JP6355240B2 - Silver fine particle dispersion - Google Patents

Silver fine particle dispersion Download PDF

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JP6355240B2
JP6355240B2 JP2014102981A JP2014102981A JP6355240B2 JP 6355240 B2 JP6355240 B2 JP 6355240B2 JP 2014102981 A JP2014102981 A JP 2014102981A JP 2014102981 A JP2014102981 A JP 2014102981A JP 6355240 B2 JP6355240 B2 JP 6355240B2
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particle dispersion
silver
fine particle
silver fine
mass
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JP2015218362A (en
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由 村野
由 村野
英史 藤田
英史 藤田
伊東　大輔
大輔 伊東
修次 山下
修次 山下
大貴 吉原
大貴 吉原
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Dowa Electronics Materials Co Ltd
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Priority to CN201580025890.4A priority patent/CN106660128B/en
Priority to EP15796825.6A priority patent/EP3117937B1/en
Priority to US15/126,062 priority patent/US10350679B2/en
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    • B22F9/00—Making metallic powder or suspensions thereof
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    • C09D11/52—Electrically conductive inks
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    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
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    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/47—Levelling agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
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    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
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    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps

Description

本発明は、銀微粒子分散液に関し、特に、ＲＦＩＤアンテナなどの電子部品の導電回路などの形成に使用する銀微粒子分散液に関する。   The present invention relates to a silver fine particle dispersion, and more particularly, to a silver fine particle dispersion used for forming a conductive circuit of an electronic component such as an RFID antenna.

従来、ＲＦＩＤアンテナなどの高信頼性が要求される電子部品の配線や導電回路は、マスクした基板上に高価な貴金属のスパッタリングにより形成されている。しかし、スパッタリングにより配線や導電回路を形成する方法では、様々な工程が必要となるため、生産性が高いとはいえず、また、原料として投入される高価な貴金属のすべてが配線や導電回路の形成に使用されるのではないため、資源の有効活用の観点から、他の方法により配線や導電回路を形成することが検討されている。   Conventionally, wiring and conductive circuits of electronic components such as RFID antennas that require high reliability are formed on a masked substrate by sputtering of expensive noble metal. However, the method of forming a wiring or a conductive circuit by sputtering requires various steps, so it cannot be said that the productivity is high, and all of the expensive noble metal that is input as a raw material is not the wiring or conductive circuit. Since it is not used for formation, from the viewpoint of effective utilization of resources, formation of wirings and conductive circuits by other methods has been studied.

近年、電子部品の配線や導電回路などを大量に且つ容易に形成する方法として、印刷技術を応用して配線や導電回路などを形成するプリンテッド・エレクトロニクスが注目されており、金属粒子を分散媒中に分散させた導電性インクを、フレキソ印刷やスクリーン印刷などの様々な印刷技術により基材上に印刷した後に、金属粒子同士を焼結させて配線や導電回路などを形成することが検討されている。   In recent years, as a method for easily forming a large amount of wiring and conductive circuits of electronic components, printed electronics that forms wiring and conductive circuits by applying printing technology has attracted attention. After the conductive ink dispersed in the substrate is printed on the substrate by various printing techniques such as flexographic printing and screen printing, it is considered to sinter metal particles to form wiring, conductive circuits, etc. ing.

一方、金属粒子の粒径が数ｎｍ〜数十ｎｍ程度になると、比表面積が非常に大きくなって、融点が劇的に低下するため、数μｍ程度の粒径の金属粒子を分散媒中に分散させた導電性インクを使用して配線や導電回路を形成する場合と比べて、微細な配線や導電回路の形成が可能になるだけでなく、２００℃以下の低温で焼成しても金属粒子同士を焼結させることができるようになるので、耐熱性の低い基板などの様々な基板を使用することができるようになる。そのため、粒径が数十ｎｍ以下の金属微粒子（金属ナノ粒子）を分散媒中に分散させた導電性インク（金属微粒子分散液）をプリンテッド・エレクトロニクスに応用して電子部品の微細な配線や導電回路を形成することが期待されている。   On the other hand, when the particle size of the metal particles is several nanometers to several tens of nanometers, the specific surface area becomes very large and the melting point decreases dramatically. Compared to the case where wiring or conductive circuit is formed using dispersed conductive ink, not only fine wiring and conductive circuit can be formed, but also metal particles even when fired at a low temperature of 200 ° C. or lower. Since it becomes possible to sinter each other, various substrates such as a substrate having low heat resistance can be used. For this reason, conductive ink (metal fine particle dispersion) in which metal fine particles (metal nanoparticles) with a particle size of several tens of nanometers or less are dispersed in a dispersion medium is applied to printed electronics to make fine wiring and It is expected to form a conductive circuit.

また、粒径が数十ｎｍ以下の金属微粒子は、活性が非常に高く、そのままでは粒子として不安定であるので、金属微粒子同士の焼結や凝集を防止して、金属微粒子の独立性や保存安定性を確保するために、長鎖の界面活性剤などの有機物で被覆した金属微粒子をデカンやターピネオールなどの有機溶媒中に分散させた導電性インク（金属微粒子分散液）が提案されている。しかし、金属微粒子を高分子量の長鎖の界面活性剤で被覆すると、その沸点や分解点が高いことから、金属微粒子同士を焼結させて配線や導電回路など形成する際に、金属微粒子の表面の界面活性剤を除去や分解するために、高温で処理する必要があり、耐熱性の低い基板を使用することができなくなるだけでなく、３０分〜１時間程度の比較的長時間にわたって熱処理する必要があり、生産性が悪くなる。また、導電性インクの分散媒として有機溶媒を使用すると、廃棄の際に注意を払わなければ環境汚染の原因になり得るし、また、加熱の際や開放系で放置した場合に蒸発した有機成分が周囲に拡散するため、大量に処理する場合に局所排気装置の設置などが必要になるので、有機溶媒を主成分としない分散媒を使用することができれば、環境面および作業面において望ましい。   In addition, metal fine particles having a particle size of several tens of nanometers or less have very high activity and are unstable as particles as they are, so that sintering and aggregation of metal fine particles are prevented, and the independence and storage of metal fine particles are prevented. In order to ensure stability, a conductive ink (metal fine particle dispersion) is proposed in which metal fine particles coated with an organic substance such as a long-chain surfactant are dispersed in an organic solvent such as decane or terpineol. However, when metal fine particles are coated with a high-molecular-weight long-chain surfactant, the boiling point and decomposition point thereof are high, so when the metal fine particles are sintered together to form wiring, conductive circuits, etc., the surface of the metal fine particles In order to remove or decompose the surface active agent, it is necessary to perform the treatment at a high temperature, which makes it impossible to use a substrate having low heat resistance, and heat treatment is performed for a relatively long time of about 30 minutes to 1 hour. It is necessary and productivity is deteriorated. In addition, if an organic solvent is used as a dispersion medium for the conductive ink, it may cause environmental pollution if care is not taken during disposal, and organic components that have evaporated when heated or left in an open system. Since it diffuses to the surroundings, it is necessary to install a local exhaust device in the case of processing in large quantities. Therefore, if a dispersion medium that does not contain an organic solvent as a main component can be used, it is desirable in terms of environment and work.

