JP6568398B2 - Cleaning device and cleaning method - Google Patents

Cleaning device and cleaning method Download PDF

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JP6568398B2
JP6568398B2 JP2015105092A JP2015105092A JP6568398B2 JP 6568398 B2 JP6568398 B2 JP 6568398B2 JP 2015105092 A JP2015105092 A JP 2015105092A JP 2015105092 A JP2015105092 A JP 2015105092A JP 6568398 B2 JP6568398 B2 JP 6568398B2
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cleaning
liquid
tank
cleaning liquid
upper edge
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JP2016219674A (en
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等 羽深
等 羽深
昭広 後藤
昭広 後藤
伸賢 小野
伸賢 小野
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Pre Tech Co Ltd
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Description

本発明は、ウェーハ等の被洗浄物を洗浄液に浸漬して洗浄する洗浄装置及び洗浄方法に関する。   The present invention relates to a cleaning apparatus and a cleaning method for cleaning an object to be cleaned such as a wafer by immersing it in a cleaning liquid.

従来、半導体ウェーハなどの被洗浄物を洗浄する場合、例えば、図８に示すような洗浄装置１００を使用することができる。図８に示すように、この洗浄装置１００は被洗浄物Ｗを浸漬して洗浄する洗浄液１０１を満たすための洗浄槽１０２、洗浄槽１０２内に洗浄液１０１を供給する供給部１０３を具備している。なお、図８における破線の矢印は洗浄液の流れを示している。   Conventionally, when an object to be cleaned such as a semiconductor wafer is cleaned, for example, a cleaning apparatus 100 as shown in FIG. 8 can be used. As shown in FIG. 8, the cleaning device 100 includes a cleaning tank 102 for filling a cleaning liquid 101 for immersing and cleaning the article W to be cleaned, and a supply unit 103 for supplying the cleaning liquid 101 into the cleaning tank 102. . In addition, the arrow of the broken line in FIG. 8 has shown the flow of the washing | cleaning liquid.

そして、図８のように、洗浄槽１０２に洗浄液１０１を満たした状態で、さらに、供給部１０３から洗浄槽１０２に洗浄液１０１を供給する。このようにして、洗浄液１０１を洗浄槽１０２の上縁から溢れさせながら被洗浄物Ｗの洗浄を行うことができる。   Then, as shown in FIG. 8, the cleaning liquid 101 is further supplied from the supply unit 103 to the cleaning tank 102 while the cleaning tank 102 is filled with the cleaning liquid 101. In this way, the cleaning object W can be cleaned while the cleaning liquid 101 overflows from the upper edge of the cleaning tank 102.

この場合、図９に示すように、供給部１０３から供給された洗浄液１０１は、まず、洗浄槽１０２の底部から、洗浄液１０１の液面に向かって上昇する。洗浄液１０１は液面に届いた後、洗浄槽１０２の側壁部に向かって水平に移動し、側壁部の上端（洗浄槽１０２の上縁）から溢れ出る。このようにして、洗浄槽１０２から洗浄液１０１が排出される。ここで、洗浄液１０１によって被洗浄物Ｗから遊離した微粒子等の汚れのうち、洗浄液１０１の液面に浮遊した汚れは、側壁部の上端から洗浄槽１０２の外に排出される。   In this case, as shown in FIG. 9, the cleaning liquid 101 supplied from the supply unit 103 first rises from the bottom of the cleaning tank 102 toward the liquid level of the cleaning liquid 101. After the cleaning liquid 101 reaches the liquid level, it moves horizontally toward the side wall of the cleaning tank 102 and overflows from the upper end of the side wall (the upper edge of the cleaning tank 102). In this way, the cleaning liquid 101 is discharged from the cleaning tank 102. Here, of the dirt such as fine particles released from the object W to be cleaned by the cleaning liquid 101, the dirt floating on the liquid surface of the cleaning liquid 101 is discharged out of the cleaning tank 102 from the upper end of the side wall portion.

さらに、特許文献１には、上記のように洗浄液をオーバーフローさせる際に、洗浄液の液面に沿って気体を吹きつけるためのノズルを設けた洗浄装置が開示されている。このような洗浄装置は、ノズルから液面に沿って気体を吹きつけることで、液面に浮遊した汚れを移動させ、汚れをより効率よく洗浄槽の上縁から除去することができる。   Furthermore, Patent Document 1 discloses a cleaning device provided with a nozzle for blowing gas along the surface of the cleaning liquid when the cleaning liquid overflows as described above. In such a cleaning apparatus, by blowing gas from the nozzle along the liquid surface, the dirt floating on the liquid surface can be moved, and the dirt can be more efficiently removed from the upper edge of the cleaning tank.

