JP6567305B2 - Led光源 - Google Patents
Led光源 Download PDFInfo
- Publication number
- JP6567305B2 JP6567305B2 JP2015058335A JP2015058335A JP6567305B2 JP 6567305 B2 JP6567305 B2 JP 6567305B2 JP 2015058335 A JP2015058335 A JP 2015058335A JP 2015058335 A JP2015058335 A JP 2015058335A JP 6567305 B2 JP6567305 B2 JP 6567305B2
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- JP
- Japan
- Prior art keywords
- substrate
- metal
- pair
- metal structure
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Description
2… LED素子
3… LED素子
4… ボンディングワイヤ
4a… ボンディングワイヤ
4b… ボンディングワイヤ
10… 第1基板
11… 電極パッド
11a、11b… ダイパッド
11c、11d… ワイヤパッド
12… 第1金属構造体
12a、12b、12c、12d… 第1金属構造体
20… 第2基板
21… 配線パッド
21ad… 配線パッド
21bd… 配線パッド
22… 第2金属構造体
22a、22b、22c、22d… 第2金属構造体
23… 電極
23a、23b… 放熱用電極
23c、23d… 受電用電極
30… 積層基板
40… LED光源実装基板
41… 放熱用電極接合バッド
41a… 放熱用電極接合バッド
41b… 放熱用電極接合バッド
42… 側壁
43… 封止樹脂
Claims (2)
- 第1基板と第2基板の2枚のLTCC基板を貼り合わせてなる積層基板と、
互いに対向する面に素子電極を設けた2つのLED素子と、を備え、
前記第1基板は、2つのLED素子の夫々が載置された一対のダイボンディングパッドと前記各ダイボンディングパッドに繋がり厚み方向に貫通する窓孔内に金属が充填されてなる一対の第1金属構造体とを有し、
前記第2基板は、一対の放熱用電極と前記各放熱用電極に繋がり厚み方向に貫通する窓孔内に金属が充填されてなる一対の第2金属構造体とを有し、
前記一対のダイボンディングパッドの夫々と前記一対の放熱用電極の夫々が、前記一対の第1金属構造体の夫々と前記一対の第2金属構造体の夫々を介して繋がっており、
互いに繋がる第1金属構造体と第2金属構造体同士は、前記第1金属構造体の断面積よりも前記第2金属構造体の断面積の方が大きく、且つ、前記一対の第1金属構造体間の間隔よりも前記一対の第2金属構造体間の間隔の方が広く、
前記間隔の夫々は、各間隔を置いて位置する夫々の一対の金属構造体の、該一対の金属構造体の配置方向の長さが同じ場合はその長さの85%以上であり、長さが異なる場合は長い方の長さの85%以上であることを特徴とするLED光源。 - 前記第1基板の窓孔に充填する金属及び前記第2基板の窓孔に充填する金属はいずれも銀及び銀を主体とする金属であることを特徴とする請求項1に記載のLED光源。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015058335A JP6567305B2 (ja) | 2015-03-20 | 2015-03-20 | Led光源 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015058335A JP6567305B2 (ja) | 2015-03-20 | 2015-03-20 | Led光源 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016178242A JP2016178242A (ja) | 2016-10-06 |
JP6567305B2 true JP6567305B2 (ja) | 2019-08-28 |
Family
ID=57071326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015058335A Active JP6567305B2 (ja) | 2015-03-20 | 2015-03-20 | Led光源 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6567305B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10861766B1 (en) * | 2019-09-18 | 2020-12-08 | Delta Electronics, Inc. | Package structures |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3671457B2 (ja) * | 1995-06-07 | 2005-07-13 | 株式会社デンソー | 多層基板 |
JP3377928B2 (ja) * | 1997-05-28 | 2003-02-17 | 京セラ株式会社 | 回路基板 |
JP4780939B2 (ja) * | 2004-07-28 | 2011-09-28 | 京セラ株式会社 | 発光装置 |
JP5640632B2 (ja) * | 2010-03-12 | 2014-12-17 | 旭硝子株式会社 | 発光装置 |
JP5499960B2 (ja) * | 2010-07-06 | 2014-05-21 | 旭硝子株式会社 | 素子用基板、発光装置 |
US8704433B2 (en) * | 2011-08-22 | 2014-04-22 | Lg Innotek Co., Ltd. | Light emitting device package and light unit |
JP2013065793A (ja) * | 2011-09-20 | 2013-04-11 | Ngk Spark Plug Co Ltd | 配線基板 |
US8895998B2 (en) * | 2012-03-30 | 2014-11-25 | Cree, Inc. | Ceramic-based light emitting diode (LED) devices, components and methods |
JP2012165016A (ja) * | 2012-04-27 | 2012-08-30 | Sanyo Electric Co Ltd | 発光装置 |
-
2015
- 2015-03-20 JP JP2015058335A patent/JP6567305B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2016178242A (ja) | 2016-10-06 |
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