JP6382239B2 - Adhesive tape for electronic parts - Google Patents
Adhesive tape for electronic parts Download PDFInfo
- Publication number
- JP6382239B2 JP6382239B2 JP2016006739A JP2016006739A JP6382239B2 JP 6382239 B2 JP6382239 B2 JP 6382239B2 JP 2016006739 A JP2016006739 A JP 2016006739A JP 2016006739 A JP2016006739 A JP 2016006739A JP 6382239 B2 JP6382239 B2 JP 6382239B2
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- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- adhesive layer
- adhesive tape
- mirror surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002390 adhesive tape Substances 0.000 title claims description 48
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 93
- 239000000853 adhesive Substances 0.000 claims description 48
- 230000001070 adhesive effect Effects 0.000 claims description 48
- 229920000642 polymer Polymers 0.000 claims description 47
- 239000010410 layer Substances 0.000 claims description 39
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 26
- 229910052710 silicon Inorganic materials 0.000 claims description 26
- 239000010703 silicon Substances 0.000 claims description 26
- 230000005855 radiation Effects 0.000 claims description 25
- 238000001723 curing Methods 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 239000003795 chemical substances by application Substances 0.000 claims description 20
- 230000009477 glass transition Effects 0.000 claims description 19
- 239000003999 initiator Substances 0.000 claims description 16
- 239000012948 isocyanate Substances 0.000 claims description 16
- 150000002513 isocyanates Chemical class 0.000 claims description 16
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 11
- 229920006243 acrylic copolymer Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 3
- 238000003847 radiation curing Methods 0.000 claims description 3
- 125000003158 alcohol group Chemical group 0.000 claims 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 27
- 239000000178 monomer Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 16
- 238000012360 testing method Methods 0.000 description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 15
- 239000003431 cross linking reagent Substances 0.000 description 13
- -1 polyethylene Polymers 0.000 description 13
- 238000001035 drying Methods 0.000 description 12
- 125000000524 functional group Chemical group 0.000 description 11
- 229920005601 base polymer Polymers 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 8
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 7
- 239000003607 modifier Substances 0.000 description 7
- 239000004925 Acrylic resin Substances 0.000 description 6
- 229920000178 Acrylic resin Polymers 0.000 description 6
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
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- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000002998 adhesive polymer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 239000006059 cover glass Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
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- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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Images
Landscapes
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
本発明は、電子部品用粘着テープに関する。さらに詳しくは、電子部品を搬送する際に、電子部品を粘着支持するのに好適に使用される電子部品用粘着テープに関する。 The present invention relates to an adhesive tape for electronic parts. More specifically, the present invention relates to an adhesive tape for electronic components that is preferably used for adhesively supporting electronic components when conveying the electronic components.
例えば、ＩＣ（Ｉｎｔｅｇｒａｔｅｄ Ｃｉｒｃｕｉｔ）、抵抗器、コンデンサ、コイル、ＩＲフィルタといったチップ型電子部品などの電子部品は、製造された後、プリント配線基板などに実装に供されるために搬送される。従来、電子部品はトレーに収容されて搬送されることが多かったが、搬送中に電子部品がトレー内で振動することにより破損することがあった。近年、電子部品の小型化、薄型化により、破損する危険性が増している。 For example, electronic components such as chip-type electronic components such as ICs (Integrated Circuits), resistors, capacitors, coils, and IR filters are manufactured and then transported for mounting on a printed wiring board or the like. Conventionally, electronic components are often housed and transported in a tray, but the electronic components may be damaged by vibration in the tray during transportation. In recent years, the risk of breakage has increased due to the downsizing and thinning of electronic components.
そこで、片面に粘着剤層を有する電子部品搬送用粘着テープを用い、電子部品を粘着支持して搬送した後、電子部品搬送用粘着テープから剥離して実装することが行われている（例えば、特許文献１参照）。 Therefore, using an electronic component transporting adhesive tape having an adhesive layer on one side, and supporting and transporting the electronic component, peeling from the electronic component transporting adhesive tape and mounting (for example, Patent Document 1).
従来の電子部品搬送用粘着テープは、工場内での搬送など、短距離、短時間での搬送を想定したものであった。ところが、近年、電子部品の実装や組み立てを外国で行う場合もでてきている。このような場合に、従来の電子部品搬送用粘着テープでは、電子部品を貼着して搬送した後、電子部品用粘着テープから剥離する際に、剥離できなかったり、剥離できても粘着剤が電子部品に付着したりするという問題があった。この問題は、船便によるコンテナ輸送など、搬送時に高温多湿の環境に数週間程度と長期間さらされた場合に特に顕著となっている。 Conventional pressure-sensitive adhesive tapes for transporting electronic components are intended for transport in a short distance and in a short time, such as transport in a factory. In recent years, however, electronic components have been mounted and assembled in foreign countries. In such a case, in the conventional adhesive tape for transporting electronic components, when the electronic component is adhered and transported, when peeling from the adhesive tape for electronic components, the adhesive cannot be peeled off or the adhesive is not peeled off. There was a problem of adhering to electronic components. This problem is particularly noticeable when exposed to a hot and humid environment for several weeks, such as container transportation by sea, for a long period of time.
そこで、本発明は、搬送時に高温多湿の環境に数週間程度と長期間さらされた場合であっても、搬送後に電子部品を良好に剥離することができる電子部品用粘着テープを提供することを目的とする。 Therefore, the present invention provides an adhesive tape for electronic components that can peel the electronic components well after transportation even when exposed to a hot and humid environment for a long period of time, such as several weeks, during transportation. Objective.
上記課題を解決するために、本願発明による電子部品用粘着テープは、基材フィルムの少なくとも片面に粘着剤層が形成された電子部品用粘着テープであって、シリコンミラー面に貼合後、２３℃、５０％ＲＨの環境下で1時間放置した後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで測定した前記シリコンミラー面に対する粘着力をＰ１とし、シリコンミラー面に貼合後、６０℃、５０％ＲＨの環境下で1週間放置した後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで測定した前記シリコンミラー面に対する粘着力をＰ２としたとき、０Ｎ／２５ｍｍ≦Ｐ２−Ｐ１≦０．７Ｎ／２５ｍｍであることを特徴とする。 In order to solve the above problems, an adhesive tape for electronic parts according to the present invention is an adhesive tape for electronic parts in which an adhesive layer is formed on at least one side of a base film, and is bonded to a silicon mirror surface. After standing for 1 hour in an environment of 50 ° C. and 50% RH, the adhesive force to the silicon mirror surface measured at a peeling angle of 90 degrees and a peeling speed of 50 mm / min under the conditions of 23 ° C. and 50% RH is P1, and silicon After being bonded to the mirror surface, the silicon mirror surface was measured after being left for 1 week in an environment of 60 ° C. and 50% RH, and measured at a peeling angle of 90 degrees and a peeling speed of 50 mm / min under the conditions of 23 ° C. and 50% RH. When the adhesive force to P2 is P2, 0N / 25 mm ≦ P2−P1 ≦ 0.7 N / 25 mm.
上記電子部品用粘着テープは、前記粘着剤層を構成する主成分のポリマーのガラス転移温度が、−６５℃〜−３０℃であることが好ましい。 In the adhesive tape for electronic parts, the glass transition temperature of the main component polymer constituting the adhesive layer is preferably -65 ° C to -30 ° C.
また、上記電子部品用粘着テープは、前記粘着剤層は、放射線を照射することにより硬化する放射線硬化型の粘着剤層であり、前記Ｐ１は、シリコンミラー面に貼合後、放射線照射により前記粘着剤層を硬化させた後、２３℃、５０％ＲＨの環境下で1時間放置後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで測定したシリコンミラー面に対する粘着力であり、前記Ｐ２は、シリコンミラー面に貼合後、放射線照射により前記粘着剤層を硬化させた後、６０℃、５０％ＲＨの環境下で1週間放置後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで測定したシリコンミラー面に対する粘着力であることが好ましい。 The pressure-sensitive adhesive tape for electronic parts is a radiation-curing pressure-sensitive adhesive layer in which the pressure-sensitive adhesive layer is cured by irradiation with radiation, and the P1 is bonded to a silicon mirror surface and then irradiated with radiation. After curing the pressure-sensitive adhesive layer, it was allowed to stand in an environment of 23 ° C. and 50% RH for 1 hour, and then measured at a peeling angle of 90 degrees and a peeling speed of 50 mm / min under the conditions of 23 ° C. and 50% RH. The P2 is bonded to a silicon mirror surface, and after curing the pressure-sensitive adhesive layer by irradiation, it is allowed to stand in an environment of 60 ° C. and 50% RH for 1 week, and then 23 ° C., 50 The adhesive strength to the silicon mirror surface measured at a peeling angle of 90 degrees and a peeling speed of 50 mm / min under the condition of% RH is preferable.
本発明によれば、搬送時に高温多湿の環境に数週間程度と長期間さらされた場合であっても、搬送後に電子部品を良好に剥離することができる。 According to the present invention, electronic parts can be satisfactorily peeled after transportation even when exposed to a high temperature and humidity environment for several weeks for a long time during transportation.
以下に、本発明の実施の形態について詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail.