特開平５−５５１９１号公報JP-A-5-55191

上述のように、図８、９に示すような従来の洗浄装置１００では、液面近傍の洗浄液１０１だけが排出される構造であった。従って、液面近傍の極めて浅い部分の洗浄液１０１が排出されるのみであった。そのため、液面より下方の洗浄液１０１は排出されることなく、洗浄槽１０２の底部方向に下降する（図９に示す破線の矢印参照）。このように、洗浄槽１０２内で洗浄液１０１は大きな循環流を形成する。   As described above, the conventional cleaning apparatus 100 as shown in FIGS. 8 and 9 has a structure in which only the cleaning liquid 101 near the liquid surface is discharged. Therefore, the cleaning liquid 101 in a very shallow portion near the liquid surface is only discharged. Therefore, the cleaning liquid 101 below the liquid level is not discharged and descends toward the bottom of the cleaning tank 102 (see the broken arrow shown in FIG. 9). Thus, the cleaning liquid 101 forms a large circulation flow in the cleaning tank 102.

そして、このような大きな循環流のために、被洗浄物Ｗから遊離した汚れのうちの液面に浮遊しなかった汚れの殆どが洗浄槽１０２内を下降し、再び被洗浄物Ｗに戻ることとなる。これにより、洗浄効率が低下し、洗浄時間が余分に必要となるうえに、洗浄液を余分に消費するという問題があった。   And, due to such a large circulation flow, most of the dirt that has not floated on the liquid surface among the dirt released from the object to be cleaned W descends in the cleaning tank 102 and returns to the object to be cleaned W again. It becomes. As a result, there is a problem that the cleaning efficiency is reduced, an extra cleaning time is required, and an extra cleaning liquid is consumed.

本発明は前述のような問題に鑑みてなされたもので、洗浄効率が良く、洗浄時間及び洗浄液の消費の増大を抑制することが可能な洗浄装置及び洗浄方法を提供することを目的とする。   The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a cleaning apparatus and a cleaning method that have good cleaning efficiency and can suppress an increase in cleaning time and consumption of cleaning liquid.

上記目的を達成するために、本発明は、被洗浄物を浸漬して洗浄するための洗浄液で満たされる洗浄槽と、前記洗浄液を前記洗浄槽の内部に供給する供給部を具備し、前記洗浄槽の内部に前記供給部から前記洗浄液を供給することで、前記洗浄槽の上縁から前記洗浄液を溢れさせながら、前記洗浄槽内の前記洗浄液に浸漬された前記被洗浄物を洗浄する洗浄装置であって、前記洗浄槽が、前記洗浄槽の上縁より下方に配置された、前記洗浄液を排出するための排出部を有し、前記洗浄槽の上縁から前記洗浄液を溢れさせるとともに、前記排出部からも前記洗浄液を排出しながら前記被洗浄物を洗浄するものであることを特徴とする洗浄装置を提供する。   To achieve the above object, the present invention comprises a cleaning tank filled with a cleaning liquid for immersing and cleaning an object to be cleaned, and a supply unit for supplying the cleaning liquid to the inside of the cleaning tank. A cleaning device for cleaning the object to be cleaned immersed in the cleaning liquid in the cleaning tank while supplying the cleaning liquid from the supply unit to the inside of the tank, and overflowing the cleaning liquid from the upper edge of the cleaning tank The cleaning tank has a discharge part for discharging the cleaning liquid disposed below the upper edge of the cleaning tank, and overflows the cleaning liquid from the upper edge of the cleaning tank, and There is provided a cleaning apparatus for cleaning the object to be cleaned while discharging the cleaning liquid from a discharge unit.

本発明の洗浄装置は、洗浄槽の上縁から洗浄液をオーバーフローさせることで洗浄液を排出するとともに、洗浄槽の上縁より下方に配置された排出部からも洗浄液を排出することができる。これにより、液面近傍の洗浄液だけでなく、液面近傍より下方の洗浄液も排出することができる。その結果、液面に浮遊しなかった汚れも除去することができ、被洗浄物から遊離した汚れが再び被洗浄物に戻ることを抑制できるので洗浄効率の高い洗浄装置となる。   The cleaning apparatus of the present invention can discharge the cleaning liquid by overflowing the cleaning liquid from the upper edge of the cleaning tank, and can also discharge the cleaning liquid from a discharge portion disposed below the upper edge of the cleaning tank. As a result, not only the cleaning liquid near the liquid level but also the cleaning liquid below the liquid level can be discharged. As a result, dirt that has not floated on the liquid surface can also be removed, and dirt released from the object to be cleaned can be prevented from returning again to the object to be cleaned, so that a cleaning device with high cleaning efficiency can be obtained.

このとき、前記洗浄槽が前記排出部として孔を有するものであることが好ましい。   At this time, it is preferable that the said washing tank has a hole as said discharge part.

本発明の洗浄装置では、排出部として孔を好適に使用することができる。   In the cleaning apparatus of the present invention, a hole can be suitably used as the discharge part.

またこのとき、前記洗浄槽が前記排出部としてスリットを有するものであることが好ましい。   Moreover, it is preferable at this time that the said washing tank has a slit as said discharge part.

本発明の洗浄装置では、排出部としてスリットを好適に使用することができる。   In the cleaning apparatus of the present invention, a slit can be suitably used as the discharge unit.

