JP6504221B2 - Method of manufacturing light emitting device - Google Patents
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Description
本開示は、発光装置の製造方法に関する。 The present disclosure relates to a method of manufacturing a light emitting device.
従来から、液晶テレビ用バックライトや照明器具などの光源として、発光素子を備える発光装置が広く用いられている。このような発光装置として、ＬＥＤ素子の電極がマザー基板に対する接続電極となる発光装置が提案されている（例えば、特許文献１）。 2. Description of the Related Art Conventionally, a light emitting device provided with a light emitting element has been widely used as a light source for a backlight for a liquid crystal television, a lighting fixture, and the like. As such a light emitting device, a light emitting device in which an electrode of an LED element is a connection electrode to a mother substrate has been proposed (for example, Patent Document 1).
しかし、このような発光装置では実装用電極が比較的小さいために、発光装置の実装が困難になるおそれがある。
そこで、本発明の実施形態は、実装が容易な発光装置を製造する方法を提供することを目的とする。
However, in such a light emitting device, the mounting electrode is relatively small, which may make it difficult to mount the light emitting device.
Therefore, an embodiment of the present invention aims to provide a method of manufacturing a light emitting device that is easy to mount.
本発明の実施形態に係る発光装置の製造方法は、同一面側に一対の電極を備え、それぞれ分離された複数の発光素子と、一対の電極の表面の一部が露出されるように複数の発光素子の側面を被覆し、複数の発光素子の間において凹部を有する被覆部材と、を備える中間体を準備する工程と、発光素子の一対の電極の表面と被覆部材の凹部の内面とを連続して覆う金属層を形成する工程と、凹部の内面において被覆部材と金属層を切断する工程と、を含む発光装置の製造方法である。 A method of manufacturing a light emitting device according to an embodiment of the present invention includes a plurality of light emitting elements each including a pair of electrodes on the same side and a plurality of light emitting elements separated from one another, and a plurality of exposed surfaces of the pair of electrodes. Preparing an intermediate body comprising a covering member covering the side surface of the light emitting element and having a recess between the plurality of light emitting elements, and continuously connecting the surface of the pair of electrodes of the light emitting element and the inner surface of the recess of the covering member And forming the covering metal layer, and cutting the covering member and the metal layer on the inner surface of the recess.
本発明の実施形態に係る発光装置の製造方法によれば、実装が容易な発光装置を製造することができる。 According to the method of manufacturing a light emitting device according to the embodiment of the present invention, it is possible to manufacture a light emitting device that is easy to mount.
以下、本発明の実施形態について適宜図面を参照して説明する。ただし、以下に説明する発光装置及びその製造方法は、実施形態の技術的思想を具現化するためのものであって、以下に限定するものではない。特に、構成部品の寸法、材質、形状、その相対的配置等は、本発明の技術的範囲を限定するものではなく、単なる説明例であり、説明を明確にするために誇張していることがある。以下に記載される実施形態は、各構成等を適宜組み合わせて適用できる。 Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light emitting device and the manufacturing method thereof to be described below are for embodying the technical idea of the embodiment, and are not limited to the following. In particular, the dimensions, materials, shapes, relative positions, etc. of the component parts do not limit the technical scope of the present invention, and are merely illustrative examples, and are exaggerated to clarify the explanation. is there. The embodiments described below can be applied by appropriately combining each configuration and the like.
本実施形態の発光装置の製造方法は、同一面側に一対の電極を備え、それぞれ分離された複数の発光素子と、一対の電極の表面の一部が露出されるように複数の発光素子の側面を被覆し、複数の発光素子の間において凹部を有する被覆部材と、を備える中間体を準備する工程と、発光素子の一対の電極の表面と被覆部材の凹部の内面とを連続して覆う金属層を形成する工程と、凹部の内面において被覆部材と金属層を切断する工程と、を含む発光装置の製造方法である。
この製造方法は、例えば、下記のとおりである。
The method of manufacturing a light emitting device according to the present embodiment includes a plurality of light emitting elements provided on the same side with a plurality of separated light emitting elements, and a plurality of light emitting elements such that a part of the surface of the pair of electrodes is exposed. Providing an intermediate body including a side surface and a covering member having a recess between a plurality of light emitting elements, continuously covering the surfaces of the pair of electrodes of the light emitting element and the inner surface of the recess of the covering member It is a manufacturing method of a light emitting device including the process of forming a metal layer, and the process of cutting a covering member and a metal layer in the inner surface of a crevice.
This manufacturing method is, for example, as follows.
１．中間体を準備する工程
まず、同一面側に一対の電極を備え、それぞれ分離された複数の発光素子と、一対の電極の表面の一部が露出されるように複数の発光素子の側面を被覆し、複数の発光素子の間において凹部を有する被覆部材と、を備える中間体を準備する工程を行う。
この工程は例えば下記の工程により行うことができる。
1. Step of preparing the intermediate First, a pair of electrodes are provided on the same side, and the side surfaces of the plurality of light emitting elements are covered so that a part of the surfaces of the plurality of separated light emitting elements and the pair of electrodes are exposed. And a step of preparing an intermediate including a covering member having a recess between the plurality of light emitting elements.
This process can be performed, for example, by the following process.
１−１．発光素子の支持体上への配置
図１Ａ及び図１Ｂに示されるように、主発光面Ｑと、主発光面Ｑと反対側の面である電極形成面に一対の電極２ａ、２ｂを有する複数の発光素子２を、電極２ａ、２ｂを上向きにして隣接するように支持体１上に配置する。
発光素子２は、少なくとも発光層を含む半導体層を含み、主発光面Ｑと、主発光面Ｑと反対側の面である電極形成面に正負一対の電極２ａ、２ｂを有する。このように、ウエハ状態から個々に分離した発光素子２を用いる、例えば特性の選別を行った後に、所望の特性を有するものだけを発光装置の製造に用いることで、歩留まりよく発光装置を形成することができる。
1-1. Arrangement of Light Emitting Element on Support As shown in FIGS. 1A and 1B, a plurality of main light emitting surface Q and a plurality of electrodes having a pair of electrodes 2a and 2b on the electrode forming surface opposite to main light emitting surface Q The light emitting element 2 is disposed on the support 1 so as to be adjacent to each other with the electrodes 2a and 2b facing upward.
The light emitting element 2 includes a semiconductor layer including at least a light emitting layer, and has a main light emitting surface Q and a pair of positive and negative electrodes 2 a and 2 b on an electrode forming surface opposite to the main light emitting surface Q. As described above, light emitting devices are formed with good yield by using only light emitting devices having desired characteristics after using, for example, sorting of characteristics using light emitting elements 2 separated individually from a wafer state. be able to.
発光素子２の平面形状は、円形、楕円形、三角形、四角形及び六角形等の多角形等のいずれであってもよい。また、発光素子２の大きさ及び厚みは、適宜選択することができる。この実施形態では、例えば、平面形状が矩形の発光素子２を用いることができる。 The planar shape of the light emitting element 2 may be any of a circle, an ellipse, a triangle, and a polygon such as a square and a hexagon. Further, the size and thickness of the light emitting element 2 can be appropriately selected. In this embodiment, for example, the light emitting element 2 having a rectangular planar shape can be used.
発光素子２を配置する支持体１を準備する。支持体１は、後述する金属層及び被覆部材を切断する前に除去してもよいし、金属層及び被覆部材とともに切断することで、発光装置の一部として用いてもよい。 The support 1 on which the light emitting element 2 is to be disposed is prepared. The support 1 may be removed before cutting a metal layer and a covering member described later, or may be used as part of a light emitting device by cutting together with the metal layer and the covering member.
この実施形態では、このような発光素子２の電極２ａ、２ｂが上向きに、つまり、主発光面Ｑが支持体１と接し、発光素子２の電極２ａ、２ｂの上面が支持体１と反対側に配置されるように、複数の発光素子２を隣接させて支持体１上に配置する。これにより、後の工程において電極上に金属層を形成しやすく、さらに、主発光面Ｑを露出させるように被覆部材を形成しやすい。 In this embodiment, the electrodes 2a and 2b of the light emitting element 2 face upward, that is, the main light emitting surface Q is in contact with the support 1, and the upper surface of the electrodes 2a and 2b of the light emitting element 2 is opposite to the support 1 The plurality of light emitting elements 2 are arranged adjacent to each other on the support 1 so as to be arranged in Thereby, it is easy to form a metal layer on an electrode in a later process, and to form a covering member so as to expose the main light emitting surface Q.
