JP6430694B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6430694B2 JP6430694B2 JP2013173920A JP2013173920A JP6430694B2 JP 6430694 B2 JP6430694 B2 JP 6430694B2 JP 2013173920 A JP2013173920 A JP 2013173920A JP 2013173920 A JP2013173920 A JP 2013173920A JP 6430694 B2 JP6430694 B2 JP 6430694B2
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Description
12 基板
12c 接地パターン
12d 出力配線
14 半導体チップ
14a HEMT
16 部品
16a〜16d 配線パターン
16e ビア配線
Claims (2)
- 上面に信号配線、および前記信号配線を挟む接地パターンを有する基板と、
前記基板の上面に設けられ、出力端子を備え、前記出力端子が前記信号配線に接続された半導体チップと、
前記基板とは別の絶縁体により形成され、前記基板上に設けられた部品と、を具備し、
前記部品は、前記信号配線との間に前記絶縁体を介して前記部品の厚さ方向において対向する第1パターン、前記部品の下面に設けられ前記接地パターンのそれぞれと接続され前記接地パターンと対向する第2パターン、および前記第1パターンおよび前記第2パターンのそれぞれとの間を接続してなる第3パターンを有し、
前記第1パターンと前記信号配線との間に容量が形成されることを特徴とする半導体装置。 - 前記部品は、前記第2パターンを前記第3パターンに接続し、前記第3パターンより幅の大きい第4パターンを前記部品の側面に有することを特徴とする請求項1に記載の半導体装置。
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JP2013173920A JP6430694B2 (ja) | 2013-08-23 | 2013-08-23 | 半導体装置 |
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JP2013173920A JP6430694B2 (ja) | 2013-08-23 | 2013-08-23 | 半導体装置 |
Publications (3)
Publication Number | Publication Date |
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JP2015042001A JP2015042001A (ja) | 2015-03-02 |
JP2015042001A5 JP2015042001A5 (ja) | 2016-10-13 |
JP6430694B2 true JP6430694B2 (ja) | 2018-11-28 |
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JP2013173920A Active JP6430694B2 (ja) | 2013-08-23 | 2013-08-23 | 半導体装置 |
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JP (1) | JP6430694B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2017033334A1 (ja) * | 2015-08-27 | 2017-03-02 | 三菱電機株式会社 | 整合回路及び高周波増幅器 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55102292A (en) * | 1979-01-29 | 1980-08-05 | Nippon Electric Co | High frequency high output transistor amplifier |
JPS593958A (ja) * | 1982-06-29 | 1984-01-10 | Elna Co Ltd | 角形チツプ部品とその取付装置 |
JPS59166510U (ja) * | 1984-03-29 | 1984-11-08 | 日本電気株式会社 | 高周波高出力トランジスタ増幅器 |
EP0506122A3 (en) * | 1991-03-29 | 1994-09-14 | Matsushita Electric Ind Co Ltd | Power module |
JP4635326B2 (ja) * | 2000-10-31 | 2011-02-23 | 株式会社村田製作所 | アンテナの実装構造およびそれを備えた無線装置 |
JP2005184343A (ja) * | 2003-12-18 | 2005-07-07 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
JP2011217357A (ja) * | 2010-03-31 | 2011-10-27 | Ngk Insulators Ltd | バイアス回路 |
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- 2013-08-23 JP JP2013173920A patent/JP6430694B2/ja active Active
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JP2015042001A (ja) | 2015-03-02 |
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