また、上記目的を達成するために、本発明は、洗浄槽の内部に満たされた洗浄液に被洗浄物を浸漬し、供給部から前記洗浄槽の内部に前記洗浄液を供給することで、前記洗浄槽の上縁から前記洗浄液を溢れさせながら前記被洗浄物を洗浄する洗浄方法であって、前記洗浄槽として、前記洗浄槽の上縁より下方に配置された、前記洗浄液を排出するための排出部を有するものを使用し、前記洗浄液を前記供給部から前記洗浄槽に供給することで、前記洗浄槽の上縁から前記洗浄液を溢れさせるとともに前記排出部からも前記洗浄液を排出しながら前記被洗浄物を洗浄することを特徴とする洗浄方法を提供する。   In order to achieve the above object, the present invention provides the cleaning by immersing an object to be cleaned in a cleaning liquid filled in the cleaning tank and supplying the cleaning liquid from the supply unit to the cleaning tank. A cleaning method for cleaning the object to be cleaned while overflowing the cleaning liquid from the upper edge of the tank, wherein the cleaning tank is disposed below the upper edge of the cleaning tank and is used to discharge the cleaning liquid. The cleaning liquid is supplied from the supply unit to the cleaning tank, and overflows the cleaning liquid from the upper edge of the cleaning tank and discharges the cleaning liquid from the discharge unit. Provided is a cleaning method characterized by cleaning a cleaning object.

本発明の洗浄方法では、洗浄槽の上縁から洗浄液をオーバーフローさせることで洗浄液を排出するとともに、洗浄槽の上縁より下方に配置された排出部からも洗浄液を排出する。これにより、液面近傍の洗浄液だけでなく、液面近傍より下方の洗浄液も排出することができる。その結果、液面に浮遊していない汚れも除去することができ、被洗浄物から遊離した汚れが再び被洗浄物に戻ることを抑制することができるので洗浄効率の高い洗浄を行うことができる。   In the cleaning method of the present invention, the cleaning liquid is discharged by overflowing the cleaning liquid from the upper edge of the cleaning tank, and the cleaning liquid is also discharged from a discharge portion disposed below the upper edge of the cleaning tank. As a result, not only the cleaning liquid near the liquid level but also the cleaning liquid below the liquid level can be discharged. As a result, dirt that is not floating on the liquid surface can also be removed, and dirt released from the object to be cleaned can be prevented from returning to the object to be cleaned, so that cleaning with high cleaning efficiency can be performed. .

このとき、本発明の洗浄方法では、前記排出部を孔とすることができる。   At this time, in the cleaning method of the present invention, the discharge portion can be a hole.

本発明の洗浄方法では、排出部として孔を好適に使用することができる。   In the cleaning method of the present invention, a hole can be suitably used as the discharge portion.

このとき、本発明の洗浄方法では、前記排出部をスリットとすることができる。   At this time, in the cleaning method of the present invention, the discharge portion can be a slit.

本発明の洗浄方法では、排出部としてスリットを好適に使用することができる。   In the cleaning method of the present invention, a slit can be suitably used as the discharge portion.

本発明の洗浄装置及び洗浄方法であれば、洗浄液の液面近傍の汚れだけでなく、液中の汚れも洗浄槽内から効率よく排出できるため、従来に比べ洗浄効率の高い洗浄を実施することができる。その結果、洗浄に要する時間、洗浄液の消費量を低減することができる。   With the cleaning apparatus and cleaning method of the present invention, not only dirt near the liquid surface of the cleaning liquid but also dirt in the liquid can be efficiently discharged from the cleaning tank, so that cleaning with higher cleaning efficiency than before is performed. Can do. As a result, the time required for cleaning and the consumption of cleaning liquid can be reduced.

本発明の洗浄装置の一例を示した概略図である。It is the schematic which showed an example of the washing | cleaning apparatus of this invention. 本発明の洗浄装置における洗浄槽内の洗浄液の流れを示した概略図である。It is the schematic which showed the flow of the washing | cleaning liquid in the washing tank in the washing | cleaning apparatus of this invention. 本発明の洗浄装置において、被洗浄物を洗浄液に浸漬する際の概略を示す図である。It is a figure which shows the outline at the time of immersing a to-be-cleaned object in a washing | cleaning liquid in the washing | cleaning apparatus of this invention. 本発明の洗浄装置において、排出部を孔とした場合の一例を示す概略図である。In the washing | cleaning apparatus of this invention, it is the schematic which shows an example at the time of setting a discharge part as a hole. 排出部から排出される洗浄液の排出速度の変化を示す図である。It is a figure which shows the change of the discharge speed of the washing | cleaning liquid discharged | emitted from a discharge part. 本発明の洗浄装置において、排出部を孔とした場合の他の一例を示す概略図である。In the washing | cleaning apparatus of this invention, it is the schematic which shows another example at the time of setting a discharge part as a hole. 本発明の洗浄装置において、排出部をスリットとした場合の一例を示す概略図である。In the washing | cleaning apparatus of this invention, it is the schematic which shows an example at the time of making a discharge part into a slit. 従来の洗浄装置の一例を示した図である。It is the figure which showed an example of the conventional washing | cleaning apparatus. 従来の洗浄装置における洗浄槽内の洗浄液の流れを示した図である。It is the figure which showed the flow of the washing | cleaning liquid in the washing tank in the conventional washing | cleaning apparatus.

