JP6604890B2 - 基板搬送装置および基板処理装置ならびに結露抑制方法 - Google Patents
基板搬送装置および基板処理装置ならびに結露抑制方法 Download PDFInfo
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- JP6604890B2 JP6604890B2 JP2016075266A JP2016075266A JP6604890B2 JP 6604890 B2 JP6604890 B2 JP 6604890B2 JP 2016075266 A JP2016075266 A JP 2016075266A JP 2016075266 A JP2016075266 A JP 2016075266A JP 6604890 B2 JP6604890 B2 JP 6604890B2
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- 239000000758 substrate Substances 0.000 title claims description 128
- 238000009833 condensation Methods 0.000 title claims description 17
- 230000005494 condensation Effects 0.000 title claims description 17
- 238000012545 processing Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 7
- 230000007246 mechanism Effects 0.000 claims description 72
- 238000005498 polishing Methods 0.000 claims description 25
- 238000012546 transfer Methods 0.000 claims description 23
- 238000004140 cleaning Methods 0.000 claims description 18
- 238000001035 drying Methods 0.000 claims description 8
- 230000032258 transport Effects 0.000 description 40
- 238000010586 diagram Methods 0.000 description 6
- 230000007723 transport mechanism Effects 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000008237 rinsing water Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/04—Preventing the formation of frost or condensate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
エアを筐体内に供給することで、筐体に結露が発生するのを抑えることができる。
基板搬送装置は、前記配管に設けられたフィルタを備え、前記フィルタを介してエアが前記筐体内に供給されてもよい。
図1は、基板処理装置の概略構成を示す図である。図1に示すように、この基板処理装置は、略矩形状のハウジング1を備えており、ハウジング1の内部は隔壁1a,1bによってロード/アンロード部2と研磨部3と洗浄部4とに区画されている。また、基板処理装置は、基板処理動作を制御する制御部5を有している。
図4Bに示すように、基板を把持していない待機時には、可動アーム301a,301bは互いに離間している。
そこで、本実施形態では結露を抑制する仕組みを設けている。
190,192 洗浄ユニット
194 乾燥ユニット
12 スイングトランスポータ
170 把持機構
300 筐体
301a,301b 可動アーム
302 開閉駆動機構
303a,303b 支持アーム
304a,304b チャック
41a,41b エアシリンダ
42a,42b エア配管
43 圧力制御部
44 オリフィス
45 フィルタ
Claims (6)
- 基板を把持するように構成された基板把持部と、
筐体と、
少なくとも一部が前記筐体内に設けられ、エアを用いて前記基板把持部を駆動する駆動機構と、を備え、
前記駆動機構は、少なくとも一部が前記筐体内に設けられ、前記基板把持部を駆動するためのエアを供給するとともに、前記筐体内にエアを供給する配管を有し、
前記配管は、
前記基板把持部が基板を把持するときに加圧される第1配管と、
前記基板把持部が基板を把持しないときに加圧される第2配管と、
を含み、
前記第2配管から前記筐体内にエアが供給される、基板搬送装置。 - 基板を把持するように構成された基板把持部と、
筐体と、
少なくとも一部が前記筐体内に設けられ、エアを用いて前記基板把持部を駆動する駆動機構と、を備え、
前記駆動機構は、前記筐体内にエアを供給可能であり、
前記基板把持部は、開閉可能な1対の支持アームを含み、
前記駆動機構は、
前記筐体内に設けられ、前記1対の支持アームをエアによって開閉させるエアシリンダと、
前記エアシリンダにエアを供給する配管と、を有し、
前記配管は、
前記基板把持部が基板を把持するときに加圧される第1配管と、
前記基板把持部が基板を把持しないときに加圧される第2配管と、
を含み、
前記第2配管から前記筐体内にエアが供給される、基板搬送装置。 - 前記配管に設けられたオリフィスを備える、請求項1または2に記載の基板搬送装置。
- 前記配管に設けられたフィルタを備え、
前記フィルタを介してエアが前記筐体内に供給される、請求項1乃至3のいずれかに記載の基板搬送装置。 - 研磨ユニット、洗浄ユニットおよび乾燥ユニットと、
各ユニット間で基板を搬送する、請求項1乃至4のいずれかに記載の基板搬送装置と、を備える基板処理装置。 - 請求項1乃至4のいずれかに記載の基板搬送装置に結露が発生するのを抑制する方法であって、
