JP6384234B2 - ラジカル重合型接着剤組成物、及び電気接続体の製造方法 - Google Patents

ラジカル重合型接着剤組成物、及び電気接続体の製造方法 Download PDF

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Publication number: JP6384234B2
Authority: JP; Japan
Prior art keywords: radical polymerization; adhesive composition; adhesive layer; photoacid generator; polymerization type
Prior art date: 2014-09-25
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2014195538A

Other languages

English (en)

Japanese (ja)

Other versions

JP2016065172A (ja

Inventor

慎一林

祐治田中

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Dexerials Corp

Original Assignee

Dexerials Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-09-25

Filing date

2014-09-25

Publication date

2018-09-05

2014-09-25 Application filed by Dexerials Corp filed Critical Dexerials Corp

2014-09-25 Priority to JP2014195538A priority Critical patent/JP6384234B2/ja

2015-08-31 Priority to PCT/JP2015/074714 priority patent/WO2016047387A1/ja

2015-08-31 Priority to CN201580048969.9A priority patent/CN106715622B/zh

2015-08-31 Priority to KR1020167035777A priority patent/KR102343433B1/ko

2015-09-25 Priority to TW104131752A priority patent/TWI720950B/zh

2016-04-28 Publication of JP2016065172A publication Critical patent/JP2016065172A/ja

