JP6381902B2 - 塗布針ホルダ - Google Patents
塗布針ホルダ Download PDFInfo
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- JP6381902B2 JP6381902B2 JP2013258189A JP2013258189A JP6381902B2 JP 6381902 B2 JP6381902 B2 JP 6381902B2 JP 2013258189 A JP2013258189 A JP 2013258189A JP 2013258189 A JP2013258189 A JP 2013258189A JP 6381902 B2 JP6381902 B2 JP 6381902B2
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- application needle
- needle
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- 230000007246 mechanism Effects 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 description 47
- 238000000576 coating method Methods 0.000 description 47
- 239000000758 substrate Substances 0.000 description 29
- 230000003287 optical effect Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000011344 liquid material Substances 0.000 description 8
- 239000013077 target material Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/06—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length by rubbing contact, e.g. by brushes, by pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
Description
図1に示した塗布装置において、回路パターンを描画する場合は、まず、塗布対象である基板5における描画する領域を観察光学系6の直下までX軸テーブル1およびY軸テーブル2を動作させて移動させる。そして、観察光学系6で描画開始位置を観察・確認し、描画開始位置を決定する。決定した描画開始位置を基準にして、塗布針24を突出させた時に、塗布針24の先端が基板5の表面に接触する位置までZ軸テーブル3を動作させ、塗布機構4を下降させる。その後、サーボモータ41を動作させ、塗布針24を突出させて、塗布針24の先端に付着した液体材料を基板5の表面に接触させる。具体的には、描画開始位置から、描画するべき位置が塗布機構4の直下に位置するようにX軸テーブル1およびY軸テーブル2を用いて基板5を移動させる。そして、移動が完了した時点で、塗布針24を突出させた時に、塗布針24の先端が基板5の表面に接触する位置まで、Z軸テーブル3で塗布機構4を下降させる。そして、塗布機構4のサーボモータ41を駆動して、塗布針24を突出させて基板5へ液体材料の塗布を行う。連続して塗布する場合は、次の描画位置が塗布機構4の直下に位置するように、X軸テーブル1およびY軸テーブル2で基板5を移動させ、塗布機構4のサーボモータ41を駆動して塗布を行う。この動作を繰り返すことで、基板5表面に回路パターンを描画する。全ての塗布が完了した後、Z軸テーブル3を用いて塗布機構4を上昇させる。
Claims (3)
- 筐体と、
固定部材とを含み、前記固定部材の少なくとも一部は前記筐体の内部に配置されており、さらに、
前記固定部材に固着されている塗布針と、
前記筐体の前記内部に配置されており、かつ、前記固定部材に接触した状態で前記固定部材を移動可能に支持する直動部材と、
前記筐体の前記内部に配置されている弾性部材とを含む、塗布針ホルダであって、
前記塗布針ホルダは、前記塗布針を用いて塗布材料を塗布する際に前記塗布針を移動させる移動機構に着脱可能に保持されるように構成されており、
前記塗布針ホルダは、前記移動機構と、前記塗布材料を収容する容器とを含んでおらず、
前記弾性部材は、前記塗布針ホルダから前記塗布針が突出する方向に向けて前記固定部材に押圧力を加えるように構成されており、前記方向は、前記直動部材によって移動可能に支持されている前記固定部材の移動方向に沿っている、塗布針ホルダ。 - 前記筐体は第1筐体部分と第2筐体部分とを含み、
前記固定部材は前記第1筐体部分に前記直動部材を介して接続されており、
前記弾性部材は、前記固定部材の一部と前記第2筐体部分の一部とにそれぞれ接触しており、かつ、前記固定部材の前記一部と前記第2筐体部分の前記一部との間に圧縮された状態で配置されており、
前記第1筐体部分と前記第2筐体部分とは、前記方向において相対的な位置関係を変更可能に構成されている、請求項1に記載の塗布針ホルダ。 - 前記固定部材の一部分が前記筐体から突出している、請求項1または請求項2に記載の塗布針ホルダ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013258189A JP6381902B2 (ja) | 2013-12-13 | 2013-12-13 | 塗布針ホルダ |
CN201480067690.0A CN105813765B (zh) | 2013-12-13 | 2014-12-10 | 涂布构件及涂布装置 |
PCT/JP2014/082637 WO2015087899A1 (ja) | 2013-12-13 | 2014-12-10 | 塗布部材および塗布装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013258189A JP6381902B2 (ja) | 2013-12-13 | 2013-12-13 | 塗布針ホルダ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015112577A JP2015112577A (ja) | 2015-06-22 |
JP2015112577A5 JP2015112577A5 (ja) | 2017-01-12 |
JP6381902B2 true JP6381902B2 (ja) | 2018-08-29 |
Family
ID=53371201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013258189A Active JP6381902B2 (ja) | 2013-12-13 | 2013-12-13 | 塗布針ホルダ |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6381902B2 (ja) |
CN (1) | CN105813765B (ja) |
WO (1) | WO2015087899A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6835506B2 (ja) * | 2016-09-01 | 2021-02-24 | Ntn株式会社 | 液体塗布ユニットおよび液体塗布装置 |
JP2018140336A (ja) | 2017-02-27 | 2018-09-13 | Ntn株式会社 | 液体塗布ユニットおよび液体塗布装置 |
JP6461260B1 (ja) | 2017-08-02 | 2019-01-30 | Ntn株式会社 | 塗布機構及び塗布装置 |
JP7164997B2 (ja) * | 2018-08-31 | 2022-11-02 | Ntn株式会社 | 塗布針部材、塗布針部材アセンブリ、塗布部材および塗布装置 |
JP2022129878A (ja) | 2021-02-25 | 2022-09-06 | Ntn株式会社 | 塗布機構及び塗布装置 |
DE102021128092A1 (de) * | 2021-10-28 | 2023-05-04 | Focke & Co. (Gmbh & Co. Kg) | Vorrichtung zum Auftragen von vorzugsweise erwärmtem Klebstoff bzw. (Heiß-) Leim |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0253162U (ja) * | 1988-10-12 | 1990-04-17 | ||
EP0855231A1 (en) * | 1995-09-07 | 1998-07-29 | Nippon Steel Corporation | Device for painting a cut surface of a pre-coated steel plate |
JP4125031B2 (ja) * | 2002-04-11 | 2008-07-23 | 株式会社リコー | 定着装置及びその定着装置を有する画像形成装置 |
JP4767708B2 (ja) * | 2005-03-28 | 2011-09-07 | Ntn株式会社 | 塗布ユニットおよびパターン修正装置 |
JP2008073637A (ja) * | 2006-09-22 | 2008-04-03 | Ntn Corp | 塗布針洗浄装置 |
JP4928284B2 (ja) * | 2007-01-23 | 2012-05-09 | 芝浦メカトロニクス株式会社 | 流体塗布装置および塗布距離測定方法 |
JP5986727B2 (ja) * | 2011-10-07 | 2016-09-06 | 武蔵エンジニアリング株式会社 | 液体材料の吐出装置および方法 |
-
2013
- 2013-12-13 JP JP2013258189A patent/JP6381902B2/ja active Active
-
2014
- 2014-12-10 CN CN201480067690.0A patent/CN105813765B/zh active Active
- 2014-12-10 WO PCT/JP2014/082637 patent/WO2015087899A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2015087899A1 (ja) | 2015-06-18 |
JP2015112577A (ja) | 2015-06-22 |
CN105813765A (zh) | 2016-07-27 |
CN105813765B (zh) | 2018-11-16 |
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