さらに、複数の発光素子２は、それぞれの発光素子２の異極どうしが隣接するように配置することが好ましい。具体的には、図１Ａに示されるように、一方の発光素子２の正電極２ａと他方の発光素子２１の負電極２ｂとが隣接し、且つ、一方の発光素子２の負電極２ｂと他方の発光素子２の正電極２ａとが隣接するように、複数の発光素子２を配置することが好ましい。 Furthermore, it is preferable to arrange the plurality of light emitting elements 2 such that the different poles of the respective light emitting elements 2 are adjacent to each other. Specifically, as shown in FIG. 1A, the positive electrode 2a of one light emitting element 2 and the negative electrode 2b of the other light emitting element 21 are adjacent, and the negative electrode 2b of the one light emitting element 2 and the other It is preferable to arrange the plurality of light emitting elements 2 such that the positive electrode 2 a of the light emitting element 2 is adjacent to the light emitting element 2.
複数の発光素子２の配置間隔は、任意に設定することができる。この間隔は、後述する被覆部材３及び凹部３ａの厚みに影響を与える。よって、所望の被覆部材３の厚みとできるように、間隔の広狭を調整することが好ましい。例えば、発光素子２の配置精度、後の個片化工程における切断位置精度、被覆部材３の構成、凹部３ａの形状にもよるが、０．１μｍ〜３００μｍ程度の間隔を空けて配置することができる。これにより、後の工程において金属層４を形成しやすく、且つ、主発光面Ｑ以外から漏れる光を十分に遮光可能な被覆部材３を形成することができる。さらに、製造される発光装置の数を増加させることができ、効率よく発光装置を製造することができる。 The arrangement intervals of the plurality of light emitting elements 2 can be set arbitrarily. This interval affects the thickness of the covering member 3 and the recess 3a described later. Therefore, it is preferable to adjust the width of the gap so that the desired thickness of the covering member 3 can be obtained. For example, although it depends on the placement accuracy of the light emitting element 2, the cutting position accuracy in the subsequent singulation process, the configuration of the covering member 3, and the shape of the recess 3a, the gap may be spaced about 0.1 μm to 300 μm. it can. As a result, it is possible to easily form the metal layer 4 in a later step, and to form the covering member 3 capable of sufficiently shielding light leaking from other than the main light emitting surface Q. Furthermore, the number of light emitting devices manufactured can be increased, and the light emitting devices can be manufactured efficiently.
支持体１上に発光素子２を配置する際、例えば、予め支持体１及び発光素子２に接着剤を配置する、または、接着膜を有する支持体１を用い該接着剤により発光素子２を支持体１上に固定することができる。接着剤としては、樹脂等の当該分野で公知のものを用いることができ、特に、支持体１を発光装置１０の一部として用いる場合は、透光性を有する樹脂を用いることが好ましい。なお、粘着性を有する支持体１を用いる場合は、支持体１の粘着性によって、発光素子２を支持体１上に固定してもよい。これにより、少ない工程数で効率よく発光素子２を配置することができる。支持体１は、樹脂に接着剤が配置されたフィルム、セラミック等の平板を用いることができる。 When disposing the light emitting element 2 on the support 1, for example, an adhesive is previously disposed on the support 1 and the light emitting element 2, or the light emitting element 2 is supported by the adhesive using the support 1 having an adhesive film. It can be fixed on the body 1. As the adhesive, those known in the art such as resins can be used. In particular, when the support 1 is used as a part of the light emitting device 10, it is preferable to use a resin having translucency. In the case where the support 1 having adhesiveness is used, the light emitting element 2 may be fixed on the support 1 by the adhesiveness of the support 1. Thus, the light emitting element 2 can be efficiently disposed with a small number of steps. The support 1 may be a flat plate such as a film or ceramic in which an adhesive is disposed on a resin.
１−２．被覆部材３の形成
次に、一対の電極２ａ、２ｂの上面が露出されるように複数の発光素子２の側面を被覆し、複数の発光素子２の間において凹部３ａを有する被覆部材３を形成する。
1-2. Next, the side surfaces of the plurality of light emitting elements 2 are covered so that the upper surfaces of the pair of electrodes 2a and 2b are exposed, and the covering member 3 having the recess 3a is formed between the plurality of light emitting elements 2 Do.
１−２−１．被覆部材３の成形
この実施形態では、次に、少なくとも複数の発光素子２の側面を被覆する被覆部材３を形成する。具体的には、支持体１上に配置された複数の発光素子２の支持体１と対向している部分以外の面を連続して被覆する被覆部材３を支持体１上に成形する。これにより、発光素子２を保護する被覆部材３を容易に形成することができ、さらに、被覆部材３が光反射性または遮光性である場合には主発光面Ｑ以外からの光漏れを防止することができる。
1-2-1. Forming of Cover Member 3 In this embodiment, next, the cover member 3 that covers the side surfaces of at least the plurality of light emitting elements 2 is formed. Specifically, a covering member 3 is formed on the support 1 so as to continuously cover the surface of the plurality of light emitting elements 2 disposed on the support 1 except the portion facing the support 1. Thereby, the covering member 3 for protecting the light emitting element 2 can be easily formed, and further, when the covering member 3 is light reflective or light shielding, light leakage from other than the main light emitting surface Q is prevented. be able to.
ここで、図４Ａ及び４Ｂに示すように、被覆部材３の上面から電極２ａ、２ｂが露出するように被覆部材３を形成する。被覆部材３は、はじめから電極２ａ、２ｂが露出される形状で形成されてもよく、一方、例えば、図２Ａ及び図２Ｂに示すように、被覆部材３を電極２ａ、２ｂの上面まで被覆する高さで形成しておき、図３に示すように、切削や研磨等によって被覆部材３の上部の除去部３Ｓを除去することで、電極２ａ、２ｂを露出させることができる。または、被覆部材３及び電極２ａ、２ｂの上部を除去することで、電極２ａ、２ｂを露出させてもよい。電極２ａ、２ｂの露出工程の詳細については後述する。 Here, as shown in FIGS. 4A and 4B, the covering member 3 is formed so that the electrodes 2a and 2b are exposed from the upper surface of the covering member 3. The covering member 3 may be formed in such a shape that the electrodes 2a and 2b are exposed from the beginning, while covering the covering member 3 up to the upper surface of the electrodes 2a and 2b, for example, as shown in FIGS. 2A and 2B. The electrodes 2a and 2b can be exposed by removing the removal portion 3S on the top of the covering member 3 by cutting, polishing, or the like as shown in FIG. Alternatively, the electrodes 2a and 2b may be exposed by removing the upper portions of the covering member 3 and the electrodes 2a and 2b. Details of the exposure process of the electrodes 2a and 2b will be described later.
被覆部材３の材料としては、樹脂等の母材に光反射性又は光吸収性物質を含有させたものを用いることができる。被覆部材は、トランスファーモールド、コンプレッションモールド、スクリーン印刷、ポッティング、スプレー等で成形することで形成できる。特に、複数の発光素子２の間の比較的狭い空間まで確実に被覆部材３を形成するために、圧縮成形、コンプレッションモールド、トランスファーモールド等の金型を用いた成形方法が好ましい。
なお、被覆部材３は、前述のように一度に形成（形成した被覆部材３の一部を除去する形態も一度に形成すると表す）してもよいし、複数回に分けて形成してもよい。
As a material of the covering member 3, a material in which a light reflecting or light absorbing substance is contained in a base material such as a resin can be used. The covering member can be formed by molding by transfer molding, compression molding, screen printing, potting, spraying or the like. In particular, in order to reliably form the covering member 3 up to a relatively narrow space between the plurality of light emitting elements 2, a molding method using a mold such as compression molding, compression mold, transfer mold or the like is preferable.
In addition, as described above, the covering member 3 may be formed at one time (indicated that the form in which a part of the formed covering member 3 is removed is also formed at one time), or may be formed in plural times. .
