JP6591629B2 - 樹脂フィルムの剥離方法及び装置、電子デバイスの製造方法並びに有機el表示装置の製造方法 - Google Patents
樹脂フィルムの剥離方法及び装置、電子デバイスの製造方法並びに有機el表示装置の製造方法 Download PDFInfo
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Description
11 樹脂フィルム(可撓性フィルム)
11a 剥離部
11b 密着面の露出部
12 電子素子
2 支持基板
21 第1部分
22 第2部分
22a 端縁
22b 反対側の端縁
3 把持具
31 挟持部
32 緩衝部
33 支軸
4 吹付け具
41 吐出口(スリット)
42 シャッター
43 タンク
51 平坦化膜
52 第1電極(陽極)
53 バンク
55 有機層
56 第2電極(陰極)
57 保護膜
6 スロットダイ
Claims (10)
- 支持基板の一面に密着して形成された樹脂フィルムを前記支持基板から剥離する方法であって、
前記支持基板を第1部分と第2部分とに分離の準備をする工程、
前記支持基板の前記第2部分の一面に前記樹脂フィルムが密着した状態で、前記支持基板の前記第1部分と、前記第2部分の少なくとも前記第1部分側の端縁とを前記一面と垂直方向に離間するように相対移動させることにより、前記樹脂フィルムと前記支持基板の第1部分との間に一部の剥離を生じさせる工程、及び
前記一部剥離により露出する前記樹脂フィルムと前記支持基板の第1部分との密着面の端部に前記支持基板と平行方向に、かつ、前記樹脂フィルムの幅の全体に亘って均一な一定圧力の気体もしくは液体による吹付力を印加する工程
を含み、
前記第2部分を垂直方向に離間させるか、前記樹脂フィルムの延びる方向に前記樹脂フィルムを引っ張りながら前記樹脂フィルムを剥離することを特徴とする樹脂フィルムの剥離方法。 - 支持基板の一面に密着して形成された樹脂フィルムを前記支持基板から剥離する方法であって、
前記支持基板を第1部分と第2部分とに分離の準備をする工程、
前記支持基板の前記第2部分の一面に前記樹脂フィルムが密着した状態で、前記支持基板の前記第1部分と、前記第2部分の少なくとも前記第1部分側の端縁とを前記一面と垂直方向に離間するように相対移動させることにより、前記樹脂フィルムと前記支持基板の第1部分との間に一部の剥離を生じさせる工程、及び
前記一部剥離により露出する前記樹脂フィルムと前記支持基板の第1部分との密着面の端部に前記支持基板と平行方向に、かつ、前記樹脂フィルムの幅方向で一定圧力の気体もしくは液体による吹付力を印加する工程
を含み、
前記支持基板は、前記第1部分と第2部分とが着脱自在に接続されている、フィルムの剥離方法。 - 前記一定圧力の気体もしくは液体の吹付けを、気体もしくは液体を吹き付ける吹付け具の吐出口から気体もしくは液体を吐出することにより行い、前記吐出口を、前記樹脂フィルムの幅をカバーするように形成することにより行う請求項1又は2に記載の樹脂フィルムの剥離方法。
- 前記一定圧力の気体もしくは液体の吹付けが、前記樹脂フィルムの幅をカバーするタンクに、一定圧力となるバルブを介して気体源又は液体源を接続すると共に、前記タンクの一面に前記樹脂フィルムの幅をカバーするスリットからなる吐出口を形成しておき、前記タンクの吐出口から一定圧力の気体又は液体を吐出して吹き付ける請求項1〜3のいずれか1項に記載の樹脂フィルムの剥離方法。
- 前記液体の吹付けを、加温した液体の吹付けにより行う請求項1〜4のいずれか1項に記載の樹脂フィルムの剥離方法。
- 前記一定圧力の気体又は液体の吹付けを0.01kg/cm2以上であって0.5kg/cm2以下の圧力で行う請求項1〜5のいずれか1項に記載の樹脂フィルムの剥離方法。
- 前記支持基板がガラス板又はセラミック基板からなり、前記第1部分と第2部分とを分離する工程を前記支持基板の前記樹脂フィルムが形成された面と反対面から入れられたスクライブ線に沿って割断することにより行う請求項1に記載の樹脂フィルムの剥離方法。
- 前記樹脂フィルムを前記支持基板の上に液状樹脂を塗布して硬化させることによって形成する請求項1〜7のいずれか1項に記載の樹脂フィルムの剥離方法。
- 第1部分と第2部分とを有する支持基板の一面に可撓性の樹脂フィルムを形成する工程、
前記樹脂フィルム上に電子素子を形成する工程、及び
前記電子素子が形成された樹脂フィルムを前記支持基板から剥離する工程
を含むフレキシブル基板を有する電子デバイスを製造する方法であって、
前記樹脂フィルムの剥離を請求項1〜8のいずれか1項に記載の方法で行うフレキシブル基板を有する電子デバイスの製造方法。 - 前記樹脂フィルムの形成を、前記支持基板上にポリイミドからなる液状樹脂を塗布し、前記樹脂フィルムの前記支持基板との密着力が、0.1N/10mm以上であって1N/10mm以下になるように焼成することにより前記樹脂フィルムを形成する請求項9記載の電子デバイスの製造方法。
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CN112042273A (zh) | 2018-05-09 | 2020-12-04 | 堺显示器制品株式会社 | 柔性发光器件的制造方法以及制造装置 |
CN112136362A (zh) | 2018-05-09 | 2020-12-25 | 堺显示器制品株式会社 | 柔性发光器件的制造方法以及制造装置 |
WO2019215835A1 (ja) | 2018-05-09 | 2019-11-14 | 堺ディスプレイプロダクト株式会社 | フレキシブル発光デバイスの製造方法および製造装置 |
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