JP6358664B2 - 回路アッセンブリ - Google Patents
回路アッセンブリ Download PDFInfo
- Publication number
- JP6358664B2 JP6358664B2 JP2015556123A JP2015556123A JP6358664B2 JP 6358664 B2 JP6358664 B2 JP 6358664B2 JP 2015556123 A JP2015556123 A JP 2015556123A JP 2015556123 A JP2015556123 A JP 2015556123A JP 6358664 B2 JP6358664 B2 JP 6358664B2
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- discrete component
- circuit assembly
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- lead frame
- flange
- Prior art date
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- 239000000758 substrate Substances 0.000 claims description 79
- 238000004804 winding Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 5
- 239000008393 encapsulating agent Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000012811 non-conductive material Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
- H01L2924/19103—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing & Machinery (AREA)
Description
Claims (15)
- 回路アッセンブリであって、
基板電気回路と、反対側の頂部及び底部基板表面と、基板孔とを有する基板であって、前記基板孔が前記基板を介して延び、前記頂部基板表面がその上に提供される複数の電気的コンタクト表面を有する、前記基板と、
ディスクリート構成要素アッセンブリであって、
少なくとも一部が前記基板孔内に物理的に搭載されるディスクリート構成要素と、
前記ディスクリート構成要素に取り付けられる支持部材であって、前記ディスクリート構成要素の少なくとも一部が前記基板孔内に物理的に搭載されるときに少なくとも1つのフランジ部が前記基板孔を超えて横方向に延在し、前記少なくとも1つのフランジ部がフランジ頂部表面とフランジ底部表面とを有する、前記支持部材と、
前記ディスクリート構成要素の前記一部に取り付けられる構造であって、前記ディスクリート構成要素の幅よりも大きい幅を有する、前記構造と、
前記フランジ底部表面に搭載され、前記頂部基板表面上の前記複数の電気的コンタクト表面に電気的に接続される複数の電気的コンタクトパッドと、
を含む、前記ディスクリート構成要素アッセンブリと、
を含む、回路アッセンブリ。 - 請求項1に記載の回路アッセンブリであって、
前記基板孔が、円形である、回路アッセンブリ。 - 請求項2に記載の回路アッセンブリであって、
前記支持部材が、前記頂部基板表面の上方に配置されるその少なくとも一部を有する、回路アッセンブリ。 - 請求項1に記載の回路アッセンブリであって、
少なくとも3つの電気的コンタクトパッドが前記フランジ底部表面上に提供される、回路アッセンブリ。 - 請求項1に記載の回路アッセンブリであって、
前記基板上に搭載される第2のディスクリート構成要素を更に含み、前記第2のディスクリート構成要素の一部が前記ディスクリート構成要素アッセンブリの上方に配置される、回路アッセンブリ。 - 請求項5に記載の回路アッセンブリであって、
前記ディスクリート構成要素アッセンブリの上方に配置される前記第2のディスクリート構成要素の前記一部が、前記ディスクリート構成要素アッセンブリに接続される、回路アッセンブリ。 - 請求項1に記載の回路アッセンブリであって、
前記ディスクリート構成要素がインダクタである、回路アッセンブリ。 - 請求項1に記載の回路アッセンブリであって、
前記ディスクリート構成要素の前記一部が前記基板孔から離れている、回路アッセンブリ。 - 回路アッセンブリであって、
基板であって、
頂部第1リードフレーム表面と、底部第1リードフレーム表面と、前記頂部第1リードフレーム表面と前記底部第1リードフレーム表面との間に延在する第1リードフレーム孔とを有する第1のリードフレームと、
頂部第2リードフレーム表面と、底部第2リードフレーム表面と、前記頂部第2リードフレーム表面と前記底部第2リードフレーム表面との間に延在する第2リードフレーム孔とを有し、前記第1のリードフレームより下で前記第1のリードフレームに概して平行に配置される第2のリードフレームと、
を含む、前記基板と、
ディスクリート構成要素アッセンブリであって、
部分的に前記第1リードフレーム孔内に配置される第1の部分と、部分的に前記第2リードフレーム孔に配置される第2の部分とを有するディスクリート構成要素と、
前記ディスクリート構成要素上に搭載される第1の支持部材であって、前記第1のリードフレームに物理的に電気的に接続される上側フランジを有する、前記第1の支持部材と、
前記上部フランジ上に搭載され、前記ディスクリート構成要素に電気的に接続される複数のコンタクトパッドと、
を含む、前記ディスクリート構成要素アッセンブリと、
