JP6601138B2 - Icソケット - Google Patents
Icソケット Download PDFInfo
- Publication number
- JP6601138B2 JP6601138B2 JP2015204812A JP2015204812A JP6601138B2 JP 6601138 B2 JP6601138 B2 JP 6601138B2 JP 2015204812 A JP2015204812 A JP 2015204812A JP 2015204812 A JP2015204812 A JP 2015204812A JP 6601138 B2 JP6601138 B2 JP 6601138B2
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- contact
- hole
- barrel
- contact terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
- H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
- H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Connecting Device With Holders (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Description
信号ラインにおける伝送特性もより安定することとなる。
12ai、22ai 電源ライン用コンタクト端子
14ai、24ai 接地ライン用コンタクト端子
16 カラー
26 ロアハウジング
28 アッパハウジング
30 ベース部材
50 シート
DV1,DV2 半導体装置
PCB プリント配線基板
Claims (6)
- 接続される半導体装置における少なくとも信号ラインに対応したコンタクト端子のバレルの胴部が通過する開口端を両端に有し該コンタクト端子を所定の隙間をもって個別に収容する孔を複数個有する導電性材料製のアッパハウジングと、
前記アッパハウジングの一方の端面に配され前記コンタクト端子の第1のプランジャーを案内する前記バレルにおける胴部の外径と異なる外径を有する第1の延在部が所定の隙間をもって通過する孔を有し誘電体からなるカラーを介して該第1の延在部を該孔の内側に支持する導電性材料製のベース部材と、
前記アッパハウジングの他方の端面に配され前記コンタクト端子の第2のプランジャーを案内する前記バレルにおける胴部の外径と異なる外径を有する第2の延在部が所定の隙間をもって通過する孔を有し誘電体からなるカラーを介して該第2の延在部を該孔の内側に支持する導電性材料製のロアハウジングと、
を具備して構成されるICソケット。 - 前記コンタクト端子は、前記第1のプランジャーおよび第2のプランジャーと、前記第1のプランジャーおよび第2のプランジャーを互いに離隔する方向に付勢する弾性部材と、前記第1のプランジャーおよび第2のプランジャーと、前記弾性部材とを収容する前記バレルとを含み、
前記バレルは、該第1のプランジャーおよび第2のプランジャーをそれぞれ、摺動可能に内側に案内する前記第1の延在部および第2の延在部を端部に有し、該第1の延在部および第2の延在部が、低誘電体からなるカラーにより支持されることを特徴とする請求項1記載のICソケット。 - 前記アッパハウジングにおける前記孔を形成する内周面と前記コンタクト端子の外周部との間に空気層が形成されることを特徴とする請求項1記載のICソケット。
- 接続される半導体装置が、前記コンタクト端子の接点部が通過する複数の孔を有する樹脂製のシートを介して前記ベース部材に載置されることを特徴とする請求項1記載のICソケット。
- 前記アッパハウジングおよびロアハウジングは、接地されていることを特徴とする請求項1記載のICソケット。
- 前記コンタクト端子の第1のプランジャーの接触端部に形成される接点部の直径が、該接触端部の他の部分の直径に比して大であって前記バレルの第1の延在部の外径と略同一に設定されることを特徴とする請求項2記載のICソケット。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015204812A JP6601138B2 (ja) | 2015-10-16 | 2015-10-16 | Icソケット |
DE112016004720.7T DE112016004720T5 (de) | 2015-10-16 | 2016-08-23 | Ic-sockel |
PCT/JP2016/074559 WO2017064927A1 (ja) | 2015-10-16 | 2016-08-23 | Icソケット |
US15/758,692 US10534033B2 (en) | 2015-10-16 | 2016-08-23 | IC socket |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015204812A JP6601138B2 (ja) | 2015-10-16 | 2015-10-16 | Icソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017076587A JP2017076587A (ja) | 2017-04-20 |
JP6601138B2 true JP6601138B2 (ja) | 2019-11-06 |
Family
ID=58517418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015204812A Active JP6601138B2 (ja) | 2015-10-16 | 2015-10-16 | Icソケット |
