JP6524669B2 - 光硬化性組成物 - Google Patents
光硬化性組成物 Download PDFInfo
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- JP6524669B2 JP6524669B2 JP2015007295A JP2015007295A JP6524669B2 JP 6524669 B2 JP6524669 B2 JP 6524669B2 JP 2015007295 A JP2015007295 A JP 2015007295A JP 2015007295 A JP2015007295 A JP 2015007295A JP 6524669 B2 JP6524669 B2 JP 6524669B2
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- 239000000203 mixture Substances 0.000 title claims description 88
- -1 fluoro compound Chemical class 0.000 claims description 331
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- 150000001875 compounds Chemical class 0.000 claims description 77
- 125000004432 carbon atom Chemical group C* 0.000 claims description 71
- 238000000034 method Methods 0.000 claims description 70
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- 229920000620 organic polymer Polymers 0.000 claims description 38
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 37
- 125000003277 amino group Chemical group 0.000 claims description 30
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 29
- 239000012025 fluorinating agent Substances 0.000 claims description 28
- 229910052731 fluorine Inorganic materials 0.000 claims description 27
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims description 25
- 229910008284 Si—F Inorganic materials 0.000 claims description 23
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 21
- 239000011737 fluorine Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 150000003377 silicon compounds Chemical class 0.000 claims description 14
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- 125000001424 substituent group Chemical group 0.000 description 20
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- 125000005843 halogen group Chemical group 0.000 description 11
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- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 8
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 8
- 125000006574 non-aromatic ring group Chemical group 0.000 description 8
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 7
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 7
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- 238000003756 stirring Methods 0.000 description 7
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 6
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 6
