JP6441921B2 - 接合構造体 - Google Patents
接合構造体 Download PDFInfo
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- JP6441921B2 JP6441921B2 JP2016529311A JP2016529311A JP6441921B2 JP 6441921 B2 JP6441921 B2 JP 6441921B2 JP 2016529311 A JP2016529311 A JP 2016529311A JP 2016529311 A JP2016529311 A JP 2016529311A JP 6441921 B2 JP6441921 B2 JP 6441921B2
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- 239000000919 ceramic Substances 0.000 claims description 103
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 229910052750 molybdenum Inorganic materials 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 9
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 229910001020 Au alloy Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 description 38
- 238000012360 testing method Methods 0.000 description 32
- 238000005219 brazing Methods 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 15
- 230000008646 thermal stress Effects 0.000 description 13
- 239000012298 atmosphere Substances 0.000 description 10
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000010955 niobium Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229910017398 Au—Ni Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910039444 MoC Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- LTOKVQLDQRXAHK-UHFFFAOYSA-N [W].[Ni].[Cu] Chemical compound [W].[Ni].[Cu] LTOKVQLDQRXAHK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005467 ceramic manufacturing process Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical compound [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 description 1
- 239000005078 molybdenum compound Substances 0.000 description 1
- 150000002752 molybdenum compounds Chemical class 0.000 description 1
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- -1 niobium carbide Chemical compound 0.000 description 1
- 150000002822 niobium compounds Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 150000003658 tungsten compounds Chemical class 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
- H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Resistance Heating (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Ceramic Products (AREA)
Description
ウェハ載置面を備えたセラミック部材と、
前記セラミック部材に埋設され前記ウェハ載置面に沿う形状の埋設電極と、
前記セラミック部材のうち前記ウェハ載置面とは反対側の面から前記埋設電極に達するように埋設された金属製の接続部材と、
前記接続部材のうち外部に露出している面に接合層を介して接合された金属製の外部通電部材と、
を備えた接合構造体であって、
前記接続部材は、円柱部材であり、直径Dが3.5〜5mm、前記埋設電極に接している円形面と円柱側面とのコーナー部分の曲率半径Rが0.3〜1.5mm、比率R/Dが0.09以上のものである。
ウェハ載置面を備えたセラミック部材と、
前記セラミック部材に埋設され前記ウェハ載置面に沿う形状の埋設電極と、
前記セラミック部材のうち前記ウェハ載置面とは反対側の面から前記埋設電極に達するように埋設された金属製の接続部材と、
前記接続部材のうち外部に露出している面に接合層を介して接合された金属製の外部通電部材と、