2018-09-05 Application granted granted Critical

2018-09-05 Publication of JP6384234B2 publication Critical patent/JP6384234B2/ja

Status Active legal-status Critical Current

2034-09-25 Anticipated expiration legal-status Critical

Links

238000010526 radical polymerization reaction Methods 0.000 title claims description 94
239000000203 mixture Substances 0.000 title claims description 81
239000000853 adhesive Substances 0.000 title claims description 73
230000001070 adhesive effect Effects 0.000 title claims description 73
238000004519 manufacturing process Methods 0.000 title claims description 20
150000001875 compounds Chemical class 0.000 claims description 63
239000012790 adhesive layer Substances 0.000 claims description 46
239000007870 radical polymerization initiator Substances 0.000 claims description 28
-1 iron arene Chemical class 0.000 claims description 18
238000000034 method Methods 0.000 claims description 18
125000002091 cationic group Chemical group 0.000 claims description 16
238000010438 heat treatment Methods 0.000 claims description 16
239000004593 Epoxy Substances 0.000 claims description 14
150000001451 organic peroxides Chemical group 0.000 claims description 14
239000002253 acid Substances 0.000 claims description 10
239000000758 substrate Substances 0.000 claims description 9
229910052751 metal Inorganic materials 0.000 claims description 8
239000002184 metal Substances 0.000 claims description 8
230000001737 promoting effect Effects 0.000 claims description 8
238000003825 pressing Methods 0.000 claims description 6
150000001768 cations Chemical class 0.000 claims description 5
239000012933 diacyl peroxide Substances 0.000 claims description 4
XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims description 4
XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
229910052742 iron Inorganic materials 0.000 claims description 4
230000001678 irradiating effect Effects 0.000 claims description 4
229920000642 polymer Polymers 0.000 claims description 3
RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium group Chemical group [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 claims description 3
125000005409 triarylsulfonium group Chemical group 0.000 claims description 3
238000001723 curing Methods 0.000 description 8
238000002156 mixing Methods 0.000 description 7
RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
230000000052 comparative effect Effects 0.000 description 6
GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 6
238000005259 measurement Methods 0.000 description 6
230000032683 aging Effects 0.000 description 5
229910052782 aluminium Inorganic materials 0.000 description 5
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
238000013329 compounding Methods 0.000 description 5
PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
238000006243 chemical reaction Methods 0.000 description 4
239000011521 glass Substances 0.000 description 4
238000006116 polymerization reaction Methods 0.000 description 4
150000003839 salts Chemical class 0.000 description 4
NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
150000001252 acrylic acid derivatives Chemical class 0.000 description 3
238000010538 cationic polymerization reaction Methods 0.000 description 3
230000000694 effects Effects 0.000 description 3
239000004973 liquid crystal related substance Substances 0.000 description 3
238000012360 testing method Methods 0.000 description 3
238000005979 thermal decomposition reaction Methods 0.000 description 3
229920005992 thermoplastic resin Polymers 0.000 description 3
MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
239000006087 Silane Coupling Agent Substances 0.000 description 2
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
229910052802 copper Inorganic materials 0.000 description 2
239000010949 copper Substances 0.000 description 2
238000000354 decomposition reaction Methods 0.000 description 2
239000007772 electrode material Substances 0.000 description 2
238000011156 evaluation Methods 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
229910052737 gold Inorganic materials 0.000 description 2
239000010931 gold Substances 0.000 description 2
239000003999 initiator Substances 0.000 description 2
ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
239000000178 monomer Substances 0.000 description 2
NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
230000009257 reactivity Effects 0.000 description 2
GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
229910052709 silver Inorganic materials 0.000 description 2
239000004332 silver Substances 0.000 description 2
229920001187 thermosetting polymer Polymers 0.000 description 2
238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 1
MCVVDMSWCQUKEV-UHFFFAOYSA-N (2-nitrophenyl)methyl 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OCC1=CC=CC=C1[N+]([O-])=O MCVVDMSWCQUKEV-UHFFFAOYSA-N 0.000 description 1
DLDWUFCUUXXYTB-UHFFFAOYSA-N (2-oxo-1,2-diphenylethyl) 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OC(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 DLDWUFCUUXXYTB-UHFFFAOYSA-N 0.000 description 1
BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 1
JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
229930185605 Bisphenol Natural products 0.000 description 1
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
235000005633 Chrysanthemum balsamita Nutrition 0.000 description 1
244000260524 Chrysanthemum balsamita Species 0.000 description 1
CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
AMFGWXWBFGVCKG-UHFFFAOYSA-N Panavia opaque Chemical compound C1=CC(OCC(O)COC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCC(O)COC(=O)C(C)=C)C=C1 AMFGWXWBFGVCKG-UHFFFAOYSA-N 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
125000002723 alicyclic group Chemical group 0.000 description 1
125000001931 aliphatic group Chemical group 0.000 description 1
150000001450 anions Chemical class 0.000 description 1
150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
239000006121 base glass Substances 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
238000012663 cationic photopolymerization Methods 0.000 description 1
238000000576 coating method Methods 0.000 description 1
239000011231 conductive filler Substances 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
230000007423 decrease Effects 0.000 description 1
239000012954 diazonium Substances 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
239000000945 filler Substances 0.000 description 1
238000005187 foaming Methods 0.000 description 1
125000000524 functional group Chemical group 0.000 description 1
VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
238000013007 heat curing Methods 0.000 description 1
150000002432 hydroperoxides Chemical class 0.000 description 1
239000004615 ingredient Substances 0.000 description 1
239000011256 inorganic filler Substances 0.000 description 1
229910003475 inorganic filler Inorganic materials 0.000 description 1
239000010410 layer Substances 0.000 description 1
239000007788 liquid Substances 0.000 description 1
239000000463 material Substances 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
229920003986 novolac Polymers 0.000 description 1
150000007524 organic acids Chemical class 0.000 description 1
239000012766 organic filler Substances 0.000 description 1
150000002921 oxetanes Chemical class 0.000 description 1
125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
150000002978 peroxides Chemical class 0.000 description 1
229920006287 phenoxy resin Polymers 0.000 description 1
239000013034 phenoxy resin Substances 0.000 description 1
229920006267 polyester film Polymers 0.000 description 1
239000003505 polymerization initiator Substances 0.000 description 1
230000000379 polymerizing effect Effects 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
238000007639 printing Methods 0.000 description 1
238000007348 radical reaction Methods 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000011347 resin Substances 0.000 description 1
230000004043 responsiveness Effects 0.000 description 1
239000000523 sample Substances 0.000 description 1
SPVXKVOXSXTJOY-UHFFFAOYSA-O selenonium Chemical class [SeH3+] SPVXKVOXSXTJOY-UHFFFAOYSA-O 0.000 description 1
230000035945 sensitivity Effects 0.000 description 1
150000004979 silylperoxides Chemical class 0.000 description 1
238000003860 storage Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
230000003746 surface roughness Effects 0.000 description 1
125000005490 tosylate group Chemical class 0.000 description 1
229920002554 vinyl polymer Polymers 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Adhesives Or Adhesive Processes (AREA)
Adhesive Tapes (AREA)
Manufacturing Of Electrical Connectors (AREA)