１−２−２．電極の露出
実装形態１では、被覆部材３で電極２ａ、２ｂの上面まで被覆した後、次に図３に示されるように被覆部材３を除去し、被覆部材３により被覆された発光素子２の電極２ａ、２ｂの上面を被覆部材３の表面（上面）から露出させる。これにより、後の工程において形成される金属層４と電極２ａ、２ｂを接触させ発光素子２へ電気を供給する電極を形成することができる。
1-2-2. Exposure of Electrodes In the first embodiment, after covering up to the upper surfaces of the electrodes 2a and 2b with the covering member 3, the covering member 3 is removed as shown in FIG. 3 and the light emitting element 2 covered by the covering member 3 is then removed. The upper surfaces of the electrodes 2 a and 2 b are exposed from the surface (upper surface) of the covering member 3. Thereby, the metal layer 4 formed in a later step and the electrodes 2a and 2b can be brought into contact to form an electrode for supplying electricity to the light emitting element 2.
電極２ａ、２ｂの露出は、研削、切断、エッチングなどの方法を用いることができる。後の工程において設けられる金属層４と被覆部材３間及び金属層４と電極２ａ、２ｂ間の密着性の低下を低減するため、この工程においては被覆部材３と電極２ａ、２ｂとの上面が略同一平面となるように平坦とすることが好ましい。このような観点および量産性を向上させる観点から、研削が好ましい。
なお、この電極２ａ、２ｂの露出は、被覆部材３の成形と同時に行ってもよく、被覆部材３の成形の後に行われてもよい。
For the exposure of the electrodes 2a and 2b, methods such as grinding, cutting and etching can be used. In order to reduce the decrease in adhesion between the metal layer 4 and the covering member 3 and between the metal layer 4 and the electrodes 2a and 2b provided in a later step, the upper surface of the covering member 3 and the electrodes 2a and 2b is It is preferable to be flat so as to be substantially the same plane. Grinding is preferable from such a viewpoint and a viewpoint of improving mass productivity.
The exposure of the electrodes 2a and 2b may be performed simultaneously with the formation of the covering member 3, or may be performed after the formation of the covering member 3.
１−２−３．凹部の形成
次に、本実施形態では、被覆部材３の一部を除去することで、凹部３ａを形成する。具体的には、図４Ａ及び４Ｂに示すように、複数の発光素子２間の被覆部材３に、発光素子２の主発光面Ｑに対して略垂直に交差する方向に切断する。これにより、後の工程において形成される金属層４を発光装置１０の側面まで形成することができる。
1-2-3. Next, in the present embodiment, the recess 3 a is formed by removing a part of the covering member 3. Specifically, as shown in FIGS. 4A and 4B, the covering member 3 between the plurality of light emitting elements 2 is cut in a direction substantially perpendicular to the main light emitting surface Q of the light emitting element 2. Thereby, the metal layer 4 formed in a later process can be formed to the side surface of the light emitting device 10.
凹部３ａの形成のための被覆部材３の除去は、当該分野で公知の切断方法、例えば、ブレードを用いたブレードダイシングや、レーザダイシング、カッタースクライブ、ドリル、マスクを用いてのブラスト等を利用することができる。 The removal of the covering member 3 for forming the concave portion 3a uses a cutting method known in the art, for example, blade dicing using a blade, laser dicing, cutter scribing, drill, blast using a mask, etc. be able to.
支持体１上に配置する複数の発光素子２の形状をそれぞれ同じとすると、被覆部材３の凹部３ａを形成しやすくなる。さらに、本実施形態では、２つの矩形の発光素子２の側面が対向するように配置されているので、発光素子２の４辺に沿ってその近傍の被覆部材３を切断して凹部３ａを形成しやすい。さらに後の工程において効率的に被覆部材３と金属層４の切断及び個々の発光装置の個片化を行うことができる。 When the shapes of the plurality of light emitting elements 2 disposed on the support 1 are the same, it becomes easy to form the recess 3 a of the covering member 3. Furthermore, in the present embodiment, since the side surfaces of the two rectangular light emitting elements 2 are arranged to face each other, the covering member 3 in the vicinity is cut along the four sides of the light emitting element 2 to form the recess 3a. It's easy to do. Furthermore, the cutting of the covering member 3 and the metal layer 4 and the singulation of the individual light emitting devices can be performed efficiently in a later step.
なお、凹部３ａの形成は、本実施形態のように成形された被覆部材３の一部を除去することで設ける他、被覆部材３の成形の際に同時に行われてもよい。例えば、被覆部材３を成形する金型で、発光素子２を被覆するとともに凹部３ａを有する形状に被覆部材３を形成してもよい。なお、凹部３ａの形成は、上述の電極２ａ、２ｂの露出工程の前に行われてもよく、後で行われてもよい。発光素子２の電極２ａ、２ｂの露出工程の後で行う場合、発光素子２の電極２ａ、２ｂの位置をカメラで確認しながら凹部３ａを形成することができるため、発光装置１０の量産性や凹部３ａの形成の精度を高めることができ好ましい。 In addition, formation of the recessed part 3a may be performed simultaneously at the time of shaping | molding of the covering member 3 besides providing by removing a part of covering member 3 shape | molded like this embodiment. For example, the covering member 3 may be formed in a shape having a recess 3a while covering the light emitting element 2 with a mold for forming the covering member 3. In addition, formation of the recessed part 3a may be performed before the exposure process of the above-mentioned electrodes 2a and 2b, and may be performed after. When the step of exposing the electrodes 2a and 2b of the light emitting element 2 is performed, the concave portions 3a can be formed while confirming the positions of the electrodes 2a and 2b of the light emitting element 2 with a camera. The precision of formation of the recessed part 3a can be raised, and it is preferable.
凹部は、複数の発光素子２の間であって、複数の発光素子の電極２ａ、２ｂと隣接した位置に設けることが好ましい。これにより、凹部３ａ内に設けられる金属層４と複数の発光素子２の電極２ａ、２ｂと接続しやすくできる。 The recess is preferably provided between the plurality of light emitting elements 2 and at a position adjacent to the electrodes 2 a and 2 b of the plurality of light emitting elements. Thereby, the metal layer 4 provided in the recess 3 a can be easily connected to the electrodes 2 a and 2 b of the plurality of light emitting elements 2.
凹部３ａの内面の形状は、製造される発光装置１０の側面の金属層４またはキャスタレーションの形を略決定する。そのため、大きさや、製造する発光装置１０の特性に求められるものとすればよい。
例えば、凹部３ａの深さ（図４Ｂにおける縦方向の幅）は、例えば、発光装置１０の高さの１％〜９９％程度とすることができる。この凹部３ａの深さを深くすると、発光装置１０の側面に設けられる金属層４の面積を増やすことができるため、発光装置１０を実装基板に実装した際に実装強度を高めることができる。しかし、凹部３ａの深さを深くしすぎると、金属層４の端部と発光装置１０の発光面が近づくため、実装に用いられる半田等の接着部材が発光装置の発光に影響するおそれがある。そのため、例えば、凹部３ａの深さは発光装置１０の高さの２０〜５０％程度とすることが好ましい。
The shape of the inner surface of the recess 3a substantially determines the shape of the metal layer 4 or castellation on the side of the light emitting device 10 to be manufactured. Therefore, the size and characteristics of the light emitting device 10 to be manufactured may be determined.
For example, the depth (the width in the vertical direction in FIG. 4B) of the recess 3 a can be, for example, about 1% to 99% of the height of the light emitting device 10. When the depth of the recess 3a is increased, the area of the metal layer 4 provided on the side surface of the light emitting device 10 can be increased, so that the mounting strength can be increased when the light emitting device 10 is mounted on a mounting substrate. However, if the depth of the concave portion 3a is too deep, the end of the metal layer 4 and the light emitting surface of the light emitting device 10 come close, so there is a possibility that an adhesive member such as solder used for mounting may affect the light emission of the light emitting device. . Therefore, for example, it is preferable to set the depth of the recess 3 a to about 20 to 50% of the height of the light emitting device 10.
