JP6355862B2 - 固体撮像装置およびイメージセンサー - Google Patents
固体撮像装置およびイメージセンサー Download PDFInfo
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- JP6355862B2 JP6355862B2 JP2017559717A JP2017559717A JP6355862B2 JP 6355862 B2 JP6355862 B2 JP 6355862B2 JP 2017559717 A JP2017559717 A JP 2017559717A JP 2017559717 A JP2017559717 A JP 2017559717A JP 6355862 B2 JP6355862 B2 JP 6355862B2
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- 238000003384 imaging method Methods 0.000 title claims description 102
- 238000006243 chemical reaction Methods 0.000 claims description 145
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- 230000003287 optical effect Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 239000003086 colorant Substances 0.000 description 6
- 238000007740 vapor deposition Methods 0.000 description 6
- 230000002238 attenuated effect Effects 0.000 description 5
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- 238000004519 manufacturing process Methods 0.000 description 5
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- 239000004065 semiconductor Substances 0.000 description 4
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- 238000010030 laminating Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/28—Interference filters
- G02B5/281—Interference filters designed for the infrared light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
- H01L27/14652—Multispectral infrared imagers, having a stacked pixel-element structure, e.g. npn, npnpn or MQW structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
- H04N23/12—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths with one sensor only
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- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Multimedia (AREA)
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- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Color Television Image Signal Generators (AREA)
- Optical Filters (AREA)
- Facsimile Heads (AREA)
- Facsimile Scanning Arrangements (AREA)
Description
図1は、本発明の実施の形態1に係るイメージセンサーの主走査方向に直交する断面図である。主走査方向は、図1の紙面に直交する方向である。イメージセンサー1は、主走査方向に延在し光を側面から読取対象物に出射する導光体2と、導光体2を保持する導光体ケース3と、主走査方向に並べて配置され、それぞれ読取対象物の像を結ぶレンズ6と、レンズ6と読取対象物との間に設置される透明板7と、レンズ6が結んだ像を電気信号に変換して出力する固体撮像装置8と、固体撮像装置8が実装されたセンサー基板9と、これらの部材を保持する筐体10とを備える。透明板7の上面に平行で、かつ、主走査方向に直交する方向が副走査方向である。
実施の形態2では、イメージセンサー1において、青色光、緑色光、赤色光および赤外光に加えて紫外光に反応するインクの読取が必要となる場合の固体撮像装置8について説明する。
Claims (2)
- 赤色光を受光して電気信号に変換する赤色光電変換素子と、
緑色光を受光して電気信号に変換する緑色光電変換素子と、
青色光を受光して電気信号に変換する青色光電変換素子と、
赤外光を受光して電気信号に変換する赤外光電変換素子と、
前記赤色光電変換素子、前記緑色光電変換素子および前記青色光電変換素子それぞれの上に膜厚が一定に積層され、赤外光を遮光する赤外遮光フィルターと、
前記赤色光電変換素子の上の前記赤外遮光フィルターの上に積層され、赤色の波長の光を透過する赤色フィルターと、
前記緑色光電変換素子の上の前記赤外遮光フィルターの上に積層され、緑色の波長の光を透過する緑色フィルターと、
前記青色光電変換素子の上の前記赤外遮光フィルターの上に積層され、青色の波長の光を透過する青色フィルターと、
前記赤外光電変換素子の上に積層され、赤外光を透過し、赤色光、緑色光および青色光を遮光する可視光遮光フィルターと、
前記赤色光電変換素子、前記緑色光電変換素子および前記青色光電変換素子のそれぞれと前記赤外遮光フィルターとの間、ならびに、前記赤外光電変換素子と前記可視光遮光フィルターとの間に膜厚が一定に積層され、赤外光および可視光を透過し、紫外光を遮光する紫外遮光フィルターと、
を備える固体撮像装置。 - 請求項1に記載の固体撮像装置と、
可視光、赤外光および紫外光を読取対象物に照射する照射部と、
前記照射部から可視光、赤外光および紫外光が照射された前記読取対象物の像を、前記固体撮像装置の上に結ぶレンズと、
前記固体撮像装置、前記照射部および前記レンズを保持する筐体と、
を備えるイメージセンサー。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016100686 | 2016-05-19 | ||
JP2016100686 | 2016-05-19 | ||
PCT/JP2017/018537 WO2017200007A1 (ja) | 2016-05-19 | 2017-05-17 | 固体撮像装置およびイメージセンサー |
Publications (2)
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JPWO2017200007A1 JPWO2017200007A1 (ja) | 2018-06-07 |
JP6355862B2 true JP6355862B2 (ja) | 2018-07-11 |
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JP2017559717A Active JP6355862B2 (ja) | 2016-05-19 | 2017-05-17 | 固体撮像装置およびイメージセンサー |
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Country | Link |
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US (1) | US10991737B2 (ja) |
JP (1) | JP6355862B2 (ja) |
CN (1) | CN109196848B (ja) |
DE (1) | DE112017002541T5 (ja) |
WO (1) | WO2017200007A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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US12009379B2 (en) * | 2017-05-01 | 2024-06-11 | Visera Technologies Company Limited | Image sensor |