を含む、回路アッセンブリ。 - 請求項9に記載の回路アッセンブリであって、
前記ディスクリート構成要素アッセンブリが、
前記ディスクリート構成要素上に搭載される第2の支持部材と、
前記ディスクリート構成要素に電気的に接続され、前記第2の支持部材上に搭載される複数のコンタクトパッドと、
を更に含み、
前記ディスクリート構成要素が前記第1及び第2のリードフレーム両方に物理的に電気的に接続される、回路アッセンブリ。 - 請求項10に記載の回路アッセンブリであって、
前記第2の支持部材が、前記第2のリードフレームに物理的に電気的に接続される下側フランジを有し、前記第2の支持部材上に搭載されたコンタクトパッドが前記下側フランジ上に搭載される、回路アッセンブリ。 - 請求項11に記載の回路アッセンブリであって、
前記上側フランジが上側表面と下側表面とを有し、前記上側フランジ上の少なくとも1つのコンタクトパッドが前記上側フランジの前記上側表面上に配置される、回路アッセンブリ。 - 請求項12に記載の回路アッセンブリであって、
前記下側フランジが上側表面と下側表面とを有し、前記下側フランジ上の少なくとも1つのコンタクトパッドが前記下側フランジの前記下側表面上に配置される、回路アッセンブリ。 - 請求項9に記載の回路アッセンブリであって、
前記ディスクリート構成要素が完全に前記頂部第1リードフレーム表面と前記底部第2リードフレーム表面との間に配置される、回路アッセンブリ。 - 請求項9に記載の回路アッセンブリであって、
前記ディスクリート構成要素の上の前記第1のリードフレーム上に搭載されるICダイを更に含む、回路アッセンブリ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361758459P | 2013-01-30 | 2013-01-30 | |
US61/758,459 | 2013-01-30 | ||
US13/900,758 US9253910B2 (en) | 2013-01-30 | 2013-05-23 | Circuit assembly |
US13/900,758 | 2013-05-23 | ||
PCT/US2014/013790 WO2014120894A1 (en) | 2013-01-30 | 2014-01-30 | Circuit assembly |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016510513A JP2016510513A (ja) | 2016-04-07 |
JP2016510513A5 JP2016510513A5 (ja) | 2017-03-02 |
JP6358664B2 true JP6358664B2 (ja) | 2018-07-18 |
Family
ID=51222731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015556123A Active JP6358664B2 (ja) | 2013-01-30 | 2014-01-30 | 回路アッセンブリ |
Country Status (4)
Country | Link |
---|---|
US (2) | US9253910B2 (ja) |
JP (1) | JP6358664B2 (ja) |
CN (1) | CN104937713B (ja) |
WO (2) | WO2014120894A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102004794B1 (ko) * | 2014-06-24 | 2019-07-29 | 삼성전기주식회사 | 복합 전자부품 및 그 실장 기판 |
DE102014118769B4 (de) | 2014-12-16 | 2017-11-23 | Infineon Technologies Ag | Drucksensor-Modul mit einem Sensor-Chip und passiven Bauelementen innerhalb eines gemeinsamen Gehäuses |
CN108738369B (zh) * | 2017-02-13 | 2022-03-29 | 新电元工业株式会社 | 电子模块 |
CN110022643A (zh) * | 2019-04-09 | 2019-07-16 | 业成科技(成都)有限公司 | 焊接固定组件结构 |
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-
2013
- 2013-05-23 US US13/900,758 patent/US9253910B2/en active Active
- 2013-05-23 US US13/900,749 patent/US20140211444A1/en not_active Abandoned
-
2014
- 2014-01-30 WO PCT/US2014/013790 patent/WO2014120894A1/en active Application Filing
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CN104937713B (zh) | 2018-09-21 |
US9253910B2 (en) | 2016-02-02 |
WO2014120894A1 (en) | 2014-08-07 |
US20140211439A1 (en) | 2014-07-31 |
CN104937713A (zh) | 2015-09-23 |
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