凹部３ａの上面視における形状は、発光素子２の辺と沿った方向に長い矩形、円形等があげられる。凹部３ａは、発光装置１０の一側面の端部から端部まで金属層４が形成できるよう、延長して形成することは好ましい。このような金属層４を用いることで発光装置１０の実装精度を高めることができる。
凹部３ａは、複数の発光素子２と隣接して延長された一つの溝としてもよい。これにより、切削や金型による成形によって容易に凹部３ａを設けることができる。一方、上面視において離間した凹部を複数設けてもよい。例えば、複数の発光素子２のそれぞれと隣接する分離した凹部３ａとしてもよい。
凹部３ａの幅（図４Ｂにおける横方向の長さ）は金属層４が製膜可能かつ切断が容易な程度で設けられることが好ましい。凹部３ａの側面は、傾斜してもよいし垂直であってもよい。
なお、凹部３ａは、発光装置１０の側面となる部分に設けられていればよく、複数の発光素子２を有する発光装置１０を製造する場合には、すべての複数の発光素子２の間に設けられていなくてもよい。
The shape of the recess 3 a in a top view may be a rectangle, a circle, or the like long in the direction along the side of the light emitting element 2. The recess 3 a is preferably extended so that the metal layer 4 can be formed from the end of one side surface of the light emitting device 10 to the end. The mounting accuracy of the light emitting device 10 can be enhanced by using such a metal layer 4.
The recess 3 a may be a groove extending adjacent to the plurality of light emitting elements 2. Thus, the recess 3a can be easily provided by cutting or molding with a die. On the other hand, a plurality of recessed portions separated in top view may be provided. For example, it may be a separate recess 3 a adjacent to each of the plurality of light emitting elements 2.
It is preferable that the width (the length in the horizontal direction in FIG. 4B) of the recess 3 a be provided to such an extent that the metal layer 4 can be formed and easily cut. The side surface of the recess 3a may be inclined or vertical.
The recess 3 a may be provided in a portion to be a side surface of the light emitting device 10, and in the case of manufacturing the light emitting device 10 having a plurality of light emitting elements 2, provided between all the plurality of light emitting elements 2. It does not have to be done.
凹部は、図５Ｂに示すように、２つの発光素子２の間に２つ、もしくは２つ以上設けてもよい。
一方、図１１に示すように、２つの発光素子２の間に１つのみ凹部３ａを設けることができる。これにより、発光素子２の間隔を広くせずに凹部３ａの幅を広げることができるため、後述する凹部３ａの内面における切断を容易に行うことができる。また、凹部３ａ内に形成される比較的高価な金属層４の材料を有効に利用することができ、安価な発光装置を製造することができる。
As shown in FIG. 5B, two or more recesses may be provided between two light emitting elements 2.
On the other hand, as shown in FIG. 11, only one recess 3 a can be provided between the two light emitting elements 2. As a result, the width of the recess 3a can be increased without increasing the distance between the light emitting elements 2, so that the inner surface of the recess 3a described later can be easily cut. Further, the material of the relatively expensive metal layer 4 formed in the recess 3a can be effectively utilized, and an inexpensive light emitting device can be manufactured.
以上のようにして、中間体１００を得る。 Intermediate 100 is obtained as described above.
次に、中間体１００の、発光素子２の一対の電極２ａ、２ｂの表面と被覆部材３の凹部３ａの内面とを連続して覆う金属層４を形成する。 Next, the metal layer 4 is formed to continuously cover the surfaces of the pair of electrodes 2 a and 2 b of the light emitting element 2 and the inner surface of the recess 3 a of the covering member 3 in the intermediate 100.
２．金属層の形成
図５Ａ及び５Ｂに示すように、中間体１００の発光素子の電極が露出された面（上面）及び凹部３ａの内面にわたって金属層４を形成する。
金属層４は、発光装置１０の実装用端子として用いられるため、その構成は発光装置１０の実装性や密着性を考慮して設けられる。
金属層４の材料は、例として、金、銀、ニッケル、アルミニウム、ロジウム、銅、又はこれらの合金を単層または積層などを用いることができる。中間体１００と接する層（金属層の第１層）としては、密着性を向上させるためにＮｉを用いることが好ましい。金属層４への実装用半田の拡散を防止するために、Ｒｕの層を含むことが好ましい。また、最表面は耐食性等の高いＡｕを用いることが好ましい。つまり、中間体１００に近い側からＮｉ／Ｒｕ／Ａｕの積層構造を用いることが好ましい。
金属層４の厚みは、薄いことが好ましく、適宜、発光装置１０を実装基板に接合する際に接合強度が確保できる条件とすることができる。レーザアブレーションが選択的に起こる程度とすることができ、例えば１μｍ以下であることが好ましく、１０００Å以下がより好ましい。また、電極の腐食を低減することができる厚み、例えば５ｎｍ以上であることが好ましい。ここで、金属層の厚みとは、金属層が複数の層が積層されて構成されている場合には、該複数の層の合計の厚みのことをいう。
金属層４が積層構造である場合には、積層構造のうちの１層の厚みは、例えば、１０Å〜１０００Åとすることができ、好ましくは、１５０Å〜１０００Å程度である。
この金属層４の形成は、ＡＬＤ、ＣＶＤ、スパッタ、蒸着で行うことができる。中でもスパッタによれば容易に金属層４を形成することができる。
2. Formation of Metal Layer As shown in FIGS. 5A and 5B, the metal layer 4 is formed over the exposed surface (upper surface) of the electrode of the light emitting element of the intermediate 100 and the inner surface of the recess 3a.
Since the metal layer 4 is used as a mounting terminal of the light emitting device 10, the configuration thereof is provided in consideration of the mountability and adhesion of the light emitting device 10.
The material of the metal layer 4 can be, for example, gold, silver, nickel, aluminum, rhodium, copper, or a single layer or lamination of these alloys or the like. As a layer in contact with the intermediate 100 (a first layer of a metal layer), it is preferable to use Ni in order to improve adhesion. In order to prevent the diffusion of the mounting solder into the metal layer 4, it is preferable to include a layer of Ru. Moreover, it is preferable to use Au with high corrosion resistance etc. for the outermost surface. That is, it is preferable to use a layered structure of Ni / Ru / Au from the side close to the intermediate 100.
It is preferable that the thickness of the metal layer 4 be thin, and accordingly, when bonding the light emitting device 10 to the mounting substrate, it can be set as a condition that can ensure the bonding strength. The laser ablation can be selectively performed, for example, preferably 1 μm or less, and more preferably 1000 Å or less. Moreover, it is preferable that it is thickness which can reduce corrosion of an electrode, for example, 5 nm or more. Here, the thickness of the metal layer refers to the total thickness of the plurality of layers when the metal layer is configured by laminating a plurality of layers.
When the metal layer 4 has a laminated structure, the thickness of one of the laminated structures can be, for example, 10 Å to 1000 Å, and preferably about 150 Å to 1000 Å.
The formation of the metal layer 4 can be performed by ALD, CVD, sputtering, or vapor deposition. Above all, the metal layer 4 can be easily formed by sputtering.
この実施形態では、まず、一つの連続する金属層４を被覆部材３と複数の電極２ａ、２ｂの表面にわたって略全面に形成している。このため、図６Ａ及び図６Ｂに示すように、一つの発光素子２の正負の電極２ａ、２ｂの間を接続するように存在している金属層４の一部を除去する。除去しなければ電極２ａ、２ｂが短絡した状態になり発光装置１０への電気供給がなく、発光装置１０が破壊されるためである。これは、例えば、レーザの照射またはエッチングまたはルータ加工によって電極２ａ、２ｂ間の金属層４を電極２ａ、２ｂに平行な一軸方向に、金属層４を除去することができる。特に、レーザの照射によれば、アブレーションにより金属層の除去を容易に精度よく行うことができる。 In this embodiment, first, one continuous metal layer 4 is formed over substantially the entire surface of the covering member 3 and the plurality of electrodes 2a and 2b. For this reason, as shown to FIG. 6A and FIG. 6B, a part of metal layer 4 which exists so that it may connect between the positive / negative electrodes 2a and 2b of one light emitting element 2 is removed. If not removed, the electrodes 2a and 2b are in a short circuited state, there is no electric supply to the light emitting device 10, and the light emitting device 10 is broken. This can remove the metal layer 4 in a uniaxial direction parallel to the electrodes 2a and 2b, for example, by laser irradiation or etching or router processing. In particular, according to laser irradiation, the metal layer can be easily and accurately removed by ablation.