本発明の実施形態に係る電子部品用粘着テープ１は、図１に示すように、基材フィルム２の少なくとも片面に、少なくとも1種類の粘着剤が塗布され、粘着剤層３が形成されている。また、半導体表面保護用粘着テープ１は、粘着剤層３上に、粘着剤層３を保護するための剥離フィルム（図示しない）をさらに備えていてもよい。半導体表面保護用粘着テープ１は、基材フィルム２、粘着剤層３、および剥離フィルムの長尺の積層体をロール状に巻いてもよいし、所定の長さごとに切断しシート状にしてもよい。また、基材フィルム２、粘着剤層３、および剥離フィルムの長尺の積層体において、従来のダイシングテープのように基材フィルム２および粘着剤層３のみ予め所定のラベル形状に打ち抜く加工（いわゆるプリカット加工）をしてもよい。以下、本実施形態の電子部品用粘着テープ１の各構成要素について詳細に説明する。 As shown in FIG. 1, an adhesive tape 1 for an electronic component according to an embodiment of the present invention has at least one adhesive applied to at least one surface of a base film 2 to form an adhesive layer 3. . Moreover, the semiconductor surface protecting pressure-sensitive adhesive tape 1 may further include a release film (not shown) for protecting the pressure-sensitive adhesive layer 3 on the pressure-sensitive adhesive layer 3. The adhesive tape 1 for protecting a semiconductor surface may be obtained by winding a long laminate of a base film 2, an adhesive layer 3, and a release film into a roll shape, or cutting it into a sheet shape for each predetermined length. Also good. Further, in a long laminate of the base film 2, the pressure-sensitive adhesive layer 3, and the release film, only the base film 2 and the pressure-sensitive adhesive layer 3 are punched into a predetermined label shape in advance (so-called dicing tape) Pre-cut processing) may be performed. Hereinafter, each component of the adhesive tape 1 for electronic components of this embodiment is demonstrated in detail.
（基材フィルム２）
基材フィルム２は、特に限定されるものではなく、樹脂フィルム、紙や不織布で構成することができる。ただし、樹脂フィルムは、紙や不織布と比べて塵芥発生が少ないために電子部品の取り扱いに好適であり、入手が容易であるため好ましい。
(Base film 2)
The base film 2 is not particularly limited, and can be composed of a resin film, paper, or nonwoven fabric. However, a resin film is preferable because it generates less dust than paper and non-woven fabric and is suitable for handling electronic components and is easily available.
また、半導体ウエハをチップ状に個片化（ダイシング）し、個片化された半導体チップを外国など工場外へ搬送し、搬送先でプリント基板などに実装することも考えられる。このような場合に、電子部品用粘着テープ１を用いて、半導体ウエハをチップ状に個片化した後、そのまま個片化された半導体チップを搬送することができれば、利便性がよい。このように、電子部品用粘着テープ１を半導体ウエハを個片化するためのダイシング工程にも使用するためには、基材フィルム２は、ポリエチレン、ポリプロピレンおよびポリブテンのようなポリオレフィン；エチレン−酢酸ビニル共重合体、エチレン−（メタ）アクリル酸共重合体およびエチレン−（メタ）アクリル酸エステル共重合体のようなエチレン共重合体；軟質ポリ塩化ビニル、ポリエチレンテレフタレート、ポリエチレンナフタレート、半硬質ポリ塩化ビニル、ポリエステル、ポリウレタン、ポリアミド、ポリイミド、天然ゴムならびに合成ゴムなどの高分子材料、またはこれらの群から選ばれる２種以上が混合されたものもしくは複層化されたものが好ましい。基材フィルム２の厚さは１０〜５００μｍが好ましく、５０〜２００μｍがより好ましい。 It is also conceivable to divide the semiconductor wafer into chips (dicing), transport the separated semiconductor chip outside the factory, such as in a foreign country, and mount it on a printed circuit board or the like at the transport destination. In such a case, it is convenient if the semiconductor wafer is separated into chips using the adhesive tape 1 for electronic parts and then the separated semiconductor chips can be transported as they are. Thus, in order to use the adhesive tape 1 for electronic parts also in the dicing process for separating the semiconductor wafer into pieces, the base film 2 is made of polyolefin such as polyethylene, polypropylene and polybutene; ethylene-vinyl acetate. Ethylene copolymers such as copolymers, ethylene- (meth) acrylic acid copolymers and ethylene- (meth) acrylic acid ester copolymers; soft polyvinyl chloride, polyethylene terephthalate, polyethylene naphthalate, semi-rigid polychlorinated Polymer materials such as vinyl, polyester, polyurethane, polyamide, polyimide, natural rubber and synthetic rubber, or a mixture of two or more selected from these groups or a multilayered material is preferable. 10-500 micrometers is preferable and, as for the thickness of the base film 2, 50-200 micrometers is more preferable.
（粘着剤層３）
粘着剤層３は、電子部品用粘着テープ１において、シリコンミラー面に貼合後、２３℃、５０％ＲＨの環境下で1時間放置した後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで測定した前記シリコンミラー面に対する粘着力をＰ１とし、シリコンミラー面に貼合後、６０℃、５０％ＲＨの環境下で1週間放置した後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで測定した前記シリコンミラー面に対する粘着力をＰ２としたとき、０Ｎ／２５ｍｍ≦Ｐ２−Ｐ１≦０．７Ｎ／２５ｍｍとなるものであれば、特に限定されるものではない。
(Adhesive layer 3)
The pressure-sensitive adhesive layer 3 is bonded to the silicon mirror surface of the pressure-sensitive adhesive tape 1 for electronic parts, left in an environment of 23 ° C. and 50% RH for 1 hour, and then peeled off at 23 ° C. and 50% RH. The adhesive strength to the silicon mirror surface measured at 90 degrees and a peeling speed of 50 mm / min is P1, and after bonding to the silicon mirror surface, it is left in an environment of 60 ° C. and 50% RH for 1 week, then 23 ° C., 50 What is 0N / 25mm ≦ P2−P1 ≦ 0.7N / 25mm, where P2 is the adhesive force to the silicon mirror surface measured at a peeling angle of 90 degrees and a peeling speed of 50 mm / min under the condition of% RH For example, there is no particular limitation.
粘着剤を構成する主成分のポリマー（粘着ポリマーでベースポリマーとも称す）は、（メタ）アクリル樹脂、エポキシ樹脂、天然ゴム系の樹脂、合成ゴム系の樹脂などの様々な種類のポリマーの中から適宜選択して用いることができるが、これらの中でも（メタ）アクリル樹脂であることが好ましい。（メタ）アクリル樹脂は粘着力の制御が容易である。 The main component of the adhesive (adhesive polymer, also called base polymer) is a variety of polymers such as (meth) acrylic resins, epoxy resins, natural rubber resins, and synthetic rubber resins. Although it can select and use suitably, among these, it is preferable that it is a (meth) acrylic resin. The (meth) acrylic resin is easy to control the adhesive force.
粘着剤を構成する主成分のポリマーは、ガラス転移温度が、−６５℃〜−３０℃であることが好ましい。ここで、ガラス転移温度は、昇温速度０．１℃／分でＤＳＣ（示差走査熱量計）により測定されたガラス転移温度をいう。ガラス転移温度が−３０℃を超えると、被着体への密着性が向上しやすくなるため、電子部品を剥離した際に、電子部品に粘着剤が付着する糊残りが発生するおそれがある。ガラス転移温度が−６５℃未満であると、粘着剤のベタツキが強くなり、作業時のハンドリングに悪影響を及ぼすため好ましくない。 The main component polymer constituting the pressure-sensitive adhesive preferably has a glass transition temperature of −65 ° C. to −30 ° C. Here, the glass transition temperature refers to a glass transition temperature measured by DSC (differential scanning calorimeter) at a temperature rising rate of 0.1 ° C./min. When the glass transition temperature exceeds −30 ° C., the adhesion to the adherend is likely to be improved. Therefore, when the electronic component is peeled off, there is a possibility that an adhesive residue to which the adhesive adheres to the electronic component may be generated. If the glass transition temperature is less than −65 ° C., the stickiness of the pressure-sensitive adhesive becomes strong and adversely affects handling during work, which is not preferable.
上述のように、電子部品用粘着テープ１を半導体ウエハを個片化するためのダイシング工程にも使用する場合は、粘着剤層３は、放射線を照射することにより硬化する放射線硬化型であることが好ましい。放射線硬化型の粘着剤層３を構成する粘着剤組成物としては、粘着剤を構成するポリマーと放射線重合性化合物を併用するか、または粘着剤を構成するポリマー中に、放射線で重合する官能基（好ましくはエチレン性不飽和基）を組み込んだポリマーを使用することができる。放射線での重合を促進するため、光重合開始剤を含むことが好ましい。また、架橋剤を含有することも好ましい。粘着剤を構成するポリマーに架橋剤と反応しうる官能基をもったモノマーを組み込むことで、膜硬度やゲル分率を調整することができる。さらに、必要に応じて、上記以外の添加剤や添加物を含有させることもできる。 As described above, when the adhesive tape 1 for electronic parts is also used for a dicing process for separating a semiconductor wafer, the adhesive layer 3 is a radiation curable type that is cured by irradiation with radiation. Is preferred. The pressure-sensitive adhesive composition constituting the radiation-curable pressure-sensitive adhesive layer 3 includes a polymer that forms a pressure-sensitive adhesive and a radiation polymerizable compound, or a functional group that is polymerized by radiation in the polymer that forms the pressure-sensitive adhesive. Polymers incorporating (preferably ethylenically unsaturated groups) can be used. In order to promote polymerization with radiation, it is preferable to include a photopolymerization initiator. It is also preferable to contain a crosslinking agent. Film hardness and gel fraction can be adjusted by incorporating a monomer having a functional group capable of reacting with a crosslinking agent into the polymer constituting the pressure-sensitive adhesive. Furthermore, additives and additives other than those described above can be included as necessary.