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- 239000011734 sodium Substances 0.000 description 6
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- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 5
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 5
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- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
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- QLNOVKKVHFRGMA-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical group [CH2]CC[Si](OC)(OC)OC QLNOVKKVHFRGMA-UHFFFAOYSA-N 0.000 description 5
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- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 125000000714 pyrimidinyl group Chemical group 0.000 description 1
- NGXSWUFDCSEIOO-UHFFFAOYSA-N pyrrolidin-3-amine Chemical compound NC1CCNC1 NGXSWUFDCSEIOO-UHFFFAOYSA-N 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 125000002294 quinazolinyl group Chemical group N1=C(N=CC2=CC=CC=C12)* 0.000 description 1
- 125000001567 quinoxalinyl group Chemical group N1=C(C=NC2=CC=CC=C12)* 0.000 description 1
- 238000007342 radical addition reaction Methods 0.000 description 1
- 238000006462 rearrangement reaction Methods 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- VCQYDZJGTXAFRL-UHFFFAOYSA-N s-phenyl benzenecarbothioate Chemical compound C=1C=CC=CC=1C(=O)SC1=CC=CC=C1 VCQYDZJGTXAFRL-UHFFFAOYSA-N 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 229910001495 sodium tetrafluoroborate Inorganic materials 0.000 description 1
- PNGLEYLFMHGIQO-UHFFFAOYSA-M sodium;3-(n-ethyl-3-methoxyanilino)-2-hydroxypropane-1-sulfonate;dihydrate Chemical compound O.O.[Na+].[O-]S(=O)(=O)CC(O)CN(CC)C1=CC=CC(OC)=C1 PNGLEYLFMHGIQO-UHFFFAOYSA-M 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000000213 sulfino group Chemical group [H]OS(*)=O 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003513 tertiary aromatic amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- IFLREYGFSNHWGE-UHFFFAOYSA-N tetracene Chemical compound C1=CC=CC2=CC3=CC4=CC=CC=C4C=C3C=C21 IFLREYGFSNHWGE-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- CBDKQYKMCICBOF-UHFFFAOYSA-N thiazoline Chemical compound C1CN=CS1 CBDKQYKMCICBOF-UHFFFAOYSA-N 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 125000005425 toluyl group Chemical group 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000006276 transfer reaction Methods 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- STAGZMKHHNNCKQ-UHFFFAOYSA-N tributyl(fluoro)silane Chemical compound CCCC[Si](F)(CCCC)CCCC STAGZMKHHNNCKQ-UHFFFAOYSA-N 0.000 description 1
