JP6630974B2 - パワーインダクタ - Google Patents
パワーインダクタ Download PDFInfo
- Publication number
- JP6630974B2 JP6630974B2 JP2015198789A JP2015198789A JP6630974B2 JP 6630974 B2 JP6630974 B2 JP 6630974B2 JP 2015198789 A JP2015198789 A JP 2015198789A JP 2015198789 A JP2015198789 A JP 2015198789A JP 6630974 B2 JP6630974 B2 JP 6630974B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- composite
- power inductor
- coil layer
- iron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052751 metal Inorganic materials 0.000 claims description 62
- 239000002184 metal Substances 0.000 claims description 62
- 239000002131 composite material Substances 0.000 claims description 42
- 239000000843 powder Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910000599 Cr alloy Inorganic materials 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 229910002796 Si–Al Inorganic materials 0.000 claims description 3
- 229910008458 Si—Cr Inorganic materials 0.000 claims description 3
- XEVZIAVUCQDJFL-UHFFFAOYSA-N [Cr].[Fe].[Si] Chemical compound [Cr].[Fe].[Si] XEVZIAVUCQDJFL-UHFFFAOYSA-N 0.000 claims description 3
- 239000000788 chromium alloy Substances 0.000 claims description 3
- -1 iron-silicon-aluminum Chemical compound 0.000 claims description 3
- 229910000889 permalloy Inorganic materials 0.000 claims description 3
- 230000004907 flux Effects 0.000 description 17
- 239000000463 material Substances 0.000 description 14
- 230000035699 permeability Effects 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 3
- 239000002905 metal composite material Substances 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
- H01F2003/106—Magnetic circuits using combinations of different magnetic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Description
200 絶縁基板
310 第1のコイル層
311 第1のコイル層の端部
320 第2のコイル層
321 第2のコイル層の端部
400 コイル部
410 金属粉末
420 高分子樹脂
500 カバー部
510 下部カバー部
520 上部カバー部
530 金属板状複合体
531 金属薄板
532 有機絶縁膜
600 インダクタ本体(body)
710 第1の外部電極
720 第2の外部電極
800 磁束の流れ
Claims (9)
- 絶縁基板と、
前記絶縁基板の両面に形成される第1のコイル層及び第2のコイル層と、
前記絶縁基板と前記第1のコイル層及び前記第2のコイル層を内部に含むコイル部、及び上部カバー部と下部カバー部を含むカバー部で構成され、前記第1のコイル層の端部と前記第2のコイル層の端部が両側端面に露出するように形成されるインダクタ本体と、
前記第1のコイル層の端部と前記第2のコイル層の端部とそれぞれ電気的に接続されて形成される第1の外部電極及び第2の外部電極と、
を含み、
前記上部カバー部と前記下部カバー部は複数の金属板状複合体の積層構造を含み、
前記上部カバー部の金属板状複合体の上面は、前記第1の外部電極及び第2の外部電極によってカバーされ、
前記下部カバー部の金属板状複合体の下面は、前記第1の外部電極及び第2の外部電極によってカバーされ、
前記複数の金属板状複合体はそれぞれ複数の板状体に分離されて、前記複数の板状体間にギャップが存在し、前記ギャップは隣接した他の金属板状複合体のギャップと前記複数の金属板状複合体の積層方向に重ならない形態を有する、
パワーインダクタ。 - 前記絶縁基板は、中央に貫通孔を有する、請求項1に記載のパワーインダクタ。
- 前記金属板状複合体は、有機絶縁膜がコーティングされた金属薄板である、請求項1または2に記載のパワーインダクタ。
- 前記コイル部は、鉄(Fe)、鉄−ニッケル合金(Fe−Ni)、鉄−珪素−アルミニウム合金(Fe−Si−Al)及び鉄−珪素−クロム合金(Fe−Si−Cr)のうちいずれか一つ又は二つ以上の金属粉末を含む、請求項1から3のいずれか1項に記載のパワーインダクタ。
- 前記金属板状複合体は、鉄−ニッケル系合金(Fe−Ni)を含む、請求項1から4のいずれか1項に記載のパワーインダクタ。
- 前記鉄−ニッケル系合金(Fe−Ni)はパーマロイ(Permalloy)である、請求項5に記載のパワーインダクタ。