そのため、主成分が水である溶媒中に有機酸またはその誘導体により保護された銀ナノ粒子が分散した銀ナノ粒子組成物が提案されている（例えば、特許文献１参照）。この銀ナノ粒子組成物を導電性インクとして使用すれば、低温で短時間の熱処理でも銀ナノ粒子同士を焼結させて基材上に良好な配線や導電回路など形成することができる。   Therefore, a silver nanoparticle composition in which silver nanoparticles protected with an organic acid or a derivative thereof are dispersed in a solvent whose main component is water has been proposed (see, for example, Patent Document 1). If this silver nanoparticle composition is used as a conductive ink, it is possible to sinter silver nanoparticles with low-temperature and short-time heat treatment to form good wirings and conductive circuits on the substrate.

国際公開第２０１２／０２６０３３号（段落番号００１６）International Publication No. 2012/026033 (paragraph number 0016)

しかし、工業的に通常用いられているロール・ツー・ロールの連続式のフレキソ印刷機により、特許文献１の金属ナノ粒子組成物を導電性インクとして使用して、複雑なデザインの配線の形状に基板上に印刷すると、隣接して対向する配線部分の間に鳥の水かき状の薄膜が形成され、熱処理して形成される配線の短絡が生じ易くなるという問題がある。このような薄膜は、特許文献１の銀ナノ粒子組成物中の有機酸またはその誘導体と（銀ナノ粒子の合成時や反応後のｐＨ調整のために添加された）アンモニアとの反応物に起因すると考えられる。   However, with a roll-to-roll continuous flexo printing machine that is usually used industrially, the metal nanoparticle composition of Patent Document 1 is used as a conductive ink to form a complicated wiring design. When printed on a substrate, there is a problem that a bird's web-like thin film is formed between adjacent and opposing wiring portions, and a short circuit of the wiring formed by heat treatment tends to occur. Such a thin film is caused by a reaction product of an organic acid or a derivative thereof in the silver nanoparticle composition of Patent Document 1 and ammonia (added for pH adjustment after the synthesis of silver nanoparticles or after the reaction). I think that.

このような薄膜の形成は、低容量のアニロックスロールを使用すれば防止することができるが、低容量のアニロックスロールを使用すると、導電性インクの転写率が低下して、熱処理して形成される配線の膜厚が薄くなって抵抗が高くなるという問題がある。
したがって、本発明は、このような従来の問題点に鑑み、フレキソ印刷により基材上に所望の配線形状に印刷することができるとともに、熱処理して基板上に形成した配線の抵抗の低下を防止することができる、銀微粒子分散液を提供することを目的とする。 The formation of such a thin film can be prevented by using a low-capacity anilox roll. However, if a low-capacity anilox roll is used, the transfer rate of the conductive ink is lowered, and the thin film is formed by heat treatment. There is a problem that the thickness of the wiring is reduced and the resistance is increased.
Therefore, in view of such a conventional problem, the present invention can print a desired wiring shape on a base material by flexographic printing, and prevent a decrease in resistance of wiring formed on a substrate by heat treatment. An object of the present invention is to provide a silver fine particle dispersion that can be obtained.

本発明者らは、上記課題を解決するために鋭意研究した結果、有機酸またはその誘導体で被覆された銀微粒子が水系分散媒中に分散し、アンモニアと硝酸を含む銀微粒子分散液に形状保持剤を添加することにより、フレキソ印刷により基材上に所望の配線形状に印刷することができるとともに、熱処理して基板上に形成した配線の抵抗の低下を防止することができる、銀微粒子分散液を提供することができることを見出し、本発明を完成するに至った。   As a result of diligent research to solve the above problems, the inventors of the present invention dispersed silver fine particles coated with an organic acid or a derivative thereof in an aqueous dispersion medium and maintained the shape in a silver fine particle dispersion containing ammonia and nitric acid. By adding an agent, a silver fine particle dispersion that can be printed in a desired wiring shape on a base material by flexographic printing and can prevent a decrease in the resistance of a wiring formed on a substrate by heat treatment The present invention has been found to be able to be provided.

すなわち、本発明による銀微粒子分散液は、有機酸またはその誘導体で被覆された銀微粒子が水系分散媒中に分散し、アンモニアと硝酸を含む銀微粒子分散液において、形状保持剤が添加されていることを特徴とする。   That is, in the silver fine particle dispersion according to the present invention, silver fine particles coated with an organic acid or a derivative thereof are dispersed in an aqueous dispersion medium, and a shape retention agent is added to the silver fine particle dispersion containing ammonia and nitric acid. It is characterized by that.

この銀微粒子分散液において、形状保持剤として表面調整剤を使用するのが好ましく、銀微粒子分散液中の表面調整剤の含有量が０．１５〜０．６質量％であるのが好ましい。表面調整剤として、ポリエーテル変性ポリジメチルシロキサンとポリ（オキシエチレン）アルキルエーテルまたはポリエーテルとを含む表面調整剤を使用するのが好ましい。また、形状保持剤として消泡剤を使用してもよく、銀微粒子分散液中の消泡剤の含有量が０．００５〜０．６質量％であるのが好ましい。消泡剤として、シリコーン消泡剤を使用するのが好ましい。   In this silver fine particle dispersion, it is preferable to use a surface conditioner as the shape-retaining agent, and the content of the surface conditioner in the silver fine particle dispersion is preferably 0.15 to 0.6% by mass. As the surface conditioner, it is preferable to use a surface conditioner containing polyether-modified polydimethylsiloxane and poly (oxyethylene) alkyl ether or polyether. Moreover, you may use an antifoamer as a shape retention agent, and it is preferable that content of the antifoamer in silver fine particle dispersion is 0.005-0.6 mass%. As the antifoaming agent, it is preferable to use a silicone antifoaming agent.