このように、中間体１００の一面の略全面に設けた金属層４の一部を除去して金属層４を形成することが、金属層４を、マスク等を用いてパターニングして形成するよりも、容易なため、量産性の観点から好ましい。 Thus, forming the metal layer 4 by removing a part of the metal layer 4 provided on substantially the entire surface of the intermediate body 100 is formed by patterning the metal layer 4 using a mask or the like. It is also preferable from the viewpoint of mass productivity because it is easy.
発光装置１０における側面の金属層４の高さは、発光装置１０の実装基板と面する面から発光装置１０の高さの１％〜９９％、好ましくは１０〜７５％程度、より好ましくは１５〜５０％程度に設けることができる。金属層４の高さは、中間体１００の上面に非選択的に金属層４を形成する場合には、上述の凹部３ａの深さによって制御することができる。 The height of the metal layer 4 on the side surface of the light emitting device 10 is 1% to 99%, preferably about 10 to 75%, of the height of the light emitting device 10 from the surface facing the mounting substrate of the light emitting device 10 It can be provided at about 50%. The height of the metal layer 4 can be controlled by the depth of the above-mentioned recess 3 a when the metal layer 4 is formed nonselectively on the upper surface of the intermediate 100.
この実施形態では、複数の発光素子２の電極２ａ、２ｂの間の領域が平面視において一つの帯状になるよう複数の発光素子２を配置しているため、発光素子２の正負の電極２ａ、２ｂの間の金属層４を容易に除去することができる。電極２ａ、２ｂ間の金属層を一直線状に除去する為に、複数の発光素子２の支持体１への配置は、位置ずれが少ない状態で行うことが好ましい。発光素子２を精度よく配列しておけば、電極２ａ、２ｂ間の金属層４を除去する際に発生する電極の形状のばらつきを少なくすることができ、発光装置の生産性や品質の安定性を向上させることができる。 In this embodiment, since the plurality of light emitting elements 2 are arranged such that the region between the electrodes 2 a and 2 b of the plurality of light emitting elements 2 becomes one strip in plan view, the positive and negative electrodes 2 a of the light emitting elements 2, The metal layer 4 between 2b can be easily removed. In order to remove the metal layer between the electrodes 2a and 2b in a straight line, it is preferable that the arrangement of the plurality of light emitting elements 2 on the support 1 be performed in a state where the positional deviation is small. By arranging the light emitting elements 2 accurately, variations in the shape of the electrodes generated when removing the metal layer 4 between the electrodes 2a and 2b can be reduced, and the productivity and quality stability of the light emitting device can be reduced. Can be improved.
なお、凹部３ａの内面に設けられた金属層４と発光素子２の電極２ａ、２ｂが電気的に接続している限り、その他の中間体１００に設けられている部分も除去してもよい。例えば、後述の被覆部材３と金属層４が切断される際または発光装置１０として個片化される際に、切断される位置の中間体１００の上面に設けられた金属層４を除去してもよい。これにより、切断の際に金属のバリやゴミが発生することを低減することができ、安定して発光装置１０を製造することができる。
発光装置１０として完成した後に、発光装置１０の底面（中間体１００の状態では上面と呼ばれていた面）の周縁部にあたる部分を除去してもよい。
金属層４は、発光素子２の一方の電極２ａと接続される部分と他方の電極２ｂと接続された部分とが略同じ形状であってもよく、異なる形状であってもよい。例えば、これらの形状を互いに異ならせることで、発光装置１０の極性を見分けるマークとして用いることができる。このような除去は、レーザの照射またはエッチングまたはルータ加工等で行うことができる。特にレーザの照射によれば、金属層４の除去を精度よく行うことができるため、比較的複雑な形状に容易に形成することができる。
金属層４は、凹部３ａの内面の全てに設けられてもよく、部分的に設けられてもよい。
In addition, as long as the metal layer 4 provided on the inner surface of the concave portion 3a and the electrodes 2a and 2b of the light emitting element 2 are electrically connected, the other portion provided on the intermediate 100 may be removed. For example, when the covering member 3 and the metal layer 4 to be described later are cut or separated into pieces as the light emitting device 10, the metal layer 4 provided on the upper surface of the intermediate 100 at the position to be cut is removed. It is also good. As a result, the occurrence of metal burrs and dust during cutting can be reduced, and the light emitting device 10 can be manufactured stably.
After the light emitting device 10 is completed, a portion corresponding to the peripheral portion of the bottom surface of the light emitting device 10 (the surface called the upper surface in the state of the intermediate 100) may be removed.
In the metal layer 4, the portion connected to the one electrode 2 a of the light emitting element 2 and the portion connected to the other electrode 2 b may have substantially the same shape, or may have different shapes. For example, by making these shapes different from each other, it can be used as a mark for identifying the polarity of the light emitting device 10. Such removal can be performed by laser irradiation or etching, router processing, or the like. In particular, according to the laser irradiation, since the metal layer 4 can be removed with high accuracy, it can be easily formed into a relatively complicated shape.
The metal layer 4 may be provided on all of the inner surface of the recess 3a or may be provided partially.
３．被覆部材と金属層の切断
次に、図７Ａ及び７Ｂに示すように、凹部３ａの内面において被覆部材３と金属層４を切断する。
この時、凹部３ａがない部分の被覆部材３と金属層４も切断することができる。
なお、すべての凹部３ａにおいて切断が行われる必要はない。例えば、１つの発光装置が複数の発光素子２を備えるものを製造する場合、複数の発光素子２の間において配置された凹部３ａを切断せず、複数の発光素子２の間の被覆部材３に凹部３ａ（及び金属層４）を備える発光装置としてもよい。
3. Cutting of Cover Member and Metal Layer Next, as shown in FIGS. 7A and 7B, the cover member 3 and the metal layer 4 are cut at the inner surface of the recess 3a.
At this time, the covering member 3 and the metal layer 4 of the portion without the recess 3a can also be cut.
In addition, it is not necessary to cut in all the recessed parts 3a. For example, when one light emitting device is manufactured to include a plurality of light emitting elements 2, the covering member 3 between the plurality of light emitting elements 2 is not cut without cutting the recess 3 a disposed between the plurality of light emitting elements 2. The light emitting device may be provided with the recess 3 a (and the metal layer 4).
切断は、被覆部材３や金属層４を切断可能な方法で行われる。例えば、ブレードを用いたブレードダイシングや、レーザダイシング、カッタースクライブ等を利用することができる。 The cutting is performed by a method capable of cutting the covering member 3 and the metal layer 4. For example, blade dicing using a blade, laser dicing, cutter scribing, or the like can be used.
本実施形態においては、発光素子２と隣接して延長された一つの溝である複数の凹部３ａの内面を、ダイサーを用いて切断しているため、容易に切断を行うことができる。 In this embodiment, since the inner surfaces of the plurality of concave portions 3a which are one groove extended adjacent to the light emitting element 2 are cut using a dicer, the cutting can be easily performed.
被覆部材と金属層の切断は、図７Ｂに示すように、１つの凹部３ａの略中央で切断することで、凹部３ａを２つに分割するように行ってもよい。また、凹部３ａの内面の側面のうち、発光素子２から離れた側の側面を除去するように行ってもよい。また、図７Ａにおける２つの凹部３ａの間に配置された被覆部材を除去するように２つの凹部３ａを一度に切断してもよい。これにより、切断の回数を減少させることができ、また切断と発光装置に利用されなかった被覆部材の除去を同時に行うことができるため、製造を容易に行うことができる。また、図１１に示すような２つの発光素子２の間に１つのみ設けられた凹部３ａを切断し、１つの凹部３ａの２つの側面をそれぞれ２つの発光装置の側面として設けてもよい。これにより、切断の回数を減少させることができるため、製造を容易に行うことができる。 Cutting of the covering member and the metal layer may be performed so as to divide the recess 3 a into two by cutting at substantially the center of one recess 3 a as shown in FIG. 7B. Further, of the side surfaces of the inner surface of the recess 3a, the side surface remote from the light emitting element 2 may be removed. Alternatively, the two recesses 3a may be cut at one time so as to remove the covering member disposed between the two recesses 3a in FIG. 7A. As a result, the number of times of cutting can be reduced, and since the cutting and the removal of the covering member not used for the light emitting device can be simultaneously performed, the manufacturing can be easily performed. Alternatively, the recess 3a provided only between two light emitting elements 2 as shown in FIG. 11 may be cut, and the two side surfaces of the one recess 3a may be provided as the side surfaces of two light emitting devices. As a result, the number of cuts can be reduced, which facilitates manufacture.
