JP6455420B2 - Electronic device and manufacturing method thereof - Google Patents

Electronic device and manufacturing method thereof Download PDF

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JP6455420B2
JP6455420B2 JP2015255248A JP2015255248A JP6455420B2 JP 6455420 B2 JP6455420 B2 JP 6455420B2 JP 2015255248 A JP2015255248 A JP 2015255248A JP 2015255248 A JP2015255248 A JP 2015255248A JP 6455420 B2 JP6455420 B2 JP 6455420B2
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sealing
electronic device
main body
jacket
insulating
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JP2017117762A (en
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慎弥 勝部
慎弥 勝部
泰治郎 藤原
泰治郎 藤原
中村　正樹
正樹 中村
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Omron Corp
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Priority to EP16200683.7A priority patent/EP3185250B1/en
Priority to US15/361,284 priority patent/US9735498B2/en
Priority to CN201611076218.0A priority patent/CN107039832B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/305—Polyamides or polyesteramides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
    • H01B3/421—Polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
    • H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H01B7/0208—Cables with several layers of insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
    • H01B7/2806—Protection against damage caused by corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
    • H01B7/282—Preventing penetration of fluid, e.g. water or humidity, into conductor or cable
    • H01B7/2825—Preventing penetration of fluid, e.g. water or humidity, into conductor or cable using a water impermeable sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5205—Sealing means between cable and housing, e.g. grommet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/622—Screw-ring or screw-casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/28—Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/005—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for making dustproof, splashproof, drip-proof, waterproof, or flameproof connection, coupling, or casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2105/00—Three poles

Description

本発明は、電子機器およびその製造方法に関し、より詳しくは、水溶性切削油に対する耐性の高い電子機器およびその製造方法に関する。   The present invention relates to an electronic device and a manufacturing method thereof, and more particularly to an electronic device having high resistance to water-soluble cutting oil and a manufacturing method thereof.

コネクタやセンサ等の産業機械用途の電子機器は、機械油等の液体に晒される環境で使用される。そのため、このような電子機器においては、電子機器としての機能を有する本体部内へ機械油等の液体が浸入してしまうことを防止する必要が有る。   Electronic devices for industrial machine applications such as connectors and sensors are used in environments exposed to liquids such as machine oil. Therefore, in such an electronic device, it is necessary to prevent liquid such as machine oil from entering the main body having a function as the electronic device.

例えば、特許文献１には、本体部と、本体部に電気信号を伝送するケーブルと、ケーブルを被覆するジャケットとを備える電子機器が開示されている。特許文献１に記載されている電子機器は、ジャケットとして、ポリブチレンテレフタラート（ＰＢＴ）樹脂に熱可塑性エラストマを添加した材料を用いることで、電子機器の屈曲性、耐油性、および機械油等の液体の浸入防止性を向上させている。   For example, Patent Document 1 discloses an electronic device that includes a main body, a cable that transmits an electrical signal to the main body, and a jacket that covers the cable. The electronic device described in Patent Document 1 uses a material obtained by adding a thermoplastic elastomer to polybutylene terephthalate (PBT) resin as a jacket, so that the flexibility, oil resistance, and machine oil of the electronic device can be reduced. Improves liquid penetration prevention.

特開２０１０−２７７７４８号公報（２０１０年１２月９日公開）JP 2010-277748 A (released on December 9, 2010)

しかしながら、特許文献１に記載されている電子機器は、ジャケット自体、あるいはケーブルとジャケットとの界面から浸入する液体に対する浸入防止性は高いものの、ケーブル自体から浸入する液体については考慮されていないという問題がある。   However, the electronic device described in Patent Document 1 has a high anti-penetration property against the liquid entering from the jacket itself or the interface between the cable and the jacket, but the liquid entering from the cable itself is not considered. There is.

具体的には、特許文献１に記載されているケーブルの外被部は、ポリ塩化ビニル樹脂あるいはポリウレタン樹脂で構成されている。このような樹脂は安価であるが、機械油の一種である水溶性切削油に対する耐性が高くない。そのため、使用時に、ケーブルの外被部が劣化することで、ケーブル自体から水溶性切削油が浸入することがある。ここで、特許文献１に記載されている電子機器では、ケーブルの中に設けられたリード線と、ジャケットとの密着性については考慮されていない。そのため、ケーブルの外被部から浸入した水溶性切削油は、ケーブルの中に設けられたリード線を伝って本体部まで浸入してしまい、電子機器の接点の絶縁抵抗の低下や、接触不良等が発生してしまう虞がある。   Specifically, the jacket portion of the cable described in Patent Document 1 is made of polyvinyl chloride resin or polyurethane resin. Such a resin is inexpensive, but does not have high resistance to water-soluble cutting oil which is a kind of machine oil. Therefore, during use, water-soluble cutting oil may infiltrate from the cable itself due to deterioration of the jacket portion of the cable. Here, in the electronic device described in Patent Document 1, the adhesion between the lead wire provided in the cable and the jacket is not considered. For this reason, water-soluble cutting oil that has entered from the outer sheath of the cable enters the main body through the lead wire provided in the cable, resulting in a decrease in the insulation resistance of the contacts of electronic devices, poor contact, etc. May occur.

本発明は、前記の問題点に鑑みてなされたものであり、その目的は、水溶性切削油に対する耐性の高い電子機器およびその製造方法を提供することにある。   This invention is made | formed in view of the said problem, The objective is to provide the electronic device with high tolerance with respect to water-soluble cutting oil, and its manufacturing method.

