JP6607550B2 - ガラス基板の製造方法 - Google Patents
ガラス基板の製造方法 Download PDFInfo
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- JP6607550B2 JP6607550B2 JP2015052318A JP2015052318A JP6607550B2 JP 6607550 B2 JP6607550 B2 JP 6607550B2 JP 2015052318 A JP2015052318 A JP 2015052318A JP 2015052318 A JP2015052318 A JP 2015052318A JP 6607550 B2 JP6607550 B2 JP 6607550B2
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- 239000011521 glass Substances 0.000 title claims description 295
- 238000004519 manufacturing process Methods 0.000 title claims description 40
- 239000000758 substrate Substances 0.000 title claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 15
- 230000009975 flexible effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 40
- 238000003475 lamination Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 11
- 230000013011 mating Effects 0.000 description 11
- 239000006059 cover glass Substances 0.000 description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 7
- 238000010030 laminating Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 239000005340 laminated glass Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Description
2 支持ガラス
3 積層体
4 有機EL素子
5 ガラス基板
Claims (2)
- 可撓性を有するガラスフィルムと、該ガラスフィルムを支持する支持ガラスとを直接に重ね合わせて積層体を作製する積層体作製工程と、前記積層体における前記ガラスフィルムに対し、加熱を伴って電子デバイス材を形成する処理工程と、前記支持ガラスから前記電子デバイス材を形成済の前記ガラスフィルムを剥離させてガラス基板を得る剥離工程とを含んだガラス基板の製造方法であって、
前記積層体作製工程の実行前に、前記ガラスフィルムと前記支持ガラスとを個別に加熱する加熱工程を実行すると共に、前記積層体作製工程の実行時に、前記加熱工程により温められた状態の前記ガラスフィルムと前記支持ガラスとを重ね合わせ、
前記積層体作製工程おいて、前記ガラスフィルムと前記支持ガラスとを重ね合わせる際の両ガラスの温度を100℃以上とすることを特徴とするガラス基板の製造方法。 - 前記加熱工程において、前記ガラスフィルム及び前記支持ガラスを100℃以上の温度まで加熱することを特徴とする請求項1に記載のガラス基板の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015052318A JP6607550B2 (ja) | 2015-03-16 | 2015-03-16 | ガラス基板の製造方法 |
TW105107883A TWI628079B (zh) | 2015-03-16 | 2016-03-15 | 玻璃基板的製造方法 |
CN201610146208.3A CN105984196B (zh) | 2015-03-16 | 2016-03-15 | 玻璃基板的制造方法 |
US15/071,208 US9969152B2 (en) | 2015-03-16 | 2016-03-16 | Method for producing glass substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015052318A JP6607550B2 (ja) | 2015-03-16 | 2015-03-16 | ガラス基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016173895A JP2016173895A (ja) | 2016-09-29 |
JP6607550B2 true JP6607550B2 (ja) | 2019-11-20 |
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Application Number | Title | Priority Date | Filing Date |
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JP2015052318A Active JP6607550B2 (ja) | 2015-03-16 | 2015-03-16 | ガラス基板の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9969152B2 (ja) |
JP (1) | JP6607550B2 (ja) |
CN (1) | CN105984196B (ja) |
TW (1) | TWI628079B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6900767B2 (ja) * | 2017-04-28 | 2021-07-07 | 日本電気硝子株式会社 | ガラスロールの製造方法 |
JP7262703B2 (ja) * | 2019-06-11 | 2023-04-24 | 日本電気硝子株式会社 | ガラスロールの製造方法 |
CN112174519B (zh) * | 2020-09-10 | 2022-12-06 | 河北光兴半导体技术有限公司 | 复合玻璃板及制备方法和应用 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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DE2829371A1 (de) * | 1978-07-04 | 1980-01-24 | Goch & Co Ft Flachglastech | Verfahren zur behandlung von im vakuum zu beschichtenden glastafeln |
CN101277799A (zh) * | 2005-09-29 | 2008-10-01 | 日本电气硝子株式会社 | 平板玻璃成形装置搭载用耐火物成形体的成形方法、耐火物成形体、及平板玻璃成形方法和平板玻璃 |
CN102471129B (zh) * | 2009-09-18 | 2015-04-15 | 日本电气硝子株式会社 | 玻璃膜的制造方法及玻璃膜的处理方法以及玻璃膜层叠体 |
CN102576106B (zh) * | 2009-10-20 | 2015-02-11 | 旭硝子株式会社 | 玻璃层叠体及其制造方法、显示面板的制造方法及利用该制造方法获得的显示面板 |
JP5585937B2 (ja) | 2010-07-28 | 2014-09-10 | 日本電気硝子株式会社 | ガラスフィルム積層体 |
US20150030829A1 (en) * | 2012-03-06 | 2015-01-29 | Lintec Corporation | Gas barrier film laminate, adhesive film, and electronic component |
WO2014073455A1 (ja) * | 2012-11-09 | 2014-05-15 | 日本電気硝子株式会社 | ガラスフィルム積層体及び電子・電気デバイスの製造方法 |
US10086584B2 (en) * | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
US20140216641A1 (en) * | 2013-02-05 | 2014-08-07 | Douglas M. Canfield | Indexing Laminating System |
TW201442875A (zh) * | 2013-05-10 | 2014-11-16 | Nippon Electric Glass Co | 玻璃膜的製造方法以及電子元件的製造方法 |
-
2015
- 2015-03-16 JP JP2015052318A patent/JP6607550B2/ja active Active
-
2016
- 2016-03-15 TW TW105107883A patent/TWI628079B/zh active
- 2016-03-15 CN CN201610146208.3A patent/CN105984196B/zh active Active
- 2016-03-16 US US15/071,208 patent/US9969152B2/en active Active
Also Published As
Publication number | Publication date |
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TWI628079B (zh) | 2018-07-01 |
CN105984196B (zh) | 2019-11-26 |
JP2016173895A (ja) | 2016-09-29 |
TW201634288A (zh) | 2016-10-01 |
CN105984196A (zh) | 2016-10-05 |
US20160276631A1 (en) | 2016-09-22 |
US9969152B2 (en) | 2018-05-15 |
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