本実施形態においては、凹部の内面において被覆部材３と金属層４の切断を行う際に同時に被覆部材３を完全に切断しているため、後述する発光装置の個片化も同時に行うことができ、量産性を高くすることができる。なお、被覆部材３と金属層４の切断の後に、さらに被覆部材３または金属層４を除去する、成形する等の工程を有してもよい。 In the present embodiment, since the covering member 3 is completely cut at the same time when the covering member 3 and the metal layer 4 are cut on the inner surface of the recess, the individualization of the light emitting device described later can be simultaneously performed. , Mass productivity can be enhanced. In addition, after cutting of the covering member 3 and the metal layer 4, the process of removing the covering member 3 or the metal layer 4 and forming may be included.
発光装置の個片化
本実施形態においては、図７Ａ及び７Ｂに示すように、凹部３ａ以外の部分においても被覆部材３と金属層４を切断して分離溝５を形成し、発光装置１０を個片化している。
前述のように、支持体１上に配置する発光素子２の形状として同じものを用いると、凹部３ａの形成のほかにも、発光装置１０の個片化も容易に行うことができる。この実施形態では、複数の矩形の発光素子２の側面が対向するように配置しているので、発光素子２の辺に沿って切断しやすく、効率的に個々の発光装置を個片化することができる。
Segregation of Light Emitting Device In the present embodiment, as shown in FIGS. 7A and 7B, the covering member 3 and the metal layer 4 are cut at portions other than the recess 3 a to form the separating groove 5, thereby forming the light emitting device 10. It is individualized.
As described above, when the same shape of the light emitting element 2 disposed on the support 1 is used, the light emitting device 10 can be easily singulated in addition to the formation of the concave portion 3 a. In this embodiment, since the side surfaces of the plurality of rectangular light emitting elements 2 are arranged to face each other, it is easy to cut along the side of the light emitting element 2 and the individual light emitting devices are separated into pieces efficiently. Can.
前述のように、個片化することで、図８及び９に示すように、実装基板８に実装する場合に、主発光面Ｑに対して略垂直な面（側面）にわたって発光装置１０の電極となる金属層４を形成することができる。また電極２ａ、２ｂ面に実装基板８の電極と同様の形状で電極が形成されていない場合でも、発光装置１０の側面に有する金属層４を利用して実装することで、発光装置１０の発光面Ｑが実装基板８の実装面に対して垂直なサイドビュー型の発光装置１０を製造することができる。
これにより、実装基板８との実装が容易な発光装置１０を形成することができる。
As described above, as shown in FIGS. 8 and 9, the electrodes of the light emitting device 10 are provided across the surface (side surface) substantially perpendicular to the main light emitting surface Q when mounting on the mounting substrate 8 by singulation. Metal layer 4 can be formed. Even when the electrodes 2a and 2b have the same shape as the electrodes of the mounting substrate 8 and no electrodes are formed, light emission of the light emitting device 10 can be achieved by mounting using the metal layer 4 provided on the side surface of the light emitting device 10. It is possible to manufacture a side view type light emitting device 10 whose surface Q is perpendicular to the mounting surface of the mounting substrate 8.
Thereby, the light emitting device 10 which can be easily mounted on the mounting substrate 8 can be formed.
このように、実装に用いられる金属層４を発光装置１０の側面に沿って設けることで、発光装置の実装を容易に精度よく行うことができる。また、実装した際に発光装置１０の側面の金属層４に半田フィレットが形成されるため、発光装置１０の実装の確認を容易に行うことができるとともに、実装基板８と発光装置１０とが実装された際の接着強度を高めることができる。これにより、実装が比較的困難な上、電極の面積を大きくすることが難しい、液晶ディスプレイのバックライトの光源等に用いられる小型の発光装置１０に好ましく用いることができる。 Thus, by providing the metal layer 4 used for mounting along the side surface of the light emitting device 10, the light emitting device can be easily and accurately mounted. Moreover, since a solder fillet is formed on the metal layer 4 on the side surface of the light emitting device 10 when mounted, the mounting of the light emitting device 10 can be easily confirmed, and the mounting substrate 8 and the light emitting device 10 are mounted. It is possible to increase the adhesive strength at the time of Accordingly, it can be preferably used for a small light emitting device 10 used as a light source of a backlight of a liquid crystal display, which is relatively difficult to mount and it is difficult to increase the area of the electrode.
金属層４は、発光装置１０の底面において、広い面積で設けられることが好ましい。例えば、発光装置１０の底面の面積の２０％〜９０％、より好ましくは５０％〜８０％の面積で設けられることが好ましい。これにより、発光装置１０の放熱性や実装強度を高めることができる。 The metal layer 4 is preferably provided in a wide area on the bottom surface of the light emitting device 10. For example, it is preferable to be provided in an area of 20% to 90%, more preferably 50% to 80% of the area of the bottom surface of the light emitting device 10. Thereby, the heat dissipation and mounting strength of the light emitting device 10 can be enhanced.
金属層４の側面が発光装置１０の側面と略同一面となるよう配置することで、複数の発光装置１０を並べて実装する際に、上述のような効果を得ながら、発光装置１０同士の間隔を狭めることができる。これにより、発光装置１０を高い密度で実装することができる。 By arranging the metal layer 4 so that the side surface of the metal layer 4 is substantially flush with the side surface of the light emitting device 10, the spacing between the light emitting devices 10 can be obtained while obtaining the above effects when mounting the plurality of light emitting devices 10 side by side. Can be narrowed. Thereby, the light emitting device 10 can be mounted at high density.
本実施形態においては、それぞれの発光素子２の両側に１つずつ溝の凹部３ａが設けられているが、隣接する発光素子２の間に１つの凹部が設けられてもよい。このような１つの凹部の内面で切断することで、凹部に隣接する２つの発光装置それぞれの側面に金属層４を形成してもよい。これによれば、切断の回数を減らすことができ、製造の効率を高めることができる。 In the present embodiment, although the recess 3 a of the groove is provided on each side of each light emitting element 2, one recess may be provided between the adjacent light emitting elements 2. The metal layer 4 may be formed on the side surface of each of the two light emitting devices adjacent to the recess by cutting at the inner surface of such one recess. According to this, the number of times of cutting can be reduced, and the manufacturing efficiency can be enhanced.
この実施形態においては、図９に示すように、発光装置１０の被覆部材３と金属層４の外側面が略同一平面となるよう設けられているが、図１０に示すように、発光装置の被覆部材３が発光装置の側面に開口を有し、開口内に金属層４の一部が設けられることで、キャスタレーションを備えていてもよい。このような開口内に金属層４を設けることにより、金属層４の高さを高くすることなく、半田と金属層が接着する面積を増やすことができ、発光装置の実装信頼性を高めることができる。このような金属層４は、中間体を準備する際に凹部３ａの幅を広く形成し、凹部３ａの内面に金属層４を形成した後、凹部３ａの底面３ｄの一部が発光装置に残るように切断することで、形成することができる。このような開口は、被覆部材３と金属層４の切断の際に、例えば、凹部３ａの内面のうち側面だけでなく底面３ｄを発光装置に残すことで形成することができる。 In this embodiment, as shown in FIG. 9, the covering member 3 of the light emitting device 10 and the outer surface of the metal layer 4 are provided so as to be substantially the same plane, but as shown in FIG. The covering member 3 may have an opening on the side surface of the light emitting device, and a portion of the metal layer 4 may be provided in the opening to provide castellation. By providing the metal layer 4 in such an opening, the area where the solder and the metal layer adhere to each other can be increased without increasing the height of the metal layer 4, and the mounting reliability of the light emitting device can be enhanced. it can. Such a metal layer 4 widens the width of the recess 3a when preparing the intermediate, and after forming the metal layer 4 on the inner surface of the recess 3a, a part of the bottom 3d of the recess 3a remains in the light emitting device It can be formed by cutting. Such an opening can be formed, for example, by leaving not only the side surface but also the bottom surface 3 d of the inner surface of the recess 3 a in the light emitting device when the covering member 3 and the metal layer 4 are cut.