上記の課題を解決するために、本発明に係る電子機器は、電子機器としての機能を有する本体部と、先端部が前記本体部内に配置され、前記本体部に接続しているケーブルとを有する電子機器であって、前記ケーブルは、リード線と、前記リード線を被覆する絶縁部と、前記絶縁部を被覆する外被部とを有し、前記絶縁部は、前記外被部の前記先端部側の端面から前記先端部側に突出するとともに、前記外被部よりも水溶性切削油に耐性の高い材料で形成されており、前記電子機器は、前記端面から突出している前記絶縁部を封止する第１封止部と、前記第１封止部を封止し、前記本体部および前記外被部に接触する第２封止部とを有し、前記第１封止部は、前記絶縁部に対して前記第２封止部よりも密着性の高い材料で形成されていることを特徴とする。   In order to solve the above-described problems, an electronic device according to the present invention includes a main body having a function as an electronic device, and a cable having a distal end disposed in the main body and connected to the main body. In the electronic device, the cable includes a lead wire, an insulating portion that covers the lead wire, and a jacket portion that covers the insulating portion, and the insulating portion is the tip of the jacket portion. The insulating part protrudes from the end face, and protrudes from the end face on the part side to the tip end side, and is formed of a material that is more resistant to water-soluble cutting oil than the jacket part. A first sealing portion to be sealed; and a second sealing portion that seals the first sealing portion and contacts the main body portion and the outer cover portion, and the first sealing portion includes: It is made of a material having higher adhesion to the insulating part than the second sealing part. And features.

上記の構成によれば、リード線が、外被部よりも水溶性切削油に耐性の高い材料である絶縁部により被覆されているため、外被部が劣化し、水溶性切削油が外被部から浸入したとしても、リード線と水溶性切削油とが接触してしまうことを防止することができる。また、絶縁部に対して第２封止部よりも密着性の高い材料である第１封止部により、外被部の端面から突出している絶縁部が封止されていることにより、水溶性切削油が外被部と絶縁部との間の界面を伝って本体部内へ浸入してしまうことも防止することができる。さらに、第２封止部により、第１封止部が封止されていることにより、第１封止部と外被部との界面からの水溶性切削油の浸入も防止することができる。これにより、水溶性切削油に対する耐性の高い電子機器を提供することが可能となる。なお、リード線は、少なくとも導体からなる導線を含んでいればよく、導線と絶縁部との間に被覆部を有していてもよい。   According to the above configuration, since the lead wire is covered with the insulating portion, which is a material more resistant to water-soluble cutting oil than the jacket portion, the jacket portion is deteriorated and the water-soluble cutting oil is not covered by the jacket. Even if it enters from the part, it is possible to prevent the lead wire and the water-soluble cutting oil from coming into contact with each other. In addition, the insulating portion protruding from the end surface of the jacket portion is sealed with the first sealing portion, which is a material having higher adhesion than the second sealing portion, with respect to the insulating portion. It is also possible to prevent the cutting oil from entering the main body portion along the interface between the jacket portion and the insulating portion. Furthermore, since the first sealing portion is sealed by the second sealing portion, it is possible to prevent water-soluble cutting oil from entering from the interface between the first sealing portion and the jacket portion. Thereby, it becomes possible to provide an electronic device with high resistance to water-soluble cutting oil. In addition, the lead wire should just contain the conducting wire which consists of a conductor at least, and may have a coating | coated part between the conducting wire and the insulation part.

また、本発明に係る電子機器において、前記第１封止部は、前記外被部の前記端面を封止していてもよい。   Moreover, the electronic device which concerns on this invention WHEREIN: The said 1st sealing part may seal the said end surface of the said jacket part.

上記の構成によれば、第１封止部が、外被部の先端部側の端面を封止していることにより、第１封止部は、当該端面における外被部と絶縁部との界面を封止することとなる。そのため、より水溶性切削油に対する耐性の高い電子機器を提供することが可能となる。   According to said structure, the 1st sealing part seals the end surface by the side of the front-end | tip part of a jacket part, Therefore A 1st sealing part is a cover part in the said end surface, and an insulation part. The interface will be sealed. Therefore, it becomes possible to provide an electronic device with higher resistance to water-soluble cutting oil.

また、本発明に係る電子機器において、前記第１封止部は、前記リード線の前記先端部側の端部を封止していてもよい。   Moreover, the electronic device which concerns on this invention WHEREIN: The said 1st sealing part may seal the edge part by the side of the said front-end | tip part of the said lead wire.

上記の構成によれば、リード線の先端部側の端部が封止されていることにより、本体部内に水溶性切削油が浸入したとしても、リード線や端子と水溶性切削油が接触を防止することができる。そのため、水溶性切削油に対する耐性の高い電子機器を提供することが可能となる。   According to the above configuration, since the end of the lead wire on the tip side is sealed, even if water-soluble cutting oil enters the main body, the lead wire or terminal and the water-soluble cutting oil are in contact with each other. Can be prevented. Therefore, it is possible to provide an electronic device having high resistance to water-soluble cutting oil.

また、本発明に係る電子機器において、前記第２封止部は、前記外被部に対して前記第１封止部よりも密着性の高い材料で形成されていてもよい。   Moreover, the electronic device which concerns on this invention WHEREIN: The said 2nd sealing part may be formed with the material whose adhesiveness is higher than the said 1st sealing part with respect to the said jacket part.

上記の構成によれば、第２封止部が第１封止部よりも外被部に対して密着性の高い材料で形成されていることにより、外被部と第２封止部との界面の密着性が向上し、第２封止部と外被部との界面からの水溶性切削油の浸入を防止することができる。   According to said structure, since the 2nd sealing part is formed with the material whose adhesiveness is higher with respect to a jacket part than a 1st sealing part, between a jacket part and a 2nd sealing part The adhesiveness of the interface is improved, and the infiltration of water-soluble cutting oil from the interface between the second sealing portion and the jacket portion can be prevented.

また、本発明に係る電子機器において、前記絶縁部を構成する材料は、フッ素系樹脂であり、前記第１封止部を構成する材料はポリアミド系樹脂であってもよい。   In the electronic device according to the present invention, the material constituting the insulating portion may be a fluorine-based resin, and the material constituting the first sealing portion may be a polyamide-based resin.