また、銀微粒子分散液の液中のアンモニアの濃度が０．１〜２．０質量％であるのが好ましく、硝酸の濃度が０．１〜６．０質量％であるのが好ましい。また、銀微粒子分散液のｐＨが５．３〜８．０であるのが好ましく、水系分散媒が５０質量％以上の水を含む溶媒であるのが好ましい。また、銀微粒子分散液中の銀微粒子の含有量が３０〜７５質量％であるのが好ましく、銀微粒子の平均粒径が１〜１００ｎｍであるのが好ましく、有機酸が炭素数５〜８のカルボン酸であるのが好ましい。また、銀微粒子分散液中の銀に対する有機酸またはその誘導体の量が２〜２０質量％であるのが好ましく、銀微粒子分散液のラメラ長の平均値が４．６ｍｍ以下であるのが好ましい。   Moreover, it is preferable that the density | concentration of ammonia in the liquid of a silver fine particle dispersion is 0.1-2.0 mass%, and it is preferable that the density | concentration of nitric acid is 0.1-6.0 mass%. The pH of the silver fine particle dispersion is preferably 5.3 to 8.0, and the aqueous dispersion medium is preferably a solvent containing 50% by mass or more of water. Further, the content of silver fine particles in the silver fine particle dispersion is preferably 30 to 75% by mass, the average particle size of the silver fine particles is preferably 1 to 100 nm, and the organic acid has 5 to 8 carbon atoms. A carboxylic acid is preferred. The amount of the organic acid or derivative thereof relative to silver in the silver fine particle dispersion is preferably 2 to 20% by mass, and the average value of the lamella length of the silver fine particle dispersion is preferably 4.6 mm or less.

なお、本明細書中において、「銀微粒子の平均粒径」とは、銀微粒子の透過型電子顕微鏡写真（ＴＥＭ像）による一次粒子径の平均値である一次粒子平均径（平均一次粒径）をいう。   In the present specification, “average particle diameter of silver fine particles” refers to an average primary particle diameter (average primary particle diameter) that is an average value of primary particle diameters according to a transmission electron micrograph (TEM image) of silver fine particles. Say.

また、「ラメラ長」とは、液体膜がどれだけ伸びるかを示す指標であり、リング（ラメラ長測定子）を液体に浸漬した後に鉛直方向に引き上げて、リングと液体面との間に形成された液体膜によりリングに働く力が最大になってから、液体膜が切れるまでのリングの引き上げ距離をラメラ長として測定することができる。本明細書中において、「ラメラ長の平均値」とは、ラメラ長測定子として線材直径０．４０ｍｍ、リング直径１４．４ｍｍの白金リングを使用し、自動表面張力計により、ステージ上下速度１．０ｍｍ／秒、プリウェットステージ上下速度１．０ｍｍ／秒、プリウェット浸漬距離２．５０ｍｍ、プリウェット浸漬時間５秒で測定したときに、ラメラ長の６回の測定値の平均値をいう。   The “lamellar length” is an index that indicates how much the liquid film extends. It is formed between the ring and the liquid surface by immersing the ring (lamellar length measuring element) in the liquid and then pulling it up in the vertical direction. The pulling distance of the ring from when the force acting on the ring is maximized by the formed liquid film until the liquid film is cut can be measured as the lamella length. In the present specification, the “average value of lamella length” means that a platinum ring having a wire diameter of 0.40 mm and a ring diameter of 14.4 mm is used as a lamella length gauge, and the vertical speed of the stage is 1. When measured at 0 mm / second, pre-wet stage vertical speed of 1.0 mm / second, pre-wet immersion distance of 2.50 mm, and pre-wet immersion time of 5 seconds, it means the average value of six measurements of lamella length.

本発明によれば、フレキソ印刷により基材上に所望の配線形状に印刷することができるとともに、熱処理して基板上に形成した配線の抵抗の低下を防止することができる、銀微粒子分散液を提供することができる。   According to the present invention, a silver fine particle dispersion liquid that can be printed in a desired wiring shape on a base material by flexographic printing and that can prevent a decrease in resistance of wiring formed on a substrate by heat treatment. Can be provided.

銀微粒子分散液の水かき状の薄膜の長さを測定するために形成した塗膜の形状および大きさを示す平面図である。It is a top view which shows the shape and magnitude | size of the coating film formed in order to measure the length of the web-like thin film of silver fine particle dispersion. 銀微粒子分散液の水かき状の薄膜の長さの測定方法を説明する図である。It is a figure explaining the measuring method of the length of the web shaped thin film of silver fine particle dispersion. 実施例および比較例で作製したＲＦＩＤアンテナの形状を示す平面図である。It is a top view which shows the shape of the RFID antenna produced by the Example and the comparative example.

本発明による銀微粒子分散液の実施の形態は、有機酸またはその誘導体で被覆された銀微粒子が水系分散媒中に分散し、アンモニアと硝酸を含む銀微粒子分散液において、形状保持剤が添加されている。   In the embodiment of the silver fine particle dispersion according to the present invention, silver fine particles coated with an organic acid or a derivative thereof are dispersed in an aqueous dispersion medium, and a shape preservative is added to the silver fine particle dispersion containing ammonia and nitric acid. ing.

水系分散媒は、水を主成分とする溶媒であり、好ましくは５０質量％以上、さらに好ましくは７５質量％以上の水を含む溶媒である。この水系分散媒の粘度を調整するために、銀微粒子分散液に対して１０質量％以下のポリウレタンシックナーなどのシックナー（増粘剤）を添加してもよく、湿潤のために１０質量％以下のプロピレングリコールなどの有機溶媒を添加してもよい。また、水系分散媒と基材との密着性をより強固にするために、水中に高分子が安定して懸濁および分散した水性分散樹脂を添加してもよい。この水性分散樹脂として、塩化ビニルなどの水性ラテックスなどを使用することができる。水性分散樹脂の添加量は、０．５〜８質量％であるのが好ましく、１〜７質量％であるのがさらに好ましい。０．５質量％未満では基材との密着性をより強固にするには十分ではなく、８質量％よりも多いと、銀微粒子分散液中に凝集塊が発生するなど、分散性が悪化するととともに、塗膜化する際の導電性に悪影響を及ぼすため好ましくない。   The aqueous dispersion medium is a solvent containing water as a main component, and is preferably a solvent containing 50% by mass or more, more preferably 75% by mass or more. In order to adjust the viscosity of the aqueous dispersion medium, a thickener (thickener) such as polyurethane thickener of 10% by mass or less may be added to the silver fine particle dispersion, and 10% by mass or less for wetting. An organic solvent such as propylene glycol may be added. In order to further strengthen the adhesion between the aqueous dispersion medium and the substrate, an aqueous dispersion resin in which a polymer is stably suspended and dispersed in water may be added. As this aqueous dispersion resin, aqueous latex such as vinyl chloride can be used. The addition amount of the aqueous dispersion resin is preferably 0.5 to 8% by mass, and more preferably 1 to 7% by mass. If it is less than 0.5% by mass, it is not sufficient to further strengthen the adhesion to the substrate, and if it exceeds 8% by mass, the dispersibility deteriorates, for example, aggregates are generated in the silver fine particle dispersion. At the same time, it adversely affects the conductivity when forming a coating film, which is not preferable.