以下、本発明について実施の形態を説明するが、本発明はこれに限定されるものではない。   Hereinafter, although an embodiment is described about the present invention, the present invention is not limited to this.

上記のように、従来の洗浄装置では、液面近傍の洗浄液のみが排出されるため、液面に浮遊しなかった汚れは洗浄槽内を循環し、被洗浄物に付着してしまうことがあった。そのため、洗浄効率が低下し、洗浄時間や洗浄液の消費量が増大してしまうという問題があった。   As described above, in the conventional cleaning apparatus, only the cleaning liquid in the vicinity of the liquid level is discharged, so that dirt that does not float on the liquid level may circulate in the cleaning tank and adhere to the object to be cleaned. It was. For this reason, there is a problem that the cleaning efficiency is lowered, and the cleaning time and the consumption of the cleaning liquid are increased.

そこで、本発明者等はこのような問題を解決すべく鋭意検討を重ねた。その結果、洗浄槽の上縁より下方に排出部を配置し、この排出部から液面に浮遊しなかった、洗浄液中を漂っている汚れを含む洗浄液を洗浄槽から排出することで洗浄効率を向上させることを見出し、本発明を完成させた。   Therefore, the present inventors have made extensive studies to solve such problems. As a result, a discharge part is arranged below the upper edge of the cleaning tank, and cleaning efficiency including the dirt floating in the cleaning liquid that did not float on the liquid surface from this discharge part is discharged from the cleaning tank. As a result, the present invention has been completed.

まず、本発明の洗浄装置について、図１〜７を参照して説明する。図１に示すように、本発明の洗浄装置１０は、被洗浄物Ｗを浸漬して洗浄するための洗浄液１で満たされる洗浄槽２と、洗浄液１を洗浄槽２の内部に供給する供給部３を具備している。洗浄液としては、例えば、水、薬液などを使用できる。供給部３としては、側面に穴を有する管状のノズル等を使用できる。さらに、洗浄槽２内で被洗浄物Ｗを保持するための保持具４を具備していても良い。なお、図１における破線の矢印は洗浄液１の流れを示している。   First, the cleaning apparatus of the present invention will be described with reference to FIGS. As shown in FIG. 1, the cleaning device 10 of the present invention includes a cleaning tank 2 filled with a cleaning liquid 1 for immersing and cleaning an object to be cleaned W, and a supply unit that supplies the cleaning liquid 1 to the inside of the cleaning tank 2. 3 is provided. As the cleaning liquid, for example, water, chemical liquid or the like can be used. As the supply unit 3, a tubular nozzle having a hole on the side surface can be used. Furthermore, you may comprise the holder 4 for hold | maintaining the to-be-cleaned object W in the washing tank 2. FIG. In addition, the arrow of the broken line in FIG.

そして、図１に示すように、本発明の洗浄装置１０において、洗浄槽２は、洗浄槽２の上縁２ａより下方に配置された排出部５を有している。そして、この排出部５は液面よりも下方の洗浄液１を排出することができる。なお、図１には、排出部５を洗浄槽２の側部２ｂに形成した孔とする場合を示している。洗浄槽２が上記のような排出部５を有していることにより、被洗浄物Ｗの洗浄時に、洗浄槽２の上縁２ａから洗浄液１を溢れさせ排出するとともに、排出部５からも洗浄液１を排出しながら被洗浄物Ｗを洗浄することができる。   As shown in FIG. 1, in the cleaning device 10 of the present invention, the cleaning tank 2 has a discharge portion 5 disposed below the upper edge 2 a of the cleaning tank 2. And this discharge part 5 can discharge the cleaning liquid 1 below the liquid surface. FIG. 1 shows a case where the discharge part 5 is a hole formed in the side part 2 b of the cleaning tank 2. Since the cleaning tank 2 has the discharge section 5 as described above, the cleaning liquid 1 overflows and is discharged from the upper edge 2a of the cleaning tank 2 when the workpiece W is cleaned, and the cleaning liquid is also discharged from the discharge section 5. The object to be cleaned W can be cleaned while discharging 1.

また、排出部５の配設に関しては、予め、洗浄槽２の側部２ｂ付近の、液面に沿って水平に移動する洗浄水の深さを把握しておき、該把握した深さに相当する深さまでの側部２ｂに排出部５を設けることができる。   In addition, regarding the arrangement of the discharge unit 5, the depth of the cleaning water that moves horizontally along the liquid surface in the vicinity of the side portion 2b of the cleaning tank 2 is grasped in advance and corresponds to the grasped depth. The discharge part 5 can be provided in the side part 2b to the depth to do.