を備えた接合構造体であって、
前記接続部材は、円柱部材であり、直径Dが3.5〜5mm、
前記埋設電極に接している円形面と円柱側面とのコーナー部分は短径F、長径Gの楕円形状であり、前記短径F及び前記長径Gが0.3〜1.5mm、比率F/D及び比率G/Dが0.09以上のものである。
図2の製造手順にしたがい、上述したセラミックヒータ10のサンプルを10種類製造した(試験例1〜9)。まず、窒化アルミニウム粉末にヒータエレメント14と円柱体116とを埋設し、一軸加圧成形することによって成形体112を作製した。ヒータエレメント14としては、モリブデン製の金網を使用した。この金網は、直径0.12mmのモリブデン線を、1インチあたり50本の密度で編んだものを使用した。円柱体116としては、粒径1〜100μmのモリブデン粉末を円柱状に成形し、ヒータエレメント14に接する円形面と円柱側面とのコーナー部分116bの曲率半径Rが所定の値になるように加工したものを使用した。この成形体112を金型に入れ、カーボンフォイル内に密封し、ホットプレス法で焼成することにより、セラミック部材12を得た。焼成は、温度1950℃、圧力200kgf/cm2で2時間保持することにより行った。このセラミック部材12を直径200mm、厚さ8mmになるように加工した。
室温下、セラミック部材12を固定し、外部通電部材18のフランジを把持して垂直に引っ張り上げ、接続部材16と外部通電部材18との接合が破断したときの荷重を測定し、その荷重を引張破断強度とした。測定には、引張強度試験機(島津製作所製、オートグラフ)を使用した。
成形体112を焼結させてセラミック部材12を製造した直後にセラミック部材12にクラックが発生したか否かを調べ、クラックが発生していたものについて製造時破損ありと判定した。
真空下、セラミックヒータ10を700℃まで加熱したあと室温まで降温し、その状態でセラミック部材12にクラックが発生したか否かを調べ、クラックが発生したものについてセラミック破損ありと判定した。ちなみに、セラミック部材12の材質(AlN)と接続部材16の材質(Mo)との熱膨張係数の僅かな違いにより熱応力が発生するが、コーナー部分16bではその熱応力が集中しやすいため、コーナー部分16bを起点とするクラックがセラミック部材12に発生しやすい。
試験例10〜13では、円柱体116として、ヒータエレメント14に接する円形面と円柱側面とのコーナー部分116bを楕円形になるように加工したものを使用した以外は、試験例1〜9と同様にセラミックヒータ10を製造した。試験例10〜13の接続部材16の直径D、コーナー部分の楕円の短径F、長径G、比率F/D,比率G/Dの各値を表2に示す。なお、接続部材16の高さは、一律3mmとした。また、楕円の短径方向は接続部材16の高さ方向(図4で上下方向)、楕円の長径方向は接続部材16の幅方向(図4で左右方向)とした。試験例10〜13につき、上述した各評価試験を行った。その結果を表2に示す。
Claims (6)
- ウェハ載置面を備えたセラミック部材と、
前記セラミック部材に埋設され前記ウェハ載置面に沿う形状の埋設電極と、
前記セラミック部材のうち前記ウェハ載置面とは反対側の面から前記埋設電極に達するように埋設された金属製の接続部材と、
前記接続部材のうち外部に露出している面に接合層を介して接合された金属製の外部通電部材と、
を備えた接合構造体であって、
前記接続部材は、円柱部材であり、直径Dが3.5〜5mm、前記埋設電極に接している円形面と円柱側面とのコーナー部分の曲率半径Rが0.3〜1.5mm、比率R/Dが0.09以上である、
接合構造体。 - 前記比率R/Dが0.3以下である、
請求項1に記載の接合構造体。 - ウェハ載置面を備えたセラミック部材と、
前記セラミック部材に埋設され前記ウェハ載置面に沿う形状の埋設電極と、
前記セラミック部材のうち前記ウェハ載置面とは反対側の面から前記埋設電極に達するように埋設された金属製の接続部材と、
前記接続部材のうち外部に露出している面に接合層を介して接合された金属製の外部通電部材と、
を備えた接合構造体であって、
前記接続部材は、円柱部材であり、直径Dが3.5〜5mm、
前記埋設電極に接している円形面と円柱側面とのコーナー部分は短径F、長径Gの楕円形状であり、短径F及び長径Gが0.3〜1.5mm、比率F/D及び比率G/Dが0.09以上である、
接合構造体。 - 前記比率F/D及び前記比率G/Dが0.3以下である、
請求項3に記載の接合構造体。 - 前記セラミック部材は、材質が窒化アルミニウム、酸化アルミニウム、炭化珪素又は窒化珪素であり、前記接続部材は、材質がMo、W、Nb、Mo化合物、W化合物又はNb化合物である、
請求項1〜4のいずれか1項に記載の接合構造体。 - 前記接合層は、材質がAu又はAu合金である、
請求項1〜5のいずれか1項に記載の接合構造体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014132305 | 2014-06-27 | ||
JP2014132305 | 2014-06-27 | ||
PCT/JP2015/067038 WO2015198892A1 (ja) | 2014-06-27 | 2015-06-12 | 接合構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2015198892A1 JPWO2015198892A1 (ja) | 2017-04-20 |
JP6441921B2 true JP6441921B2 (ja) | 2018-12-19 |
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Application Number | Title | Priority Date | Filing Date |