４．その他の工程
以上の工程の他に、例えば、波長変換層を形成する工程、透光層を形成する工程等を適宜行ってもよい。
4. Other Steps In addition to the above steps, for example, a step of forming a wavelength conversion layer, a step of forming a light transmitting layer, and the like may be appropriately performed.
波長変換層を形成する工程では、主発光面Ｑから出射される光を所望の波長に変換する波長変換層を、主発光面Ｑを被覆するように形成することができる。波長変換層としては、例えば樹脂やガラス等の母材に蛍光体等の波長変換材料を含有したものを用いることができる。波長変換層は、スプレー、印刷、塗布、貼り付け等の所望の方法で形成することができる。被覆部材で波長変換層の側面も覆うことにより、発光部と非発光部のコントラストが高い、いわゆる見切り性の良い発光装置を形成することができる。波長変換層は、その構成に応じて、上述のどの工程の前後に行われてもよい。例えば、支持体１として波長変換材料を含有した透光性の樹脂等からなるシートを用い、この支持体１を波長変換層として用いてもよい。また、周縁を遮光性部材の枠で囲まれた波長変換層を予め形成しておき、被覆部材の形成前に主発光面に貼り付けることで、見切り性の良い発光装置を製造することができる。また、被覆部材の形成前に発光素子の主発光面に波長変換層を接着した後、被覆部材を形成してもよい。波長変換層の上に発光素子の主発光面を対向するように接着することで、容易に波長変換層と発光素子の位置決めを行うことができる。透光性接着剤の波長変換層と発光素子との接着には、シリコーン樹脂等の透光性接着剤を用いることができる。この透光性接着剤は発光素子の側面と被覆部材の間に設けられていてもよい。 In the step of forming the wavelength conversion layer, a wavelength conversion layer that converts light emitted from the main light emission surface Q into a desired wavelength can be formed to cover the main light emission surface Q. As a wavelength conversion layer, what contained wavelength conversion materials, such as fluorescent substance, in base materials, such as resin and glass, can be used, for example. The wavelength conversion layer can be formed by a desired method such as spraying, printing, application, and sticking. By covering the side surface of the wavelength conversion layer with the covering member as well, it is possible to form a light emitting device having a high contrast between the light emitting part and the non-light emitting part, that is, a so-called line-off property. The wavelength conversion layer may be performed before or after any of the above-described steps, depending on its configuration. For example, a sheet made of a translucent resin containing a wavelength conversion material may be used as the support 1, and the support 1 may be used as a wavelength conversion layer. In addition, a wavelength conversion layer whose periphery is surrounded by the frame of the light shielding member is formed in advance, and is attached to the main light emitting surface before the formation of the covering member, whereby a light emitting device with good line-off can be manufactured. . In addition, after the wavelength conversion layer is adhered to the main light emitting surface of the light emitting element before the formation of the covering member, the covering member may be formed. The wavelength conversion layer and the light emitting element can be easily positioned by adhering the main light emitting surface of the light emitting element so as to face the wavelength conversion layer. A translucent adhesive such as silicone resin can be used to bond the wavelength conversion layer of the translucent adhesive to the light emitting element. The light transmitting adhesive may be provided between the side surface of the light emitting element and the covering member.
透光層を形成する工程は、発光装置の発光面（具体的には、波長変換層や主発光面Ｑ）上に、透光性を有する透光層を形成する工程である。透光層を形成することで、発光装置の発光面を保護することができる。透光層としては、例えば透光性を有する樹脂やガラス等を用いることができる。また、フィラー等を含有させることで、光の取り出し向上や、タック性を低減させることが可能である。透光層は、例えばスプレー、印刷、塗布、貼り付け等の所望の方法で形成することができる。上記の波長変換層を用いる場合、あらかじめ波長変換層と透光層を積層した状態に形成した後、発光素子に設けてもよい。 The step of forming the light transmitting layer is a step of forming a light transmitting layer having light transmitting property on the light emitting surface (specifically, the wavelength conversion layer and the main light emitting surface Q) of the light emitting device. The light emitting surface of the light emitting device can be protected by forming the light transmitting layer. As a light transmission layer, resin, glass, etc. which have translucency, for example can be used. Further, by incorporating a filler or the like, it is possible to improve the light extraction and reduce the tackiness. The light transmitting layer can be formed by a desired method such as, for example, spraying, printing, application, and sticking. In the case of using the above wavelength conversion layer, the wavelength conversion layer and the light transmission layer may be formed in advance and then provided in the light emitting element.
以下、各構成部材について説明する。 Hereinafter, each component will be described.
発光素子２
発光素子２は、当該分野で一般的に用いられる発光ダイオード、レーザダイオード等を用いることができる。例えば、窒化物系半導体（ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）、ＧａＰ、ＧａＡｓなどのＩＩＩ−Ｖ族化合物半導体、ＺｎＳｅ、ＩＩ−ＶＩ族化合物半導体等、種々の半導体を利用することができる。なお、発光素子２は、半導体層を成長させるための基板を有していてもよい。基板としては、サファイア等の絶縁性基板、ＳｉＣ、ＺｎＯ、Ｓｉ、ＧａＡｓ、ダイヤモンド、窒化物半導体と格子接合するニオブ酸リチウム、ガリウム酸ネオジム等の酸化物からなる基板が挙げられる。なお、基板はレーザリフトオフ法等を利用して除去されていてもよい。
Light emitting element 2
As the light emitting element 2, a light emitting diode, a laser diode or the like generally used in the relevant field can be used. For example, the nitride semiconductor (In X Al Y Ga 1- X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), GaP, III-V group compound semiconductor such as GaAs, ZnSe, II-VI group Various semiconductors such as compound semiconductors can be used. The light emitting element 2 may have a substrate for growing the semiconductor layer. Examples of the substrate include insulating substrates such as sapphire, and substrates made of oxides such as lithium niobate and neodymium gallium oxide lattice-joined to SiC, ZnO, Si, GaAs, diamond, and nitride semiconductors. The substrate may be removed using a laser lift off method or the like.
支持体１
支持体１は、前述のようにシート状の樹脂、セラミックス、ガラス等を用いることができる。特に、耐熱性の観点から、シート状のポリイミド樹脂を用いることが好ましい。
支持体１の平面形状、大きさ、厚み等は、配置する発光素子２の大きさや数によって適宜調整することができる。特に、均一な厚みを有し、その表面が平坦なシート状の支持体１であると、発光素子２を安定的に配置しやすく好ましい。
Support 1
As described above, the sheet-like resin, ceramics, glass or the like can be used as the support 1. In particular, it is preferable to use a sheet-like polyimide resin from the viewpoint of heat resistance.
The planar shape, size, thickness and the like of the support 1 can be appropriately adjusted depending on the size and the number of the light emitting elements 2 to be disposed. In particular, a sheet-like support 1 having a uniform thickness and a flat surface is preferable because the light emitting element 2 can be stably disposed.
支持体１を発光装置の一部として用いる場合は、透光性を有していると好ましく、発光素子２からの光の透過率が６０％以上、７０％以上、８０％以上、９０％以上であるものが好ましい。
特に、支持体１を発光装置の一部として用いる場合は、支持体１として樹脂を用いることが好ましく、シリコーン樹脂、シリコーン変性樹脂、エポキシ樹脂、エポキシ変性樹脂、フェノール樹脂、ポリカーボネート樹脂、アクリル樹脂、ＴＰＸ樹脂、ポリノルボルネン樹脂、又はこれらの樹脂を１種以上含むハイブリッド樹脂等の樹脂等によって形成されたものが挙げられる。なかでも、シリコーン樹脂又はエポキシ樹脂が好ましく、特に耐光性、耐熱性に優れるシリコーン樹脂が好ましい。
In the case where the support 1 is used as part of a light emitting device, it is preferable that the support 1 has light transmitting property, and the light transmittance of the light emitting element 2 is 60% or more, 70% or more, 80% or more, 90% or more Is preferred.