- VQOXUMQBYILCKR-UHFFFAOYSA-N tridecaene Natural products CCCCCCCCCCCC=C VQOXUMQBYILCKR-UHFFFAOYSA-N 0.000 description 1
- XVYIJOWQJOQFBG-UHFFFAOYSA-N triethoxy(fluoro)silane Chemical compound CCO[Si](F)(OCC)OCC XVYIJOWQJOQFBG-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- UZIAQVMNAXPCJQ-UHFFFAOYSA-N triethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C(C)=C UZIAQVMNAXPCJQ-UHFFFAOYSA-N 0.000 description 1
- WEAPVABOECTMGR-UHFFFAOYSA-N triethyl 2-acetyloxypropane-1,2,3-tricarboxylate Chemical compound CCOC(=O)CC(C(=O)OCC)(OC(C)=O)CC(=O)OCC WEAPVABOECTMGR-UHFFFAOYSA-N 0.000 description 1
- QYBKVVRRGQSGDC-UHFFFAOYSA-N triethyl methyl silicate Chemical compound CCO[Si](OC)(OCC)OCC QYBKVVRRGQSGDC-UHFFFAOYSA-N 0.000 description 1
- QVMRVWAOMIXFFW-UHFFFAOYSA-N triethyl(fluoro)silane Chemical compound CC[Si](F)(CC)CC QVMRVWAOMIXFFW-UHFFFAOYSA-N 0.000 description 1
- BHOCBLDBJFCBQS-UHFFFAOYSA-N trifluoro(methyl)silane Chemical compound C[Si](F)(F)F BHOCBLDBJFCBQS-UHFFFAOYSA-N 0.000 description 1
- JGHTXIKECBJCFI-UHFFFAOYSA-N trifluoro(propyl)silane Chemical compound CCC[Si](F)(F)F JGHTXIKECBJCFI-UHFFFAOYSA-N 0.000 description 1
- CJYXHAUSMDGBBU-UHFFFAOYSA-N trifluoro-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound F[Si](F)(F)CCCOCC1CO1 CJYXHAUSMDGBBU-UHFFFAOYSA-N 0.000 description 1
- DALOGFFOSLUGET-UHFFFAOYSA-N trifluoromethoxysilane Chemical compound FC(F)(F)O[SiH3] DALOGFFOSLUGET-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- ATVLVRVBCRICNU-UHFFFAOYSA-N trifluorosilicon Chemical group F[Si](F)F ATVLVRVBCRICNU-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- UOKUUKOEIMCYAI-UHFFFAOYSA-N trimethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C(C)=C UOKUUKOEIMCYAI-UHFFFAOYSA-N 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 125000001834 xanthenyl group Chemical group C1=CC=CC=2OC3=CC=CC=C3C(C12)* 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
(2)前記(B)光塩基発生剤が、光潜在性第3級アミンであることを特徴とする(1)に記載の光硬化性組成物。
(3) (D)光により、第一級アミノ基および第二級アミノ基からなる群から選択される1種以上のアミノ基を生成する架橋性珪素基含有化合物をさらに含有することを特徴とする請求項1又は2に記載の光硬化性組成物。
(4)シランカップリング剤(Si−F結合を有するものは除く)をさらに含有することを特徴とする(1)または(2)に記載の光硬化性組成物。