形状保持剤として、表面調整剤または消泡剤を使用するのが好ましく、表面調整剤が水に不溶性であるのが好ましい。銀微粒子分散液に表面調整剤（好ましくは水に不溶性の表面調整剤）や消泡剤を添加すると、銀微粒子分散液を複雑なデザインの配線の形状に基板上に印刷した場合でも、隣接して対向する配線部分の間に鳥の水かき状の薄膜が形成されるのを抑制し、熱処理して形成される配線の短絡を防止することができる。また、銀微粒子分散液中の泡を消したり、銀微粒子分散液を基板上に塗布して塗膜を形成した際に、塗膜の表面の泡を消して塗膜を均一の厚さにすることもできる。形状保持剤として表面調整剤を使用する場合には、銀微粒子分散液中の表面調整剤の含有量が０．１５〜０．６質量％であるのが好ましく、０．２〜０．５質量％であるのがさらに好ましい。また、形状保持剤として消泡剤を使用する場合には、銀微粒子分散液中の消泡剤の含有量が０．００５〜０．６質量％であるのが好ましく、０．０１〜０．３質量％であるのがさらに好ましい。   As the shape-retaining agent, it is preferable to use a surface conditioner or an antifoaming agent, and the surface conditioner is preferably insoluble in water. When a surface conditioner (preferably a water-insoluble surface conditioner) or antifoaming agent is added to the silver fine particle dispersion, the silver fine particle dispersion is adjoined even when printed on the substrate in the shape of a complicatedly designed wiring. Thus, it is possible to suppress the formation of a bird's web-like thin film between the wiring portions facing each other, and to prevent a short circuit of the wiring formed by heat treatment. Also, when the foam in the silver fine particle dispersion is erased or when the silver fine particle dispersion is applied onto the substrate to form a coating film, the foam on the surface of the coating film is erased to make the coating thickness uniform. You can also. When using a surface conditioner as the shape-retaining agent, the content of the surface conditioner in the silver fine particle dispersion is preferably 0.15 to 0.6% by mass, and 0.2 to 0.5% by mass. % Is more preferable. Moreover, when using an antifoamer as a shape retention agent, it is preferable that content of the antifoamer in silver fine particle dispersion is 0.005-0.6 mass%, and 0.01-0. More preferably, it is 3 mass%.

表面調整剤としては、ポリエーテル変性ポリジメチルシロキサンとポリ（オキシエチレン）アルキルエーテルまたはポリエーテルとを含む表面調整剤を使用するのが好ましい。ポリエーテル変性ポリジメチルシロキサンとポリ（オキシエチレン）アルキルエーテルを含む表面調整剤としては、不揮発成分を９５質量％以上含み、表面張力低下能力が中程度であり、４３質量％のポリエーテル変性ポリジメチルシロキサンと５７質量％のポリ（オキシエチレン）アルキルエーテルを含む表面調整剤（ＢＹＫ社製のＢＹＫ３０２）を使用することができる。ポリエーテル変性ポリジメチルシロキサンとポリエーテルを含む表面調整剤としては、不揮発成分を９８質量％以上含み、表面張力低下能力が中程度であり、ポリエーテル変性ポリジメチルシロキサンとポリエーテルの混合物からなる表面調整剤（ＢＹＫ社製のＢＹＫ３３１）や、不揮発成分を９７質量％以上含み、表面張力低下能力が高く、ポリエーテル変性ポリジメチルシロキサンとポリエーテルの混合物からなる表面調整剤（ＢＹＫ社製のＢＹＫ３３３）を使用することができる。   As the surface conditioner, it is preferable to use a surface conditioner containing polyether-modified polydimethylsiloxane and poly (oxyethylene) alkyl ether or polyether. The surface conditioner containing polyether-modified polydimethylsiloxane and poly (oxyethylene) alkyl ether contains 95% by mass or more of non-volatile components, has a moderate surface tension reducing ability, and is 43% by mass of polyether-modified polydimethyl. A surface conditioner (BYK302 manufactured by BYK) containing siloxane and 57% by mass of poly (oxyethylene) alkyl ether can be used. As a surface conditioner containing polyether-modified polydimethylsiloxane and polyether, a surface composed of a mixture of polyether-modified polydimethylsiloxane and polyether, containing 98% by mass or more of non-volatile components and having a moderate surface tension reducing ability. Conditioner (BYK331 manufactured by BYK) and a surface conditioner comprising a mixture of polyether-modified polydimethylsiloxane and polyether (BYK333 manufactured by BYK) that contains 97% by mass or more of non-volatile components and has a high surface tension reducing ability. Can be used.

消泡剤としては、シリコーン消泡剤を使用するのが好ましい。このシリコーン消泡剤として、信越化学株式会社製のＫＭ−７７５０（有効成分３８％）やＫＭ−９０（有効成分５３％）を使用することができる。   As the antifoaming agent, it is preferable to use a silicone antifoaming agent. As this silicone antifoaming agent, KM-7750 (active ingredient 38%) and KM-90 (active ingredient 53%) manufactured by Shin-Etsu Chemical Co., Ltd. can be used.

銀微粒子分散液の液中のアンモニアの濃度は、０．１〜２．０質量％であるのが好ましく、０．２〜１．５質量％であるのがさらに好ましい。アンモニア濃度が０．１質量％未満であると、銀微粒子分散液中の銀微粒子の２次凝集体が大きくなって銀微粒子の沈降が激しくなり、銀微粒子分散液を基板上に塗布して焼成することにより形成された銀導電膜の導電性が悪化する。一方、アンモニア濃度が２．０質量％を超えると、イオン強度が高くなり過ぎて、銀微粒子が激しく凝集する。   The concentration of ammonia in the silver fine particle dispersion is preferably 0.1 to 2.0 mass%, more preferably 0.2 to 1.5 mass%. When the ammonia concentration is less than 0.1% by mass, the secondary aggregates of silver fine particles in the silver fine particle dispersion become large and the silver fine particles settle down, and the silver fine particle dispersion is applied onto the substrate and fired. As a result, the conductivity of the silver conductive film formed deteriorates. On the other hand, when the ammonia concentration exceeds 2.0% by mass, the ionic strength becomes too high and the silver fine particles agglomerate violently.

