JP6555942B2 - 電子モジュールの製造方法 - Google Patents
電子モジュールの製造方法 Download PDFInfo
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- JP6555942B2 JP6555942B2 JP2015120405A JP2015120405A JP6555942B2 JP 6555942 B2 JP6555942 B2 JP 6555942B2 JP 2015120405 A JP2015120405 A JP 2015120405A JP 2015120405 A JP2015120405 A JP 2015120405A JP 6555942 B2 JP6555942 B2 JP 6555942B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 230000002093 peripheral effect Effects 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 9
- 238000003384 imaging method Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 32
- 239000006071 cream Substances 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000004075 alteration Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15158—Shape the die mounting substrate being other than a cuboid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Manufacturing & Machinery (AREA)
Description
Claims (10)
- 電子部品の複数の接続部と配線部材とを、リフローはんだ付けによって接合する電子モジュールの製造方法であって、
前記電子部品は、電子デバイスと、前記電子デバイスを収容する容器と、を備え、
前記容器は、前記電子デバイスが搭載された第1面および前記第1面とは反対側の第2面を有する基部と、空間を介して前記電子デバイスに対向する対向部と、前記基部と前記対向部との間の前記空間を囲む枠部と、前記第2面の側において少なくとも前記電子デバイスの正射影領域に位置し、前記配線部材へはんだ付けされる前記複数の接続部と、を有しており、
前記接合の前の前記電子部品において、前記第2面が凹面を成すように、前記基部の厚さは前記電子デバイスの正射影領域のうちの周辺領域よりも中央領域において小さくなっており、
前記接合の後の前記第2面は前記接合の前の前記第2面よりも平坦であることを特徴とする電子モジュールの製造方法。 - 電子部品の複数の接続部と配線部材とを、リフローはんだ付けによって接合する電子モジュールの製造方法であって、
前記電子部品は、電子デバイスと、前記電子デバイスを収容する容器と、を備え、
前記容器は、前記電子デバイスが搭載された第1面および前記第1面とは反対側の第2面を有する基部と、空間を介して前記電子デバイスに対向する対向部と、前記基部と前記対向部との間の前記空間を囲む枠部と、前記第2面の側において少なくとも前記電子デバイスの正射影領域に位置し、配線部材へはんだ付けされる複数の接続部と、を有しており、
前記接合の前の前記電子部品において、前記第2面が凹面を成すように、前記基部の厚さは前記電子デバイスの正射影領域のうちの周辺領域よりも中央領域において小さくなっており、
前記接合の後の前記第1面は凹面を成すことを特徴とする電子モジュールの製造方法。 - 前記接合の前の前記電子部品において、前記第1面が凹面を成している、請求項1または2に記載の電子モジュールの製造方法。
- 前記接合の前の前記電子部品において、前記基部の厚さは前記周辺領域から前記中央領域に向かって連続的に小さくなっている、請求項1乃至3のいずれか1項に記載の電子モジュールの製造方法。
- 前記基部は樹脂からなる、請求項1乃至4のいずれか1項に記載の電子モジュールの製造方法。
- 前記接合の前の前記電子部品において、前記電子部品の厚さは前記電子デバイスの正射影領域のうちの周辺領域よりも中央領域において小さくなっている、請求項1乃至5のいずれか1項に記載の電子モジュールの製造方法。
- 前記電子デバイスは撮像デバイスまたは表示デバイスである、請求項1乃至6のいずれか1項に記載の電子モジュールの製造方法。
- 前記接合の前の前記電子部品において、前記第1面が前記第2面よりも平坦である、請求項1乃至7のいずれか1項に記載の電子モジュールの製造方法。
- 前記接合の後の前記第2面は前記接合の前の前記第2面よりも平坦である、請求項2に記載の電子モジュールの製造方法。
- 前記リフローはんだ付けの熱処理時に、前記基部は、前記第1面が凹面を成し、前記第2面が前記第1面よりも平坦になるように変形する、請求項1乃至9のいずれか1項に記載の電子モジュールの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015120405A JP6555942B2 (ja) | 2015-06-15 | 2015-06-15 | 電子モジュールの製造方法 |
US15/177,250 US20160366774A1 (en) | 2015-06-15 | 2016-06-08 | Electronic component and method for manufacturing electronic module |
Applications Claiming Priority (1)
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JP2015120405A JP6555942B2 (ja) | 2015-06-15 | 2015-06-15 | 電子モジュールの製造方法 |
Publications (2)
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JP2017005199A JP2017005199A (ja) | 2017-01-05 |
JP6555942B2 true JP6555942B2 (ja) | 2019-08-07 |
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JP2015120405A Active JP6555942B2 (ja) | 2015-06-15 | 2015-06-15 | 電子モジュールの製造方法 |
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US (1) | US20160366774A1 (ja) |
JP (1) | JP6555942B2 (ja) |
Families Citing this family (2)
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JP2020004901A (ja) * | 2018-06-29 | 2020-01-09 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および撮像装置の製造方法 |
CN109166839B (zh) * | 2018-08-30 | 2020-06-16 | 业成科技(成都)有限公司 | 接合垫的区域结构 |
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JP2605865Y2 (ja) * | 1992-05-29 | 2000-08-21 | 京セラ株式会社 | Ccd素子収納用パッケージ |
JP2000164757A (ja) * | 1998-11-26 | 2000-06-16 | Kyocera Corp | 半導体素子収納用パッケージおよびその実装構造 |
JP3726998B2 (ja) * | 1999-04-01 | 2005-12-14 | 株式会社村田製作所 | 表面波装置 |
JP2003188508A (ja) * | 2001-12-18 | 2003-07-04 | Toshiba Corp | プリント配線板、面実装形回路部品および回路モジュール |
US6750549B1 (en) * | 2002-12-31 | 2004-06-15 | Intel Corporation | Variable pad diameter on the land side for improving the co-planarity of ball grid array packages |
JP2006005071A (ja) * | 2004-06-16 | 2006-01-05 | Matsushita Electric Ind Co Ltd | 半導体装置用パッケージおよび半導体装置ならびに半導体装置用パッケージの製造方法 |
EP1860694A1 (en) * | 2005-03-16 | 2007-11-28 | Yamaha Corporation | Semiconductor device, semiconductor device manufacturing method and cover frame |
JP4719009B2 (ja) * | 2006-01-13 | 2011-07-06 | ルネサスエレクトロニクス株式会社 | 基板および半導体装置 |
JP2007266380A (ja) * | 2006-03-29 | 2007-10-11 | Matsushita Electric Ind Co Ltd | 半導体撮像装置およびその製造方法 |
JP5004669B2 (ja) * | 2007-05-28 | 2012-08-22 | 京セラ株式会社 | 撮像部品および撮像ユニット、ならびにこれらの製造方法 |
US8633051B2 (en) * | 2009-08-24 | 2014-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
JP5885690B2 (ja) * | 2012-04-27 | 2016-03-15 | キヤノン株式会社 | 電子部品および電子機器 |
JP6296687B2 (ja) * | 2012-04-27 | 2018-03-20 | キヤノン株式会社 | 電子部品、電子モジュールおよびこれらの製造方法。 |
US8920934B2 (en) * | 2013-03-29 | 2014-12-30 | Intel Corporation | Hybrid solder and filled paste in microelectronic packaging |
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2015
- 2015-06-15 JP JP2015120405A patent/JP6555942B2/ja active Active
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2016
- 2016-06-08 US US15/177,250 patent/US20160366774A1/en not_active Abandoned
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JP2017005199A (ja) | 2017-01-05 |
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