上記の構成によれば、絶縁部を構成する材料を水溶性切削油に対する耐性の高いフッ素樹脂とし、第１封止部をフッ素樹脂に対して密着性の高いポリアミド樹脂とすることで、水溶性切削油に対する耐性の高い電子機器を提供することが可能となる。   According to said structure, the material which comprises an insulation part is made into a fluororesin with high tolerance with respect to water-soluble cutting oil, and a 1st sealing part is made into a polyamide resin with high adhesiveness with respect to a fluororesin, thereby being water-soluble. It is possible to provide an electronic device having high resistance to cutting oil.

また、本発明に係る電子機器において、前記外被部を構成する材料は、ポリ塩化ビニル樹脂であり、前記第２封止部を構成する材料は、ポリブチレンテレフタラート樹脂であってもよい。   In the electronic device according to the present invention, the material forming the outer cover portion may be a polyvinyl chloride resin, and the material forming the second sealing portion may be a polybutylene terephthalate resin.

上記の構成によれば、外被部としては安価な材料であるポリ塩化ビニル樹脂を用い、第２封止部としてポリ塩化ビニル樹脂に対して密着性がよく、また水溶性切削油に対して耐性の高いポリブチレンテレフタラート樹脂を用いることで、水溶性切削油に対して耐性の高い電子機器を安価に提供することが可能となる。   According to the above configuration, a polyvinyl chloride resin, which is an inexpensive material, is used as the outer cover portion, and the second sealing portion has good adhesion to the polyvinyl chloride resin, and is also resistant to water-soluble cutting oil. By using a polybutylene terephthalate resin having high resistance, it is possible to provide an electronic device having high resistance to water-soluble cutting oil at a low cost.

また、本発明に係る電子機器の製造方法は、電子機器としての機能を有する本体部と、先端部が前記本体部内に配置され前記本体部に接続しているケーブルとを有する電子機器の製造方法であって、前記本体部内に、リード線と、前記リード線を被覆する絶縁部と、前記絶縁部を被覆する外被部とを有する前記ケーブルの先端部を配置する工程と、前記外被部の前記先端部側の端面から前記先端部側に突出している絶縁部を封止する第１封止部を形成する工程と、前記第１封止部を封止し、かつ、前記本体部および前記外被部に接触する第２封止部を形成する工程とを含み、前記絶縁部は、前記外被部よりも水溶性切削油に耐性の高い材料で形成されており、前記第１封止部は、前記絶縁部に対して第２封止部よりも密着性の高い材料で形成されている。   In addition, an electronic device manufacturing method according to the present invention includes a main body having a function as an electronic device, and a cable having a distal end portion disposed in the main body and connected to the main body. A step of disposing a leading end portion of the cable having a lead wire, an insulating portion covering the lead wire, and a covering portion covering the insulating portion in the main body, and the covering portion Forming a first sealing portion that seals the insulating portion protruding from the end surface on the tip portion side toward the tip portion side, sealing the first sealing portion, and the main body portion and Forming a second sealing portion in contact with the jacket portion, wherein the insulating portion is made of a material that is more resistant to water-soluble cutting oil than the jacket portion, and the first seal The stop part is formed of a material having higher adhesion than the second sealing part with respect to the insulating part. It has been.

上記の構成によれば、水溶性切削油に対する耐性の高い電子機器の製造方法を提供することができる。   According to said structure, the manufacturing method of an electronic device with high tolerance with respect to water-soluble cutting oil can be provided.

本発明によれば、水溶性切削油に対する耐性の高い電子機器およびその製造方法を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the electronic device with high tolerance with respect to water-soluble cutting oil, and its manufacturing method can be provided.

（ａ）および（ｂ）は本発明の一実施形態に電子機器の外観を示す平面図である。(A) And (b) is a top view which shows the external appearance of an electronic device in one Embodiment of this invention. 図１の（ａ）におけるＡ−Ａ線矢視断面図である。It is AA arrow sectional drawing in (a) of FIG. 図１の（ａ）におけるＢ−Ｂ線矢視断面図である。It is BB arrow sectional drawing in (a) of FIG. （ａ）および（ｂ）は、図１に示す電子機器の製造方法における一工程を示す図である。(A) And (b) is a figure which shows one process in the manufacturing method of the electronic device shown in FIG. （ａ）および（ｂ）は、図１に示す電子機器の製造方法における組み付け工程を示す図である。(A) And (b) is a figure which shows the assembly | attachment process in the manufacturing method of the electronic device shown in FIG. （ａ）および（ｂ）は、図１に示す電子機器の製造方法における第１封止工程を示す図である。(A) And (b) is a figure which shows the 1st sealing process in the manufacturing method of the electronic device shown in FIG. （ａ）および（ｂ）は、図１に示す電子機器の製造方法における第２封止工程を示す図である。(A) And (b) is a figure which shows the 2nd sealing process in the manufacturing method of the electronic device shown in FIG.

以下、本発明の実施の形態について、図面を参照し詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

〔電子機器の構成〕
図１は、本発明の一実施形態に係る電子機器１００の外観を示す平面図であり、（ａ）は正面図を、（ｂ）は側面図を示している。また、図２は、図１の（ａ）におけるＡ−Ａ線矢視断面図であり、図３は、図１の（ａ）におけるＢ−Ｂ線矢視断面図である。 [Configuration of electronic equipment]
FIG. 1 is a plan view showing an external appearance of an electronic apparatus 100 according to an embodiment of the present invention, where (a) shows a front view and (b) shows a side view. 2 is a cross-sectional view taken along line AA in FIG. 1A, and FIG. 3 is a cross-sectional view taken along line BB in FIG.

図１〜３に示すように、電子機器１００は、電子機器１００としての機能を有する本体部１と、先端部１０ａが本体部１内に配置され、本体部１と電気的に接続しているケーブル１０と、第１封止部２０と、第２封止部２１とを有する。   As shown in FIGS. 1 to 3, in the electronic device 100, a main body 1 having a function as the electronic device 100 and a tip portion 10 a are arranged in the main body 1 and are electrically connected to the main body 1. The cable 10, the first sealing portion 20, and the second sealing portion 21 are included.