粘着剤を構成する主成分のポリマーは、（メタ）アクリル共重合樹脂であることが好ましい。（メタ）アクリル樹脂とすることによって粘着力の制御が容易になり、ゲル分率などをコントロールできるため、粘着剤の残渣が電子部品の表面に残ってしまう、いわゆる糊残りや有機物による汚染を少なくすることができる。ポリマーが（メタ）アクリル樹脂である場合、ポリマーを構成する主モノマーとしては、（メタ）アクリル酸アルキルエステルまたは２種以上の異なる（メタ）アクリル酸アルキルエステルのモノマー混合物が好ましい。 The main component polymer constituting the pressure-sensitive adhesive is preferably a (meth) acrylic copolymer resin. By using (meth) acrylic resin, the adhesive force can be easily controlled and the gel fraction and the like can be controlled. Therefore, the adhesive residue remains on the surface of electronic components, so-called adhesive residue and organic contamination are reduced. can do. When the polymer is a (meth) acrylic resin, the main monomer constituting the polymer is preferably a (meth) acrylic acid alkyl ester or a monomer mixture of two or more different (meth) acrylic acid alkyl esters.
（メタ）アクリル酸のアルキルエステルの具体例としては、例えば（メタ）アクリル酸メチル、（メタ）アクリル酸エチル、（メタ）アクリル酸プロピル、（メタ）アクリル酸ブチル、（メタ）アクリル酸イソブチル、（メタ）アクリル酸イソアミル、（メタ）アクリル酸ヘキシル、（メタ）アクリル酸２−エチルヘキシル、（メタ）アクリル酸イソオクチル、（メタ）アクリル酸イソノニル、（メタ）アクリル酸イソデシルなどが挙げられる。これらは単独で使用してもよいし、２種以上を混合して使用してもよい。 Specific examples of alkyl esters of (meth) acrylic acid include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, Examples thereof include isoamyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, and isodecyl (meth) acrylate. These may be used singly or in combination of two or more.
本発明では２種以上を混合して用いられることが好ましく、２種以上を混合することで様々な粘着剤としての機能を発揮させることができる。３種以上を混合することが更に好ましく、（メタ）アクリル酸メチル、アクリル酸ブチル、（メタ）アクリル酸２−エチルヘキシル、（メタ）アクリル酸、（メタ）アクリル酸２−ヒドロキシエチル、（メタ）アクリル酸グリシジル、後述の２−イソシアナトエチル（メタ）アクリレートから選択される３種以上、好ましくは４種以上を少なくとも共重合することが特に好ましい。３種類以上のモノマーを共重合することで電子部品への密着性および糊残りを含む非汚染性を両立できるようになる。
本発明においては、上記に加え、重合性基を有するモノマー成分、多官能モノマー、架橋剤と反応しうる官能基を有するモノマー成分を使用することが好ましい。
In the present invention, it is preferable to use a mixture of two or more types, and by mixing two or more types, various functions as an adhesive can be exhibited. More preferably, 3 or more types are mixed, methyl (meth) acrylate, butyl acrylate, 2-ethylhexyl (meth) acrylate, (meth) acrylic acid, 2-hydroxyethyl (meth) acrylate, (meth) It is particularly preferable to copolymerize at least three, preferably at least four selected from glycidyl acrylate and 2-isocyanatoethyl (meth) acrylate described below. By copolymerizing three or more types of monomers, it is possible to achieve both adhesion to electronic components and non-contamination including adhesive residue.
In the present invention, in addition to the above, it is preferable to use a monomer component having a polymerizable group, a polyfunctional monomer, and a monomer component having a functional group capable of reacting with a crosslinking agent.
放射線（好ましくは紫外線）に反応するためのモノマーとして、アルコール部にイソシアネート（−Ｎ＝Ｃ＝Ｏ）基を有する（メタ）アクリル酸エステルが挙げられ、なかでもイソシアネート（−Ｎ＝Ｃ＝Ｏ）基で置換された（メタ）アクリル酸アルキルエステルが好ましい。このようなモノマーとしては、例えば、２−イソシアナトエチルメタクリレート、２−イソシアナトエチルアクリレートなどが挙げられる。これらを適宜、アクリルポリマー共重合体に加えてアクリルポリマー共重合体の側鎖の水酸基と反応することで共重合体に重合性基を組み込むことができ、放射線照射後の粘着力を低下させることができる。 Examples of the monomer for reacting with radiation (preferably ultraviolet rays) include (meth) acrylic acid ester having an isocyanate (—N═C═O) group in the alcohol portion, and among them, isocyanate (—N═C═O). (Meth) acrylic acid alkyl esters substituted with groups are preferred. Examples of such a monomer include 2-isocyanatoethyl methacrylate and 2-isocyanatoethyl acrylate. As appropriate, these can be added to the acrylic polymer copolymer and reacted with the hydroxyl group of the side chain of the acrylic polymer copolymer to incorporate a polymerizable group into the copolymer, thereby reducing the adhesive strength after irradiation. Can do.
放射線（好ましくは紫外線）に反応するモノマーのポリマー中への含有量はポリマー１００質量に対し３０〜９０質量％が好ましく、４０〜８０質量％がより好ましい。
また、放射線（好ましくは紫外線）に反応するモノマーのポリマー中へ組み込みは、水酸基、カルボキシル基、エポキシ基、アミノ基などの官能基を側鎖に有するポリマーを合成した後に、この官能基と反応する官能基を有する放射線（好ましくは紫外線）に反応するモノマーを加えて反応させることによって得ることができる。
The content of the monomer that reacts with radiation (preferably ultraviolet rays) in the polymer is preferably 30 to 90% by mass, more preferably 40 to 80% by mass with respect to 100% by mass of the polymer.
In addition, incorporation of a monomer that reacts with radiation (preferably ultraviolet rays) into a polymer reacts with this functional group after synthesizing a polymer having a functional group such as a hydroxyl group, a carboxyl group, an epoxy group, or an amino group in the side chain. It can be obtained by adding a monomer that reacts with radiation having a functional group (preferably ultraviolet rays) and reacting it.
粘着剤に含まれるポリマーは、架橋剤と反応し得る官能基を有していてもよく、架橋剤と反応し得る官能基としては、水酸基、カルボキシル基、エポキシ基、アミノ基などが挙げられる。粘着剤ポリマー中にこれらの架橋剤と反応しうる官能基を導入する方法としては、ポリマーを重合する際にこれらの官能基を有するモノマーを共重合させる方法が一般に用いられる。 The polymer contained in the pressure-sensitive adhesive may have a functional group that can react with the crosslinking agent, and examples of the functional group that can react with the crosslinking agent include a hydroxyl group, a carboxyl group, an epoxy group, and an amino group. As a method for introducing functional groups capable of reacting with these crosslinking agents into the pressure-sensitive adhesive polymer, a method of copolymerizing monomers having these functional groups when polymerizing the polymer is generally used.
また、粘着剤層のゲル分率の調整のため、粘着剤に含まれるポリマーを重合する際に多官能モノマー成分を共重合することができる。
これらの多官能モノマー成分の官能基としては、（メタ）アクリロイル基、ビニル基、アリル基が挙げられる。
Moreover, in order to adjust the gel fraction of the pressure-sensitive adhesive layer, a polyfunctional monomer component can be copolymerized when the polymer contained in the pressure-sensitive adhesive is polymerized.
Examples of the functional group of these polyfunctional monomer components include (meth) acryloyl group, vinyl group, and allyl group.
多官能モノマーとしては、例えばジエチレングリコールジアクリレート、ジエチレングリコールジメタクリレート、エチレングリコールジアクリレート、エチレングリコールジメタクリレート、テトラエチレングリコールジアクリレート、テトラエチレングリコールジメタクリレート、ネオペンチルグリコールジアクリレート、ネオペンチルグリコールジメタクリレート、１，６−ヘキサンジオールジアクリレート、１，６−ヘキサンジオールジメタクリレート、トリメチロールプロパントリアクリレート、トリメチロールプロパントリメタクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールトリメタクリレート、ジペンタエリスリトールヘキサアクリレート、ジペンタエリスリトールヘキサメタクリレート、ジビニルベンゼンなどが挙げられる。 Examples of the polyfunctional monomer include diethylene glycol diacrylate, diethylene glycol dimethacrylate, ethylene glycol diacrylate, ethylene glycol dimethacrylate, tetraethylene glycol diacrylate, tetraethylene glycol dimethacrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate, 1 , 6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate Jibi Rubenzen and the like.
