JP6678830B1 - 薄膜トランジスタ基板、その製造方法及びそれを備えた液晶表示装置 - Google Patents
薄膜トランジスタ基板、その製造方法及びそれを備えた液晶表示装置 Download PDFInfo
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- 239000010409 thin film Substances 0.000 title claims description 38
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 37
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 94
- 230000001681 protective effect Effects 0.000 claims abstract description 70
- 239000010408 film Substances 0.000 claims description 274
- 239000001257 hydrogen Substances 0.000 claims description 53
- 229910052739 hydrogen Inorganic materials 0.000 claims description 53
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 150000002431 hydrogen Chemical class 0.000 claims description 10
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 9
- 230000000087 stabilizing effect Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 79
- 238000005530 etching Methods 0.000 description 14
- 230000007547 defect Effects 0.000 description 13
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000005401 electroluminescence Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
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- 238000004544 sputter deposition Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
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- 239000007789 gas Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
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- 239000003566 sealing material Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- H01L29/772—Field effect transistors
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- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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Abstract
Description
まず、本発明の実施の形態に係る薄膜トランジスタ基板について説明する前に、これと関連する薄膜トランジスタ基板(以下、「関連TFT基板」と記す)について説明する。
本発明の実施の形態1に係るTFT基板100の構成について説明する。なお、以下では、本実施の形態1に係るTFT基板100が、バックチャネルエッチング構造と呼ばれる一般的なTFT構造を有する場合を一例として説明する。
次に、本実施の形態1に係るTFT基板100の製造方法について説明する。以下、TFT基板100のうちの画素TFT基板の製造方法について主に説明する。図10は、本実施の形態1に係るTFT基板100の製造方法の一例を示すフローチャートである。なお、以下の説明で記載したレジスト塗布及びパターニングは、図10中では写真製版と記載され、以下の説明で記載したレジスト除去は、図10中ではレジスト剥離及び純水洗浄と記載されている。