ここで、洗浄槽２を正面から見た場合の、洗浄槽２内の洗浄液１の流れの概略を図２に示す。なお、図２においても、洗浄液１の流れを破線の矢印で示す。図２に示すように、供給部３から供給された洗浄液１は、側部２ｂと底部２ｃから成る洗浄槽２内で液面１ａに向かって上昇する。そして、液面１ａ近傍に到達した洗浄液は、側部２ｂに向かって水平方向に移動する。そして、液面１ａの近傍の洗浄液１は洗浄槽２の上縁２ａから排出され、液面１ａ近傍よりも下方を流れる洗浄液１は排出口５から排出される。このようにして、洗浄液１の循環を妨げることで、被洗浄物Ｗから遊離した汚れが再び被洗浄物Ｗに付着することを抑制できる。   Here, FIG. 2 shows an outline of the flow of the cleaning liquid 1 in the cleaning tank 2 when the cleaning tank 2 is viewed from the front. In FIG. 2 as well, the flow of the cleaning liquid 1 is indicated by broken-line arrows. As shown in FIG. 2, the cleaning liquid 1 supplied from the supply unit 3 rises toward the liquid level 1a in the cleaning tank 2 composed of the side part 2b and the bottom part 2c. Then, the cleaning liquid that has reached the vicinity of the liquid level 1a moves in the horizontal direction toward the side portion 2b. The cleaning liquid 1 in the vicinity of the liquid level 1a is discharged from the upper edge 2a of the cleaning tank 2, and the cleaning liquid 1 flowing below the vicinity of the liquid level 1a is discharged from the discharge port 5. In this way, by preventing the circulation of the cleaning liquid 1, it is possible to prevent the dirt released from the object to be cleaned W from adhering to the object to be cleaned again.

本発明の洗浄装置１０であれば、特に、洗浄液の供給量及び排出部からの排出量を調整することにより、図３に示すように、洗浄槽２内に供給されて液面に向かって上昇した洗浄液の殆どを上縁２ａ及び排出部５から排出することもできるため、汚れが付着した被洗浄物Ｗを洗浄槽２内に浸漬する際に洗浄液１の循環がほぼないようにすることができる。この場合、洗浄液１に浸漬することにより被洗浄物Ｗの表面から脱離した汚れなどが直ちに洗浄槽２の外に排出される。従って、被洗浄物Ｗ全体が洗浄槽２内に浸漬された時点で洗浄がほぼ完了するようにすることもできる。このように、本発明の洗浄装置１０は洗浄効率を向上させることができ、洗浄時間の短縮及び洗浄液の消費量の低減ができる。   In the cleaning apparatus 10 of the present invention, in particular, by adjusting the supply amount of the cleaning liquid and the discharge amount from the discharge unit, as shown in FIG. 3, it is supplied into the cleaning tank 2 and rises toward the liquid level. Since most of the cleaned liquid can be discharged from the upper edge 2a and the discharge portion 5, it is possible to prevent the cleaning liquid 1 from being circulated when the object W to be cleaned is immersed in the cleaning tank 2. it can. In this case, dirt or the like detached from the surface of the workpiece W by being immersed in the cleaning liquid 1 is immediately discharged out of the cleaning tank 2. Therefore, the cleaning can be almost completed when the entire object to be cleaned W is immersed in the cleaning tank 2. Thus, the cleaning apparatus 10 of the present invention can improve the cleaning efficiency, shorten the cleaning time and reduce the consumption of the cleaning liquid.

また、図１、２では排出部５の具体例として、各側部２ｂにおいて孔を一段三列で配置した例を説明したが、孔の数及び位置はこれに限定されることは無い。排水部５から排出する流量に合わせて、孔の数、形、大きさ、及び位置等は調整できる。   Moreover, although the example which has arrange | positioned the hole in 1 step | paragraph three rows in each side part 2b was demonstrated as FIGS. 1 and 2 as a specific example of the discharge part 5, the number and position of a hole are not limited to this. The number, shape, size, position, and the like of the holes can be adjusted according to the flow rate discharged from the drainage unit 5.

本発明の洗浄装置１０では、洗浄の際に洗浄槽２の上縁２ａ及び排出部５の両方から洗浄液１を排出する。従って、洗浄液１の液面１ａは洗浄槽２の上縁に到達している必要が有る。そのため、排出部から排出される水量の合計が供給部３から注入される水量の合計を超えないようにするために、孔の数や大きさ、その分布等を調節する。   In the cleaning apparatus 10 of the present invention, the cleaning liquid 1 is discharged from both the upper edge 2a of the cleaning tank 2 and the discharge unit 5 during the cleaning. Therefore, the liquid surface 1 a of the cleaning liquid 1 needs to reach the upper edge of the cleaning tank 2. Therefore, in order to prevent the total amount of water discharged from the discharge unit from exceeding the total amount of water injected from the supply unit 3, the number and size of the holes, the distribution thereof, and the like are adjusted.

例えば、図４に示すような配列で、洗浄槽２に孔を配置しても良い。図４の場合は、５段５列、上縁２ａから５ｃｍの深さまで孔を等間隔（１ｃｍ）で配置した。このとき、図４のように孔を配設し、孔の直径を１ｍｍ、２ｍｍ、３ｍｍとした場合の、各段における洗浄水の排出速度を図５に示す。   For example, the holes may be arranged in the cleaning tank 2 in the arrangement as shown in FIG. In the case of FIG. 4, the holes are arranged at equal intervals (1 cm) from 5 rows and 5 rows to a depth of 5 cm from the upper edge 2a. At this time, holes are provided as shown in FIG. 4, and the discharge rate of the cleaning water at each stage when the diameter of the holes is 1 mm, 2 mm, and 3 mm is shown in FIG.