これらの多官能モノマーは、粘着剤に含まれるポリマー成分として組み込む以外に、粘着剤ポリマーに併用して含有する放射線重合性化合物として使用することも好ましい。
この場合、粘着剤ポリマーは放射線の重合性基を有していても有していなくても構わない。
粘着剤ポリマーに併用して含有する放射線重合性化合物として使用する場合、放射線重合性化合物の配合量は、粘着剤ポリマー１００質量部に対して、３０〜２００質量部が好ましく、１００〜１５０質量部がより好ましい。
These polyfunctional monomers are preferably used as a radiation-polymerizable compound contained in combination with the pressure-sensitive adhesive polymer, in addition to being incorporated as a polymer component contained in the pressure-sensitive adhesive.
In this case, the pressure-sensitive adhesive polymer may or may not have a radiation polymerizable group.
When used as a radiation-polymerizable compound contained in combination with a pressure-sensitive adhesive polymer, the amount of the radiation-polymerizable compound is preferably 30 to 200 parts by weight, preferably 100 to 150 parts by weight, based on 100 parts by weight of the pressure-sensitive adhesive polymer. Is more preferable.
放射線硬化型の粘着剤層３を構成する粘着剤は、例えば、特公平１−５６１１２号公報、特開平７−１３５１８９号公報などに記載のものが好ましく使用されるがこれらに限定されることはない。 As the pressure-sensitive adhesive constituting the radiation curable pressure-sensitive adhesive layer 3, for example, those described in JP-B-1-56112, JP-A-7-135189 and the like are preferably used, but are not limited thereto. Absent.
粘着剤には、光重合開始剤を含有させることで、放射線照射による硬化反応を効率的に行うことができ、好ましい。
光重合開始剤としては、４，４’−ビス（ジエチルアミノ）ベンゾフェノン、２−ヒドロキシ−２−メチルプロピオフェノン、２，２−ジメトキシ−１，２−ジフェニルエタン−１−オン、２−ヒロドキシ−１−｛４−［４−（２−ヒドロキシ−２−メチル−プロピオニル）−ベンジル］フェニル｝−２−メチル−プロパン−１−オン、１−［４−（２−ヒドロキシエトキシ）−フェニル］−２−ヒドロキシ−２−メチル−１−プロパン−１−オンなどが挙げられる。
光重合開始剤の配合量は、ベースポリマー１００質量部に対して、１〜１０質量部が好ましく、２〜５質量部がより好ましい。
It is preferable that the pressure-sensitive adhesive contains a photopolymerization initiator because a curing reaction by radiation irradiation can be efficiently performed.
As photopolymerization initiators, 4,4′-bis (diethylamino) benzophenone, 2-hydroxy-2-methylpropiophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2-hydroxy- 1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propan-1-one, 1- [4- (2-hydroxyethoxy) -phenyl]- 2-hydroxy-2-methyl-1-propan-1-one and the like can be mentioned.
1-10 mass parts is preferable with respect to 100 mass parts of base polymers, and, as for the compounding quantity of a photoinitiator, 2-5 mass parts is more preferable.
上記ベースポリマーに凝集力を付加するために架橋剤を配合することができる。
特に、ベースポリマーが（メタ）アクリル樹脂の場合、硬化剤を配合することによって粘着力が制御される。硬化剤の配合部数を調整することで所定の粘着力を得ることができる。
このような架橋剤としては、例えばイソシアネート系架橋剤、エポキシ系架橋剤、金属キレート系架橋剤、アジリジン系架橋剤、アミン樹脂などが挙げられる。
架橋剤の配合量は、ベースポリマー１００質量部に対して、１〜１０質量部が好ましく、３〜５質量部がより好ましい。
In order to add cohesive force to the base polymer, a crosslinking agent can be blended.
In particular, when the base polymer is a (meth) acrylic resin, the adhesive force is controlled by blending a curing agent. A predetermined adhesive force can be obtained by adjusting the number of parts of the curing agent.
Examples of such a crosslinking agent include an isocyanate crosslinking agent, an epoxy crosslinking agent, a metal chelate crosslinking agent, an aziridine crosslinking agent, and an amine resin.
1-10 mass parts is preferable with respect to 100 mass parts of base polymers, and, as for the compounding quantity of a crosslinking agent, 3-5 mass parts is more preferable.
さらに粘着剤には、本発明の目的が損なわれない範囲で、所望により、各種添加成分を含有させることができる。 Further, the pressure-sensitive adhesive can contain various additive components as desired within the range in which the object of the present invention is not impaired.
粘着剤層３は、上述のような粘着剤組成物を、基材フィルム２上に塗布し、乾燥させることで形成することができる。粘着剤層３の厚さは、５〜３０μｍであることが好ましい。 The pressure-sensitive adhesive layer 3 can be formed by applying the pressure-sensitive adhesive composition as described above onto the base film 2 and drying it. The thickness of the pressure-sensitive adhesive layer 3 is preferably 5 to 30 μm.
なお、粘着剤層３は複数の層が積層された構成であってもよい。複数の層を有する場合は、少なくとも一層は上述の放射線硬化型の粘着剤を使用することが好ましいが、それ以外の層に、加熱発泡型の粘着剤も用いることができる。放射線硬化型の粘着剤は、紫外線、電子線などで硬化し、剥離時には剥離しやすくするものであり、加熱発泡型の粘着剤は、発泡剤や膨張剤により剥離しやすくするものである。また、基材フィルム２と粘着剤層３の間に、必要に応じてプライマー層などの中間層を設けてもよい。 The pressure-sensitive adhesive layer 3 may have a configuration in which a plurality of layers are laminated. In the case of having a plurality of layers, it is preferable to use the above-mentioned radiation-curable pressure-sensitive adhesive for at least one layer, but a heat-foaming pressure-sensitive adhesive can also be used for the other layers. The radiation curable pressure-sensitive adhesive is cured by ultraviolet rays, electron beams or the like and easily peeled off at the time of peeling. The heat-foaming pressure-sensitive adhesive is easily peeled off by a foaming agent or an expanding agent. Moreover, you may provide intermediate | middle layers, such as a primer layer, between the base film 2 and the adhesive layer 3 as needed.
また、必要に応じて、実用に供するまでの間、粘着剤層３を保護するため通常セパレータとして用いられる剥離フィルムを粘着剤層３側に貼付しておいても良い。剥離フィルムの構成材料としては、ポリエチレン、ポリプロピレン、ポリエチレンテレフタレートなどの合成樹脂フィルムや紙などが挙げられる。合成樹脂フィルムの表面には、粘着剤層３からの剥離性を高めるため、必要に応じてシリコーン処理、長鎖アルキル処理、フッ素処理などの剥離処理が施されていても良い。剥離フィルムの厚みは、通常１０〜１００μｍ、好ましくは２５〜５０μｍ程度である。 Moreover, you may stick the peeling film normally used as a separator on the adhesive layer 3 side in order to protect the adhesive layer 3 until it uses for practical use as needed. Examples of the constituent material of the release film include synthetic resin films such as polyethylene, polypropylene, and polyethylene terephthalate, and paper. The surface of the synthetic resin film may be subjected to a release treatment such as silicone treatment, long-chain alkyl treatment, or fluorine treatment as necessary in order to enhance the peelability from the pressure-sensitive adhesive layer 3. The thickness of the release film is usually about 10 to 100 μm, preferably about 25 to 50 μm.
本実施形態の電子部品用粘着テープ１は、シリコンミラー面に貼合後、２３℃、５０％ＲＨの環境下で1時間放置した後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで測定した前記シリコンミラー面に対する粘着力をＰ１とし、シリコンミラー面に貼合後、６０℃、５０％ＲＨの環境下で1週間放置した後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで測定した前記シリコンミラー面に対する粘着力をＰ２としたとき、０Ｎ／２５ｍｍ≦Ｐ２−Ｐ１≦０．７Ｎ／２５ｍｍである。粘着力は、上記条件以外については、ＪＩＳ Ｚ ０２３７の８．３．２に準拠して測定する。 The adhesive tape 1 for electronic parts of this embodiment is bonded to a silicon mirror surface, left in an environment of 23 ° C. and 50% RH for 1 hour, and then peeled at 90 ° under conditions of 23 ° C. and 50% RH. The adhesive strength with respect to the silicon mirror surface measured at a peeling speed of 50 mm / min is P1, and after bonding to the silicon mirror surface, it is left in an environment of 60 ° C. and 50% RH for 1 week, and then 23 ° C. and 50% RH. Assuming that the adhesive force to the silicon mirror surface measured at a peeling angle of 90 degrees and a peeling speed of 50 mm / min is P2, 0 N / 25 mm ≦ P2-P1 ≦ 0.7 N / 25 mm. The adhesive strength is measured according to JIS Z 0237 8.3.2 except for the above conditions.