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JP2016529311A Active JP6441921B2 (ja) | 2014-06-27 | 2015-06-12 | 接合構造体 |
Country Status (6)
Country | Link |
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US (1) | US20170069520A1 (ja) |
JP (1) | JP6441921B2 (ja) |
KR (1) | KR101933292B1 (ja) |
CN (1) | CN106463452A (ja) |
TW (1) | TW201616915A (ja) |
WO (1) | WO2015198892A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US11229968B2 (en) * | 2011-11-30 | 2022-01-25 | Watlow Electric Manufacturing Company | Semiconductor substrate support with multiple electrodes and method for making same |
EP3254729B1 (en) * | 2015-05-04 | 2019-09-04 | Neuboron Medtech Ltd. | Beam shaping body for neutron capture therapy |
JP6666717B2 (ja) * | 2015-12-28 | 2020-03-18 | 日本特殊陶業株式会社 | セラミックス部材 |
JP6926217B2 (ja) * | 2017-09-28 | 2021-08-25 | 京セラ株式会社 | 構造体 |
US11560913B2 (en) * | 2018-01-19 | 2023-01-24 | Applied Materials, Inc. | Brazed joint and semiconductor processing chamber component having the same |
US11587773B2 (en) * | 2019-05-24 | 2023-02-21 | Applied Materials, Inc. | Substrate pedestal for improved substrate processing |
JP7143256B2 (ja) | 2019-07-01 | 2022-09-28 | 日本碍子株式会社 | ウエハ載置台及びその製法 |
KR102352837B1 (ko) * | 2019-07-01 | 2022-01-20 | 주식회사 미코세라믹스 | 세라믹 히터용 접속 부재 |
KR102158247B1 (ko) * | 2019-07-30 | 2020-09-21 | 주식회사 보부하이테크 | 메쉬형 전극을 구비한 기판 지지 플레이트 제조 방법 및 이에 의하여 제조된 기판 지지 플레이트 |
KR102123398B1 (ko) * | 2019-07-30 | 2020-06-16 | 주식회사 보부하이테크 | 코일형 전극을 구비한 기판 지지 플레이트 제조 방법 및 이에 의하여 제조된 기판 지지 플레이트 |
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JP2023149784A (ja) | 2022-03-31 | 2023-10-13 | 日本碍子株式会社 | 接合構造体 |
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JP3790000B2 (ja) | 1997-01-27 | 2006-06-28 | 日本碍子株式会社 | セラミックス部材と電力供給用コネクターとの接合構造 |
JP3297637B2 (ja) * | 1998-01-30 | 2002-07-02 | 京セラ株式会社 | ウエハ支持部材 |
JP4005268B2 (ja) | 1999-06-01 | 2007-11-07 | 日本碍子株式会社 | セラミックスと金属との接合構造およびこれに使用する中間挿入材 |
JP3967278B2 (ja) * | 2003-03-07 | 2007-08-29 | 日本碍子株式会社 | 接合部材及び静電チャック |
JP2007258610A (ja) * | 2006-03-24 | 2007-10-04 | Ngk Insulators Ltd | アルミナ焼成体 |
US8294069B2 (en) * | 2007-03-28 | 2012-10-23 | Ngk Insulators, Ltd. | Heating device for heating a wafer |
TWI450353B (zh) * | 2008-01-08 | 2014-08-21 | Ngk Insulators Ltd | A bonding structure and a semiconductor manufacturing apparatus |
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US20170069520A1 (en) | 2017-03-09 |
CN106463452A (zh) | 2017-02-22 |
KR101933292B1 (ko) | 2018-12-27 |
JPWO2015198892A1 (ja) | 2017-04-20 |
WO2015198892A1 (ja) | 2015-12-30 |
KR20160145812A (ko) | 2016-12-20 |
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