(5)光硬化性組成物が光硬化性接着剤組成物であることを特徴とする(1)〜(3)いずれかに記載の光硬化性組成物。
(6)(1)〜(4)のいずれかに記載の光硬化性組成物に対し、光を照射することにより硬化物を形成することを特徴とする硬化物の製造方法。
(7)(6)記載の方法により形成されてなる硬化物。
(8)(1)〜(4)のいずれかに記載の光硬化性組成物を用いて製造することを特徴とする製品の製造方法。
(9)(6)に記載の方法により製造されてなる製品。
(10)(8)に記載の方法を用いて製造されてなる製品。
(11)(1)〜(4)のいずれかに記載の光硬化性組成物を接着剤として用いてなる製品。
(12)(1)〜(4)のいずれかに記載の光硬化性組成物をコーティング剤として用いてなる製品。
−R2−O−・・・(4)
前記一般式(4)中、R2は炭素数1〜14の直鎖状もしくは分岐アルキレン基であり、炭素数1〜14の、さらには2〜4の、直鎖状もしくは分岐アルキレン基が好ましい。
−CH2O−、−CH2CH2O−、−CH2CH(CH3)O−、−CH2CH(C2H5)O−、−CH2C(CH3)2O−、−CH2CH2CH2CH2O−
等が挙げられる。ポリオキシアルキレン系重合体の主鎖骨格は、1種類だけの繰り返し単位からなってもよいし、2種類以上の繰り返し単位からなってもよい。
R52及びR53は、互いに独立して、水素、C1−C18アルキル、C3−C18アルケニル、C3−C18アルキニル又はフェニルであり、そしてもしR52が水素又はC1−C18アルキルであれば、R53は、更に、基−CO−R64(式中、R64は、C1−C18アルキル又はフェニルである)であるか;或いは、R51とR53は、カルボニル基及びR53が結合しているC原子と一緒になって、ベンゾシクロペンタノン基を形成する。
R54およびR56は、一緒になって、非置換であるか、または1個以上のC1〜C4アルキル基によって置換されているC2〜C12アルキレンブリッジを形成する。R55およびR57は、一緒になって、R54およびR56とは独立して、非置換であるか、または1個以上のC1〜C4アルキル基によって置換されているC2〜C12アルキレンブリッジを形成する。R54とR56が、一緒になって、C3アルキレン橋を形成し、R55とR57が、一緒になって、プロピレン又はペンチレンであることが好ましい。
R66は炭素原子数1〜12のアルキル基;−OH、−炭素原子数1〜4のアルコキシ、−CNもしくは−COO(炭素原子数1〜4のアルキル)で置換された炭素原子数2〜4のアルキル基を表すか、または、R66は炭素原子数3〜5のアルケニル基、炭素原子数5〜12のシクロアルキル基またはフェニル−炭素原子数1〜3のアルキル基を表す。R67は炭素原子数1〜12のアルキル基;または−OH、−炭素原子数1〜4のアルコキシ基、−CNもしくは−COO(炭素原子数1〜4のアルキル)で置換された炭素原子数2〜4のアルキル基を表すかまたはR67は炭素原子数3〜5のアルケニル基、炭素原子数5〜12のシクロアルキル基、フェニル−炭素原子数1〜3のアルキル基、または、未置換であるかまたは炭素原子数1〜12のアルキル基、炭素原子数1〜4のアルコキシ基もしくは−COO(炭素原子数1〜4のアルキル)によって置換されたフェニル基を表すか、あるいはR67はRR66と一緒になって炭素原子数1〜7のアルキレン基、フェニル−炭素原子数1〜4のアルキレン基、o−キシリレン基、2−ブテニレン基または炭素原子数2もしくは3のオキサアルキレン基を表すか、あるいはR66およびR67は一緒になって−O−、−S−もしくは−CO−で中断され得る炭素原子数4〜7のアルキレン基を表すか、またはR66およびR67は一緒になってOH、炭素原子数1〜4のアルコキシ基もしくは−COO(炭素原子数1〜4のアルキル)で置換され得る炭素原子数3〜7のアルキレン基を表す。R66およびR67が複数存在する場合それらは同じであっても異なっていてもよい。
Y1は下記式(v)で示される2価の基、−N(R68)−又は−N(R68)−R69−N(R68)−で示される2価の基を表し、R68は炭素原子数1〜8のアルキル基、炭素原子数3〜5のアルケニル基、フェニル−炭素原子数1〜3のアルキル基、炭素原子数1〜4のヒドロキシアルキル基もしくはフェニル基を表し、R69は1もしくはそれ以上の−O−または−S−により中断され得る枝分かれしていないまたは枝分かれした炭素原子数2〜16のアルキレン基を表す。Y2は炭素原子数1〜6のアルキレン基、シクロヘキシレン基もしくは直接結合を表す。
R70〜R72は、それぞれ互いに独立に、水素、C1〜C18アルキル、C3〜C18アルケニル、C3〜C18アルキニルもしくはフェニルであり;またはR70とR71および/もしくはR72とR71が、互いに独立にC2〜C12アルキレン架橋を形成しているか;あるいはR70〜R72が、結合している窒素原子とともに、P1、P2、P<t/4>型のホスファゼン塩基を、または、下記構造式(a)、(b)、(c)、(d)、(e)、(f)もしくは(g)の基を形成している。
R73およびR74は、それぞれ独立に、水素原子、炭素数1〜20のアルキル基又はハロゲン原子、炭素数1〜20のアルコキシ基、ニトロ基、カルボキシル基、水酸基、メルカプト基、炭素数1〜20のアルキルチオ基、炭素数1〜20のアルキルシリル基、炭素数1〜20のアシル基、アミノ基、シアノ基、炭素数1〜20のアルキル基、フェニル基、ナフチル基、フェノキシ基及びフェ二ルチオ基の群から選ばれる基で置換されていてもよいフェニル基を表し、R73及びR74は互いに結合して環構造を形成していてもよい。