ここで、上述のようなダイシング工程にも使用できる放射線硬化型の電子部品用粘着テープ１の場合は、電子部品を貼着して搬送した後、搬送先で放射線を照射し粘着剤層３を硬化させるタイプの電子部品用粘着テープ１とすることもできるが、電子部品を貼着した後、放射線照射により粘着剤層を硬化させた状態で搬送するタイプの電子部品用粘着テープ１とすることが好ましい。これは、搬送時の粘着力の上昇が抑制されやすいためである。電子部品を貼着した後、放射線照射により粘着剤層を硬化させた状態で搬送するタイプの電子部品用粘着テープ１の場合は、電子部品用粘着テープ１の試験片をシリコンミラー面に貼合後、放射線を照射することにより粘着剤層を硬化させた後に所定の環境下で放置し、その後に粘着剤力を測定する。 Here, in the case of the radiation-curing type electronic component adhesive tape 1 that can be used in the dicing process as described above, after the electronic component is attached and conveyed, the adhesive layer 3 is irradiated with radiation at the conveyance destination. Although it can be set as the type of adhesive tape 1 for electronic parts to be cured, the adhesive tape 1 for electronic parts that is transported in a state where the adhesive layer is cured by radiation irradiation after the electronic parts are attached is used. Is preferred. This is because an increase in adhesive force during conveyance is easily suppressed. In the case of the pressure-sensitive adhesive tape 1 for electronic components that is transported in a state where the pressure-sensitive adhesive layer is cured by radiation irradiation after the electronic components are bonded, the test piece of the pressure-sensitive adhesive tape 1 for electronic components is bonded to the silicon mirror surface. Thereafter, the pressure-sensitive adhesive layer is cured by irradiation with radiation, and then left in a predetermined environment, and then the pressure-sensitive adhesive force is measured.
Ｐ２−Ｐ１が０Ｎ／２５ｍｍより小さいと、搬送中に電子部品が電子部品用粘着テープ１から脱離してしまうおそれがある。Ｐ２−Ｐ１が０．７Ｎ／２５ｍｍより大きいと、電子部品を搬送した後、電子部品用粘着テープ１から電子部品を剥離する際に、剥離できなかったり、剥離できても粘着剤が電子部品に付着してしまう。 If P2-P1 is smaller than 0 N / 25 mm, the electronic component may be detached from the electronic component adhesive tape 1 during conveyance. When P2-P1 is larger than 0.7 N / 25 mm, when the electronic component is peeled from the electronic component pressure-sensitive adhesive tape 1 after transporting the electronic component, the adhesive cannot be peeled or can be peeled off. It will stick.
電子部品用粘着テープ１において０Ｎ／２５ｍｍ≦Ｐ２−Ｐ１≦０．７Ｎ／２５ｍｍとなるようにするには、Ｐ１，Ｐ２をそれぞれ調節するとよい。Ｐ１は、粘着剤層３を構成するベースポリマーのガラス転移温度を上げたり、硬化剤の量を減らすことで高くすることができ、逆に、ベースポリマーのガラス転移温度を下げたり、硬化剤の量を増やすことで低くすることができる。また、Ｐ２は、粘着剤層３を構成するベースポリマーのガラス転移温度を上げたり、硬化剤の量を減らす、あるいは粘着剤ポリマーの炭素−炭素ニ重結合量を上げることで高くすることができ、逆に、ベースポリマーのガラス転移温度を下げたり、硬化剤の量を増やす、あるいは粘着剤ポリマーの炭素−炭素ニ重結合量を下げることで低くすることができる。 In order to satisfy 0N / 25 mm ≦ P2-P1 ≦ 0.7 N / 25 mm in the adhesive tape 1 for electronic components, P1 and P2 may be adjusted. P1 can be increased by increasing the glass transition temperature of the base polymer constituting the pressure-sensitive adhesive layer 3 or by reducing the amount of the curing agent. Conversely, the glass transition temperature of the base polymer can be decreased, It can be lowered by increasing the amount. P2 can be increased by increasing the glass transition temperature of the base polymer constituting the pressure-sensitive adhesive layer 3, decreasing the amount of the curing agent, or increasing the amount of carbon-carbon double bonds in the pressure-sensitive adhesive polymer. Conversely, it can be lowered by decreasing the glass transition temperature of the base polymer, increasing the amount of the curing agent, or decreasing the amount of carbon-carbon double bonds in the pressure-sensitive adhesive polymer.
また、Ｐ２は０．１Ｎ／２５ｍｍ〜０．８Ｎ／２５ｍｍであることが好ましい。 P2 is preferably 0.1 N / 25 mm to 0.8 N / 25 mm.
＜使用方法＞
次に、本発明の電子部品用粘着テープ１の使用方法について説明する。本発明の電子部品用粘着テープ１は、電子部品を高温多湿の環境で数週間程度と長期間にわたって搬送するのに好適に用いられる。電子部品は、特に限定されるものではなく、広く電気製品に使用される部品を貼着固定して搬送することができるが、特に板状の比較的小さな部品の搬送に好適に用いられる。例えば、ＩＣ（Ｉｎｔｅｇｒａｔｅｄ Ｃｉｒｃｕｉｔ）、抵抗器、コンデンサ、コイルといったチップ型電子部品や、半導体ウエハを個片化した状態のベアチップ、カバーガラス、光学ガラス、ＩＲフィルタに使用できる。
<How to use>
Next, the usage method of the adhesive tape 1 for electronic components of this invention is demonstrated. The pressure-sensitive adhesive tape 1 for electronic parts of the present invention is suitably used for transporting electronic parts over a long period of about several weeks in a hot and humid environment. The electronic component is not particularly limited, and components used widely in electrical products can be adhered and fixed, and can be transported, but is particularly suitable for transporting relatively small plate-shaped components. For example, it can be used for chip-type electronic components such as ICs (Integrated Circuits), resistors, capacitors, and coils, bare chips in a state where a semiconductor wafer is separated, a cover glass, an optical glass, and an IR filter.
まず、剥離フィルムが設けられている場合は、剥離フィルムを剥離して粘着剤層３を露出させ、粘着剤層３をリングフレームに貼り付ける。電子部品用粘着テープ１がプリカットされていない場合は、リングフレームの形状に合わせて電子部品用粘着テープ１をカットする。その後、リングフレームに支持された電子部品用粘着テープ１の粘着剤層３に、電子部品をピックアップマシンにて載置して貼着する。次いで、必要に応じて、電子部品用粘着テープ１の基材フィルム２側から放射線、例えば紫外線を照射して粘着剤層３を硬化させる。その後、ウエハカセットのような保護用の収納容器にリングフレームごと収納して、コンテナなどに積み込んで船便などで搬送する。 First, when a release film is provided, the release film is peeled to expose the pressure-sensitive adhesive layer 3, and the pressure-sensitive adhesive layer 3 is attached to the ring frame. When the adhesive tape 1 for electronic components is not pre-cut, the adhesive tape 1 for electronic components is cut according to the shape of the ring frame. Then, an electronic component is mounted and stuck on the adhesive layer 3 of the adhesive tape 1 for electronic components supported by the ring frame with a pickup machine. Next, if necessary, the pressure-sensitive adhesive layer 3 is cured by irradiating radiation, for example, ultraviolet rays, from the base film 2 side of the pressure-sensitive adhesive tape 1 for electronic components. Thereafter, the entire ring frame is stored in a protective storage container such as a wafer cassette, loaded into a container, etc., and transported by sea mail or the like.
次に、半導体ウエハを個片化した状態のベアチップを搬送する場合の電子部品用粘着テープ１の使用方法についてより詳細に説明する。 Next, the usage method of the adhesive tape 1 for electronic components when conveying the bare chip of the state which separated the semiconductor wafer is demonstrated in detail.
まず、剥離フィルムが設けられている場合は、剥離フィルムを剥離して粘着剤層３を露出させ、粘着剤層３をリングフレームに貼り付け、半導体ウエハを粘着剤層３に貼り合わせる。これらの貼り付け順序に制限はなく、半導体ウエハを粘着剤層３に貼り合わせた後に粘着剤層３をリングフレームに貼り付けてもよい。また、リングフレームへの貼り付けと、半導体ウエハの貼り合わせとを、同時に行っても良い。これらの貼合工程は、従来のダイシング工程の前段階として行われる貼合工程と同じ手法で実施することができる。 First, when a release film is provided, the release film is peeled to expose the pressure-sensitive adhesive layer 3, the pressure-sensitive adhesive layer 3 is bonded to the ring frame, and the semiconductor wafer is bonded to the pressure-sensitive adhesive layer 3. There is no restriction | limiting in these sticking orders, and after bonding a semiconductor wafer to the adhesive layer 3, you may adhere the adhesive layer 3 to a ring frame. Further, the bonding to the ring frame and the bonding of the semiconductor wafer may be performed simultaneously. These bonding processes can be implemented by the same technique as the bonding process performed as a previous stage of the conventional dicing process.
そして、半導体ウエハのダイシング工程を実施し、次いで、必要に応じて、粘着フィルム３に放射線、例えば紫外線を照射する工程を実施する。これらの工程は、従来のダイシング工程や放射線照射工程と同じ手法で実施することができる。 And the dicing process of a semiconductor wafer is implemented, and then the process of irradiating the adhesive film 3 with radiation, for example, ultraviolet rays, is performed if necessary. These steps can be performed by the same technique as the conventional dicing step and radiation irradiation step.
その後、ウエハカセットのような保護用の収納容器にリングフレームごと収納して、コンテナなどに積み込んで船便などで搬送する。 Thereafter, the entire ring frame is stored in a protective storage container such as a wafer cassette, loaded into a container, etc., and transported by sea mail or the like.