前記基板把持部を駆動するためのエアを、前記基板搬送装置の筐体にも供給する、結露抑制方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016075266A JP6604890B2 (ja) | 2016-04-04 | 2016-04-04 | 基板搬送装置および基板処理装置ならびに結露抑制方法 |
KR1020170040733A KR102190187B1 (ko) | 2016-04-04 | 2017-03-30 | 기판 반송 장치 및 기판 처리 장치와 결로 억제 방법 |
US15/474,113 US10816259B2 (en) | 2016-04-04 | 2017-03-30 | Substrate transport apparatus, substrate processing apparatus, and dew condensation suppression method |
TW106111036A TWI703627B (zh) | 2016-04-04 | 2017-03-31 | 基板搬運裝置、基板處理裝置以及結露抑制方法 |
CN201710214125.8A CN107275271B (zh) | 2016-04-04 | 2017-04-01 | 基板搬运装置、基板处理装置以及结露抑制方法 |
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Application Number | Priority Date | Filing Date | Title |
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JP2016075266A JP6604890B2 (ja) | 2016-04-04 | 2016-04-04 | 基板搬送装置および基板処理装置ならびに結露抑制方法 |
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Publication Number | Publication Date |
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JP2017188531A JP2017188531A (ja) | 2017-10-12 |
JP6604890B2 true JP6604890B2 (ja) | 2019-11-13 |
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US (1) | US10816259B2 (ja) |
JP (1) | JP6604890B2 (ja) |
KR (1) | KR102190187B1 (ja) |
CN (1) | CN107275271B (ja) |
TW (1) | TWI703627B (ja) |
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JP7137047B2 (ja) | 2018-03-15 | 2022-09-14 | シンフォニアテクノロジー株式会社 | Efem、及び、efemにおけるガス置換方法 |
TWI759595B (zh) * | 2018-05-11 | 2022-04-01 | 日商東京威力科創股份有限公司 | 基板處理系統及基板處理方法 |
JP7097760B2 (ja) * | 2018-06-25 | 2022-07-08 | 東京エレクトロン株式会社 | 搬送装置および搬送方法 |
JP6877480B2 (ja) * | 2019-04-09 | 2021-05-26 | 株式会社荏原製作所 | 搬送装置、ワーク処理装置、搬送装置の制御方法、プログラムを記憶する記録媒体 |
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JP3005373B2 (ja) * | 1992-10-23 | 2000-01-31 | 東京エレクトロン株式会社 | 処理装置 |
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JP4127346B2 (ja) | 1999-08-20 | 2008-07-30 | 株式会社荏原製作所 | ポリッシング装置及び方法 |
JP2002110609A (ja) * | 2000-10-02 | 2002-04-12 | Tokyo Electron Ltd | 洗浄処理装置 |
JP3888608B2 (ja) * | 2001-04-25 | 2007-03-07 | 東京エレクトロン株式会社 | 基板両面処理装置 |
JP4197103B2 (ja) | 2002-04-15 | 2008-12-17 | 株式会社荏原製作所 | ポリッシング装置 |
CN102117736B (zh) | 2006-02-22 | 2013-06-05 | 株式会社荏原制作所 | 基板处理装置、基板搬运装置、基板把持装置以及药液处理装置 |
US8795032B2 (en) | 2008-06-04 | 2014-08-05 | Ebara Corporation | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method |
JP2013086241A (ja) * | 2011-10-21 | 2013-05-13 | Ihi Corp | チャック装置およびチャック方法 |
JP2015114966A (ja) * | 2013-12-13 | 2015-06-22 | アドバンス電気工業株式会社 | 流量制御弁及びこれを用いた流量制御装置 |
JP2017175072A (ja) * | 2016-03-25 | 2017-09-28 | 川崎重工業株式会社 | 基板搬送ハンド及びロボット |
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