(式(5)において、R80はそれぞれ独立して、置換あるいは非置換の炭素原子数1〜20の炭化水素基、またはR90SiO−(R90はそれぞれ独立に、炭素原子数1〜20の置換あるいは非置換の炭化水素基、又はフッ素原子である)で示されるオルガノシロキシ基のいずれかを示す。dは1〜3のいずれかであり、dが3であることが好ましい。R80及びR90が複数存在する場合、それらは同じであっても異なっていてもよい。)
(式(6)中、R80及びdはそれぞれ式(5)と同じであり、X’はそれぞれ独立して水酸基又はフッ素以外の加水分解性基であり、eは0〜2のいずれかであり、fは0〜2のいずれかであり、d+e+fは3である。R80及びX’が複数存在する場合、それらは同じであっても異なっていてもよい。)
また、合成の容易さからフルオロジメチルシリル基、ジフルオロメチルシリル基、トリフルオロシリル基、フルオロメトキシメチルシリル基、フルオロエトキシメチルシリル基、フルオロメトキシエチルシリル基、フルオロジメトキシシリル基、フルオロジエトキシシリル基、ジフルオロメトキシシリル基、ジフルオロエトキシシリル基がより好ましく、安定性の観点からフルオロジメチルシリル基、ジフルオロメチルシリル基、トリフルオロシリル基などのフッ素以外に加水分解性基を持たない珪素基がさらに好ましく、硬化性の高さからは、ジフルオロメチルシリル基、ジフルオロメトキシシリル基、ジフルオロエトキシシリル基、トリフルオロシリル基など、珪素基上に2個ないし3個のフッ素が置換した珪素基が好ましく、トリフルオロシリル基が最も好ましい。
−SiR80 3−qX’q・・・(7)
(式(7)中、R80及びX’はそれぞれ式(6)と同じであり、qは1〜3のいずれかである。)
ハロシリル基のフッ素化に使用されるフッ素化剤の具体例としては、特に限定されず、例えば、AgBF4、SbF3、ZnF2、NaF、KF、CsF、NH4F、CuF2、NaSiF6、NaPF6、NaSbF6、NaBF4、Me3SnF、KF(HF)1.5〜5などが挙げられる。
ヒドロシリル基のフッ素化に使用されるフッ素化剤の具体例としては、特に限定されず、例えば、AgF、PF5、Ph3CBF4、SbF3、NOBF4、NO2BF4などが挙げられる。
シロキサン結合を有する化合物はBF3などにより開裂し、フルオロシリル基が得られる。
有機重合体中のSiF結合の位置も特に制限はなく、重合体分子内のいずれの部位にあっても効果を発揮し、主鎖または側鎖の末端であれば−SiRn 2F、重合体の主鎖に組み込まれていれば、−SiRnF−または≡SiF(Rnはそれぞれ独立に、任意の基)の形で表される。
主鎖又は側鎖の末端にSi−F結合を有する有機重合体としては、前述した式(6)で示されるフルオロシリル基を有する重合体が好適である。フルオロシリル基が重合体の主鎖中に組み込まれたものの例としては、−Si(CH3)F−、−Si(C6H5)F−、−SiF2−、≡SiFなどが挙げられる。
(イ)分子中に水酸基、エポキシ基やイソシアネート基等の官能基を有する重合体に、この官能基に対して反応性を示す官能基およびフルオロシリル基を有する化合物を反応させる方法。たとえば、末端に水酸基を有する重合体とイソシアネートプロピルジフルオロメチルシランを反応させる方法や、末端にSiOH基を有する重合体とジフルオロジエトキシシランを反応させる方法が挙げられる。
(ロ)分子中に不飽和基を含有する重合体に、フルオロシリル基を有するヒドロシランを作用させてヒドロシリル化する方法。たとえば、末端にアリル基を有する重合体に、ジフルオロメチルヒドロシランを反応させる方法が挙げられる。
(ハ)不飽和基を含有する重合体に、メルカプト基およびフルオロシリル基を有する化合物を反応させる方法。たとえば、末端にアリル基を有する重合体に、メルカプトプロピルジフルオロメチルシランを反応させる方法が挙げられる。
フッ素化剤としては、例えば、前述したフッ素化剤が挙げられ、中でも、BF3エーテル錯体、BF3アルコール錯体、BF3二水和物は活性が高く、効率よくフッ素化が進行し、さらに副生成物に塩等が生じず、後処理が容易であるためにより好ましく、BF3エーテル錯体が特に好ましい。
さらに、BF3エーテル錯体によるフッ素化は、加熱しなくても反応が進行するが、より効率よくフッ素化を行なうためには、加熱することが好ましい。加熱温度としては50℃以上150℃以下が好ましく、60℃以上130℃がより好ましい。50℃以下であると反応が効率よく進行せず、フッ素化に時間がかかる場合がある。150℃以上であるとフッ素化ポリマーが分解する虞がある。BF3錯体によるフッ素化において、用いる重合体(X)の種類によっては着色が起こる場合があるが、着色の抑制の点から、BF3アルコール錯体、BF3二水和物を用いることが好ましい。
前記三フッ化ホウ素のアミン錯体の市販品としては、例えば、エアプロダクツジャパン株式会社製のアンカー1040、アンカー1115、アンカー1170、アンカー1222、BAK1171等が挙げられる。
これらの中でも、多価フルオロ化合物のアルカリ金属塩における多価フルオロ化合物成分としては、テトラフルオロホウ酸又はヘキサフルオロリン酸が好ましい。また、多価フルオロ化合物のアルカリ金属塩におけるアルカリ金属としては、リチウム、ナトリウム及びカリウムからなる群から選ばれる一種以上のアルカリ金属であることが好ましい。