その後は、搬送先で、電子部品用粘着テープ１に貼着保持されている半導体チップのピックアップ工程を実施する。この工程は、従来の半導体チップのピックアップ工程と同じ手法で実施することができる。このように、ベアチップの場合、電子部品用粘着テープ１を搬送用のテープとしてもダイシングテープとしても使用することができるが、別途、従来のダイシングテープを用いてダイシングした後、ベアチップをピックアップするあるいはそまま転写するなどして本願発明による電子部品用粘着テープ１に貼り付けて搬送してもよい。 After that, the pick-up process of the semiconductor chip stuck and held on the adhesive tape 1 for electronic parts is carried out at the transport destination. This step can be performed by the same method as the conventional semiconductor chip pick-up step. As described above, in the case of a bare chip, the electronic component adhesive tape 1 can be used as a transport tape or a dicing tape. Alternatively, after dicing using a conventional dicing tape, the bare chip is picked up. It may be transferred as it is and affixed to the adhesive tape 1 for electronic parts according to the present invention.
なお、従来のダイシングテープを用いて、船便など高温多湿の環境下で長期間搬送した場合、搬送先で電子部品を剥離しようとしたときに、剥離できなかったり、剥離できても電子部品に糊残りが発生したりしてしまう。 In addition, when the conventional dicing tape is used for transport over a long period of time in a hot and humid environment such as sea mail, when an electronic component is peeled off at the transport destination, it cannot or cannot be peeled off. The rest will occur.
以下、本発明を実施例に基づき、さらに詳細に説明するが、本発明はこれら実施例に限定されるものではない。 EXAMPLES Hereinafter, although this invention is demonstrated further in detail based on an Example, this invention is not limited to these Examples.
（基材フィルムの作製）
エチレン−メタクリル酸−（アクリル酸２−メチル−プロピル）３元共重合体−Ｚｎ++‐アイオノマー樹脂であるハイミランＡＭ−７３１６（商品名、三井・デュポンポリケミカル株式会社製）を使用し、厚さ８０μｍのフィルムを押出成形で作製し、基材フィルムとした。
(Preparation of base film)
Ethylene-methacrylic acid- (2-methyl-propyl acrylate) terpolymer-Zn ++ -ionomer resin Himiran AM-7316 (trade name, manufactured by Mitsui DuPont Polychemical Co., Ltd.) A film having a thickness of 80 μm was produced by extrusion molding to obtain a base film.
（粘着剤層の原材料）
＜ポリマー＞
ポリマーＡ：２−エチルへキシルアクリレート７０重量％、２−ヒドロキシエチルアクリレート２９重量％、メタクリル酸１重量％を構成単位とするアクリル共重合体（ガラス転位温度：−６５℃）に、２−メタクリロイルオキシエチルイソシアネートを二重結合量が１．０（ｍｅｑ／ｇ）になるよう付与した。
ポリマーＢ：２−エチルへキシルアクリレート７０重量％、２−ヒドロキシエチルアクリレート２９重量％、メタクリル酸１重量％を構成単位とするアクリル共重合体（ガラス転位温度：−６５℃）に、２−メタクリロイルオキシエチルイソシアネートを二重結合量が０．５（ｍｅｑ／ｇ）になるよう付与した。
ポリマーＣ：ブチルアクリレート７０重量％、２−ヒドロキシエチルアクリレート２９重量％、メタクリル酸１重量％を構成単位とするアクリル共重合体（ガラス転位温度：−４０℃）に、２−メタクリロイルオキシエチルイソシアネートを二重結合量が１．５（ｍｅｑ／ｇ）になるよう付与した。
ポリマーＤ：２−エチルへキシルアクリレート６７重量％、２−ヒドロキシエチルアクリレート２５重量％、メタクリル酸メチル７重量％、メタクリル酸１重量％を構成単位とするアクリル共重合体（ガラス転位温度：−５５℃）に、２−メタクリロイルオキシエチルイソシアネートを二重結合量が１．０（ｍｅｑ／ｇ）になるよう付与した。
ポリマーＥ：２−エチルへキシルアクリレート４７重量％、２−ヒドロキシエチルアクリレート２８重量％、メタクリル酸メチル２４重量％、メタクリル酸１重量％を構成単位とするアクリル共重合体（ガラス転位温度：−３０℃）に、２−メタクリロイルオキシエチルイソシアネートを二重結合量が１．０（ｍｅｑ／ｇ）になるよう付与した。
ポリマーＦ：エチルアクリレート８０重量％、２−ヒドロキシエチルアクリレート１９重量％、メタクリル酸１重量％を構成単位とするアクリル共重合体（ガラス転位温度：−１５℃）に、２−メタクリロイルオキシエチルイソシアネートを二重結合量が１．０（ｍｅｑ／ｇ）になるよう付与した。
ポリマーＧ：２−エチルへキシルアクリレート７０重量％、２−ヒドロキシエチルアクリレート２９重量％、メタクリル酸１重量％を構成単位とするアクリル共重合体（ガラス転位温度：−６５℃）に、２−メタクリロイルオキシエチルイソシアネートを二重結合量が０．５（ｍｅｑ／ｇ）になるよう付与した。
(Raw material for adhesive layer)
<Polymer>
Polymer A: An acrylic copolymer (glass transition temperature: −65 ° C.) having 2-ethylhexyl acrylate 70% by weight, 2-hydroxyethyl acrylate 29% by weight and methacrylic acid 1% by weight as a structural unit, 2-methacryloyl Oxyethyl isocyanate was added so that the double bond amount was 1.0 (meq / g).
Polymer B: An acrylic copolymer (glass transition temperature: −65 ° C.) having 2-ethylhexyl acrylate 70% by weight, 2-hydroxyethyl acrylate 29% by weight and methacrylic acid 1% by weight as a structural unit, 2-methacryloyl Oxyethyl isocyanate was added so that the double bond amount was 0.5 (meq / g).
Polymer C: 2-methacryloyloxyethyl isocyanate was added to an acrylic copolymer (glass transition temperature: −40 ° C.) containing 70% by weight of butyl acrylate, 29% by weight of 2-hydroxyethyl acrylate, and 1% by weight of methacrylic acid. It provided so that the amount of double bonds might be set to 1.5 (meq / g).
Polymer D: Acrylic copolymer (glass transition temperature: -55) comprising 67% by weight of 2-ethylhexyl acrylate, 25% by weight of 2-hydroxyethyl acrylate, 7% by weight of methyl methacrylate, and 1% by weight of methacrylic acid. C.) 2-methacryloyloxyethyl isocyanate was added so that the double bond amount was 1.0 (meq / g).
Polymer E: acrylic copolymer (glass transition temperature: -30) comprising 47% by weight of 2-ethylhexyl acrylate, 28% by weight of 2-hydroxyethyl acrylate, 24% by weight of methyl methacrylate, and 1% by weight of methacrylic acid C.) 2-methacryloyloxyethyl isocyanate was added so that the double bond amount was 1.0 (meq / g).
Polymer F: Acrylic copolymer (glass transition temperature: −15 ° C.) containing 80% by weight of ethyl acrylate, 19% by weight of 2-hydroxyethyl acrylate, and 1% by weight of methacrylic acid as a structural unit, and 2-methacryloyloxyethyl isocyanate It provided so that the amount of double bonds might be set to 1.0 (meq / g).
Polymer G: An acrylic copolymer (glass transition temperature: −65 ° C.) having 2-ethylhexyl acrylate 70% by weight, 2-hydroxyethyl acrylate 29% by weight, and methacrylic acid 1% by weight as a structural unit, 2-methacryloyl Oxyethyl isocyanate was added so that the double bond amount was 0.5 (meq / g).
＜光重合性開始剤＞
イルガキュアー１８４(商品名、日本チバガイギー株式会社製)
<Photopolymerizable initiator>
Irgacure 184 (trade name, manufactured by Nippon Ciba Geigy Co., Ltd.)
＜硬化剤＞
コロネートＬ(イソシアネート系硬化剤、商品名、東ソー株式会社製)
<Curing agent>
Coronate L (isocyanate-based curing agent, trade name, manufactured by Tosoh Corporation)
＜表面改質剤＞
ＴＥＧＯＲａｄ２１００(商品名、テゴケミー社製)
<Surface modifier>
TEGORad2100 (trade name, manufactured by Tego Chemie)
（実施例１）
ポリマーＡの重量に対して光重合性開始剤を５重量％、イソシアネート系硬化剤を１重量％配合し、粘着剤組成物を得た。基材フィルムの表面に前記粘着剤組成物を乾燥後の膜厚が１５μｍの厚さになるように塗工し乾燥させて、実施例１に係る電子部品用粘着テープを作製した。
Example 1
5 wt% of the photopolymerizable initiator and 1 wt% of the isocyanate curing agent were blended with respect to the weight of the polymer A to obtain an adhesive composition. The pressure-sensitive adhesive composition was applied to the surface of the base film so that the film thickness after drying was 15 μm, and dried to produce a pressure-sensitive adhesive tape for electronic parts according to Example 1.
