JP6461300B1 - セラミック装置 - Google Patents
セラミック装置 Download PDFInfo
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- JP6461300B1 JP6461300B1 JP2017253369A JP2017253369A JP6461300B1 JP 6461300 B1 JP6461300 B1 JP 6461300B1 JP 2017253369 A JP2017253369 A JP 2017253369A JP 2017253369 A JP2017253369 A JP 2017253369A JP 6461300 B1 JP6461300 B1 JP 6461300B1
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/001—Joining burned ceramic articles with other burned ceramic articles or other articles by heating directly with other burned ceramic articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
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- C—CHEMISTRY; METALLURGY
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/365—Silicon carbide
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/368—Silicon nitride
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/62—Forming laminates or joined articles comprising holes, channels or other types of openings
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/68—Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/3255—Material
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
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Abstract
Description
平面状に延在する所定のパターンを有し、前記セラミック基体に埋設された通電可能な発熱抵抗体又は電極体と、を備え、
前記中間層の上面には水平面が定められ、前記中間層の上面に沿って前記発熱抵抗体又は電極体が配置されるとともに、前記被覆層が前記発熱抵抗体又は電極体を被覆するように前記中間層上面に積層されたことを特徴とする。
セラミック焼結体からなり、少なくとも、基層、前記基層上面に積層された中間層及び前記中間層上面に積層された被覆層を備えるセラミック基体と、
前記中間層と前記被覆層との間で延在する所定のパターンを有し、前記セラミック基体に埋設された通電可能な発熱抵抗体又は電極体と、
前記中間層と前記基層との間で延在する所定の導線パターンを有し、前記発熱抵抗体又は電極体と異なる層で前記セラミック基体に埋設された導線と、を備え、
前記中間層には、前記導線から前記中間層の上面に向けて前記中間層の厚さ未満の長さで延びる少なくとも1つの接続導体がさらに設けられ、
前記基層には、前記基層の下面から前記接続導体に向けて開口する少なくとも1つの接続孔が設けられていることを特徴とする。
本発明は、上記実施形態に限定されず、種々の実施形態や変形例を取り得る。以下、本発明の複数の変形例を説明する。各実施形態において、下二桁が共通する構成要素は、特定のない限り、同一又は類似の特徴を有し、その説明を一部省略する。
110 セラミック基体
111 基層
112 中間層
113 被覆層
114 ビア
115 接続導体
116 接続孔
117 接続孔
118 接続孔
120 ヒータ線(発熱抵抗体又は電極体)
121 ヒータパターン部(所定のパターン)
122 始端部
123 終端部
130 導線
131 接続部
Claims (12)
- セラミック焼結体からなり、少なくとも、基層、前記基層上面に積層された中間層及び前記中間層上面に積層された被覆層を備えるセラミック基体と、
平面状に延在する所定のパターンを有し、前記セラミック基体に埋設された通電可能な発熱抵抗体又は電極体と、を備え、
前記中間層の上面に沿って前記発熱抵抗体又は電極体が配置されるとともに、前記被覆層が前記発熱抵抗体又は電極体を被覆するように前記中間層上面に積層され、
前記中間層の明度が前記基層及び前記被覆層の明度と異なることを特徴とするセラミック装置。 - セラミック焼結体からなり、少なくとも、基層、前記基層上面に積層された中間層及び前記中間層上面に積層された被覆層を備えるセラミック基体と、
平面状に延在する所定のパターンを有し、前記セラミック基体に埋設された通電可能な発熱抵抗体又は電極体と、を備え、
前記中間層の上面には水平面が定められ、前記中間層の上面に沿って前記発熱抵抗体又は電極体が配置されるとともに、前記被覆層が前記発熱抵抗体又は電極体を被覆するように前記中間層上面に積層され、
前記水平面は、前記中間層の前駆焼結体の研磨面に対応する平面形状を有し、前記発熱抵抗体又は電極体の平面形状が前記水平面に沿って維持されていること特徴とするセラミック装置。 - 前記中間層には、前記発熱抵抗体又は電極体に電気的に接続され、前記中間層の上面から下面まで延びる少なくとも1つのビアが設けられ、前記基層には、前記基層の下面から前記ビアに向けて開口する少なくとも1つの接続孔が設けられていることを特徴とする請求項1又は2に記載のセラミック装置。
- 前記中間層と前記基層との間で平面状に延在する所定の導線パターンを有する導線をさらに備え、
前記中間層には、前記導線から前記中間層の上面に向けて前記中間層の厚さ未満の長さで延びる少なくとも1つの接続導体がさらに設けられ、
前記基層には、前記基層の下面から前記接続導体に向けて開口する少なくとも1つの接続孔が設けられていることを特徴とする請求項1から3のいずれか一項に記載のセラミック装置。 - 前記中間層の下面には水平面が定められ、前記中間層の下面に沿って前記導線が配置されていることを特徴とする請求項4に記載のセラミック装置。
- 前記接続導体は、厚さ方向に延びるピンからなり、丸みを帯びた上端部を有することを特徴とする請求項4又は5に記載のセラミック装置。
- 前記基層、前記中間層及び前記被覆層の各境界において、隣接する層が隙間なく密着していることを特徴とする請求項1から6のいずれか一項に記載のセラミック装置。
- 前記発熱抵抗体又は電極体がパターン化された導体箔からなることを特徴とする請求項1から7のいずれか一項に記載のセラミック装置。
- 前記導線がパターン化された導体箔からなることを特徴とする請求項4から6のいずれか一項に記載のセラミック装置。
- セラミック焼結体からなり、少なくとも、基層、前記基層上面に積層された中間層及び前記中間層上面に積層された被覆層を備えるセラミック基体と、
前記中間層と前記被覆層との間で延在する所定のパターンを有し、前記セラミック基体に埋設された通電可能な発熱抵抗体又は電極体と、
前記中間層と前記基層との間で延在する所定の導線パターンを有し、前記発熱抵抗体又は電極体と異なる層で前記セラミック基体に埋設された導線と、を備え、
前記中間層には、前記導線から前記中間層の上面に向けて前記中間層の厚さ未満の長さで延びる少なくとも1つの接続導体がさらに設けられ、