[前記式(17)において、Aは直接結合又は2価の連結基であり、Q’は環状構造含有基である。直接結合とは、Q’が連結基を介することなく、Zに直接結合していることを意味する。Aにおける2価の連結基としては、例えば、それぞれ置換基を有していてもよい、アルキレン基、カルボニル基、エーテル結合、エステル結合、−CONH−基、またはこれらの組み合わせを含む2価の連結基等が挙げられ、置換基を含んでいてもよいアルキレン基やカルボニル基及びそれらの組合せが好ましい。また、Aの置換基が環状構造を有していてもよく、また、置換基同士が結合し、環状構造を形成していてもよい。該環状構造としては、例えば、Q’と同様のものが挙げられる。
前記Q’における環状構造は、単環及び複数の環のいずれもよく、また、単素環式及び複素環式のいずれでもよいが、ビニル基やカルボニル基、イミノ基等の官能基を含んでいることが好ましく、芳香族性を示す環状構造を有していることがより好ましい。前記Q’としては、例えば、それぞれ置換基を有していてもよい、アリール基,アリールオキシ基,窒素や酸素、硫黄等のヘテロ原子を1種以上含む複素環基,カルボニル基が結合した環状構造を含む基やこれらの組合せ及びこれらの縮合環等が挙げられる。また、置換基がさらに環状構造を有していてもよい。また、Aの置換基とQ’とが結合していてもよい。]
数平均分子量は、特に指定がない限りゲルパーミエーションクロマトグラフィー(GPC)により下記条件で測定した。本発明において、該測定条件でGPCにより測定し、標準ポリエチレングリコールで換算した最大頻度の分子量を数平均分子量と称する。
・分析装置:Alliance(Waters社製)、2410型示差屈折検出器(Waters社製)、996型多波長検出器(Waters社製)、Milleniamデータ処理装置(Waters社製)
・カラム:PlgelGUARD+5μmMixed−C×3本(50×7.5mm,300×7.5mm:PolymerLab社製)
・流速:1mL/分
・換算したポリマー:ポリエチレングリコール
・測定温度:40℃
・GPC測定時の溶媒:THF
NMRの測定は、下記測定装置を用いて行った。
FT−NMR測定装置:日本電子(株)製JNM−ECA500(500MHz)
温度計を備えた撹拌機中に、ポリプロピレングリコール(三井化学ポリウレタン(株)製、商品名:Diol−2000)589.4重量部を脱水処理した後、4,4−ジフェニルメタンジイソシアネート(MDI)110.6重量部を添加し、窒素気流下70〜90℃で3時間反応させ、NCO/OH当量比1.5のウレタンプレポリマーAを得た。このウレタンプレポリマーAのNCO基に対し0.5当量の3−メルカプトプロピルトリメトキシシランをウレタンプレポリマーAと反応させ、平均して片末端にトリメトキシシリル基を他の末端にNCO基を有する重合体を得た。得られた重合体のNCO基に対し、当量の4−ヒドロキシブチルアクリレートをこの重合体と反応させ、平均して片末端にトリメトキシシリル基を他の末端にアクリロイルオキシ基を有する重合体を得た。
合成例1で得られたウレタンプレポリマーAのNCO基に対し当量の3−メルカプトプロピルトリメトキシシランをウレタンプレポリマーAと反応させ、平均して両末端にトリメトキシシリル基を有する重合体を得た。
合成例1で得られたウレタンプレポリマーAのNCO基に対し当量の4−ヒドロキシブチルアクリレートをウレタンプレポリマーAと反応させ、平均して両末端にアクリロイルオキシ基を有する重合体を得た。
攪拌装置、窒素ガス導入管、温度計および環流冷却器を備えた新しいフラスコに、分子量約2,000のポリオキシプロピレンジオールを開始剤とし、亜鉛ヘキサシアノコバルテート−グライム錯体触媒の存在下、プロピレンオキシドを反応させて得られた水酸基価換算分子量14500、かつ分子量分布1.3のポリオキシプロピレンジオールを得た。得られたポリオキシプロピレンジオールにナトリウムメトキシドのメタノール溶液を添加し、加熱減圧下メタノールを留去してポリオキシプロピレンジオールの末端水酸基をナトリウムアルコキシドに変換し、ポリオキシアルキレン系重合体を得た。
得られた末端にメチルジメトキシシリル基を有するポリオキシアルキレン系重合体の分子量をGPCにより測定した結果、ピークトップ分子量は15000、分子量分布1.3であった。H1−NMR測定により末端のメチルジメトキシシリル基は1分子あたり1.7個であった。
攪拌装置、窒素ガス導入管、温度計および環流冷却器を備えたフラスコに、エチレングリコールを開始剤とし、亜鉛ヘキサシアノコバルテート−グライム錯体触媒の存在下、プロピレンオキシドを反応させ、ポリオキシプロピレントリオールを得た。得られたポリオキシプロピレントリオールにナトリウムメトキシドのメタノール溶液を添加し、加熱減圧下メタノールを留去してポリオキシプロピレントリオールの末端水酸基をナトリウムアルコキシドに変換し、ポリオキシアルキレン系重合体M1を得た。
攪拌装置、窒素ガス導入管、温度計および環流冷却器を備えたフラスコに、エチレングリコールを開始剤とし、亜鉛ヘキサシアノコバルテート−グライム錯体触媒の存在下、プロピレンオキシドを反応させ、ポリオキシプロピレントリオールを得た。得られたポリオキシプロピレントリオールにナトリウムメトキシドのメタノール溶液を添加し、加熱減圧下メタノールを留去してポリオキシプロピレントリオールの末端水酸基をナトリウムアルコキシドに変換し、ポリオキシアルキレン系重合体M2を得た。
