JP6434443B2 - ファイバレーザ発振器 - Google Patents
ファイバレーザ発振器 Download PDFInfo
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- JP6434443B2 JP6434443B2 JP2016082100A JP2016082100A JP6434443B2 JP 6434443 B2 JP6434443 B2 JP 6434443B2 JP 2016082100 A JP2016082100 A JP 2016082100A JP 2016082100 A JP2016082100 A JP 2016082100A JP 6434443 B2 JP6434443 B2 JP 6434443B2
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- Prior art keywords
- clean bench
- laser oscillator
- housing
- fiber laser
- optical unit
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
- H01S3/067—Fibre lasers
- H01S3/06704—Housings; Packages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0014—Monitoring arrangements not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/10069—Memorized or pre-programmed characteristics, e.g. look-up table [LUT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
- H01S3/2383—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
- H01S3/027—Constructional details of solid state lasers, e.g. housings or mountings comprising a special atmosphere inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0404—Air- or gas cooling, e.g. by dry nitrogen
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
- Ventilation (AREA)
Description
本実施形態のファイバレーザ発振器10は、光学ユニット12を引き出し可能に収容する筐体11と、光学ユニット12側に着脱自在であって、筐体11から引き出された光学ユニット12の上方に外部から隔絶された閉鎖空間を形成するクリーンベンチ20と、を備え、クリーンベンチ20には、筐体11の内部空間31に連通する連通口22が形成される。
11 筐体
12 光学ユニット
20 クリーンベンチ
22 連通口
25 外部棚
26 内部棚
51 可視光透過板部(可視透光部)
52 カーテン部
70 制御部
91 湿度検出部
Claims (5)
- 光ファイバが接続される融着接続部を有する光学ユニットを備えるファイバレーザ発振器であって、
前記光学ユニットを引き出し可能に収容する筐体と、
前記筐体又は前記光学ユニット側に着脱自在であって、前記筐体から引き出された前記光学ユニットの上方に外部から隔絶された閉鎖空間を形成するクリーンベンチと、
前記光学ユニットを固定し、前記筐体から引き出し可能なベースプレートと、
を備え、
前記クリーンベンチには、前記筐体の内部空間に連通する連通口が形成され、
前記クリーンベンチは、前記ベースプレートに設置されるファイバレーザ発振器。 - 前記クリーンベンチの内部の湿度を検出する湿度検出部と、
前記湿度検出部の検出値に基づいてファイバレーザ発振器が稼動可能か否かを判別する制御部と、を備える請求項1に記載のファイバレーザ発振器。 - 前記クリーンベンチは、可視透光部を有する請求項1又は2に記載のファイバレーザ発振器。
- 前記クリーンベンチは、前記筐体に接する部分とは異なる外側面に可視透光性の材料であって可撓性を有する材料で構成されるカーテン部を有する請求項1から3の何れかに記載のファイバレーザ発振器。
- 前記クリーンベンチは、その内部又は外部に棚を配置可能に構成される請求項1から4の何れかに記載のファイバレーザ発振器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016082100A JP6434443B2 (ja) | 2016-04-15 | 2016-04-15 | ファイバレーザ発振器 |
DE102017206075.1A DE102017206075B4 (de) | 2016-04-15 | 2017-04-10 | Faserlaseroszillator |
US15/484,362 US10027082B2 (en) | 2016-04-15 | 2017-04-11 | Fiber laser oscillator and clean bench mountable to the same |
CN201710240712.4A CN107302173B (zh) | 2016-04-15 | 2017-04-13 | 光纤激光振荡器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016082100A JP6434443B2 (ja) | 2016-04-15 | 2016-04-15 | ファイバレーザ発振器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017191907A JP2017191907A (ja) | 2017-10-19 |
JP6434443B2 true JP6434443B2 (ja) | 2018-12-05 |
Family
ID=59980802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016082100A Active JP6434443B2 (ja) | 2016-04-15 | 2016-04-15 | ファイバレーザ発振器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10027082B2 (ja) |
JP (1) | JP6434443B2 (ja) |
CN (1) | CN107302173B (ja) |