本体部１とは、その部分が無ければ電子機器１００としての機能を果たし得なくなる部分をいう。例えば電子機器１００がコネクタである場合には、本体部１は、接続端子を内蔵している部分であり、電子機器１００がセンサである場合には、基板等が実装されている部分を指す。ここで、コネクタやセンサ等の電子機器１００は、例えば自動車工場等、高温多湿の環境下で、ワックス、水溶性切削油等の工作機械油、および洗浄液等の液体に長時間晒されるという過酷な状況下で使用される。そのため、本体部１の機能を十分に発揮させるためには、本体部１内への液体の浸入を防止する必要が有る。   The main body 1 refers to a part that cannot function as the electronic device 100 without the part. For example, when the electronic device 100 is a connector, the main body 1 is a portion having a built-in connection terminal, and when the electronic device 100 is a sensor, it indicates a portion on which a substrate or the like is mounted. Here, the electronic device 100 such as a connector or a sensor is severely exposed to liquids such as wax, machine tool oil such as water-soluble cutting oil, and cleaning liquid for a long time in a hot and humid environment such as an automobile factory. Used in circumstances. Therefore, in order to fully exhibit the function of the main body 1, it is necessary to prevent the liquid from entering the main body 1.

ケーブル１０は、銅等の導体からなるリード線１３と、リード線１３を被覆する絶縁部１２と、絶縁部１２で被覆された複数のリード線１３を被覆している外被部１１と、リード線１３と電気的に接続する端子１４とを有する。また、図２に示すように、ケーブル１０の絶縁部１２は、外被部１１の先端部１０ａ側の端面１１ａから、先端部１０ａ側に突出している。なお、本実施形態では、ケーブル１０が複数のリード線１３を有している多芯ケーブルを示すが、ケーブル１０は、リード線１３が１本設けられた単芯ケーブルであってもよい。さらに、本実施形態では、ケーブル１０が、先端部１０ａにリード線１３と電気的に接続する端子１４を備えている構成について説明するが、本体部１が端子１４を備えている構成であってもよい。また、本実施形態では、リード線１３が導体からなる例について説明するが、リード線１３は、少なくとも導体からなる導線を含んでいればよい。すなわち、リード線１３は、導線と絶縁部１２との間に、導線を被覆する被覆層を備えていてもよい。   The cable 10 includes a lead wire 13 made of a conductor such as copper, an insulating portion 12 that covers the lead wire 13, a jacket portion 11 that covers a plurality of lead wires 13 covered with the insulating portion 12, and leads And a terminal 14 electrically connected to the line 13. As shown in FIG. 2, the insulating portion 12 of the cable 10 protrudes from the end surface 11 a on the distal end portion 10 a side of the jacket portion 11 toward the distal end portion 10 a side. In the present embodiment, the cable 10 is a multi-core cable having a plurality of lead wires 13, but the cable 10 may be a single-core cable provided with one lead wire 13. Furthermore, in this embodiment, although the cable 10 demonstrates the structure provided with the terminal 14 electrically connected with the lead wire 13 in the front-end | tip part 10a, it is the structure by which the main-body part 1 is equipped with the terminal 14. Also good. Moreover, although this embodiment demonstrates the example in which the lead wire 13 consists of a conductor, the lead wire 13 should just contain the conducting wire which consists of a conductor at least. That is, the lead wire 13 may include a coating layer that covers the conductive wire between the conductive wire and the insulating portion 12.

ケーブル１０の外被部１１を構成する材料としては、特に限定されるものでは無く、従来公知の物を用いることができる。例えば、ポリエチレン樹脂、ポリ塩化ビニル樹脂、ポリエステル樹脂、ポリアミド樹脂、ＰＥエラストマ樹脂、ＰＶＣエラストマ樹脂、ポリウレタン樹脂等の熱可塑性樹脂であればよい。中でも、特に安価であるポリ塩化ビニル樹脂であることが好ましい。   It does not specifically limit as a material which comprises the jacket part 11 of the cable 10, A conventionally well-known thing can be used. For example, any thermoplastic resin such as polyethylene resin, polyvinyl chloride resin, polyester resin, polyamide resin, PE elastomer resin, PVC elastomer resin, and polyurethane resin may be used. Among these, a polyvinyl chloride resin that is particularly inexpensive is preferable.

絶縁部１２は、ケーブル１０の外被部１１よりも水溶性切削油に耐性のある材料で構成されている。絶縁部１２を構成する材料としては、例えば、エチレン・四フッ化エチレン共重合体（ＦＴＦＥ）、フッ化ビニリデン・テトラフルオロエチレン・ヘキサフルオロエチレン共重合体（ＴＨＶ）、ポリテトラフルオロエチレン（ＰＴＦＥ）、ペルフルオロアルコキシフッ素樹脂（ＰＦＡ）、ビニリデンフルオライド（ＰＶＤＦ）、テトラフルオロエチレン（ＴＦＥ）、およびヘキサフルオロプロピレン（ＨＦＰ）等のフッ素系樹脂であることが好ましい。なお、水溶性切削油への耐性の評価方法の詳細は後述する。   The insulating portion 12 is made of a material that is more resistant to water-soluble cutting oil than the jacket portion 11 of the cable 10. Examples of the material constituting the insulating portion 12 include ethylene / tetrafluoroethylene copolymer (FTFE), vinylidene fluoride / tetrafluoroethylene / hexafluoroethylene copolymer (THV), and polytetrafluoroethylene (PTFE). Fluorine resins such as perfluoroalkoxy fluororesin (PFA), vinylidene fluoride (PVDF), tetrafluoroethylene (TFE), and hexafluoropropylene (HFP) are preferable. In addition, the detail of the evaluation method of the tolerance to water-soluble cutting oil is mentioned later.

