JP6522139B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP6522139B2 JP6522139B2 JP2017540048A JP2017540048A JP6522139B2 JP 6522139 B2 JP6522139 B2 JP 6522139B2 JP 2017540048 A JP2017540048 A JP 2017540048A JP 2017540048 A JP2017540048 A JP 2017540048A JP 6522139 B2 JP6522139 B2 JP 6522139B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Description
Claims (10)
- 蛍光体を含有する蛍光体層と、
前記蛍光体を励起して生成される蛍光との組合せにより白色光を出射する第1のLED素子と、
赤色光を出射する第2のLED素子と、
前記蛍光体層を挟んで前記第1のLED素子とは反対側に配置され、緑色光を出射する第3のLED素子と、
前記蛍光体層を挟んで前記第1のLED素子とは反対側で前記第2および第3のLED素子よりも前記蛍光体層から遠くに配置され、青色光を出射する第4のLED素子と、
前記第1から第4のLED素子が同じ実装面上に実装された基板と、
少なくとも、前記蛍光体層から前記第1のLED素子が実装されている側の前記基板の外周を取り囲み、前記蛍光体層を挟んで前記第1のLED素子とは反対側に前記第1から第4のLED素子による出射光の出射口が設けられた樹脂枠と、
前記樹脂枠内の前記基板上に充填されて前記第1から第4のLED素子を封止する封止樹脂と、
前記実装面とは反対側の面である前記封止樹脂の上面に配置され、少なくとも前記第1のLED素子を覆う遮光部材と、を有し、
前記出射光は、前記出射口から前記実装面に平行な方向に出射されることを特徴とする発光装置。 - 蛍光体を含有する蛍光体層と、
前記蛍光体を励起して生成される蛍光との組合せにより白色光を出射する第1のLED素子と、
赤色光を出射する第2のLED素子と、
前記蛍光体層を挟んで前記第1のLED素子とは反対側に配置され、緑色光を出射する第3のLED素子と、
前記蛍光体層を挟んで前記第1のLED素子とは反対側で前記第2および第3のLED素子よりも前記蛍光体層から遠くに配置され、青色光を出射する第4のLED素子と、
前記第1から第4のLED素子が同じ実装面上に実装された基板と、
前記基板の外周全体を取り囲む樹脂枠と、
前記樹脂枠内の前記基板上に充填されて前記第1から第4のLED素子を封止する封止樹脂と、
前記実装面とは反対側の面である前記封止樹脂の上面に配置され、前記第1のLED素子の上方を覆う遮光部材と、を有し、
前記第1から第4のLED素子による出射光は、前記第2から第4のLED素子の上方から、前記実装面に垂直な方向に出射されることを特徴とする発光装置。 - 前記封止樹脂には、光を拡散させる散乱剤が分散混入されている、請求項1または2に記載の発光装置。
- 前記樹脂枠は、前記封止樹脂の側に光を反射させる内側の白色樹脂層と、外部への光の透過を防止する外側の黒色樹脂層とを有する、請求項1〜3のいずれか一項に記載の発光装置。
- 前記遮光部材は、前記封止樹脂の側に光を反射させる内側の白色シートと、外部への光の透過を防止する外側の黒色シートとを有する、請求項1〜4のいずれか一項に記載の発光装置。
- 前記遮光部材は、前記封止樹脂の上面全体を覆う、請求項1に記載の発光装置。
- 前記第1から第4のLED素子は、前記実装面上において前記第1、第2、第3および第4のLED素子の順序で1直線状に配列している、請求項1〜6のいずれか一項に記載の発光装置。
- 前記蛍光体層は、前記第3のLED素子と前記第2のLED素子の間で前記封止樹脂を2分し、
前記第2のLED素子は、前記蛍光体層よりも前記第1のLED素子に近い側に配置されている、請求項7に記載の発光装置。 - 前記第2から第4のLED素子は、3角形状に配列している、請求項1〜6のいずれか一項に記載の発光装置。
- 前記第3および第4のLED素子は、前記白色光および前記赤色光を透過させる透明な素子であり、
前記第2のLED素子は前記青色光を透過させない不透明な素子である、請求項1〜9のいずれか一項に記載の発光装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015185976 | 2015-09-18 | ||
JP2015185976 | 2015-09-18 | ||
PCT/JP2016/077736 WO2017047815A1 (ja) | 2015-09-18 | 2016-09-20 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
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JPWO2017047815A1 JPWO2017047815A1 (ja) | 2017-11-24 |
JP6522139B2 true JP6522139B2 (ja) | 2019-05-29 |
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Application Number | Title | Priority Date | Filing Date |
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JP2017540048A Active JP6522139B2 (ja) | 2015-09-18 | 2016-09-20 | 発光装置 |
Country Status (5)
Country | Link |
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US (1) | US10707189B2 (ja) |
JP (1) | JP6522139B2 (ja) |
CN (1) | CN108028303B (ja) |
DE (1) | DE112016004229B4 (ja) |
WO (1) | WO2017047815A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7221052B2 (ja) * | 2016-04-29 | 2023-02-13 | ルミレッズ ホールディング ベーフェー | 高輝度明白色led光源 |