Country Status (4)
Country | Link |
---|---|
US (1) | US10534033B2 (ja) |
JP (1) | JP6601138B2 (ja) |
DE (1) | DE112016004720T5 (ja) |
WO (1) | WO2017064927A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9341671B2 (en) * | 2013-03-14 | 2016-05-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Testing holders for chip unit and die package |
US11221348B2 (en) * | 2017-05-26 | 2022-01-11 | Smiths Interconnect Americas, Inc. | Impedance controlled test socket |
JP7098886B2 (ja) * | 2017-07-04 | 2022-07-12 | 日本電産リード株式会社 | 接触端子、検査治具、及び検査装置 |
KR101954086B1 (ko) * | 2017-11-07 | 2019-03-06 | 리노공업주식회사 | 검사 프로브 조립체 및 검사 소켓 |
CN111316112B (zh) * | 2017-11-30 | 2022-08-09 | 恩普乐股份有限公司 | 电连接用插座 |
KR102677699B1 (ko) * | 2018-03-23 | 2024-06-21 | 스미스 인터커넥트 아메리카스, 인크. | 임피던스 제어형 금속화된 플라스틱 소켓 |
JP7068578B2 (ja) | 2018-03-30 | 2022-05-17 | 山一電機株式会社 | 検査用ソケット |
SG11202105529RA (en) * | 2018-11-27 | 2021-06-29 | Nhk Spring Co Ltd | Probe unit |
CN113167815B (zh) * | 2018-11-27 | 2024-02-23 | 日本发条株式会社 | 探针单元 |
JP7335507B2 (ja) | 2019-12-10 | 2023-08-30 | 山一電機株式会社 | 検査用ソケット |
KR102455150B1 (ko) * | 2020-02-10 | 2022-10-18 | 주식회사 아이에스시 | 피검사 디바이스 검사용 테스트 소켓 |
CN113764947A (zh) * | 2020-06-02 | 2021-12-07 | 山一电机株式会社 | 插座、ic封装以及接触片对连接器壳体的安装方法 |
KR102599969B1 (ko) * | 2020-09-29 | 2023-11-08 | 주식회사 티에스이 | 테스트 소켓 |
GB2604586B (en) | 2021-02-28 | 2024-03-13 | Owen Mumford Ltd | Auto-injector housing latch |
JP2023036137A (ja) * | 2021-09-02 | 2023-03-14 | 山一電機株式会社 | プローブ及び検査用ソケット |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4242199B2 (ja) * | 2003-04-25 | 2009-03-18 | 株式会社ヨコオ | Icソケット |
JP2004325306A (ja) | 2003-04-25 | 2004-11-18 | Yokowo Co Ltd | 検査用同軸プローブおよびそれを用いた検査ユニット |
JP4646552B2 (ja) * | 2004-06-11 | 2011-03-09 | Ateサービス株式会社 | コンタクトピン及びポゴピン |
JP4438601B2 (ja) * | 2004-10-28 | 2010-03-24 | 株式会社ヨコオ | 検査ユニットの製法 |
JP2009129877A (ja) | 2007-11-28 | 2009-06-11 | S Ii R:Kk | 電子部品用ソケット |
JP2012098219A (ja) * | 2010-11-04 | 2012-05-24 | Yamaichi Electronics Co Ltd | 半導体装置用ソケット |
-
2015
- 2015-10-16 JP JP2015204812A patent/JP6601138B2/ja active Active
-
2016
- 2016-08-23 US US15/758,692 patent/US10534033B2/en active Active
- 2016-08-23 DE DE112016004720.7T patent/DE112016004720T5/de active Pending
- 2016-08-23 WO PCT/JP2016/074559 patent/WO2017064927A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US10534033B2 (en) | 2020-01-14 |
WO2017064927A1 (ja) | 2017-04-20 |
JP2017076587A (ja) | 2017-04-20 |
US20180238957A1 (en) | 2018-08-23 |
DE112016004720T5 (de) | 2018-07-19 |
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