DE (1) | DE102017206075B4 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11114809B2 (en) * | 2018-02-22 | 2021-09-07 | Lumentum Operations Llc | Fiber optic device operational monitoring |
USD912339S1 (en) * | 2018-03-22 | 2021-03-02 | P-Laser N.V. | Laser cleaning device |
CN112272905A (zh) * | 2018-06-29 | 2021-01-26 | 松下知识产权经营株式会社 | 激光装置及激光装置的除湿管理方法 |
JP7228809B2 (ja) * | 2019-04-16 | 2023-02-27 | パナソニックIpマネジメント株式会社 | レーザ装置及びそれを用いたレーザ加工装置 |
JP7228810B2 (ja) * | 2019-04-16 | 2023-02-27 | パナソニックIpマネジメント株式会社 | レーザ装置及びそれを用いたレーザ加工装置 |
JP7257295B2 (ja) * | 2019-09-06 | 2023-04-13 | 株式会社アマダ | ファイバレーザ発振器及びファイバレーザ発振器のメンテナンスシステム |
JP2021093398A (ja) | 2019-12-06 | 2021-06-17 | ファナック株式会社 | 保守性を高めたレーザ発振器 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4578792A (en) * | 1982-09-30 | 1986-03-25 | Metalworking Lasers International Ltd. | High-power lasers |
JP2001343140A (ja) * | 2000-06-01 | 2001-12-14 | Sankyo Seiki Mfg Co Ltd | クリーン作業モジュールおよびクリーントンネル |
JP2002057385A (ja) * | 2000-08-14 | 2002-02-22 | Komatsu Ltd | レーザ装置 |
JP2003060268A (ja) * | 2001-08-21 | 2003-02-28 | Mitsubishi Electric Corp | 固体レーザ装置 |
JP2003083579A (ja) * | 2001-09-11 | 2003-03-19 | Seiko Epson Corp | クリーンスペースユニットとクリーンエア吹き出しユニット |
CH695872A5 (de) * | 2002-07-29 | 2006-09-29 | Brooks Pri Automation Switzerl | Reticle-Handhabungsvorrichtung. |
JP2004219878A (ja) * | 2003-01-17 | 2004-08-05 | Orc Mfg Co Ltd | 波長変換レーザー装置 |
JP2005033040A (ja) * | 2003-07-07 | 2005-02-03 | Cyber Laser Kk | レーザー湿度調節装置 |
JP2005338618A (ja) * | 2004-05-28 | 2005-12-08 | Nippon Tsushin Denzai Kk | モジュール搭載型ラックパネル |
JP2010054689A (ja) * | 2008-08-27 | 2010-03-11 | Sumitomo Electric Ind Ltd | 光ファイバ接続用作業台 |
US20130087292A1 (en) * | 2011-10-05 | 2013-04-11 | Don Gould | Welding Curtian |
WO2014065360A1 (ja) * | 2012-10-26 | 2014-05-01 | コマツ産機株式会社 | ファイバレーザ加工機、ファイバ接続方法及びファイバレーザ発振器 |
US9815140B2 (en) * | 2013-02-27 | 2017-11-14 | Komatsu Industries Corporation | Power control method for fiber laser processing machine, and fiber laser processing machine |
JP2016015435A (ja) * | 2014-07-03 | 2016-01-28 | 株式会社アマダホールディングス | ファイバレーザ発振器,ファイバレーザ加工装置,及びファイバレーザ発振器の除湿方法 |
US9680279B2 (en) * | 2014-09-10 | 2017-06-13 | Bae Systems Information And Electronic Systems Integration Inc. | Ruggedized fiber optic laser for high stress environments |
CN204615141U (zh) * | 2015-05-15 | 2015-09-02 | 中国电子科技集团公司第四十六研究所 | 一种模块化光纤激光器 |
-
2016
- 2016-04-15 JP JP2016082100A patent/JP6434443B2/ja active Active
-
2017
- 2017-04-10 DE DE102017206075.1A patent/DE102017206075B4/de active Active
- 2017-04-11 US US15/484,362 patent/US10027082B2/en active Active
- 2017-04-13 CN CN201710240712.4A patent/CN107302173B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US20170302046A1 (en) | 2017-10-19 |
DE102017206075A1 (de) | 2017-10-19 |
CN107302173B (zh) | 2019-11-01 |
JP2017191907A (ja) | 2017-10-19 |
DE102017206075B4 (de) | 2019-12-24 |
US10027082B2 (en) | 2018-07-17 |
CN107302173A (zh) | 2017-10-27 |
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