図５から分かるように、孔の直径が同じであれば、下方に位置する孔ほど排水量が増える。また、孔の直径が大きいほど排水量が増えることが分かる。従って、孔の直径や孔を配設する位置の高さによって排水部から排出する洗浄液の流量を調整することができる。例えば、図６に示すように、孔の分布を偏らせて配置しても良い。   As can be seen from FIG. 5, if the diameters of the holes are the same, the amount of drainage increases as the holes are located below. Moreover, it turns out that the amount of drainage increases, so that the diameter of a hole is large. Therefore, the flow rate of the cleaning liquid discharged from the drainage part can be adjusted according to the diameter of the hole and the height of the position where the hole is provided. For example, as shown in FIG. 6, the distribution of the holes may be biased.

また、図１〜４、６では、本発明の洗浄装置１０における洗浄槽２が排出部５として孔を有する場合を説明したが、これに限定されることは無い。例えば、図７に示すように、排出部５としてスリットを有する洗浄槽２とすることもできる。図７に示すようなスリットは、例えば、洗浄槽２の上縁２ａから所定の深さまで切込みを入れることで形成することができる。このようなスリットにより、洗浄槽２の上縁２ａに加え、上縁２ａより下方の位置からも洗浄液１を排出できる。   Moreover, although FIG. 1-4, 6 demonstrated the case where the washing tank 2 in the washing | cleaning apparatus 10 of this invention has a hole as the discharge part 5, it is not limited to this. For example, as shown in FIG. 7, the discharge tank 5 may be a cleaning tank 2 having a slit. The slit as shown in FIG. 7 can be formed, for example, by cutting from the upper edge 2a of the cleaning tank 2 to a predetermined depth. By such a slit, in addition to the upper edge 2a of the cleaning tank 2, the cleaning liquid 1 can be discharged from a position below the upper edge 2a.

また、本発明の洗浄装置１０は、洗浄液１に超音波を伝搬し、被洗浄物Ｗに超音波を照射する超音波照射機構（不図示）を具備していても良い。このように超音波照射機構を具備していれば、洗浄効率を一層向上させることができる。   Moreover, the cleaning apparatus 10 of the present invention may include an ultrasonic irradiation mechanism (not shown) that propagates ultrasonic waves to the cleaning liquid 1 and irradiates ultrasonic waves to the object to be cleaned W. If the ultrasonic irradiation mechanism is provided as described above, the cleaning efficiency can be further improved.

次に、本発明の洗浄方法について説明する。ここでは、上述の本発明の洗浄装置１０を使用して被洗浄物Ｗを洗浄する場合を例に説明する。   Next, the cleaning method of the present invention will be described. Here, the case where the to-be-cleaned object W is cleaned using the above-described cleaning apparatus 10 of the present invention will be described as an example.

最初に、図１に示した洗浄槽２に供給部３から洗浄液１を供給し、洗浄槽２を洗浄液１で満たす。この際に、供給部３から供給する洗浄液の量が排出部５から排出される洗浄液の量より多くなるようにする。そのためには、洗浄液の供給量を増加させても良いが、洗浄液の消費量をより低減するために、排出部５の形状、位置などを上述のように調整することが好ましい。   First, the cleaning liquid 1 is supplied from the supply unit 3 to the cleaning tank 2 shown in FIG. 1, and the cleaning tank 2 is filled with the cleaning liquid 1. At this time, the amount of cleaning liquid supplied from the supply unit 3 is set to be larger than the amount of cleaning liquid discharged from the discharge unit 5. For this purpose, the supply amount of the cleaning liquid may be increased, but in order to further reduce the consumption amount of the cleaning liquid, it is preferable to adjust the shape, position, etc. of the discharge part 5 as described above.

また、本発明の洗浄方法にて使用する洗浄装置の排出部５を、具体的には、図１〜４、６に示すように孔とすることができる。さらに、図７に示すように、排出部５をスリットとすることもできる。   Moreover, the discharge part 5 of the washing | cleaning apparatus used with the washing | cleaning method of this invention can be specifically made into a hole as shown in FIGS. Furthermore, as shown in FIG. 7, the discharge part 5 can also be made into a slit.

続いて、被洗浄物Ｗを洗浄槽２内に満たされた洗浄液１に浸漬し洗浄を開始する。洗浄の際にも、供給部３から洗浄槽２内に洗浄液１は供給され続けている。これによって、洗浄槽２の上縁２ａから洗浄液１を溢れさせるとともに、排出部５からも洗浄液１を排出しながら被洗浄物Ｗを洗浄することができる。   Subsequently, the object to be cleaned W is immersed in the cleaning liquid 1 filled in the cleaning tank 2 to start cleaning. During the cleaning, the cleaning liquid 1 is continuously supplied from the supply unit 3 into the cleaning tank 2. As a result, the cleaning liquid 1 overflows from the upper edge 2 a of the cleaning tank 2, and the object to be cleaned W can be cleaned while discharging the cleaning liquid 1 from the discharge part 5.