ここで、上述したように電子機器１００には、水溶性切削油に代表される液体の浸入を防止することが求められる。液体の浸入経路の１つとしては、液体によって外被部１１が劣化してしまう、あるいは応力集中によって外被部１１に割れが発生してしまうといったように、外被部１１自体からケーブル１０の内部に液体が浸入する経路が考えられる。しかしながら、本実施形態に係る絶縁部１２は、外被部１１よりも水溶性切削油に耐性のある材料で構成されている。そのため、外被部１１自体から液体がケーブル１０の内部に浸入したとしても、絶縁部１２より内側に入り込むことは無く、リード線１３や端子１４を保護することができる。   Here, as described above, the electronic device 100 is required to prevent infiltration of a liquid typified by water-soluble cutting oil. As one of the liquid intrusion paths, the jacket portion 11 itself is deteriorated by the liquid, or cracks are generated in the jacket portion 11 due to stress concentration. A route through which the liquid enters can be considered. However, the insulating portion 12 according to the present embodiment is made of a material that is more resistant to water-soluble cutting oil than the jacket portion 11. Therefore, even if liquid enters the inside of the cable 10 from the jacket portion 11 itself, the lead wire 13 and the terminal 14 can be protected without entering the inside of the insulating portion 12.

また、水溶性切削油に対して耐性の高い材料を、外被部１１ではなく絶縁部１２に用いることで、水溶性切削油に対して耐性の高い材料の使用量を低減でき、電子機器１００のコストを低減することが可能となる。   Further, by using a material highly resistant to water-soluble cutting oil for the insulating portion 12 instead of the jacket portion 11, the amount of the material highly resistant to water-soluble cutting oil can be reduced. The cost can be reduced.

第１封止部２０は、インサート成形により形成され、液体が本体部１に浸入することを防止するために、絶縁部１２を被覆して保護するためのものである。第１封止部２０を構成する材料としては、絶縁部１２に対する密着性が、第２封止部２１よりも高いものが用いられる。具体的には、第１封止部２０は、ナイロン６（ＰＡ６）、ナイロン１１（ＰＡ１１）、ナイロン１２（ＰＡ１２）、ナイロン４６（ＰＡ４６）、ナイロン６６（ＰＡ６６）、ナイロン６１０（Ｐ６１０）、ナイロン１０１０（ＰＡ１０１０）等のポリアミド系樹脂であることが好ましい。なお、密着性の評価方法の詳細は後述する。   The first sealing portion 20 is formed by insert molding, and covers and protects the insulating portion 12 in order to prevent liquid from entering the main body portion 1. As a material constituting the first sealing portion 20, a material having higher adhesion to the insulating portion 12 than that of the second sealing portion 21 is used. Specifically, the first sealing portion 20 includes nylon 6 (PA6), nylon 11 (PA11), nylon 12 (PA12), nylon 46 (PA46), nylon 66 (PA66), nylon 610 (P610), nylon A polyamide-based resin such as 1010 (PA1010) is preferable. The details of the adhesion evaluation method will be described later.

図２に示すように、第１封止部２０は、外被部１１の先端部１０ａ側の端面１１ａ、該端面１１ａから突出している絶縁部１２、および本体部１の一部を封止している。ここで、第１封止部２０は、絶縁部１２との密着性が高い材料で形成されている。そのため、水溶性切削油等の液体により外被部１１が劣化し、外被部１１を通って外被部１１と絶縁部１２との界面に液体が浸入したとしても、絶縁部１２との密着性が高い第１封止部２０によって外被部１１の先端部１０ａ側の端面１１ａ、および該端面１１ａから突出している絶縁部１２が封止されていることにより、端面１１ａよりも先端部１０ａ側への液体の浸入を十分に防止することができ、本体部１内へ液体が浸入することを防止することができる。なお、本実施形態では、第１封止部２０が、外被部１１の先端部１０ａ側の端面１１ａ、該端面１１ａから突出している絶縁部１２、および本体部１の一部を封止している例について述べたが、第１封止部２０は、少なくとも端面１１ａから突出している絶縁部１２を封止していればよい。   As shown in FIG. 2, the first sealing portion 20 seals the end surface 11 a on the distal end portion 10 a side of the outer cover portion 11, the insulating portion 12 protruding from the end surface 11 a, and a part of the main body portion 1. ing. Here, the first sealing portion 20 is formed of a material having high adhesion with the insulating portion 12. Therefore, even if the jacket portion 11 is deteriorated by a liquid such as water-soluble cutting oil, and the liquid enters the interface between the jacket portion 11 and the insulating portion 12 through the jacket portion 11, it is in close contact with the insulating portion 12. Since the end surface 11a on the side of the front end portion 10a of the outer cover portion 11 and the insulating portion 12 protruding from the end surface 11a are sealed by the first sealing portion 20 having high performance, the front end portion 10a is more than the end surface 11a. The liquid can be sufficiently prevented from entering the side, and the liquid can be prevented from entering the main body 1. In the present embodiment, the first sealing portion 20 seals the end surface 11a on the distal end portion 10a side of the jacket portion 11, the insulating portion 12 protruding from the end surface 11a, and a part of the main body portion 1. However, the first sealing portion 20 only needs to seal at least the insulating portion 12 protruding from the end surface 11a.

また、第１封止部２０がインサート成形により形成されていることにより、本体部１内に配置されているケーブル１０の先端部１０ａの絶縁部１２と本体部１との隙間にも第１封止部２０が入り込んでいる。そのため、先端部１０ａ側のリード線１３の端部も第１封止部２０により封止されている。これにより、本体部１内に液体が浸入したとしても、リード線１３や端子１４と液体とが接触することで起こる、絶縁抵抗の低下や、接触不良の発生等を防止することができる。   Further, since the first sealing portion 20 is formed by insert molding, the first sealing portion 20 is also sealed in the gap between the insulating portion 12 and the main body portion 1 of the distal end portion 10a of the cable 10 disposed in the main body portion 1. The stop part 20 has entered. Therefore, the end portion of the lead wire 13 on the distal end portion 10 a side is also sealed with the first sealing portion 20. As a result, even if the liquid enters the main body 1, it is possible to prevent a decrease in insulation resistance, occurrence of poor contact, and the like that occur when the lead wire 13 or the terminal 14 contacts the liquid.

