及びそれに用いる金属層付絶縁層
JP6061470B2 (ja) *	2012-01-20	2017-01-18	旭化成株式会社	フレキシブル配線板
JP2013193253A (ja) *	2012-03-16	2013-09-30	Yamaichi Electronics Co Ltd	電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法
JP5934533B2 (ja) *	2012-03-23	2016-06-15	富士フイルム株式会社	複層フィルム及び光学シート
WO2015068611A1 (ja) *	2013-11-07	2015-05-14	東洋インキＳｃホールディングス株式会社	導電性接着剤、導電性接着シート、配線デバイス、および配線デバイスの製造方法
JP2017024246A (ja) *	2015-07-21	2017-02-02	武藤工業株式会社	複合樹脂材料
KR101973137B1 (ko) *	2016-05-23	2019-04-26	타츠타 전선 주식회사	도전성 접착제 조성물
JP6694763B2 (ja) *	2016-06-08	2020-05-20	信越ポリマー株式会社	電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板

2018
- 2018-03-15 JP JP2018048087A patent/JP6714631B2/ja active Active
- 2018-10-24 TW TW107137515A patent/TWI720356B/zh active
2019
- 2019-03-01 CN CN201910156490.7A patent/CN110278701A/zh active Pending
- 2019-03-15 KR KR1020190029952A patent/KR102423541B1/ko active IP Right Grant

Also Published As

Publication number	Publication date
TWI720356B (zh)	2021-03-01
TW201940021A (zh)	2019-10-01
JP2019161101A (ja)	2019-09-19
KR102423541B1 (ko)	2022-07-20
CN110278701A (zh)	2019-09-24
KR20190109302A (ko)	2019-09-25

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Publication	Publication Date	Title
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