（実施例２）
ポリマーＢの重量に対して光重合性開始剤を５重量％、イソシアネート系硬化剤を１重量％、表面改質剤を０．２重量％配合し、粘着剤組成物を得た。基材フィルムの表面に前記粘着剤組成物を乾燥後の膜厚が１５μｍの厚さになるように塗工し乾燥させて、実施例２に係る電子部品用粘着テープを作製した。
(Example 2)
5 wt% of the photopolymerizable initiator, 1 wt% of the isocyanate curing agent, and 0.2 wt% of the surface modifier were blended with respect to the weight of the polymer B to obtain a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition was applied to the surface of the base film so that the thickness after drying was 15 μm and dried to prepare an adhesive tape for electronic parts according to Example 2.
（実施例３）
ポリマーＡの重量に対して光重合性開始剤を５重量％、イソシアネート系硬化剤を１重量％、表面改質剤を０．２重量％配合し、粘着剤組成物を得た。基材フィルムの表面に前記粘着剤組成物を乾燥後の膜厚が１５μｍの厚さになるように塗工し乾燥させて、実施例３に係る電子部品用粘着テープを作製した。
(Example 3)
5 wt% of the photopolymerizable initiator, 1 wt% of the isocyanate curing agent, and 0.2 wt% of the surface modifier were blended with respect to the weight of the polymer A to obtain an adhesive composition. The pressure-sensitive adhesive composition was applied to the surface of the base film so that the film thickness after drying was 15 μm, and dried to produce a pressure-sensitive adhesive tape for electronic parts according to Example 3.
（実施例４）
ポリマーＣの重量に対して光重合性開始剤を５重量％、イソシアネート系硬化剤を１重量％配合し、粘着剤組成物を得た。基材フィルムの表面に前記粘着剤組成物を乾燥後の膜厚が１５μｍの厚さになるように塗工し乾燥させて、実施例４に係る電子部品用粘着テープを作製した。
Example 4
5% by weight of the photopolymerizable initiator and 1% by weight of the isocyanate curing agent were blended with respect to the weight of the polymer C to obtain an adhesive composition. The pressure-sensitive adhesive composition was applied to the surface of the base film so that the film thickness after drying was 15 μm, and dried to produce a pressure-sensitive adhesive tape for electronic parts according to Example 4.
（実施例５）
ポリマーＣの重量に対して光重合性開始剤を５重量％、イソシアネート系硬化剤を１重量％、表面改質剤を０．２重量％配合し、粘着剤組成物を得た。基材フィルムの表面に前記粘着剤組成物を乾燥後の膜厚が１５μｍの厚さになるように塗工し乾燥させて、実施例５に係る電子部品用粘着テープを作製した。
(Example 5)
5 wt% of the photopolymerizable initiator, 1 wt% of the isocyanate curing agent, and 0.2 wt% of the surface modifier were blended with respect to the weight of the polymer C to obtain a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition was coated on the surface of the base film so that the film thickness after drying was 15 μm, and dried to produce a pressure-sensitive adhesive tape for electronic parts according to Example 5.
（実施例６）
ポリマーＤの重量に対して光重合性開始剤を５重量％、イソシアネート系硬化剤を１重量％配合し、粘着剤組成物を得た。基材フィルムの表面に前記粘着剤組成物を乾燥後の膜厚が１５μｍの厚さになるように塗工し乾燥させて、実施例６に係る電子部品用粘着テープを作製した。
(Example 6)
5 wt% of the photopolymerizable initiator and 1 wt% of the isocyanate curing agent were blended with respect to the weight of the polymer D to obtain an adhesive composition. The pressure-sensitive adhesive composition was applied to the surface of the base film so that the film thickness after drying was 15 μm and dried to prepare a pressure-sensitive adhesive tape for electronic parts according to Example 6.
（実施例７）
ポリマーＤの重量に対して光重合性開始剤を５重量％、イソシアネート系硬化剤を１重量％、表面改質剤を０．２重量％配合し、粘着剤組成物を得た。基材フィルムの表面に前記粘着剤組成物を乾燥後の膜厚が１５μｍの厚さになるように塗工し乾燥させて、実施例７に係る電子部品用粘着テープを作製した。
(Example 7)
5 wt% of the photopolymerizable initiator, 1 wt% of the isocyanate curing agent, and 0.2 wt% of the surface modifier were blended with respect to the weight of the polymer D to obtain an adhesive composition. The pressure-sensitive adhesive composition was applied to the surface of the base film so that the thickness after drying was 15 μm and dried to prepare an adhesive tape for electronic parts according to Example 7.
（実施例８）
ポリマーＥの重量に対して光重合性開始剤を５重量％、イソシアネート系硬化剤を１重量％配合し、粘着剤組成物を得た。基材フィルムの表面に前記粘着剤組成物を乾燥後の膜厚が１５μｍの厚さになるように塗工し乾燥させて、実施例８に係る電子部品用粘着テープを作製した。
(Example 8)
5 wt% of the photopolymerizable initiator and 1 wt% of the isocyanate curing agent were blended with respect to the weight of the polymer E to obtain an adhesive composition. The pressure-sensitive adhesive composition was applied to the surface of the base film so that the film thickness after drying was 15 μm and dried to prepare an adhesive tape for electronic parts according to Example 8.
（実施例９）
ポリマーＥの重量に対して光重合性開始剤を５重量％、イソシアネート系硬化剤を１重量％、表面改質剤を０．２重量％配合し、粘着剤組成物を得た。基材フィルムの表面に前記粘着剤組成物を乾燥後の膜厚が１５μｍの厚さになるように塗工し乾燥させて、実施例９に係る電子部品用粘着テープを作製した。
Example 9
5 wt% of the photopolymerizable initiator, 1 wt% of the isocyanate curing agent, and 0.2 wt% of the surface modifier were blended with respect to the weight of the polymer E to obtain a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition was applied to the surface of the base film so that the film thickness after drying was 15 μm, and dried to produce a pressure-sensitive adhesive tape for electronic parts according to Example 9.
（実施例１０）
ポリマーＦの重量に対して光重合性開始剤を５重量％、イソシアネート系硬化剤を１重量％、表面改質剤を０．２重量％配合し、粘着剤組成物を得た。基材フィルムの表面に前記粘着剤組成物を乾燥後の膜厚が１５μｍの厚さになるように塗工し乾燥させて、実施例１０に係る電子部品用粘着テープを作製した。
(Example 10)
5 wt% of the photopolymerizable initiator, 1 wt% of the isocyanate curing agent, and 0.2 wt% of the surface modifier were blended with respect to the weight of the polymer F to obtain a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition was applied to the surface of the base film so that the film thickness after drying was 15 μm, and dried to produce a pressure-sensitive adhesive tape for electronic parts according to Example 10.
（比較例１）
ポリマーＧの重量に対して光重合性開始剤を５重量％、イソシアネート系硬化剤を１重量％配合し、粘着剤組成物を得た。基材フィルムの表面に前記粘着剤組成物を乾燥後の膜厚が１５μｍの厚さになるように塗工し乾燥させて、比較例１に係る電子部品用粘着テープを作製した。
(Comparative Example 1)
5 wt% of the photopolymerizable initiator and 1 wt% of the isocyanate curing agent were blended with respect to the weight of the polymer G to obtain an adhesive composition. The pressure-sensitive adhesive composition was coated on the surface of the base film so that the thickness after drying was 15 μm and dried to prepare a pressure-sensitive adhesive tape for electronic parts according to Comparative Example 1.
上記のようにして作製した各実施例および各比較例に係る電子部品用粘着テープの粘着力Ｐ１，Ｐ２を以下のようにして測定した。その結果を表１に示す。 The adhesive strengths P1 and P2 of the adhesive tapes for electronic parts according to each Example and each Comparative Example produced as described above were measured as follows. The results are shown in Table 1.
（粘着力Ｐ１）
各実施例および各比較例に係る電子部品用粘着テープについて、２３℃、５０％ＲＨの条件下で、＃２０００で研磨されたシリコンウエハのミラー面に貼付した。その後、２３℃、５０％ＲＨの環境下で１時間放置した後、電子部品用粘着テープの裏面（基材フィルム側の面）から紫外線を４００ｍＪ／ｃｍ2で照射し、粘着剤層を放射線硬化させた後、２３℃、５０％ＲＨの環境下でさらに1時間放置した後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで剥離力を測定した。上記条件以外については、ＪＩＳ Ｚ ０２３７の８．３．２に準拠して測定した。
(Adhesive strength P1)
About the adhesive tape for electronic components which concerns on each Example and each comparative example, it affixed on the mirror surface of the silicon wafer ground | polished by # 2000 on the conditions of 23 degreeC and 50% RH. Then, after standing for 1 hour in an environment of 23 ° C. and 50% RH, ultraviolet rays were irradiated from the back surface (surface on the base film side) of the adhesive tape for electronic parts at 400 mJ / cm 2 to radiation-harden the adhesive layer. After being allowed to stand, the substrate was further left for 1 hour in an environment of 23 ° C. and 50% RH, and then the peeling force was measured at a peeling angle of 90 ° and a peeling speed of 50 mm / min under the conditions of 23 ° C. and 50% RH. The conditions other than the above were measured in accordance with JIS Z 0237 8.3.2.