撹拌装置、窒素ガス導入管、温度計および還流冷却管を備えたフラスコに、酢酸エチルを40.00g、メチルメタクリレート70.00g、2−エチルヘキシルメタクリレート(東京化成工業(株)製)30.00g、3−メタクリロキシプロピルトリメトキシシラン(商品名:KBM503、信越化学工業(株)製)12.00g、及び金属触媒としてチタノセンジクライド0.10gを仕込みフラスコ内に窒素ガスを導入しながらフラスコの内容物を80℃に加熱した。ついで、充分に窒素ガス置換した3−メルカプトプロピルトリメトキシシラン4.30gを撹拌下にフラスコ内に一気に添加した。3−メルカプトプロピルトリメトキシシラン4.30gを添加後、撹拌中のフラスコ内の内容物の温度が80℃に維持できるように、加熱及び冷却を4時間行った。さらに、充分に窒素ガス置換した3−メルカプトプロピルトリメトキシシラン4.30gを撹拌下に5分かけてフラスコ内に追加添加した。3−メルカプトプロピルトリメトキシシラン4.30g全量を追加添加後、撹拌中のフラスコ内の内容物の温度が90℃に維持できるように、さらに冷却及び加温を行いながら、反応を4時間行った。合計で8時間5分間の反応後、反応物の温度を室温に戻し、反応物にベンゾキノン溶液(95%THF溶液)を20.00g添加して重合を停止し、トリメトキシシリル基を有する(メタ)アクリル系重合体P3を得た。ピークトップ分子量は4000、分子量分布は2.4であった。H1−NMR測定により含有されるトリメトキシシリル基は1分子あたり2.00個であった。
フラスコに2−ニトロベンジルアルコール15.3gとトルエン344部を加え、約113℃で60分間還流した。その後、3−イソシアネートプロピルトリメトキシシラン20.5部を滴下し、5時間撹拌し、o-NO2C6H4CH2OCONHCH2CH2CH2Si(OCH3)3で示される光によりアミノシランを発生する化合物を得た。
表1に示す配合割合にて、攪拌機、温度計、窒素導入口、モノマー装入管および水冷コンデンサーを装着した300mLのフラスコに、(A)分子内に架橋性珪素基と光ラジカル重合性のビニル基を有する有機重合体、(C)Si−F結合を有する珪素化合物として合成例4で得られたフッ素化ポリマーを入れ、撹拌し、溶解させた。また。表1に示す配合割合にて、別の100mLのナスフラスコに(B)光塩基発生剤及びプロピレンカーボネートを入れ、撹拌し、溶解させ、この溶液の全量を先ほど量り取った300mLフラスコへ投入し、減圧撹拌を行い、光硬化性組成物を得た。
*1)2−(ジメチルアミノ)−2−[(4−メチルフェニル)メチル]−1−[4−(4−モルホリニル)フェニル]−1−ブタノン、BASF社製、商品名「IRGACURE379EG」。
*2)共栄社化学(株)製、商品名「ライトアクリレートDPM−A」。
被着材(アクリル樹脂板)に、ガラス棒を用いて光硬化性組成物を幅5mm×長さ25mm×厚さ200μmになるように塗布し、UV照射(照射条件:UV−LED365nm、照度:1000mW/cm2、積算光量:3000mJ/cm2)を行った。照射後直ちに、被着材(アクリル樹脂板)を張り合わせ、目玉クリップ小により圧締し23℃、50%RH下で15分間間養生した。前記養生後、JISK6850剛性被着材の引張りせん断接着強さ試験方法に準拠し、試験速度50mm/分で測定した。
(A)分子内に架橋性珪素基と光ラジカル重合性のビニル基を有する有機重合体60gに代えて架橋性珪素基を有する有機重合体30gと光重合性ビニル基を有する有機重合体30gを使用したほかは実施例1と同様に光硬化性組成物を得、接着強さの測定を行った。結果を表1に示す。
Claims (12)
- (A)分子内に下記一般式(3)で表される架橋性珪素基と光ラジカル重合性のビニル基を有する有機重合体(但し、Si−F結合を有するものを除く)、
(B)光塩基発生剤、及び
(C)(C1)Si−F結合を有する珪素化合物、及び/又は(C2)三フッ化ホウ素、三フッ化ホウ素の錯体、フッ素化剤及び多価フルオロ化合物のアルカリ金属塩からなる群から選択される1種以上のフッ素系化合物、
を含有することを特徴とする光硬化性組成物。
- 前記(B)光塩基発生剤が、光潜在性第3級アミンであることを特徴とする請求項1に記載の光硬化性組成物。
- (D)光により、第一級アミノ基および第二級アミノ基からなる群から選択される1種以上のアミノ基と架橋性珪素基とを有するアミノシラン化合物を発生する化合物をさらに含有することを特徴とする請求項1又は2に記載の光硬化性組成物。
- シランカップリング剤(Si−F結合を有するものは除く)をさらに含有することを特徴とする請求項1〜3に記載の光硬化性組成物。
- 光硬化性組成物が光硬化性接着剤組成物であることを特徴とする請求項1〜4いずれか1項に記載の光硬化性組成物。
- 請求項1〜4のいずれか1項記載の光硬化性組成物に対し、光を照射することにより硬化物を形成することを特徴とする硬化物の製造方法。
- 請求項6記載の方法により形成されてなる硬化物。
- 請求項1〜4のいずれか1項記載の光硬化性組成物を用いて製造することを特徴とする製品の製造方法。
- 請求項6記載の方法により製造されてなる製品。
- 請求項8記載の方法を用いて製造されてなる製品。
- 請求項1〜4のいずれか1項記載の光硬化性組成物を接着剤として用いてなる製品。
- 請求項1〜4のいずれか1項記載の光硬化性組成物をコーティング剤として用いてなる製品。
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