なお、絶縁部１２の外表面に対して、加熱処理、コロナ放電、プラズマ加工、化学処理、機械処理等の従来知られている表面処理を行い、絶縁部１２と第１封止部２０との密着性をさらに向上させてもよい。   In addition, conventionally known surface treatments such as heat treatment, corona discharge, plasma processing, chemical treatment, and mechanical treatment are performed on the outer surface of the insulating portion 12, and the insulating portion 12 and the first sealing portion 20 are connected. The adhesion may be further improved.

第２封止部２１は、インサート成形により形成され、液体が本体部１内に浸入することを防止するために、第１封止部２０および外被部１１を被覆して保護するためのものである。具体的には、第２封止部２１は、第１封止部２０を封止し、本体部１および外被部１１と接触している。第２封止部２１を構成する材料としては、第１封止部２０および外被部１１と密着性の高い材料であることが好ましく、第１封止部２０よりも外被部１１に対して密着性の高い材料であることがより好ましい。また、第２封止部２１を構成する材料は、水溶性切削油に対して耐性の高い材料であることが好ましい。第２封止部２１を構成する材料としては、例えば、ポリブチレンテレフタラート（ＰＢＴ）樹脂を用いることができる。このように、第１封止部２０と外被部１１との両方に対して密着性の高い第２封止部２１で第１封止部２０を封止することにより、第１封止部２０と外被部１１との界面、および第２封止部２１と外被部１１との界面から水溶性切削油等の液体が浸入することを防止することができる。また、第２封止部２１が、本体部１と接触しているため、第１封止部２０と本体部１との界面から水溶性切削油等の液体が浸入することも防止することができる。   The second sealing portion 21 is formed by insert molding, and covers and protects the first sealing portion 20 and the jacket portion 11 in order to prevent liquid from entering the main body portion 1. It is. Specifically, the second sealing portion 21 seals the first sealing portion 20 and is in contact with the main body portion 1 and the jacket portion 11. The material constituting the second sealing portion 21 is preferably a material having high adhesion to the first sealing portion 20 and the jacket portion 11. It is more preferable that the material has high adhesion. Moreover, it is preferable that the material which comprises the 2nd sealing part 21 is a material with high tolerance with respect to water-soluble cutting oil. As a material constituting the second sealing portion 21, for example, polybutylene terephthalate (PBT) resin can be used. Thus, by sealing the 1st sealing part 20 with the 2nd sealing part 21 with high adhesiveness with respect to both the 1st sealing part 20 and the jacket part 11, the 1st sealing part It is possible to prevent a liquid such as a water-soluble cutting oil from entering from the interface between 20 and the jacket portion 11 and the interface between the second sealing portion 21 and the jacket portion 11. Moreover, since the 2nd sealing part 21 is contacting the main-body part 1, it can also prevent that liquids, such as water-soluble cutting oil, permeate from the interface of the 1st sealing part 20 and the main-body part 1. it can.

〔水溶性切削油に対する耐性の評価方法〕
次に、水溶性切削油に対する耐性の評価方法について説明する。 [Method for evaluating resistance to water-soluble cutting oil]
Next, a method for evaluating resistance to water-soluble cutting oil will be described.

まず、水溶性切削油を所定の濃度となるように水道水で希釈し（例えば、２０倍に希釈）、規定温度（例えば５０℃）に加熱し、恒温槽で保持する。そして、評価対象となる材料を所定時間（例えば２４０時間）恒温槽内に浸漬する。なお、浸漬状態では、評価対象となる材料の全体が水溶性切削油に浸漬しているように保持する。   First, the water-soluble cutting oil is diluted with tap water to a predetermined concentration (for example, diluted 20 times), heated to a specified temperature (for example, 50 ° C.), and held in a thermostatic bath. And the material used as evaluation object is immersed in a thermostat for predetermined time (for example, 240 hours). In the immersion state, the entire material to be evaluated is held so as to be immersed in the water-soluble cutting oil.

そして、浸漬後の材料に対して、クラックや破損等の損傷の有無、および反り等の変形の有無といった外観の検査、ならびに絶縁抵抗性等の製品特性を充足しているか否かの検査を行う。そして検査結果を用いて、水溶性切削油に対する耐性を評価する。   Then, the material after immersion is inspected for appearance such as presence or absence of cracks or breakage and deformation such as warpage, and whether or not product characteristics such as insulation resistance are satisfied. . And the tolerance with respect to water-soluble cutting oil is evaluated using a test result.

評価方法の一例としては、浸漬前後の材料の引張強度を測定し、浸漬前後での引張強度の変化率を表す引張強度変化率を用いて評価することが考えられる。すなわち、浸漬前後で引張強度変化率が小さいものを水溶性切削油に対する耐性が高い材料であると評価することができる。なお、絶縁部１２として用いる材料は、引張強度変化率が２０％未満であることが好ましい。   As an example of the evaluation method, it is conceivable to measure the tensile strength of the material before and after the immersion and to evaluate using the tensile strength change rate representing the change rate of the tensile strength before and after the immersion. That is, it can be evaluated that a material having a small tensile strength change rate before and after immersion is a material having high resistance to water-soluble cutting oil. In addition, it is preferable that the material used as the insulating part 12 has a tensile strength change rate of less than 20%.

〔密着性の評価方法〕
次に、密着性の評価方法について説明する。 [Adhesion evaluation method]
Next, the adhesion evaluation method will be described.