- 前記金属板状複合体の厚さは10μm以下である、請求項1から6のいずれか1項に記載のパワーインダクタ。
- 前記金属板状複合体は、メッキ工程により形成されたものである、請求項1から7のいずれか1項に記載のパワーインダクタ。
- 前記金属板状複合体は、有機絶縁膜によって中心を基準として放射状に分離されたものである、請求項1に記載のパワーインダクタ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150037426A KR101681405B1 (ko) | 2015-03-18 | 2015-03-18 | 파워 인덕터 |
KR10-2015-0037426 | 2015-03-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016178275A JP2016178275A (ja) | 2016-10-06 |
JP6630974B2 true JP6630974B2 (ja) | 2020-01-15 |
Family
ID=56924943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015198789A Active JP6630974B2 (ja) | 2015-03-18 | 2015-10-06 | パワーインダクタ |
Country Status (3)
Country | Link |
---|---|
US (1) | US20160276096A1 (ja) |
JP (1) | JP6630974B2 (ja) |
KR (1) | KR101681405B1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101681406B1 (ko) * | 2015-04-01 | 2016-12-12 | 삼성전기주식회사 | 코일 전자부품 및 그 제조방법 |
KR101681409B1 (ko) * | 2015-04-16 | 2016-12-12 | 삼성전기주식회사 | 코일 전자부품 |
KR102517759B1 (ko) | 2016-08-31 | 2023-04-03 | 엘지디스플레이 주식회사 | 전원 공급부와 이를 포함한 표시장치 |
JP6761742B2 (ja) | 2016-11-24 | 2020-09-30 | 山陽特殊製鋼株式会社 | 高周波で用いる磁性粉末およびこれを含有する磁性樹脂組成物 |
KR20190076587A (ko) * | 2017-12-22 | 2019-07-02 | 삼성전기주식회사 | 코일 전자부품 |
KR102122925B1 (ko) | 2018-11-02 | 2020-06-15 | 삼성전기주식회사 | 코일 전자부품 |
KR102244565B1 (ko) * | 2019-07-24 | 2021-04-26 | 삼성전기주식회사 | 코일 전자 부품 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0677055A (ja) * | 1992-08-27 | 1994-03-18 | Toshiba Corp | 平面磁気素子 |
JP2003203813A (ja) * | 2001-08-29 | 2003-07-18 | Matsushita Electric Ind Co Ltd | 磁性素子およびその製造方法、並びにそれを備えた電源モジュール |
WO2004040597A1 (ja) * | 2002-10-31 | 2004-05-13 | Matsushita Electric Industrial Co., Ltd. | インダクタンス部品とそれを用いた電子機器 |
EP1661149A2 (en) * | 2003-08-26 | 2006-05-31 | Philips Intellectual Property & Standards GmbH | Ultra-thin flexible inductor |
JP2005228869A (ja) * | 2004-02-12 | 2005-08-25 | Jfe Steel Kk | 磁性厚膜およびそれを用いた基板と磁気素子 |
JP2007067214A (ja) | 2005-08-31 | 2007-03-15 | Taiyo Yuden Co Ltd | パワーインダクタ |
JP5874199B2 (ja) * | 2011-05-26 | 2016-03-02 | Tdk株式会社 | コイル部品及びその製造方法 |
JP5960971B2 (ja) | 2011-11-17 | 2016-08-02 | 太陽誘電株式会社 | 積層インダクタ |
KR101503967B1 (ko) * | 2011-12-08 | 2015-03-19 | 삼성전기주식회사 | 적층형 인덕터 및 그 제조방법 |
JP6113510B2 (ja) * | 2013-01-16 | 2017-04-12 | アルプス電気株式会社 | 磁気素子 |
JP2015026812A (ja) * | 2013-07-29 | 2015-02-05 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | チップ電子部品及びその製造方法 |
-
2015
- 2015-03-18 KR KR1020150037426A patent/KR101681405B1/ko active IP Right Grant
- 2015-10-06 JP JP2015198789A patent/JP6630974B2/ja active Active
- 2015-10-16 US US14/885,865 patent/US20160276096A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR20160112185A (ko) | 2016-09-28 |
KR101681405B1 (ko) | 2016-11-30 |
JP2016178275A (ja) | 2016-10-06 |
US20160276096A1 (en) | 2016-09-22 |
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