JP2014195538A 2014-09-25 2014-09-25 ラジカル重合型接着剤組成物、及び電気接続体の製造方法 Active JP6384234B2 (ja)

Priority Applications (5)

Application Number	Priority Date	Filing Date	Title
JP2014195538A JP6384234B2 (ja)	2014-09-25	2014-09-25	ラジカル重合型接着剤組成物、及び電気接続体の製造方法
PCT/JP2015/074714 WO2016047387A1 (ja)	2014-09-25	2015-08-31	ラジカル重合型接着剤組成物、及び電気接続体の製造方法
CN201580048969.9A CN106715622B (zh)	2014-09-25	2015-08-31	自由基聚合型粘接剂组合物以及电连接体的制造方法
KR1020167035777A KR102343433B1 (ko)	2014-09-25	2015-08-31	라디칼 중합형 접착제 조성물, 및 전기 접속체의 제조 방법
TW104131752A TWI720950B (zh)	2014-09-25	2015-09-25	自由基聚合型接著劑組成物、及電連接體之製造方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2014195538A JP6384234B2 (ja)	2014-09-25	2014-09-25	ラジカル重合型接着剤組成物、及び電気接続体の製造方法

Publications (2)

Publication Number	Publication Date
JP2016065172A JP2016065172A (ja)	2016-04-28
JP6384234B2 true JP6384234B2 (ja)	2018-09-05

Family

ID=55580915

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2014195538A Active JP6384234B2 (ja)	2014-09-25	2014-09-25	ラジカル重合型接着剤組成物、及び電気接続体の製造方法

Country Status (5)

Country	Link
JP (1)	JP6384234B2 (zh)
KR (1)	KR102343433B1 (zh)
CN (1)	CN106715622B (zh)
TW (1)	TWI720950B (zh)
WO (1)	WO2016047387A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102018216868A1 (de)	2018-10-01	2020-04-02	Tesa Se	Latent reaktiver Klebefilm
EP3719089B1 (en) *	2019-04-02	2024-07-31	3M Innovative Properties Company	Process of manufacturing a curable precursor of a structural adhesive composition
EP3719088A1 (en) *	2019-04-02	2020-10-07	3M Innovative Properties Company	Curable precursor of a structural adhesive composition
DE102020203952A1 (de)	2020-03-26	2021-09-30	Tesa Se	Latent reaktiver Klebefilm

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JP2000169553A (ja) *	1998-12-09	2000-06-20	Kyoeisha Chem Co Ltd	高耐熱性樹脂組成物
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JP2008013721A (ja) *	2006-07-10	2008-01-24	Kyocera Chemical Corp	硬化性樹脂組成物、表示素子用接着剤及び接着方法
CN101235257A (zh) *	2007-02-02	2008-08-06	Jsr株式会社	放射线固化性粘合剂用组合物、复合体及复合体的制法
KR101475573B1 (ko) *	2009-06-08	2014-12-22	산요가세이고교 가부시키가이샤	감광성 조성물
JP5610307B2 (ja) *	2010-09-20	2014-10-22	エルジー・ケム・リミテッド	偏光板用接着剤組成物、これを含む偏光板及び光学素子
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JP5830883B2 (ja) *	2011-03-08	2015-12-09	日立化成株式会社	半導体用接着剤組成物、半導体装置及び半導体装置の製造方法
CN103087640A (zh) *	2011-11-08	2013-05-08	汉高股份有限公司	双固化粘合剂组合物及其用途以及粘合基底的方法
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JP6232855B2 (ja) *	2013-08-30	2017-11-22	デクセリアルズ株式会社	ラジカル重合型接着剤組成物、及び電気接続体の製造方法

2014
- 2014-09-25 JP JP2014195538A patent/JP6384234B2/ja active Active
2015
- 2015-08-31 WO PCT/JP2015/074714 patent/WO2016047387A1/ja active Application Filing
- 2015-08-31 CN CN201580048969.9A patent/CN106715622B/zh active Active
- 2015-08-31 KR KR1020167035777A patent/KR102343433B1/ko active IP Right Grant
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