銀微粒子分散液の液中の硝酸の濃度は、０．１〜６．０質量％であるのが好ましく、０．３〜５．０質量％であるのがさらに好ましい。硝酸の濃度が０．１質量％未満であると、銀微粒子分散液を基板上に塗布した塗膜を加熱して焼成することにより銀導電膜を形成する際に、銀微粒子分散液に添加した樹脂などの分解を促進することができなくなり、低温焼結性が悪化する。一方、硝酸の濃度が６．０質量％を超えると、イオン強度が高くなり過ぎて、銀微粒子が激しく凝集する。   The concentration of nitric acid in the silver fine particle dispersion is preferably 0.1 to 6.0% by mass, and more preferably 0.3 to 5.0% by mass. When the concentration of nitric acid is less than 0.1% by mass, the silver fine particle dispersion was added to the silver fine particle dispersion when forming a silver conductive film by heating and baking the coating film coated on the substrate. Decomposition of resin or the like cannot be promoted, and the low temperature sinterability deteriorates. On the other hand, when the concentration of nitric acid exceeds 6.0% by mass, the ionic strength becomes too high and silver fine particles agglomerate violently.

銀微粒子は、平均粒径が１〜１００ｎｍであり、１〜５０ｎｍであるのが好ましく、１〜３０ｎｍであるのがさらに好ましく、１〜２０ｎｍであるのが最も好ましい。平均粒径が１００ｎｍよりも大きいと、銀微粒子として期待される低温焼結性が得られ難くなる。また、銀微粒子分散液中の銀微粒子の含有量は、３０〜７５質量％であるのが好ましく、５５〜７５質量％であるのがさらに好ましい。銀微粒子分散液中の銀微粒子の含有量が少な過ぎると、銀微粒子分散液を使用して形成した配線や導電回路などの導電性が悪くなり、銀微粒子分散液中の銀微粒子の含有量が多過ぎると、銀微粒子分散液の粘度が高くなり過ぎて、基銀微粒子分散液を基板上に良好に印刷することができなくなる。   The silver fine particles have an average particle diameter of 1 to 100 nm, preferably 1 to 50 nm, more preferably 1 to 30 nm, and most preferably 1 to 20 nm. When the average particle size is larger than 100 nm, it is difficult to obtain the low-temperature sinterability expected as silver fine particles. Further, the content of silver fine particles in the silver fine particle dispersion is preferably 30 to 75% by mass, and more preferably 55 to 75% by mass. If the silver fine particle content in the silver fine particle dispersion is too small, the conductivity of the wiring or conductive circuit formed using the silver fine particle dispersion will deteriorate, and the silver fine particle content in the silver fine particle dispersion will be reduced. If the amount is too large, the viscosity of the silver fine particle dispersion becomes too high and the base silver fine particle dispersion cannot be printed satisfactorily on the substrate.

銀微粒子は、表面が炭素数５〜８のカルボン酸（例えば、ヘプタン酸）のような有機酸またはその誘導体で被覆されているのが好ましい。このような被覆により銀微粒子間の焼結を防ぎ、銀微粒子間の距離を適度に保つことができる。炭素数が８よりも大きくなると、熱分解時に高い熱エネルギーが必要となり、一方、炭素数が３より小さくなると、銀微粒子間の距離を適度に保つことができなくなる。   The surface of the silver fine particles is preferably coated with an organic acid such as a carboxylic acid having 5 to 8 carbon atoms (for example, heptanoic acid) or a derivative thereof. Such a coating prevents sintering between the silver fine particles and keeps the distance between the silver fine particles moderate. If the carbon number is greater than 8, high thermal energy is required during pyrolysis. On the other hand, if the carbon number is smaller than 3, the distance between the silver fine particles cannot be maintained appropriately.

銀微粒子分散液のｐＨは、５．３〜８．０であるのが好ましい。ｐＨが５．３より低いと、銀微粒子分散液中の有機酸やその誘導体がほとんど溶解しないため、銀微粒子の表面から過剰な有機酸やその誘導体を解離させることができず、ｐＨが８．０より高いと、銀微粒子分散液中の有機酸やその誘導体の溶解度が高くなり過ぎて、銀微粒子同士を分散させるために十分な量の有機酸やその誘導体により銀微粒子を被覆することができなくなるため、銀微粒子同士が凝集する。   The pH of the silver fine particle dispersion is preferably 5.3 to 8.0. When the pH is lower than 5.3, the organic acid and its derivative in the silver fine particle dispersion are hardly dissolved. Therefore, the excess organic acid and its derivative cannot be dissociated from the surface of the silver fine particle, and the pH is 8. If it is higher than 0, the solubility of the organic acid or its derivative in the silver fine particle dispersion becomes too high, and the silver fine particle can be coated with a sufficient amount of the organic acid or its derivative to disperse the silver fine particles. Since it disappears, silver fine particles aggregate.

銀微粒子分散液の粘度は、２５℃において１１．７（１／ｓ）、１０８（１／ｓ）および１０００（１／ｓ）で、それぞれ１０，０００ｍＰａ・ｓ以下、２，０００ｍＰａ・ｓ以下、５００ｍＰａ・ｓ以下であるのが好ましい。銀微粒子分散液の粘度が高過ぎると、銀微粒子分散液を基板上に塗布した際の塗膜の表面が粗くなるとともに、銀微粒子分散液を基板上に連続的に印刷する場合に、銀微粒子分散液を供給し難くなり、良好に印刷することができなくなる。   The viscosity of the silver fine particle dispersion is 11.7 (1 / s), 108 (1 / s) and 1000 (1 / s) at 25 ° C., respectively, 10,000 mPa · s or less, 2,000 mPa · s or less, It is preferably 500 mPa · s or less. When the viscosity of the silver fine particle dispersion is too high, the surface of the coating film becomes rough when the silver fine particle dispersion is applied to the substrate, and the silver fine particle dispersion is continuously printed on the substrate. It becomes difficult to supply the dispersion and printing cannot be performed satisfactorily.

銀微粒子分散液中の銀に対する有機酸またはその誘導体の量は、２〜２０質量％であるのが好ましい。２質量％未満であると、銀微粒子を被覆して保護する効果が著しく低下し、銀微粒子の凝集体を生じ、低温焼結性が悪化する。一方、２０質量％を超えると、有機酸やその誘導体の沸点が水よりも高いことから、低温で且つ短時間で焼結させることができなくなる。   The amount of the organic acid or derivative thereof relative to silver in the silver fine particle dispersion is preferably 2 to 20% by mass. If it is less than 2% by mass, the effect of covering and protecting the silver fine particles is remarkably reduced, and aggregates of silver fine particles are produced, and the low-temperature sinterability deteriorates. On the other hand, if it exceeds 20% by mass, the boiling point of the organic acid or its derivative is higher than that of water, so that it cannot be sintered at a low temperature in a short time.