まず、絶縁部１２として用いられる材料を短冊状に成形し、成形した材料を金型内に設置する。そして、第１封止部２０として用いられる材料をインサート成形し、絶縁部１２として用いられる材料と、第１封止部２０として用いられる材料とが接合した試験片を得る。このようにして得た試験片を用いて、引張試験機により試験片の両端を引っ張ることで引張強度を測定する。同様に、絶縁部１２として用いられる材料と、外被部１１として用いられる材料についても試験片を作成し、引張試験を行い、引張強度を測定する。そして、測定した引張強度を比較し、引張強度が大きいものが、絶縁部１２に対して密着性の高い材料であると評価することができる。   First, a material used as the insulating portion 12 is formed into a strip shape, and the formed material is placed in a mold. And the material used as the 1st sealing part 20 is insert-molded, and the test piece which the material used as the insulating part 12 and the material used as the 1st sealing part 20 joined is obtained. Using the test piece thus obtained, the tensile strength is measured by pulling both ends of the test piece with a tensile tester. Similarly, a test piece is created for the material used as the insulating portion 12 and the material used as the jacket portion 11, a tensile test is performed, and the tensile strength is measured. Then, the measured tensile strength is compared, and it can be evaluated that a material having a high tensile strength is a material having high adhesion to the insulating portion 12.

なお、密着性の評価方法はこれに限られるものでは無く、例えば、溶解度パラメータ（ＳＰ値）を用い、近い値の溶解度パラメータを有する材料同士を密着性の高い材料であると評価してもよい。   Note that the method for evaluating adhesion is not limited to this, and for example, a solubility parameter (SP value) may be used to evaluate materials having close solubility parameters as materials having high adhesion. .

〔電子機器の製造方法〕
次に、図４〜７を参照し、電子機器１００の製造方法について説明する。 [Method of manufacturing electronic equipment]
Next, a method for manufacturing the electronic device 100 will be described with reference to FIGS.

図４〜７は、電子機器１００の製造方法における各工程を示す図である。それぞれの図面において、（ａ）では平面図を示し、（ｂ）は（ａ）における矢視断面図を示している。   4-7 is a figure which shows each process in the manufacturing method of the electronic device 100. FIG. In each drawing, (a) shows a plan view, and (b) shows an arrow cross-sectional view in (a).

（組み付け工程）
まず、図４に示すような、本体部１とケーブル１０とを用いて、図５に示すようにケーブル１０の先端部１０ａを本体部１内に組み付ける。ここで、図５に示すように、ケーブル１０は、絶縁部１２が外被部１１の先端部１０ａ側の端面１１ａから突出するように設けられており、そのため、図５に示すような、ケーブル１０の先端部１０ａを本体部１内に組み付けた状態では、絶縁部１２の少なくとも一部が露出している。 (Assembly process)
First, using the main body 1 and the cable 10 as shown in FIG. 4, the tip 10 a of the cable 10 is assembled into the main body 1 as shown in FIG. 5. Here, as shown in FIG. 5, the cable 10 is provided so that the insulating portion 12 protrudes from the end surface 11 a on the distal end portion 10 a side of the jacket portion 11. In a state in which the ten distal end portions 10 a are assembled in the main body portion 1, at least a part of the insulating portion 12 is exposed.

（第１封止工程）
次に、図６に示すように、露出している絶縁部１２を封止するために第１封止部２０をインサート成形により成形する。具体的には、金型内に、本体部１を組み付けたケーブル１０を設置し、第１封止部２０の材料を金型内に注入し、第１封止部２０を成形する。このとき、第１封止部２０により、外被部１１の端面１１ａ、および外被部１１の端面１１ａから突出している絶縁部１２が封止される。また、第１封止部２０はインサート成形により形成されるため、本体部１とケーブル１０の先端部１０ａとの間に形成された間隙にも第１封止部２０が入り込み、先端部１０ａ側のリード線１３の端部も第１封止部２０により封止される。これにより、ケーブル１０と本体部１との接続を強固なものとするとともに、当該間隙からの液体の浸入を防止することができる。 (First sealing step)
Next, as shown in FIG. 6, in order to seal the exposed insulating part 12, the 1st sealing part 20 is shape | molded by insert molding. Specifically, the cable 10 assembled with the main body 1 is installed in the mold, the material of the first sealing part 20 is injected into the mold, and the first sealing part 20 is molded. At this time, the first sealing portion 20 seals the end surface 11 a of the jacket portion 11 and the insulating portion 12 protruding from the end surface 11 a of the jacket portion 11. In addition, since the first sealing portion 20 is formed by insert molding, the first sealing portion 20 also enters the gap formed between the main body portion 1 and the tip portion 10a of the cable 10, and the tip portion 10a side The end portions of the lead wires 13 are also sealed by the first sealing portion 20. Thereby, the connection between the cable 10 and the main body 1 can be strengthened, and the intrusion of liquid from the gap can be prevented.

（第２封止工程）
次に、図７に示すように、露出している第１封止部２０を封止するために第２封止部２１をインサート成形により成形する。具体的には、金型内に、図５に示す第１封止部２０が形成された本体部１およびケーブル１０を設置し、第２封止部２１の材料を金型内に注入し、第２封止部２１を形成する。このとき、第２封止部２１は、第１封止部２０を封止するとともに、本体部１およびケーブル１０の外被部１１に接触するように形成される。 (Second sealing step)
Next, as shown in FIG. 7, in order to seal the exposed first sealing portion 20, the second sealing portion 21 is formed by insert molding. Specifically, the main body 1 and the cable 10 in which the first sealing portion 20 shown in FIG. 5 is formed are installed in the mold, and the material of the second sealing portion 21 is injected into the mold. The second sealing portion 21 is formed. At this time, the second sealing portion 21 is formed to seal the first sealing portion 20 and to be in contact with the main body portion 1 and the jacket portion 11 of the cable 10.