前記基層には、前記基層の下面から前記接続導体に向けて開口する少なくとも1つの接続孔が設けられ、
前記中間層の明度が前記基層及び前記被覆層の明度と異なることを特徴とするセラミック装置。 - 前記中間層には、前記発熱抵抗体又は電極体及び前記導線に電気的に接続され、前記中間層の上面から下面まで延びる少なくとも1つのビアが設けられ、前記導線が前記ビア及び前記接続導体を接続していることを特徴とする請求項10に記載のセラミック装置。
- 前記電極体は、静電チャック用電極又はRF電極であることを特徴とする請求項1から11のいずれか一項に記載のセラミック装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2017253369A JP6461300B1 (ja) | 2017-12-28 | 2017-12-28 | セラミック装置 |
PCT/JP2018/047523 WO2019131611A1 (ja) | 2017-12-28 | 2018-12-25 | セラミック装置 |
US16/497,698 US11643368B2 (en) | 2017-12-28 | 2018-12-25 | Ceramic device |
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JP2017253369A JP6461300B1 (ja) | 2017-12-28 | 2017-12-28 | セラミック装置 |
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JP6461300B1 true JP6461300B1 (ja) | 2019-01-30 |
JP2019121432A JP2019121432A (ja) | 2019-07-22 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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DE112019002610B4 (de) | 2018-05-22 | 2023-03-16 | Watlow Electric Manufacturing Company | Verfahren zur herstellung eines heizgeräts |
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US11083050B2 (en) | 2017-11-21 | 2021-08-03 | Watlow Electric Manufacturing Company | Integrated heater and method of manufacture |
JP7202326B2 (ja) | 2020-03-11 | 2023-01-11 | 日本碍子株式会社 | セラミックヒータ |
US20210287929A1 (en) * | 2020-03-16 | 2021-09-16 | Applied Materials, Inc. | Heater uniformity in substrate supports |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001244320A (ja) * | 2000-02-25 | 2001-09-07 | Ibiden Co Ltd | セラミック基板およびその製造方法 |
JP2001313157A (ja) * | 2000-04-26 | 2001-11-09 | Sumitomo Osaka Cement Co Ltd | 加熱装置 |
JP2003300785A (ja) * | 2002-04-04 | 2003-10-21 | Ibiden Co Ltd | セラミック接合体およびセラミック接合体の製造方法 |
JP2005347559A (ja) * | 2004-06-03 | 2005-12-15 | Ngk Spark Plug Co Ltd | 静電チャック及びセラミック製の静電チャックの製造方法 |
JP2006196311A (ja) * | 2005-01-13 | 2006-07-27 | Toyota Central Res & Dev Lab Inc | 面状発熱体の給電端子構造 |
WO2017188189A1 (ja) * | 2016-04-28 | 2017-11-02 | 京セラ株式会社 | ヒータシステム、セラミックヒータ、プラズマ処理装置及び吸着装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001257200A (ja) * | 2000-03-13 | 2001-09-21 | Ibiden Co Ltd | 半導体製造・検査装置用セラミック基板 |
JP5341049B2 (ja) | 2010-10-29 | 2013-11-13 | 日本発條株式会社 | セラミックス焼結体の製造方法、セラミックス焼結体およびセラミックスヒータ |
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- 2017-12-28 JP JP2017253369A patent/JP6461300B1/ja active Active
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- 2018-12-25 US US16/497,698 patent/US11643368B2/en active Active
- 2018-12-25 WO PCT/JP2018/047523 patent/WO2019131611A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001244320A (ja) * | 2000-02-25 | 2001-09-07 | Ibiden Co Ltd | セラミック基板およびその製造方法 |
JP2001313157A (ja) * | 2000-04-26 | 2001-11-09 | Sumitomo Osaka Cement Co Ltd | 加熱装置 |
JP2003300785A (ja) * | 2002-04-04 | 2003-10-21 | Ibiden Co Ltd | セラミック接合体およびセラミック接合体の製造方法 |
JP2005347559A (ja) * | 2004-06-03 | 2005-12-15 | Ngk Spark Plug Co Ltd | 静電チャック及びセラミック製の静電チャックの製造方法 |
JP2006196311A (ja) * | 2005-01-13 | 2006-07-27 | Toyota Central Res & Dev Lab Inc | 面状発熱体の給電端子構造 |
WO2017188189A1 (ja) * | 2016-04-28 | 2017-11-02 | 京セラ株式会社 | ヒータシステム、セラミックヒータ、プラズマ処理装置及び吸着装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112019002610B4 (de) | 2018-05-22 | 2023-03-16 | Watlow Electric Manufacturing Company | Verfahren zur herstellung eines heizgeräts |
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US20210107836A1 (en) | 2021-04-15 |
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