JP2019180048A (ja) * | 2018-03-30 | 2019-10-17 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子および撮像装置 |
JP7271121B2 (ja) * | 2018-10-01 | 2023-05-11 | キヤノン電子株式会社 | 光学フィルタ及び光学装置 |
JP2020115515A (ja) * | 2019-01-17 | 2020-07-30 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置及び電子機器 |
TW202127642A (zh) * | 2020-01-14 | 2021-07-16 | 力晶積成電子製造股份有限公司 | 影像感測器結構及其製造方法 |
JP7447591B2 (ja) * | 2020-03-18 | 2024-03-12 | 株式会社リコー | 光電変換装置、画像読取装置、画像形成装置、及び撮像システム |
JP2021150837A (ja) | 2020-03-19 | 2021-09-27 | 株式会社リコー | 固体撮像素子、画像読取装置、及び画像形成装置 |
CN111584673A (zh) * | 2020-05-22 | 2020-08-25 | 成都天马微电子有限公司 | 传感器、传感器的制造方法及电子设备 |
CN114190113A (zh) * | 2020-07-14 | 2022-03-15 | 深圳市汇顶科技股份有限公司 | 图像传感装置以及相关电子装置 |
JP2022115678A (ja) * | 2021-01-28 | 2022-08-09 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
WO2022261977A1 (zh) * | 2021-06-18 | 2022-12-22 | 苏州晶湛半导体有限公司 | 前照式图像传感器 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3083013B2 (ja) | 1993-01-19 | 2000-09-04 | キヤノン株式会社 | イメージセンサ及び画像情報処理装置 |
US5453611A (en) | 1993-01-01 | 1995-09-26 | Canon Kabushiki Kaisha | Solid-state image pickup device with a plurality of photoelectric conversion elements on a common semiconductor chip |
JP3227249B2 (ja) * | 1993-01-01 | 2001-11-12 | キヤノン株式会社 | イメージセンサ |
JP3405620B2 (ja) * | 1995-05-22 | 2003-05-12 | 松下電器産業株式会社 | 固体撮像装置 |
JP4304915B2 (ja) | 2002-04-23 | 2009-07-29 | 凸版印刷株式会社 | 固体撮像素子 |
US7022965B2 (en) * | 2003-07-22 | 2006-04-04 | Omnivision Tehnologies, Inc. | Low voltage active CMOS pixel on an N-type substrate with complete reset |
JP2005184293A (ja) | 2003-12-18 | 2005-07-07 | Nec Electronics Corp | 固体撮像装置及びそれを用いた画像読取システム |
KR100672995B1 (ko) * | 2005-02-02 | 2007-01-24 | 삼성전자주식회사 | 이미지 센서의 제조 방법 및 그에 의해 형성된 이미지 센서 |
US20070010042A1 (en) * | 2005-07-05 | 2007-01-11 | Sheng-Chin Li | Method of manufacturing a cmos image sensor |
JP4695550B2 (ja) | 2006-06-22 | 2011-06-08 | 富士フイルム株式会社 | 固体撮像装置およびその駆動方法 |
JP4876812B2 (ja) | 2006-09-19 | 2012-02-15 | 株式会社デンソー | 車載用カラーセンサおよびその製造方法 |
US20080067330A1 (en) | 2006-09-19 | 2008-03-20 | Denso Corporation | Color sensor for vehicle and method for manufacturing the same |
EP2698771B1 (en) * | 2007-03-29 | 2015-11-18 | Glory Ltd. | Paper-sheet recognition apparatus, paper-sheet processing apparatus, and paper-sheet recognition method |
JP2008288629A (ja) * | 2007-05-15 | 2008-11-27 | Sony Corp | 画像信号処理装置、撮像素子、および画像信号処理方法、並びにコンピュータ・プログラム |
JP4674610B2 (ja) * | 2008-03-07 | 2011-04-20 | パナソニック株式会社 | 分析物測定方法および自動遺伝子検出装置 |
US9532033B2 (en) * | 2010-11-29 | 2016-12-27 | Nikon Corporation | Image sensor and imaging device |
JP6161007B2 (ja) * | 2012-09-14 | 2017-07-12 | パナソニックIpマネジメント株式会社 | 固体撮像装置及びカメラモジュール |
US9699393B2 (en) * | 2014-06-26 | 2017-07-04 | Semiconductor Components Industries, Llc | Imaging systems for infrared and visible imaging with patterned infrared cutoff filters |
US9679933B2 (en) | 2014-10-06 | 2017-06-13 | Visera Technologies Company Limited | Image sensors and methods of forming the same |
US9666620B2 (en) | 2014-10-06 | 2017-05-30 | Visera Technologies Company Limited | Stacked filter and image sensor containing the same |
JP2016100686A (ja) | 2014-11-19 | 2016-05-30 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 撮像装置および撮像方法 |
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- 2017-05-17 WO PCT/JP2017/018537 patent/WO2017200007A1/ja active Application Filing
- 2017-05-17 CN CN201780029635.6A patent/CN109196848B/zh active Active
- 2017-05-17 JP JP2017559717A patent/JP6355862B2/ja active Active
- 2017-05-17 US US16/092,133 patent/US10991737B2/en active Active
- 2017-05-17 DE DE112017002541.9T patent/DE112017002541T5/de active Pending
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US10991737B2 (en) | 2021-04-27 |
CN109196848B (zh) | 2020-03-20 |
DE112017002541T5 (de) | 2019-02-21 |
US20190165021A1 (en) | 2019-05-30 |
WO2017200007A1 (ja) | 2017-11-23 |
CN109196848A (zh) | 2019-01-11 |
JPWO2017200007A1 (ja) | 2018-06-07 |
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