なお、銀微粒子の平均粒径（一次粒子平均径）は、例えば、６０質量％のＡｇ粒子と３．０質量％の塩化ビニルコポリマーラテックスと２．０質量％のポリウレタンシックナーと２．５質量％のプロピレングリコールとを含む水系Ａｇインクなどの銀微粒子を含む水系Ａｇインク２質量部をシクロヘキサン９６質量部とオレイン酸２質量部の混合溶液に添加し、超音波によって分散させた後、得られた分散溶液を支持膜付きＣｕマイクログリッドに滴下して乾燥させ、このマイクログリッド上の銀微粒子を透過型電子顕微鏡（日本電子株式会社製のＪＥＭ−１００ＣＸＭａｒｋ−ＩＩ型）により加速電圧１００ｋＶとして明視野で観察した像を倍率３００，０００倍で撮影し、得られたＴＥＭ像から算出することができる。この銀微粒子の一次粒子平均径の算出は、例えば、画像解析ソフト（旭化成エンジニアリング株式会社製のＡ像くん（登録商標））を使用して行うことができる。この画像解析ソフトは、色の濃淡で個々の粒子を識別して解析するものであり、例えば、３００，０００倍のＴＥＭ像に対して「粒子の明度」を「暗」、「雑音除去フィルタ」を「有」、「円形しきい値」を「２０」、「重なり度」を「５０」とする条件で円形粒子解析を行って、２００個以上の粒子について一次粒子径を測定し、その数平均径を求めて一次粒子平均径とすることができる。なお、ＴＥＭ像中に凝結粒子や異形粒子が多数ある場合には、測定不能とすればよい。   The average particle diameter (primary particle average diameter) of the silver fine particles is, for example, 60% by mass of Ag particles, 3.0% by mass of vinyl chloride copolymer latex, 2.0% by mass of polyurethane thickener, and 2.5% by mass. Obtained by adding 2 parts by mass of an aqueous Ag ink containing silver fine particles such as an aqueous Ag ink containing propylene glycol to a mixed solution of 96 parts by mass of cyclohexane and 2 parts by mass of oleic acid and dispersing by ultrasonic waves. The dispersion solution is dropped onto a Cu microgrid with a support film and dried, and the silver fine particles on the microgrid are brightened at an accelerating voltage of 100 kV with a transmission electron microscope (JEM-100CXMark-II type manufactured by JEOL Ltd.) in a bright field. The observed image can be taken at a magnification of 300,000 and calculated from the obtained TEM image. The primary particle average diameter of the silver fine particles can be calculated using, for example, image analysis software (A Image-kun (registered trademark) manufactured by Asahi Kasei Engineering Co., Ltd.). This image analysis software discriminates and analyzes individual particles based on color shading. For example, for a 300,000-fold TEM image, the “particle brightness” is “dark” and “noise removal filter”. Is “Yes”, “Circular threshold” is “20”, and “Overlapping degree” is “50”, and circular particle analysis is performed to measure the primary particle diameter of 200 or more particles. An average diameter can be calculated | required and it can be set as an average primary particle diameter. In addition, what is necessary is just to make measurement impossible when there are many condensed particles and irregular-shaped particles in a TEM image.

また、銀微粒子分散液のラメラ長は、ラメラ長測定子として線材直径０．４０ｍｍ、リング直径１４．４ｍｍの白金リングを使用し、自動表面張力計により、ステージ上下速度１．０ｍｍ／秒、プリウェットステージ上下速度１．０ｍｍ／秒、プリウェット浸漬距離２．５０ｍｍ、プリウェット浸漬時間５秒で測定したときに、６回の測定値の平均値が４．６ｍｍ以下であるのが好ましい。このラメラ長の平均値が４．６ｍｍより長くなると、複雑なデザインの配線の形状に基板上に印刷した場合に、隣接して対向する配線部分の間に鳥の水かき状の薄膜が形成され、熱処理して形成される配線の短絡が生じ易くなる。   The lamella length of the silver fine particle dispersion is a platinum ring having a wire diameter of 0.40 mm and a ring diameter of 14.4 mm as a lamella length measuring element. When measured at a wet stage up / down speed of 1.0 mm / second, a pre-wet immersion distance of 2.50 mm, and a pre-wet immersion time of 5 seconds, the average value of the six measurements is preferably 4.6 mm or less. When the average value of this lamella length is longer than 4.6 mm, when a complicated design of the wiring shape is printed on the substrate, a bird's webbed thin film is formed between adjacent wiring portions, Short circuit of the wiring formed by heat treatment is likely to occur.

また、フレキソ印刷機を使用し、アニロックス容量２０ｃｃ／ｍ２（１５０線／インチ）、印刷速度２０ｍ／分として、紙の基材上に、図１Ａに示す形状および大きさの塗膜（長さ３０ｍｍ×幅９．５ｍｍの領域内に線幅０．５ｍｍ、幅方向間隔０．５ｍｍで折り返した塗膜）を形成するように銀微粒子分散液を（矢印Ｂで示す方向に）塗布したときに、図１Ｂに斜線で示す領域に形成された（銀微粒子分散液の）水かき状の薄膜の長さＬが１０ｍｍ以下であるのが好ましい。 Also, using a flexographic printing machine, with an anilox capacity of 20 cc / m 2 (150 lines / inch), a printing speed of 20 m / min, a coating film (length) having a shape and size shown in FIG. When the silver fine particle dispersion is applied (in the direction indicated by arrow B) so as to form a coating film folded back with a line width of 0.5 mm and a widthwise interval of 0.5 mm in an area of 30 mm × width of 9.5 mm The length L of the web-like thin film (of the silver fine particle dispersion) formed in the hatched region in FIG. 1B is preferably 10 mm or less.

以下、本発明による銀微粒子分散液の実施例について詳細に説明する。   Hereinafter, examples of the silver fine particle dispersion according to the present invention will be described in detail.

［実施例１］
まず、２８質量％のアンモニア水０．３１ｋｇとヘプタン酸０．３６ｋｇをイオン交換水１．２ｋｇに混合した原料液Ａと、８５質量％の含水ヒドラジン０．３９ｋｇをイオン交換水１．０ｋｇで希釈した原料液Ｂと、硝酸銀結晶１．４ｋｇを加温したイオン交換水１．２ｋｇに溶解させた原料液Ｃを用意した。 [Example 1]
First, a raw material liquid A prepared by mixing 0.31 kg of 28% by mass of ammonia water and 0.36 kg of heptanoic acid with 1.2 kg of ion-exchanged water and 0.39 kg of 85% by mass of hydrous hydrazine were diluted with 1.0 kg of ion-exchanged water. A raw material liquid B prepared by dissolving 1.4 kg of silver nitrate crystals in 1.2 kg of heated ion-exchanged water was prepared.