図11は、本発明の実施の形態2に係るTFT基板100を有する液晶表示装置の構成の一例を示す平面図であり、画素TFT基板の構成を例示したものである。図12は、図11のA−A線に沿った断面図である。以下、本実施の形態2に係る構成要素のうち、上述の構成要素と同じまたは類似する構成要素については同じ参照符号を付し、異なる構成要素について主に説明する。なお、図示の便宜上、図11及び図12では、寸法の整合性が取られていない構成要素がある。
次に、本実施の形態2に係るTFT基板100の製造方法について説明する。以下、TFT基板100のうちの画素TFT基板の製造方法について主に説明する。
図13は、本発明の実施の形態3に係るTFT基板100を有する液晶表示装置の構成の一例を示す断面図であり、画素TFT基板の構成を例示したものである。以下、本実施の形態3に係る構成要素のうち、上述の構成要素と同じまたは類似する構成要素については同じ参照符号を付し、異なる構成要素について主に説明する。
図14は、本発明の実施の形態4に係るTFT基板100を有する液晶表示装置の構成の一例を示す断面図であり、画素TFT基板の構成を例示したものである。以下、本実施の形態4に係る構成要素のうち、上述の構成要素と同じまたは類似する構成要素については同じ参照符号を付し、異なる構成要素について主に説明する。
図15は、本発明の実施の形態4に係るTFT基板100を有する液晶表示装置の構成の一例を示す断面図であり、画素TFT基板の構成を例示したものである。以下、本実施の形態4に係る構成要素のうち、上述の構成要素と同じまたは類似する構成要素については同じ参照符号を付し、異なる構成要素について主に説明する。
Claims (13)
- 基板と、
前記基板上に選択的に配設された第1ゲート電極と、
前記第1ゲート電極を覆う第1ゲート絶縁膜と、
前記第1ゲート絶縁膜上に配設され、平面視で前記第1ゲート電極と重なる第1酸化物半導体層と、
前記第1酸化物半導体層と接続され、前記第1酸化物半導体層上で互いに離間された第1ソース電極及び第1ドレイン電極と、
前記第1酸化物半導体層、前記第1ソース電極及び前記第1ドレイン電極を覆う第1保護絶縁膜と、
前記第1保護絶縁膜を覆う、水素を含む第1SiN膜と
を備え、
前記第1SiN膜は、
平面視における前記第1酸化物半導体層のうちの前記第1ソース電極と前記第1ドレイン電極との間の第1領域の一部の上方に等間隔で配設された複数の第1開口部を有し、かつ、前記一部以外の前記第1領域の上方に存在する、薄膜トランジスタ基板。 - 請求項1に記載の薄膜トランジスタ基板であって、
前記第1SiN膜は、前記第1開口部の底部を規定する、他よりも膜厚が薄い薄肉部を有する、薄膜トランジスタ基板。 - 請求項1または請求項2に記載の薄膜トランジスタ基板であって、
前記基板上に選択的に配設された第2ゲート電極と、
前記第2ゲート電極を覆う第2ゲート絶縁膜と、
前記第2ゲート絶縁膜上に配設され、平面視で前記第2ゲート電極と重なる第2酸化物半導体層と、
前記第2酸化物半導体層と接続され、前記第2酸化物半導体層上で互いに離間された第2ソース電極及び第2ドレイン電極と、
前記第2酸化物半導体層、前記第2ソース電極及び前記第2ドレイン電極を覆う第2保護絶縁膜と、
前記第2保護絶縁膜を覆う、水素を含む第2SiN膜と
をさらに備え、
前記第2SiN膜は、
平面視における前記第2酸化物半導体層のうちの前記第2ソース電極と前記第2ドレイン電極との間の第2領域の全てを覆うか、
前記第2領域の少なくとも一部の上方に配設され、前記第1領域に対する前記第1開口部の面積の割合よりも前記第2領域に対する面積の割合が小さい第2開口部を有し、
前記第1ゲート電極、前記第1ゲート絶縁膜、前記第1酸化物半導体層、前記第1ソース電極、前記第1ドレイン電極、前記第1保護絶縁膜、及び、前記第1SiN膜は、前記基板に配設された画素薄膜トランジスタに含まれ、
前記第2ゲート電極、前記第2ゲート絶縁膜、前記第2酸化物半導体層、前記第2ソース電極、前記第2ドレイン電極、前記第2保護絶縁膜、及び、前記第2SiN膜は、前記基板に配設された駆動回路薄膜トランジスタに含まれる、薄膜トランジスタ基板。 - 請求項1から請求項3のうちのいずれか1項に記載の薄膜トランジスタ基板であって、
前記第1ドレイン電極と電気的に接続され、前記第1SiN膜下に配設された画素電極と、
前記第1SiN膜上、かつ前記画素電極の上方に配設された共通電極と
をさらに備える、薄膜トランジスタ基板。 - 請求項1から請求項3のうちのいずれか1項に記載の薄膜トランジスタ基板であって、
