JP6494125B2 - 複合電子部品 - Google Patents
複合電子部品 Download PDFInfo
- Publication number
- JP6494125B2 JP6494125B2 JP2017074839A JP2017074839A JP6494125B2 JP 6494125 B2 JP6494125 B2 JP 6494125B2 JP 2017074839 A JP2017074839 A JP 2017074839A JP 2017074839 A JP2017074839 A JP 2017074839A JP 6494125 B2 JP6494125 B2 JP 6494125B2
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- composite
- antistatic
- electronic component
- composite electronic
- disposed
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- 239000002131 composite material Substances 0.000 title claims description 81
- 239000000758 substrate Substances 0.000 claims description 18
- 239000011241 protective layer Substances 0.000 claims description 12
- 230000003068 static effect Effects 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 229920001940 conductive polymer Polymers 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 230000001052 transient effect Effects 0.000 claims description 4
- 208000032365 Electromagnetic interference Diseases 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 229910000859 α-Fe Inorganic materials 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 239000004020 conductor Substances 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000004891 communication Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- 230000005611 electricity Effects 0.000 description 6
- 230000002265 prevention Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000696 magnetic material Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
- H01F27/402—Association of measuring or protective means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/25—Magnetic cores made from strips or ribbons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Thermistors And Varistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Elimination Of Static Electricity (AREA)
Description
以下、添付の図面を参照して本発明の好ましい実施形態について説明する。
110 (インダクタ)本体
120 EOS保護素子
130 複合体
23 基板
42 第1コイル部
44 第2コイル部
46 コア
131 端子電極(入力端子)
132 端子電極(接地端子または出力端子)
133 接地端子
140 静電気防止ペースト
141、142 第1及び第2静電気防止電極
150 保護層
Claims (11)
- 基板、及び前記基板の少なくとも一面に形成され、内部にコアを有するコイル部を含む本体を含むインダクタと、
前記コイル部の上部及び下部の少なくとも一部に配置され、且つ静電気防止電極と前記静電気防止電極の間に配置された静電気防止ペーストとを含むEOS保護素子と、が結合された複合体と、
前記複合体の長さ方向の両側面に配置され、前記インダクタのコイル部及び静電気防止電極と接続される端子電極と、を含み、
前記EOS保護素子は、前記コイル部の中心部領域であるコアから前記本体の幅方向に所定の間隔離れ、且つ前記本体の幅方向の側面に隣接する領域に配置され、
前記端子電極は本体の長さ方向の両端面に配置され、
前記端子電極は、前記複合体の長さ方向の第1端面に配置された入力端子と、前記複合体の長さ方向の第2端面に配置された出力端子と、を含み、
前記インダクタのコイル部は、前記複合体の長さ方向の第1端面に露出する第1コイル部と、前記複合体の長さ方向の第2端面に露出する第2コイル部と、を含み、
前記静電気防止電極は、前記複合体の長さ方向の第1端面に露出する第1静電気防止電極と、前記複合体の長さ方向の第2端面に露出する第2静電気防止電極と、を含み、
前記入力端子は、第1コイル部及び第1静電気防止電極と連結され、前記出力端子は、前記第2コイル部及び第2静電気防止電極と連結され、且つ前記EOS保護素子は前記コイル部の中心部領域であるコアと前記本体の厚さ方向において互いに離れている、複合電子部品。 - 前記EOS保護素子は前記コイル部の上部及び下部にそれぞれ配置される、請求項1に記載の複合電子部品。
- 前記静電気防止電極は、同一の平面上において互いに対向する第1及び第2静電気防止電極で構成される、請求項1または請求項2に記載の複合電子部品。
- 前記静電気防止ペーストは導電性の高分子を含む、請求項1から請求項3の何れか一項に記載の複合電子部品。
- 前記静電気防止ペーストはシリカをさらに含む、請求項4に記載の複合電子部品。
- 前記EOS保護素子は、前記静電気防止電極と、静電気防止ペースト上に配置された保護層と、をさらに含む、請求項1から請求項5の何れか一項に記載の複合電子部品。
- 前記保護層はエポキシ系樹脂を含む、請求項6に記載の複合電子部品。
- 前記複合体の幅方向の少なくとも一面には、前記EOS保護素子と接続された接地端子がさらに配置される、請求項1から請求項7の何れか一項に記載の複合電子部品。
- 前記端子電極は入力端子及び出力端子である、請求項8に記載の複合電子部品。
- 前記端子電極はL字状である、請求項1から請求項9の何れか一項に記載の複合電子部品。
- EOSは、ESD(Electro Static Discharge)、EFT(Electrical Fast Transient)、サージ(Surge)、ラッチアップ(Latch Up)、及びEMI(Electro Magnetic Interference)からなる群より選択されたいずれか一つ以上である、請求項1から請求項10の何れか一項に記載の複合電子部品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160106797A KR101872596B1 (ko) | 2016-08-23 | 2016-08-23 | 복합 전자부품 |
KR10-2016-0106797 | 2016-08-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018032843A JP2018032843A (ja) | 2018-03-01 |
JP6494125B2 true JP6494125B2 (ja) | 2019-04-03 |
Family
ID=61303570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017074839A Active JP6494125B2 (ja) | 2016-08-23 | 2017-04-04 | 複合電子部品 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6494125B2 (ja) |
KR (1) | KR101872596B1 (ja) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5232562B2 (ja) * | 2008-07-31 | 2013-07-10 | 東光株式会社 | 積層型電子部品 |
KR101174327B1 (ko) * | 2008-09-30 | 2012-08-16 | 티디케이가부시기가이샤 | 복합 전자 디바이스, 그 제조 방법, 및 복합 전자 디바이스의 접속 구조 |
KR101012965B1 (ko) | 2008-10-20 | 2011-02-08 | 주식회사 아모텍 | 복합소자 |
US8350660B2 (en) * | 2008-11-21 | 2013-01-08 | Showa Denko K.K. | Resin composition for filling discharge gap and electrostatic discharge protector |
JP2011049418A (ja) * | 2009-08-28 | 2011-03-10 | Panasonic Corp | コモンモードノイズフィルタ |
JP2012084629A (ja) * | 2010-10-08 | 2012-04-26 | Murata Mfg Co Ltd | コイル装置 |
JPWO2013058144A1 (ja) * | 2011-10-18 | 2015-04-02 | 株式会社村田製作所 | 複合電子部品 |
KR20150055444A (ko) * | 2013-11-13 | 2015-05-21 | 삼성전기주식회사 | 공통 모드 필터 |
KR101983159B1 (ko) * | 2013-11-28 | 2019-05-28 | 삼성전기주식회사 | 코일 부품 및 이의 제조 방법 |
JP2015138932A (ja) * | 2014-01-24 | 2015-07-30 | Tdk株式会社 | 静電気保護部品 |
KR20160024262A (ko) * | 2014-08-25 | 2016-03-04 | 삼성전기주식회사 | 공통 모드 필터 및 그 제조 방법 |
-
2016
- 2016-08-23 KR KR1020160106797A patent/KR101872596B1/ko active IP Right Grant
-
2017
- 2017-04-04 JP JP2017074839A patent/JP6494125B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
KR20180022029A (ko) | 2018-03-06 |
JP2018032843A (ja) | 2018-03-01 |
KR101872596B1 (ko) | 2018-06-28 |
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