次に、還流冷却器付の反応槽にイオン交換水を１１ｋｇ添加して攪拌しながら加熱し、液温が３０〜５０℃の範囲になったときに、攪拌しながら原料液Ａ、Ｂ、Ｃを順次添加して、銀微粒子の合成反応を開始させた。この反応中に液温が６０℃以上にならないように、反応槽に設置した冷却管により反応槽内を冷却した。この反応槽の冷却を止めても、反応熱による昇温がなくなった時点で反応終了した。   Next, 11 kg of ion exchange water was added to a reaction tank equipped with a reflux condenser and heated while stirring. When the liquid temperature was in the range of 30 to 50 ° C., the raw material liquids A, B, and C were stirred. Were sequentially added to initiate the silver fine particle synthesis reaction. The reaction tank was cooled by a cooling pipe installed in the reaction tank so that the liquid temperature did not exceed 60 ° C. during the reaction. Even when the cooling of the reaction vessel was stopped, the reaction was completed when the temperature was not increased due to the reaction heat.

この反応により得られた反応液（ヘプタン酸が周囲に配置された銀微粒子を含む液）を別の容器に移して２４時間静置した後、上澄み液を取り除いて反応液を濃縮した。このようにして得られた濃縮物を気密性の高い蓋付き瓶に入れて冷暗所で３か月静置した後、上澄み液を適度に取り除いて、さらに濃縮された反応液を得た。   The reaction solution obtained by this reaction (a solution containing silver fine particles around which heptanoic acid is arranged) was transferred to another container and allowed to stand for 24 hours, and then the supernatant was removed to concentrate the reaction solution. The concentrate thus obtained was placed in a highly airtight lidded bottle and allowed to stand in a cool and dark place for 3 months, and then the supernatant was removed appropriately to obtain a further concentrated reaction solution.

このようにして濃縮された反応液にアンモニア水を添加してｐＨ６．０に調整し、３日間静置して（銀微粒子の周囲から）過剰なヘプタン酸を解離させた後、上澄み液を取り除いて、ヘプタン酸で被覆された銀微粒子を含む液を得た。なお、この銀微粒子の平均粒径は１８ｎｍであった。   Ammonia water is added to the reaction solution thus concentrated to adjust the pH to 6.0, and left to stand for 3 days (from around the silver fine particles) to dissociate excess heptanoic acid, and then the supernatant is removed. Thus, a liquid containing silver fine particles coated with heptanoic acid was obtained. The average particle diameter of the silver fine particles was 18 nm.

このようにして得られた（ヘプタン酸で被覆された）銀微粒子を含む液に、（基板上に塗布する際に基板との密着性を高めるために高ＴｇポリマーとしてＴｇが７３℃の）塩化ビニルコポリマーラテックスと、（粘度調整のために）ポリウレタンシックナーと、（湿潤剤として）プロピレングリコールと、（銀濃度を調整するために）上記のｐＨ調整後に得られた上澄み液を添加して攪拌することにより、６１質量％銀微粒子と、３．０質量％の塩化ビニルコポリマーラテックス（Ｔｇ＝７３℃）と、２．０質量％のポリウレタンシックナーと、２．５質量％のプロピレングリコールを含む導電性Ａｇインクを得た。   The liquid containing silver fine particles (coated with heptanoic acid) obtained in this way is chlorinated (with a Tg of 73 ° C. as a high Tg polymer in order to enhance adhesion to the substrate when applied on the substrate). Add vinyl copolymer latex, polyurethane thickener (for viscosity adjustment), propylene glycol (as wetting agent), and supernatant obtained after pH adjustment (to adjust silver concentration) and stir. Conductive material containing 61% by weight silver fine particles, 3.0% by weight vinyl chloride copolymer latex (Tg = 73 ° C.), 2.0% by weight polyurethane thickener, and 2.5% by weight propylene glycol. Ag ink was obtained.

この導電性Ａｇインク２００ｇに、４３質量％のポリエーテル変性ポリジメチルシロキサンと５７質量％のポリ（オキシエチレン）アルキルエーテルとからなる表面調整剤（ＢＹＫ社製のＢＹＫ３０２）（不揮発成分を９５質量％以上含み、表面張力低下能力が中程度）０．４１ｇ（Ａｇインクに対して０．２０質量％）と、上記のｐＨ調整前に得られた上澄み液４．９８ｇを添加して、Ａｇ濃度５９．４質量％の銀微粒子分散液を得た。   In 200 g of this conductive Ag ink, a surface conditioner (BYK302 manufactured by BYK) consisting of 43% by mass of polyether-modified polydimethylsiloxane and 57% by mass of poly (oxyethylene) alkyl ether (95% by mass of non-volatile components) In addition, 0.41 g (0.20 mass% with respect to Ag ink) and 4.98 g of the supernatant obtained before the pH adjustment described above were added, and the Ag concentration was 59. A 4% by mass silver fine particle dispersion was obtained.

このようにして得られた銀微粒子分散液をメンブレンフィルタと超遠心分離機により固液分離し、液体中のアンモニア濃度と硝酸濃度をイオンクロマトグラフにより測定したところ、アンモニア濃度は０．４質量％であり、硝酸濃度は１．０質量％であった。また、銀微粒子分散液に硝酸を過剰に添加して加熱し、完全に金属成分を溶解させた後、ｎ−ヘキサンで４回抽出し、その後、ガスクロマトグラフ質量分析計（ヒューレット・パッカード社製）により、有機酸（ヘプタン酸）を定量したところ、銀に対するヘプタン酸の量は５質量％であった。なお、以下に示す実施例２〜１２および比較例１〜７において、銀微粒子分散液の液中のアンモニア濃度および硝酸濃度と銀に対するヘプタン酸の量は上記の値とほぼ同じ値（それぞれ０．４質量％、１．０質量％および５質量％）であった。   The silver fine particle dispersion thus obtained was solid-liquid separated with a membrane filter and an ultracentrifuge, and the ammonia concentration and nitric acid concentration in the liquid were measured by ion chromatography. The ammonia concentration was 0.4% by mass. The nitric acid concentration was 1.0% by mass. In addition, excessive addition of nitric acid to the silver fine particle dispersion and heating to completely dissolve the metal component, followed by extraction with n-hexane four times, followed by a gas chromatograph mass spectrometer (manufactured by Hewlett-Packard) The amount of heptanoic acid relative to silver was 5% by mass. In Examples 2 to 12 and Comparative Examples 1 to 7 shown below, the ammonia concentration and the nitric acid concentration in the liquid of the silver fine particle dispersion and the amount of heptanoic acid relative to silver were substantially the same values as described above (each 0. 4 mass%, 1.0 mass% and 5 mass%).