前記第1ドレイン電極と電気的に接続され、前記第1SiN膜上に配設された画素電極と、
前記第1SiN膜下、かつ前記画素電極の下方に配設された共通電極と
をさらに備える、薄膜トランジスタ基板。 - 請求項1から請求項3のうちのいずれか1項に記載の薄膜トランジスタ基板であって、
前記第1ドレイン電極と電気的に接続され、前記第1保護絶縁膜下に配設された画素電極と、
前記第1SiN膜上、かつ前記画素電極の上方に配設された共通電極と
をさらに備える、薄膜トランジスタ基板。 - 基板と、
前記基板上に選択的に配設された第1ゲート電極と、
前記第1ゲート電極を覆う第1ゲート絶縁膜と、
前記第1ゲート絶縁膜上に配設され、平面視で前記第1ゲート電極と重なる第1酸化物半導体層と、
前記第1酸化物半導体層と接続され、前記第1酸化物半導体層上で互いに離間された第1ソース電極及び第1ドレイン電極と、
前記第1酸化物半導体層、前記第1ソース電極及び前記第1ドレイン電極を覆う第1保護絶縁膜と、
前記第1保護絶縁膜を覆う、水素を含む第1SiN膜と
を備え、
前記第1SiN膜は、
平面視における前記第1酸化物半導体層のうちの前記第1ソース電極と前記第1ドレイン電極との間の第1領域の一部の上方に配設された第1開口部を有し、かつ、前記一部以外の前記第1領域の上方に存在し、
前記第1保護絶縁膜上に配設され、前記第1SiN膜の前記第1開口部から露出する導電層をさらに備える、薄膜トランジスタ基板。 - 請求項1から請求項7のうちのいずれか1項に記載の薄膜トランジスタ基板であって、
前記第1ゲート絶縁膜は水素を含み、
前記第1SiN膜に含まれる水素は、前記第1ゲート絶縁膜に含まれる水素よりも多い、薄膜トランジスタ基板。 - 請求項1から請求項8のうちのいずれか1項に記載の薄膜トランジスタ基板であって、
前記第1保護絶縁膜は、
シリコン酸化膜と、
前記シリコン酸化膜上に配設された平坦化絶縁膜と
を含む、薄膜トランジスタ基板。 - 請求項1から請求項9のうちのいずれか1項に記載の薄膜トランジスタ基板と、対向基板とを含み、前記薄膜トランジスタ基板と前記対向基板との間に液晶層が挟まれた液晶パネルと、
前記薄膜トランジスタ基板に関して前記対向基板と逆側に配設されるバックライトユニットと
を備える、液晶表示装置。 - 基板上に第1ゲート電極を選択的に形成し、
前記第1ゲート電極を覆う第1ゲート絶縁膜を形成し、
平面視で前記第1ゲート電極と重なる第1酸化物半導体層を、前記第1ゲート絶縁膜上に形成し、
前記第1酸化物半導体層と接続され、前記第1酸化物半導体層上で互いに離間された第1ソース電極及び第1ドレイン電極を形成し、
前記第1酸化物半導体層、前記第1ソース電極及び前記第1ドレイン電極を覆う第1保護絶縁膜を形成し、
前記第1保護絶縁膜を覆う、水素を含むSiN膜を形成し、
平面視における前記第1酸化物半導体層のうちの前記第1ソース電極と前記第1ドレイン電極との間の第1領域の一部の上方の前記SiN膜に等間隔に配設される複数の第1開口部を形成し、かつ、前記一部以外の前記第1領域の上方に前記SiN膜を存在させる、薄膜トランジスタ基板の製造方法。 - 基板上に第1ゲート電極を選択的に形成し、
前記第1ゲート電極を覆う第1ゲート絶縁膜を形成し、
平面視で前記第1ゲート電極と重なる第1酸化物半導体層を、前記第1ゲート絶縁膜上に形成し、
前記第1酸化物半導体層と接続され、前記第1酸化物半導体層上で互いに離間された第1ソース電極及び第1ドレイン電極を形成し、
前記第1酸化物半導体層、前記第1ソース電極及び前記第1ドレイン電極を覆う第1保護絶縁膜を形成し、
前記第1保護絶縁膜を覆う、水素を含むSiN膜を形成し、
平面視における前記第1酸化物半導体層のうちの前記第1ソース電極と前記第1ドレイン電極との間の第1領域の一部の上方の前記SiN膜に第1開口部を形成し、かつ、前記一部以外の前記第1領域の上方に前記SiN膜を存在させ、
前記第1保護絶縁膜を形成した後、前記第1ドレイン電極と電気的に接続された画素電極と、前記画素電極から離間され前記第1領域の少なくとも一部の上方に位置する導電層とを前記第1保護絶縁膜上に形成し、
前記第1保護絶縁膜、前記画素電極及び前記導電層を覆う前記SiN膜を形成し、
前記導電層を露出する開口部を、前記第1開口部として形成する、薄膜トランジスタ基板の製造方法。 - 請求項11または請求項12に記載の薄膜トランジスタ基板の製造方法であって、
前記SiN膜の形成温度は、前記第1ゲート絶縁膜の形成温度よりも低い、薄膜トランジスタ基板の製造方法。
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