このような本発明の洗浄方法では、図３に示すように、汚れが付着した被洗浄物Ｗを洗浄槽２内に浸漬する際に洗浄液１の循環がほぼないため、洗浄液１に浸漬されることにより被洗浄物Ｗの表面から脱離した汚れなどが直ちに洗浄槽２の外に排出される。そのため、被洗浄物Ｗの表面から脱離した汚れが循環せず、再度被洗浄物に付着することが無いので、被洗浄物Ｗ全体が洗浄槽２内に浸漬した時点で洗浄がほぼ完了する。従って、本発明の洗浄方法であれば、洗浄効率を向上させることができ、洗浄時間の短縮及び洗浄液の消費量の低減をはかることができる。   In such a cleaning method of the present invention, as shown in FIG. 3, since there is almost no circulation of the cleaning liquid 1 when the object W to be cleaned is immersed in the cleaning tank 2, it is immersed in the cleaning liquid 1. As a result, dirt or the like detached from the surface of the object W to be cleaned is immediately discharged out of the cleaning tank 2. Therefore, the dirt detached from the surface of the object to be cleaned W does not circulate and does not adhere to the object to be cleaned again, so that the cleaning is almost completed when the entire object to be cleaned W is immersed in the cleaning tank 2. . Therefore, with the cleaning method of the present invention, the cleaning efficiency can be improved, and the cleaning time can be shortened and the consumption of the cleaning liquid can be reduced.

以下、本発明の実施例及び比較例を示して本発明をより具体的に説明するが、本発明はこれら実施例に限定されるものではない。   EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples of the present invention, but the present invention is not limited to these examples.

（実施例）
図１に示すような、本発明の洗浄装置を使用して、本発明の洗浄方法に従い直径２００ｍｍのシリコンウェーハを洗浄した。このとき、洗浄槽２として、図６に示すような、孔からなる排出部５を有するものを使用した。また、供給部３からの洗浄液１の供給量が１７Ｌ／ｍｉｎ、洗浄槽２の上縁２ａからの洗浄液１の排出量が７Ｌ／ｍｉｎ、排出部５からの洗浄液１の排出量が１０Ｌ／ｍｉｎであった。浸漬時間は２分、ウェーハの洗浄液への出入速度は３０ｍｍ／ｓｅｃとした。 (Example)
A silicon wafer having a diameter of 200 mm was cleaned according to the cleaning method of the present invention using the cleaning apparatus of the present invention as shown in FIG. At this time, the cleaning tank 2 having a discharge part 5 made of holes as shown in FIG. 6 was used. The supply amount of the cleaning liquid 1 from the supply unit 3 is 17 L / min, the discharge amount of the cleaning liquid 1 from the upper edge 2 a of the cleaning tank 2 is 7 L / min, and the discharge amount of the cleaning liquid 1 from the discharge unit 5 is 10 L / min. Met. The immersion time was 2 minutes, and the wafer entrance / exit speed was 30 mm / sec.

洗浄終了後、シリコンウェーハの表面に付着しているパーティクルの個数をパーティクルカウンターで測定した。そして、洗浄後のシリコンウェーハ表面のパーティクルの個数を後述する比較例と比較した。   After cleaning, the number of particles adhering to the surface of the silicon wafer was measured with a particle counter. The number of particles on the surface of the cleaned silicon wafer was compared with a comparative example described later.

（比較例）
図８のような、従来の洗浄装置を用いたこと以外、基本的に実施例と同様な条件でシリコンウェーハを洗浄した。つまり、比較例では洗浄槽の上縁のみから洗浄液を排出することが可能な洗浄装置を使用した。 (Comparative example)
The silicon wafer was cleaned under basically the same conditions as in the example except that a conventional cleaning apparatus as shown in FIG. 8 was used. That is, in the comparative example, a cleaning apparatus capable of discharging the cleaning liquid only from the upper edge of the cleaning tank was used.

洗浄終了後、シリコンウェーハの表面に付着しているパーティクルの個数を実施例と同様に測定した。   After cleaning, the number of particles adhering to the surface of the silicon wafer was measured in the same manner as in the example.

実施例、比較例のパーティクルの個数を比較したところ、実施例にて測定された洗浄後のシリコンウェーハ表面のパーティクルの個数は、比較例にて測定されたパーティクルの個数の０．４倍であった。このように、洗浄液を排出する手段以外、基本的に同様な条件下で洗浄したにもかかわらず、実施例において測定されたパーティクル数は、比較例に比べて著しく少なかった。このことから、本発明の洗浄装置、洗浄方法によって、従来に比べ洗浄効率の高い洗浄を実施することができ、その結果、洗浄に要する時間、洗浄液の使用量を低減することができることが確認された。   When the number of particles in the example and the comparative example were compared, the number of particles on the cleaned silicon wafer surface measured in the example was 0.4 times the number of particles measured in the comparative example. It was. As described above, the number of particles measured in the example was remarkably smaller than that in the comparative example, although the cleaning was performed under basically the same conditions except for the means for discharging the cleaning liquid. From this, it was confirmed that the cleaning apparatus and the cleaning method of the present invention can perform cleaning with higher cleaning efficiency than before, and as a result, the time required for cleaning and the amount of cleaning liquid used can be reduced. It was.

なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。   The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

１…洗浄液、 １ａ…液面、
２…洗浄槽、 ２ａ…上縁、 ２ｂ…側部、 ２ｃ…底部、
３…供給部、 ４…保持具、 ５…排出部、
１０…本発明の洗浄装置、
Ｗ…被洗浄物。 1 ... cleaning liquid, 1a ... liquid level,
2 ... cleaning tank, 2a ... upper edge, 2b ... side, 2c ... bottom,
3 ... Supply part 4 ... Holder 5 ... Discharge part
10 ... Cleaning device of the present invention,
W: Object to be cleaned.

Claims (2)

被洗浄物を浸漬して洗浄するための洗浄液で満たされる洗浄槽と、前記洗浄液を前記洗浄槽の内部に供給する供給部を具備し、前記洗浄槽の内部に前記供給部から前記洗浄液を供給することで、前記洗浄槽の上縁から前記洗浄液を溢れさせながら、前記洗浄槽内の前記洗浄液に浸漬された前記被洗浄物を洗浄する洗浄装置であって、
前記洗浄槽が、前記洗浄槽の上縁より下方に配置された、前記洗浄液を排出するための排出部を有し、
該排出部として、前記洗浄槽の深さ方向に複数段形成された孔を有し、該孔からの前記洗浄液の排出量（Ｌ／ｍｉｎ）が前記上縁からの前記洗浄液の排出量（Ｌ／ｍｉｎ）よりも大きいものであるか、または、前記洗浄槽の前記上縁から所定の深さまで形成されたスリットを有するものであり、
前記洗浄槽の上縁から前記洗浄液を溢れさせるとともに、前記排出部からも前記洗浄液を排出しながら前記被洗浄物を洗浄するものであることを特徴とする洗浄装置。 A cleaning tank filled with a cleaning liquid for immersing and cleaning an object to be cleaned, and a supply unit for supplying the cleaning liquid to the inside of the cleaning tank, and supplying the cleaning liquid from the supply unit to the inside of the cleaning tank A washing apparatus for washing the object to be washed immersed in the washing liquid in the washing tank while overflowing the washing liquid from the upper edge of the washing tank,
The cleaning tank is disposed below the upper edge of the cleaning tank, and has a discharge part for discharging the cleaning liquid,
As the outlet portion, have a plurality of stages hole formed in the depth direction of the cleaning tank, the discharge amount of the cleaning liquid from the hole (L / min) is discharged amount of the cleaning liquid from the upper edge (L / Min) or having a slit formed from the upper edge of the cleaning tank to a predetermined depth,
A cleaning apparatus, wherein the cleaning liquid overflows from an upper edge of the cleaning tank, and the object to be cleaned is cleaned while discharging the cleaning liquid from the discharge section. 洗浄槽の内部に満たされた洗浄液に被洗浄物を浸漬し、供給部から前記洗浄槽の内部に前記洗浄液を供給することで、前記洗浄槽の上縁から前記洗浄液を溢れさせながら前記被洗浄物を洗浄する洗浄方法であって、
前記洗浄槽として、前記洗浄槽の上縁より下方に配置された、前記洗浄液を排出するための排出部を有するものを使用し、
該排出部を、前記洗浄槽の深さ方向に複数段形成された孔とし、該孔からの前記洗浄液の排出量（Ｌ／ｍｉｎ）が前記上縁からの前記洗浄液の排出量（Ｌ／ｍｉｎ）よりも大きいものとするか、または、前記洗浄槽の前記上縁から所定の深さまで形成されたスリットとし、
前記洗浄液を前記供給部から前記洗浄槽に供給することで、前記洗浄槽の上縁から前記洗浄液を溢れさせるとともに前記排出部からも前記洗浄液を排出しながら前記被洗浄物を洗浄することを特徴とする洗浄方法。 The object to be cleaned is immersed in the cleaning liquid filled in the cleaning tank, and the cleaning liquid is supplied from the supply unit to the inside of the cleaning tank, so that the cleaning liquid overflows from the upper edge of the cleaning tank. A cleaning method for cleaning an object,
As the cleaning tank, a tank having a discharge part for discharging the cleaning liquid disposed below the upper edge of the cleaning tank is used.
The discharge portion is a hole formed in a plurality of stages in the depth direction of the cleaning tank, and the discharge amount (L / min) of the cleaning liquid from the hole is the discharge amount (L / min) of the cleaning liquid from the upper edge. min) or a slit formed from the upper edge of the cleaning tank to a predetermined depth,
By supplying the cleaning liquid from the supply unit to the cleaning tank, the cleaning liquid overflows from the upper edge of the cleaning tank, and the cleaning target is cleaned while discharging the cleaning liquid from the discharge unit. Cleaning method.
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