本発明は上述した各実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、異なる実施形態にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本発明の技術的範囲に含まれる。   The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

１ 本体部
１０ ケーブル
１０ａ 先端部
１１ 外被部
１１ａ 端面
１２ 絶縁部
１３ リード線
２０ 第１封止部
２１ 第２封止部
１００ 電子機器 DESCRIPTION OF SYMBOLS 1 Main-body part 10 Cable 10a Tip part 11 Outer part 11a End surface 12 Insulation part 13 Lead wire 20 1st sealing part 21 2nd sealing part 100 Electronic device

Claims (7)

電子機器としての機能を有する本体部と、先端部が前記本体部内に配置され、前記本体部に接続しているケーブルとを有する電子機器において、
前記ケーブルは、リード線と、前記リード線を被覆する絶縁部と、前記絶縁部を被覆する外被部とを有し、
前記絶縁部は、前記外被部の前記先端部側の端面から前記先端部側に突出するとともに、前記外被部よりも水溶性切削油に耐性の高い材料で形成されており、かつ水溶性切削油に対する耐性試験として、５０℃に加熱した２０倍希釈の水溶性切削油に２４０時間浸漬したときの耐性試験前後の引張強度変化率が２０％未満であり、
前記電子機器は、
前記端面から突出している前記絶縁部を封止する第１封止部と、
前記第１封止部を封止し、前記本体部および前記外被部に接触する第２封止部とを有し、
前記第１封止部は、前記絶縁部に対して前記第２封止部よりも密着性の高い材料で形成されていることを特徴とする電子機器。 In an electronic device having a main body portion having a function as an electronic device, and a cable having a tip portion disposed in the main body portion and connected to the main body portion,
The cable includes a lead wire, an insulating portion that covers the lead wire, and a jacket portion that covers the insulating portion,
The insulating portion protrudes from the end surface of the outer jacket portion toward the distal end portion, is formed of a material that is more resistant to water-soluble cutting oil than the outer jacket portion, and is water-soluble. As a resistance test against cutting oil, the tensile strength change rate before and after the resistance test when immersed in a 20-fold diluted water-soluble cutting oil heated to 50 ° C. for 240 hours is less than 20%,
The electronic device is
A first sealing portion for sealing the insulating portion protruding from the end face;
Sealing the first sealing part, and having a second sealing part in contact with the main body part and the jacket part,
The electronic device, wherein the first sealing portion is made of a material having higher adhesion to the insulating portion than the second sealing portion. 前記第１封止部は、前記外被部の前記端面を封止していることを特徴とする請求項１に記載の電子機器。   The electronic device according to claim 1, wherein the first sealing portion seals the end surface of the outer jacket portion. 前記第１封止部は、前記リード線の前記先端部側の端部を封止していることを特徴とする請求項１または２に記載の電子機器。   The electronic device according to claim 1, wherein the first sealing portion seals an end portion of the lead wire on the tip end side. 前記第２封止部は、前記外被部に対して前記第１封止部よりも密着性の高い材料で形成されていることを特徴とする請求項１から３の何れか１項に記載の電子機器。   The said 2nd sealing part is formed with the material whose adhesiveness is higher than the said 1st sealing part with respect to the said jacket part, The any one of Claim 1 to 3 characterized by the above-mentioned. Electronic equipment. 前記絶縁部を構成する材料は、フッ素系樹脂であり、
前記第１封止部を構成する材料はポリアミド系樹脂であることを特徴とする請求項１から４の何れか１項に記載の電子機器。 The material constituting the insulating part is a fluorine resin,
5. The electronic apparatus according to claim 1, wherein the material constituting the first sealing portion is a polyamide-based resin. 前記外被部を構成する材料は、ポリ塩化ビニル樹脂であり、
前記第２封止部を構成する材料は、ポリブチレンテレフタラート樹脂であることを特徴とする請求項５に記載の電子機器。 The material constituting the jacket portion is polyvinyl chloride resin,
The electronic device according to claim 5, wherein the material constituting the second sealing portion is a polybutylene terephthalate resin. 電子機器としての機能を有する本体部と、先端部が前記本体部内に配置され、前記本体部に接続しているケーブルとを有する電子機器の製造方法であって、
前記本体部内に、リード線と、前記リード線を被覆する絶縁部と、前記絶縁部を被覆する外被部とを有する前記ケーブルの先端部を配置する工程と、
前記外被部の前記先端部側の端面から前記先端部側に突出している絶縁部を封止する第１封止部を形成する工程と、
前記第１封止部を封止し、かつ、前記本体部および前記外被部に接触する第２封止部を形成する工程とを含み、
前記絶縁部は、前記外被部よりも水溶性切削油に耐性の高い材料で形成されており、かつ水溶性切削油に対する耐性試験として、５０℃に加熱した２０倍希釈の水溶性切削油に２４０時間浸漬したときの耐性試験前後の引張強度変化率が２０％未満であり、
前記第１封止部は、前記絶縁部に対して前記第２封止部よりも密着性の高い材料で形成されていることを特徴とする電子機器の製造方法。 A method of manufacturing an electronic device having a main body having a function as an electronic device, and a cable having a distal end portion disposed in the main body and connected to the main body,
Disposing a tip of the cable having a lead wire, an insulating portion covering the lead wire, and a jacket portion covering the insulating portion in the main body portion;
Forming a first sealing portion that seals an insulating portion protruding from the end surface of the outer cover portion toward the distal end portion;
Sealing the first sealing portion and forming a second sealing portion that contacts the main body portion and the jacket portion,
The insulating part is made of a material that is more resistant to water-soluble cutting oil than the jacket part, and as a resistance test against water-soluble cutting oil, 20-fold diluted water-soluble cutting oil heated to 50 ° C. The tensile strength change rate before and after the resistance test when immersed for 240 hours is less than 20%,
The method of manufacturing an electronic device, wherein the first sealing portion is formed of a material having higher adhesion than the second sealing portion with respect to the insulating portion.
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