In particular, when using the support 1 as a part of a light emitting device, it is preferable to use a resin as the support 1, and silicone resin, silicone modified resin, epoxy resin, epoxy modified resin, phenol resin, polycarbonate resin, acrylic resin, What is formed with resin etc., such as TPX resin, poly norbornene resin, or hybrid resin containing 1 or more types of these resins, is mentioned. Among these, silicone resins or epoxy resins are preferable, and silicone resins having excellent light resistance and heat resistance are particularly preferable.
さらに、支持体１を発光装置の一部として用いる場合、支持体１に発光素子からの光を波長変換する波長変換部材、例えば、蛍光体及び／又は発光物質を含有させると、発光装置の波長変換層として用いることができる。
蛍光体及び／又は発光物質としては、例えば、イットリウム・アルミニウム・ガーネット（ＹＡＧ）系蛍光体などを用いることができる。
Furthermore, when the support 1 is used as part of a light emitting device, the wavelength of the light emitting device can be obtained by including a wavelength conversion member for converting the wavelength of light from the light emitting element into the support 1, for example, phosphor and / or light emitting material. It can be used as a conversion layer.
As the phosphor and / or the light emitting material, for example, yttrium aluminum garnet (YAG) phosphor can be used.
支持体１は、フィラー（例えば、拡散剤、着色剤等）を含んでいてもよい。例えば、シリカ、酸化チタン、酸化ジルコニウム、酸化マグネシウム、ガラス、蛍光体の結晶又は焼結体、蛍光体と無機物の結合材との焼結体等が挙げられる。 The support 1 may contain a filler (eg, a diffusing agent, a coloring agent, etc.). For example, silica, titanium oxide, zirconium oxide, magnesium oxide, glass, a crystal or sintered body of a phosphor, a sintered body of a phosphor and a binder of an inorganic substance, and the like can be mentioned.
被覆部材３
被覆部材３は、例えば、母材である樹脂に光反射性又は光吸収性物質を含有させた材料により形成することができる。これにより、被覆部材３を所望の形状に成形しやすい。樹脂としては、例えば、シリコーン樹脂、変成シリコーン樹脂、エポキシ樹脂、変成エポキシ樹脂、不飽和ポリエステル樹脂、ポリイミド樹脂、変成ポリイミド樹脂、フェノール樹脂、ウレタン樹脂、アクリレート樹脂、ユリア樹脂、アクリル樹脂、ポリフタルアミド（ＰＰＡ）、ポリフェニレンサルファイド（ＰＰＳ）、液晶ポリマー（ＬＣＰ）等が挙げられる。これらは単独で又は２種以上の樹脂を組み合わせて用いてもよい。特に、耐熱性、耐候性の観点から、シリコーン系の樹脂を含むことが好ましい。
なお、被覆部材３の厚み（発光素子２の側面から発光装置１００の側面までの距離、図１０に示すＤ）は、例えば１０μｍ〜１００μｍとすることで、主発光面Ｑ以外からの発光素子の光を十分に遮光しつつ、小型の発光装置を形成することができる。
Cover member 3
The covering member 3 can be formed of, for example, a material in which a resin that is a base material contains a light reflective or light absorbing material. Thereby, the covering member 3 can be easily formed into a desired shape. As a resin, for example, silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, unsaturated polyester resin, polyimide resin, modified polyimide resin, phenol resin, urethane resin, acrylate resin, urea resin, acrylic resin, polyphthalamide (PPA), polyphenylene sulfide (PPS), liquid crystal polymer (LCP) and the like. You may use these individually or in combination of 2 or more types of resin. In particular, from the viewpoint of heat resistance and weather resistance, it is preferable to contain a silicone resin.
Note that the thickness of the covering member 3 (the distance from the side surface of the light emitting element 2 to the side surface of the light emitting device 100, D shown in FIG. 10) is 10 μm to 100 μm, for example. A small light emitting device can be formed while sufficiently blocking light.
光反射性又は光吸収性物質としては、例えば、セラミックス、二酸化チタン、二酸化ケイ素、二酸化ジルコニウム、チタン酸カリウム、アルミナ、窒化アルミニウム、窒化ケイ素、窒化ホウ素、ムライト、酸化ニオブ、酸化亜鉛、硫酸バリウム、各種希土類酸化物（例えば、酸化イットリウム、酸化ガドリニウム）等が挙げられる。光反射性又は光吸収性物質は、被覆部材の全重量において、約２０重量％〜８０重量％程度含有されていることが好ましく、約３０重量％〜７０重量％程度がより好ましい。これにより、被覆部材の遮光性及び強度を確保することができる。 As the light reflective or light absorbing substance, for example, ceramics, titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, silicon nitride, boron nitride, mullite, niobium oxide, zinc oxide, barium sulfate, Various rare earth oxides (for example, yttrium oxide, gadolinium oxide) and the like can be mentioned. The light-reflecting or light-absorbing substance is preferably contained in an amount of about 20% by weight to about 80% by weight, and more preferably about 30% by weight to about 70% by weight, based on the total weight of the covering member. Thereby, the light shielding property and the strength of the covering member can be secured.
本発明の実施形態に係る発光装置は、照明用光源、各種インジケーター用光源、車載用光源、ディスプレイ用光源、液晶のバックライト用光源、センサー用光源、信号機等、種々の発光装置に使用することができる。 The light emitting device according to the embodiment of the present invention may be used for various light emitting devices such as illumination light sources, light sources for various indicators, light sources for vehicles, light sources for displays, light sources for backlight of liquid crystals, light sources for sensors, and traffic lights. Can.
１ 支持体
２ 発光素子
２ａ、２ｂ 発光素子の電極
３ 被覆部材
３ａ 凹部
３ｄ 底面
４ 金属層
５ 分離溝
８ 実装基板
９ 半田
１０ 発光装置
１００ 中間体
REFERENCE SIGNS LIST 1 support 2 light emitting element 2 a, 2 b electrode of light emitting element 3 covering member 3 a concave portion 3 d bottom surface 4 metal layer 5 separation groove 8 mounting substrate 9 solder 10 light emitting device 100 intermediate body
Claims (9)
前記発光素子の前記一対の電極の表面と前記単層構造の被覆部材の前記凹部の内面とを連続して覆う、単層又は平面形状が同一の積層構造の金属層を形成する工程と、
金属層を形成する工程に続いて、前記凹部の内面において前記被覆部材と前記金属層を切断する工程と、を含む発光装置の製造方法。 A pair of electrodes are provided on the same side, and the side surfaces of the plurality of light emitting elements are covered such that a plurality of light emitting elements separated from one another and a part of the surface of the pair of electrodes are exposed. Providing an intermediate body comprising a single-layered cover member having a recess between the elements;
Forming a single layer or a metal layer of a laminated structure having the same planar shape, continuously covering the surfaces of the pair of electrodes of the light emitting element and the inner surface of the recess of the covering member of the single layer structure ;
Following the step of forming a metal layer, cutting the covering member and the metal layer on the inner surface of the recess.
前記発光素子の前記一対の電極の表面と前記被覆部材の前記凹部の内面とを連続して覆う金属層を形成する工程と、 Forming a metal layer continuously covering the surfaces of the pair of electrodes of the light emitting element and the inner surface of the recess of the covering member;
前記凹部の内面において前記被覆部材と前記金属層を切断する工程と、 Cutting the covering member and the metal layer on the inner surface of the recess;
得られた前記発光素子の前記一対の電極及び該電極表面の金属層を実装基板に対面させて、前記電極表面の金属層と、前記発光素子の側面側の被覆部材の表面で露出する金属層とに半田を接触させて前記発光素子を実装基板に実装する工程とを含む発光装置の製造方法。The pair of electrodes of the obtained light emitting device and the metal layer on the surface of the electrode are made to face the mounting substrate, and the metal layer on the surface of the electrode and the metal layer exposed on the surface of the covering member on the side of the light emitting device And a step of mounting the light emitting device on a mounting substrate by contacting the solder with the solder.
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| KR20160082953A (en) * | 2016-06-28 | 2016-07-11 | 주식회사 세미콘라이트 | Semiconductor light emitting device and method of manufacturing the same |
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| JP6773162B2 (en) | 2020-10-21 |
| JP2019114811A (en) | 2019-07-11 |
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