JP7072368B2 (ja) * | 2017-11-06 | 2022-05-20 | シチズン電子株式会社 | 側面照射型led発光装置 |
KR102653015B1 (ko) | 2018-07-18 | 2024-03-29 | 삼성전자주식회사 | 발광 장치, 운송 수단용 헤드램프, 및 그를 포함하는 운송 수단 |
CN111463193B (zh) * | 2019-01-21 | 2021-11-12 | 光宝光电(常州)有限公司 | 芯片级发光二极管封装结构 |
CN210624452U (zh) * | 2019-09-29 | 2020-05-26 | 漳州立达信光电子科技有限公司 | 一种led灯以及控制电路 |
JP7196813B2 (ja) * | 2019-10-14 | 2022-12-27 | 豊田合成株式会社 | 発光装置およびその製造方法 |
KR20210113870A (ko) * | 2020-03-09 | 2021-09-17 | 엘지이노텍 주식회사 | 조명모듈 및 이를 구비한 조명장치 |
CN111785174A (zh) * | 2020-08-07 | 2020-10-16 | 京东方科技集团股份有限公司 | 柔性面板的支撑结构及其制作方法、柔性显示装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1107321A4 (en) | 1999-06-23 | 2006-08-30 | Citizen Electronics | LIGHT-EMITTING DIODE |
JP3400958B2 (ja) * | 1999-07-07 | 2003-04-28 | 株式会社シチズン電子 | 多色発光ダイオード |
JP4113017B2 (ja) | 2002-03-27 | 2008-07-02 | シチズンホールディングス株式会社 | 光源装置および表示装置 |
JP4458804B2 (ja) | 2003-10-17 | 2010-04-28 | シチズン電子株式会社 | 白色led |
JP4357311B2 (ja) | 2004-02-04 | 2009-11-04 | シチズン電子株式会社 | 発光ダイオードチップ |
JP4535928B2 (ja) * | 2005-04-28 | 2010-09-01 | シャープ株式会社 | 半導体発光装置 |
JP2008288412A (ja) | 2007-05-18 | 2008-11-27 | Citizen Electronics Co Ltd | Led発光装置 |
JP2009246353A (ja) | 2008-03-10 | 2009-10-22 | Opt Link Co Ltd | Led低背光源装置及びled低背光源装置の製造方法 |
JP5410342B2 (ja) * | 2010-03-12 | 2014-02-05 | 星和電機株式会社 | 発光装置 |
CN101937911B (zh) * | 2010-07-14 | 2013-07-24 | 深圳市华星光电技术有限公司 | 发光二极管封装构造及背光模块 |
US20120014091A1 (en) | 2010-07-14 | 2012-01-19 | Shenzhen China Star Optoelectronics Technology Co Ltd. | Led package assembly and backlight module |
WO2012046661A1 (ja) | 2010-10-07 | 2012-04-12 | シャープ株式会社 | 発光素子、発光装置、及び表示装置 |
CN102593115A (zh) * | 2012-03-15 | 2012-07-18 | 深圳市丽晶光电科技股份有限公司 | Led表面贴装器件及其制造方法 |
TW201513402A (zh) * | 2013-09-27 | 2015-04-01 | Lextar Electronics Corp | 發光二極體封裝結構 |
KR20150044307A (ko) * | 2013-10-16 | 2015-04-24 | 주식회사 루멘스 | 측면 발광형 발광 소자 패키지와, 백라이트 유닛 및 측면 발광형 발광 소자 패키지의 제작 방법 |
JP6230392B2 (ja) * | 2013-11-29 | 2017-11-15 | シチズン電子株式会社 | 発光装置 |
JP6269702B2 (ja) * | 2015-11-30 | 2018-01-31 | 日亜化学工業株式会社 | 発光装置の製造方法 |
-
2016
- 2016-09-20 WO PCT/JP2016/077736 patent/WO2017047815A1/ja active Application Filing
- 2016-09-20 DE DE112016004229.9T patent/DE112016004229B4/de active Active
- 2016-09-20 CN CN201680048422.3A patent/CN108028303B/zh active Active
- 2016-09-20 JP JP2017540048A patent/JP6522139B2/ja active Active
- 2016-09-20 US US15/760,785 patent/US10707189B2/en active Active
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Publication number | Publication date |
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US10707189B2 (en) | 2020-07-07 |
US20180254263A1 (en) | 2018-09-06 |
DE112016004229T5 (de) | 2018-07-19 |
JPWO2017047815A1 (ja) | 2017-11-24 |
CN108028303B (zh) | 2020-01-24 |
CN108028303A (zh) | 2018-05-11 |
WO2017047815A1 (ja) | 2017-03-23 |
DE112016004229B4 (de) | 2022-08-25 |
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