（粘着力Ｐ２）
各実施例および各比較例に係る電子部品用粘着テープについて、２３℃、５０％ＲＨの条件下で、＃２０００で研磨されたシリコンウエハのミラー面に貼付した。その後、２３℃、５０％ＲＨの環境下で１時間放置した後、電子部品用粘着テープの裏面（基材フィルム側の面）から紫外線を４００ｍＪ／ｃｍ2で照射し、粘着剤層を放射線硬化させた後、６０℃、５０％ＲＨの環境下で１週間放置した後、２３℃、５０％ＲＨの環境下でさらに1時間放置した後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで剥離力を測定した。上記条件以外については、ＪＩＳ Ｚ ０２３７の８．３．２に準拠して測定した。
(Adhesive strength P2)
About the adhesive tape for electronic components which concerns on each Example and each comparative example, it affixed on the mirror surface of the silicon wafer ground | polished by # 2000 on the conditions of 23 degreeC and 50% RH. Then, after standing for 1 hour in an environment of 23 ° C. and 50% RH, ultraviolet rays were irradiated from the back surface (surface on the base film side) of the adhesive tape for electronic parts at 400 mJ / cm 2 to radiation-harden the adhesive layer. And then left for 1 week in an environment of 60 ° C. and 50% RH, then left for an additional hour in an environment of 23 ° C. and 50% RH, and then peeled off at a peel angle of 90 ° C. under conditions of 23 ° C. and 50% RH. The peeling force was measured at a rate of 50 mm / min. The conditions other than the above were measured in accordance with JIS Z 0237 8.3.2.
また、上記の実施例及び比較例に係る電子部品用粘着テープについて、以下のようにして糊残り試験を行い、その性能を評価した。評価結果を表１に示す。 Moreover, about the adhesive tape for electronic components which concerns on said Example and a comparative example, the adhesive residue test was done as follows and the performance was evaluated. The evaluation results are shown in Table 1.
各実施例および各比較例に係る電子部品用粘着テープについて、それぞれ幅２５ｍｍ、長さ１５０ｍｍの試験片を３枚切り出し、電子部品の表面に見立てた試験板（ＩＲＣ４−７６Ａ（商品名）、セラテックジャパン株式会社製）に、２ｋｇの荷重のゴムローラを３往復させて試験片を貼合し、１時間放置した。その後、試験片側よりメタルハライドランプにて紫外線を４００ｍＪ／ｃｍ2照射し、６０℃の恒温槽に１週間保管し、１時間放冷後に試験片を剥離し、試験板表面の糊残りを目視および光学顕微鏡にて観察し、以下のランクで評価した。
全ての試験片について試験板表面に糊残りが観察されなかったもの：優良品として◎
全ての試験片について目視では糊残りが観察されなかったものの、光学顕微鏡では一部の試験片について部分的に糊残りが観察されたもの：良品として○
一部の試験片について目視で試験板表面に部分的に糊残りが観察されたもの：許容品としてとして△
１つでも目視で全面に糊残りが観察されたもの：不良品として×
About the adhesive tape for electronic components which concerns on each Example and each comparative example, each test piece (IRC4-76A (brand name), Ceratech) cut out three test pieces of width 25mm and length 150mm, and made it look on the surface of an electronic component. A rubber roller with a load of 2 kg was reciprocated three times to make a test piece, and left for 1 hour. Then, UV light was irradiated from the test piece side with a metal halide lamp at 400 mJ / cm 2 , stored in a thermostatic bath at 60 ° C. for 1 week, allowed to cool for 1 hour, peeled off the test piece, and the adhesive residue on the test plate surface was visually and optically observed. It observed with the microscope and evaluated with the following ranks.
For all test pieces, no adhesive residue was observed on the test plate surface: Excellent product ◎
Although no adhesive residue was visually observed for all the test pieces, the adhesive residue was partially observed for some of the test pieces with the optical microscope: ○
Some of the test pieces were visually observed with adhesive residue on the test plate surface: △ as an acceptable product
At least one glue residue was visually observed on the entire surface: x
表１に示すように、実施例に係る電子部品用粘着テープは、Ｐ２−Ｐ１が０．７Ｎ／２５ｍｍ以下であるため、糊残り試験において良好な結果となった。特に、Ｐ２−Ｐ１が０．３Ｎ／２５ｍｍ以下であり、粘着剤層を構成する主成分のポリマーのガラス転移温度が、−６５℃〜−３０℃の実施例３〜実施例９に係る電子部品用粘着テープは、糊残りが全く発生せず特に優れた結果となった。 As shown in Table 1, since the P2-P1 of the adhesive tape for electronic parts according to the example was 0.7 N / 25 mm or less, a good result was obtained in the adhesive residue test. Particularly, the electronic component according to Examples 3 to 9 in which P2-P1 is 0.3 N / 25 mm or less and the glass transition temperature of the main component polymer constituting the pressure-sensitive adhesive layer is −65 ° C. to −30 ° C. The adhesive tape for use did not generate any adhesive residue and was particularly excellent.
一方、表１に示すように、比較例係る電子部品用粘着テープは、Ｐ２−Ｐ１が０．７Ｎ／２５ｍｍを超えるため、糊残り試験において劣る結果となった。 On the other hand, as shown in Table 1, the adhesive tape for electronic parts according to the comparative example had inferior results in the adhesive residue test because P2-P1 exceeded 0.7 N / 25 mm.
１：電子部品用粘着テープ
２：基材フィルム
３：粘着剤層
1: Adhesive tape for electronic parts 2: Base film 3: Adhesive layer
Claims (2)
前記粘着剤層は、（メタ）アクリル共重合樹脂にアルコール部にイソシアネート基を有する（メタ）アクリル酸エステルを、炭素−炭素二重結合量が０．５〜１．５（ｍｅｑ／ｇ）になるよう付与した粘着剤ポリマーと、光重合性開始剤と、イソシアネート系硬化剤とを有し、
シリコンミラー面に貼合後、２３℃、５０％ＲＨの環境下で１時間放置した後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで測定した前記シリコンミラー面に対する粘着力をＰ１とし、シリコンミラー面に貼合後、６０℃、５０％ＲＨの環境下で１週間放置した後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで測定した前記シリコンミラー面に対する粘着力をＰ２としたとき、０Ｎ／２５ｍｍ≦Ｐ２−Ｐ１≦０．７Ｎ／２５ｍｍであり、
前記粘着剤層は、放射線を照射することにより硬化する放射線硬化型の粘着剤層であり、前記Ｐ１は、シリコンミラー面に貼合後、放射線照射により前記粘着剤層を硬化させた後、２３℃、５０％ＲＨの環境下で１時間放置後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで測定したシリコンミラー面に対する粘着力であり、前記Ｐ２は、シリコンミラー面に貼合後、放射線照射により前記粘着剤層を硬化させた後、６０℃、５０％ＲＨの環境下で１週間放置後、２３℃、５０％ＲＨの条件下、剥離角度９０度、剥離速度５０ｍｍ／ｍｉｎで測定したシリコンミラー面に対する粘着力であることを特徴とする電子部品用粘着テープ。 An adhesive tape for electronic parts in which an adhesive layer is formed on at least one side of a base film,
The pressure-sensitive adhesive layer is a (meth) acrylic copolymer resin having a (meth) acrylic acid ester having an isocyanate group in the alcohol part and having a carbon-carbon double bond amount of 0.5 to 1.5 (meq / g). Having a pressure-sensitive adhesive polymer, a photopolymerizable initiator, and an isocyanate curing agent,
After being bonded to the silicon mirror surface, the silicon mirror was left to stand in an environment of 23 ° C. and 50% RH for 1 hour, and then measured at a peeling angle of 90 degrees and a peeling speed of 50 mm / min under the conditions of 23 ° C. and 50% RH. The adhesive strength to the surface is P1, and after bonding to the silicon mirror surface, it is left for 1 week in an environment of 60 ° C. and 50% RH, and then at a peeling angle of 90 ° and a peeling speed of 50 mm under the conditions of 23 ° C. and 50% RH. When the adhesive force to the silicon mirror surface measured at / min is P2, 0N / 25mm ≦ P2-P1 ≦ 0.7N / 25mm,
The pressure-sensitive adhesive layer is a radiation-curing pressure-sensitive adhesive layer that is cured by irradiation with radiation. After the P1 is bonded to the silicon mirror surface, the pressure-sensitive adhesive layer is cured by radiation irradiation, and then 23 It is the adhesive force with respect to the silicon mirror surface measured at a peeling angle of 90 degrees and a peeling speed of 50 mm / min under the conditions of 23 ° C. and 50% RH after being left for 1 hour in an environment of 50 ° C. and 50% RH. After being bonded to the silicon mirror surface, the pressure-sensitive adhesive layer was cured by radiation irradiation, then allowed to stand for 1 week in an environment of 60 ° C. and 50% RH, and then peeled at 90 ° under conditions of 23 ° C. and 50% RH. for electronic components sensitive adhesive tape, wherein the adhesive strength der Rukoto to a silicon mirror surface was measured at a peeling speed of 50 mm / min.
The pressure-sensitive adhesive tape for electronic parts according to claim 1, wherein the glass transition temperature of the main component polymer constituting the pressure-sensitive adhesive layer is -65 ° C to -30 ° C.
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