JP6592012B2 - ガス分配及び個別のポンピングを伴うバッチ硬化チャンバ - Google Patents
ガス分配及び個別のポンピングを伴うバッチ硬化チャンバ Download PDFInfo
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- JP6592012B2 JP6592012B2 JP2016567489A JP2016567489A JP6592012B2 JP 6592012 B2 JP6592012 B2 JP 6592012B2 JP 2016567489 A JP2016567489 A JP 2016567489A JP 2016567489 A JP2016567489 A JP 2016567489A JP 6592012 B2 JP6592012 B2 JP 6592012B2
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Images
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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- H01L21/67011—Apparatus for manufacture or treatment
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- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Robotics (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Polyurethanes Or Polyureas (AREA)
Description
図2は、区分されたプラズマ生成領域を有する流動性化学気相堆積チャンバ200の一実施形態の断面図である。処理チャンバ200は、基板上に流動性誘電体材料を堆積させるように少なくとも構成される、処理ツール100の任意の処理チャンバ108a−fであってよい。幾つかの実施形態において、処理ツール100は、処理チャンバ200ではなく、任意の他の適当な化学気相堆積チャンバを含んでよい。
図3は、処理チャンバ200とバッチ硬化チャンバ103において実施され得るプロセス300の一実施形態のフロー図である。図4A〜図4Cは、プロセス300の様々な段階に対応する、基板の一部分の概略断面図である。プロセス300は、シャロートレンチアイソレーション(STI)構造製造プロセスのように、基板内又は基板上に画定されたトレンチ内に誘電体材料を形成するように示されているが、プロセス300は、層間誘電体(ILD)構造などの他の構造を基板上に形成するのに利用され得る。
図5は、本開示の実施形態により構成されたバッチ硬化チャンバ500の側面断面図である。バッチ硬化チャンバ500は、図1のバッチ硬化チャンバ103として用いられてもよく、上記のステップ306に記載されたバッチ硬化プロセスを実行するために用いられてもよい。一般に、バッチ硬化チャンバ500は、チャンバ本体510、チャンバ本体510内に配置された複数の硬化ステーション530、及びチャンバ本体510内に部分的に配置された複数基板リフトアセンブリ540を含む。
Claims (15)
- 基板の表面上に誘電体材料を形成するシステムであって、
メインフレームと、
少なくとも1つの大気ロボットを含み、1つ以上の基板カセットを受け取るように構成されるファクトリインターフェースと、
前記メインフレームに連結され、前記ファクトリインターフェースの前記少なくとも1つの大気ロボットから1つ以上の基板を受け取るように構成されるロードロックチャンバと、
各々が前記メインフレームに連結される複数の流動性CVD堆積チャンバと、
前記ファクトリインターフェースに連結されたバッチ処理チャンバと
を備え、前記バッチ処理チャンバは、
前記少なくとも1つの大気ロボットから基板を受け取り、前記大気ロボットから受け取った前記基板に硬化プロセスを実施するように、各々が構成される複数のサブ処理領域と、
前記バッチ処理チャンバの壁に形成されたローディング開口と、
前記ローディング開口を覆って配置される1つのドアと、
複数のスロット開口を含み、前記ローディング開口を覆って配置されるカバープレートと
を備え、
前記ドアは、前記複数のスロット開口の全てを覆って配置され、
前記ドアは、前記ローディング開口を、前記複数のスロット開口を覆う密閉面で密閉するように構成され、
前記複数のスロット開口の各々が、前記少なくとも1つの大気ロボットに、前記バッチ処理チャンバの外側の位置から前記複数のサブ処理領域の1つにアームを伸ばすことを可能にさせるように構成され、
前記複数のスロット開口の各々が、前記ローディング開口が開いている場合、前記ローディング開口のフリーエリアを減少させるように構成される、
システム。 - 前記複数のスロット開口の各々が、前記複数のサブ処理領域の1つに対応する、請求項1に記載のシステム。
- 前記複数のスロット開口の各々が、前記複数のサブ処理領域のうちの対応するサブ処理領域と整列している、請求項2に記載のシステム。
- 前記ローディング開口が、複数の硬化ステーション又は前記ファクトリインターフェースに対して前記ローディング開口を位置決めし直すことなく、前記複数の硬化ステーションの各々の中に基板がロードされることを可能にするように構成される、請求項1に記載のシステム。
- 前記複数の流動性CVD堆積チャンバが、CVDプロセスによって基板上に流動性誘電体層を堆積させるように、各々構成される、請求項1に記載のシステム。
- 前記複数のサブ処理領域が、スタックアレイで配列され、前記ローディング開口が、2次元で前記スタックアレイに広がるように構成される、請求項1に記載のシステム。
- 前記ファクトリインターフェースが、前記バッチ処理チャンバ内で処理される前に、前記バッチ処理チャンバの外側で基板を一時的に保管するように構成された少なくとも1つの大気保持ステーションを更に含む、請求項1に記載のシステム。
- 前記バッチ処理チャンバ内の前記複数のサブ処理領域の各々が、加熱された基板ペデスタルとシャワーヘッドの間に配置される、請求項1に記載のシステム。
- 前記シャワーヘッドが、前記サブ処理領域に配置された基板にプロセスガスを独立に供給するように構成される、請求項8に記載のシステム。
- 前記加熱された基板ペデスタルが、処理中に前記サブ処理領域に配置された基板を独立に加熱するように構成される、請求項8に記載のシステム。
- バッチ処理チャンバであって、
大気ロボットから基板を受け取り、前記大気ロボットから受け取った前記基板に硬化プロセスを実施するように、各々が構成される複数のサブ処理領域と、
バッチ処理チャンバの壁に形成されたローディング開口と、
前記ローディング開口を覆って配置される1つのドアと、
複数のスロット開口を含み、前記ローディング開口を覆って配置されたカバープレートと
を備え、
前記ドアは、前記複数のスロット開口の全てを覆って配置され、
前記ドアは、前記ローディング開口を、前記複数のスロット開口を覆う密閉面で密閉するように構成され、
前記スロット開口の各々が、少なくとも1つの大気ロボットに、前記バッチ処理チャンバの外側の位置から前記複数のサブ処理領域の1つにアームを伸ばすことを可能にさせるように構成され、
前記複数のスロット開口の各々が、前記ローディング開口が開いている場合、前記ローディング開口のフリーエリアを減少させるように構成される、
バッチ基板処理チャンバ。 - 前記複数のスロット開口の各々が、前記複数のサブ処理領域の1つに対応する、請求項11に記載のバッチ処理チャンバ。
- 前記複数のスロット開口の各々が、前記複数のサブ処理領域のうちの対応するサブ処理領域と整列している、請求項12に記載のバッチ処理チャンバ。
- 前記ローディング開口が、複数の硬化ステーションに対して前記ローディング開口を位置決めし直すことなく、前記複数の硬化ステーションの各々の中に基板がロードされることを可能にするように構成される、請求項11に記載のバッチ処理チャンバ。
- 前記バッチ処理チャンバ内の前記複数のサブ処理領域の各々が、加熱された基板ペデスタルとシャワーヘッドの間に配置される、請求項11に記載のバッチ処理チャンバ。
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