また、この銀微粒子分散液のｐＨを（ＪＩＳ Ｚ８８０２（１９８４年度版）のｐＨ測定法に準拠した）ｐＨ計（株式会社堀場製作所製のハンディーｐＨ／ＤｏメータＤ−５５）で測定したところ、ｐＨ５．８４であった。なお、このｐＨ測定前にｐＨ６．８６とｐＨ４．０１の標準液で２点校正を行い、ｐＨ測定は、よく攪拌した後に３０秒〜１分程度静置した後に検査端としてｐＨ電極（株式会社堀場製作所製の９６１１−１０Ｄ）を銀微粒子分散液に浸けて行った。   Further, when the pH of this silver fine particle dispersion was measured with a pH meter (based on the pH measurement method of JIS Z8802 (1984 version)) (handy pH / Do meter D-55 manufactured by Horiba, Ltd.), pH 5 .84. Prior to this pH measurement, two-point calibration was performed with standard solutions of pH 6.86 and pH 4.01, and the pH measurement was performed after thorough stirring and allowed to stand for about 30 seconds to 1 minute, and then the pH electrode (Inc. 9611-10D) manufactured by HORIBA, Ltd. was immersed in a silver fine particle dispersion.

また、この銀微粒子分散液の粘度をレオメーター（ＨＡＡＫＥ社製のＲｅｏｓｔｒｅｓｓ６００Ｃ、コーンはＣ３５／２）を使用して１１．７（１／ｓ）、１０８（１／ｓ）および１０００（１／ｓ）で測定したところ、それぞれ３８３ｍＰａ・ｓ、１４３ｍＰａ・ｓ、１０２ｍＰａ・ｓであり、チキソ比（＝｛１１．７（１／ｓ）のときの粘度｝／｛１０００（１／ｓ）のときの粘度｝）は４であった。また、この銀微粒子分散液のラメラ長をラメラ長測定子として線材直径０．４０ｍｍ、リング直径１４．４ｍｍの白金リングを使用し、自動表面張力計（協和界面科学株式会社製のＤＹ−３００）により、ステージ上下速度１．０ｍｍ／秒、プリウェットステージ上下速度１．０ｍｍ／秒、プリウェット浸漬距離２．５０ｍｍ、プリウェット浸漬時間５秒で測定したところ、６回の測定値の平均値が４．５ｍｍ（標準偏差０．１５、変動係数３．４％）であった。   Further, the viscosity of the silver fine particle dispersion was adjusted to 11.7 (1 / s), 108 (1 / s), and 1000 (1 / s using a rheometer (Reostless 600C manufactured by HAAKE, C35 / 2). ), 383 mPa · s, 143 mPa · s and 102 mPa · s, respectively, and thixo ratio (= {viscosity at 11.7 (1 / s)} / {1000 (1 / s) Viscosity}) was 4. In addition, an automatic surface tension meter (DY-300 manufactured by Kyowa Interface Science Co., Ltd.) is used by using a platinum ring having a wire diameter of 0.40 mm and a ring diameter of 14.4 mm as the lamellar length measuring element of the silver fine particle dispersion. Measured with a stage vertical speed of 1.0 mm / second, a pre-wet stage vertical speed of 1.0 mm / second, a pre-wet immersion distance of 2.50 mm, and a pre-wet immersion time of 5 seconds. 4.5 mm (standard deviation 0.15, coefficient of variation 3.4%).

次に、簡易フレキソ印刷機（ＲＫ Ｐｒｉｎｔ Ｃｏａｔ Ｉｎｓｔｒｕｍｅｎｔｓ Ｌｔｄ．製のフレキソループ１００）と、フレキソ印刷版（株式会社渡辺護三堂製、印刷版の材質は旭化成株式会社製の板状感光性樹脂ＡＷＰ グレードＤＥＦ、表面加工１５０ライン、９６ＤＯＴ％）を使用し、アニロックス容量２０ｃｃ／ｍ２（１５０線／インチ）、印刷速度２０ｍ／分として、紙の基材（三菱製紙株式会社製のＤＦカラーＭ７０、表面粗さ１．６μｍ）上に、図１Ａに示す形状および大きさの塗膜（長さ３０ｍｍ×幅９．５ｍｍの領域内に線幅０．５ｍｍ、幅方向間隔０．５ｍｍで折り返した塗膜）を形成するように、基材を（矢印Ａで示す方向に）移動させて、上記の銀微粒子分散液を（矢印Ｂで示す印刷方向に）塗布した。 Next, a simple flexographic printing machine (flexo loop 100 manufactured by RK Print Coat Instruments Ltd.) and a flexographic printing plate (manufactured by Watanabe Gosando Co., Ltd., the printing plate is made of plate-like photosensitive resin AWP manufactured by Asahi Kasei Corporation) Grade DEF, surface treatment 150 lines, 96 DOT%), anilox capacity 20 cc / m 2 (150 lines / inch), printing speed 20 m / min, paper substrate (DF color M70 manufactured by Mitsubishi Paper Industries, Ltd.) A coating film having a shape and size shown in FIG. 1A on a surface roughness of 1.6 μm (with a line width of 0.5 mm and a width direction interval of 0.5 mm in an area of 30 mm length × 9.5 mm width) The base material was moved (in the direction indicated by arrow A) so as to form a film, and the above-described silver fine particle dispersion was applied (in the printing direction indicated by arrow B).

このように銀微粒子分散液を塗布した後に、図１Ｂに斜線で示す領域に形成された（銀微粒子分散液の）水かき状の薄膜の長さＬを測定して、その平均値を求めたところ、１．９ｍｍであった。   After the silver fine particle dispersion was applied in this way, the length L of the web-like thin film (of the silver fine particle dispersion) formed in the hatched area in FIG. 1B was measured, and the average value was obtained. 1.9 mm.

また、上記の銀微粒子分散液を上記と同様の方法により図２に示す形状（全長３２．０ｍｍ、全幅１８．５ｍｍ、線幅０．５ｍｍのＲＦＩＤアンテナ１０の形状）に印刷した後、ホットプレート上において１４０℃で３０秒間熱処理して焼成することによって、銀導電膜からなるＲＦＩＤアンテナを作製した。   Further, after the above silver fine particle dispersion is printed on the shape shown in FIG. 2 (the shape of the RFID antenna 10 having a total length of 32.0 mm, a total width of 18.5 mm, and a line width of 0.5 mm) by the same method as described above, The RFID antenna which consists of a silver electrically conductive film was produced by heat-treating and baking at 140 degreeC for 30 second above.

この銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。   While measuring the film thickness and electric resistance (line resistance) of this silver electrically conductive film, the volume resistivity of the silver electrically conductive film was computed.

銀導電膜の膜厚は、レーザーマイクロスコープ（ＫＥＹＥＮＣＥ社製の型式ＶＫ−９７００）を用いて、銀導電膜が形成された基材の表面と銀導電膜の表面との高低差を１００箇所測定し、平均値を算出することによって求めた。その結果、銀導電膜の膜厚は２．０μｍであった。   The film thickness of the silver conductive film was measured at 100 points using a laser microscope (Model VK-9700 manufactured by KEYENCE Corp.) at 100 points on the surface of the silver conductive film and the surface of the silver conductive film. And it calculated | required by calculating an average value. As a result, the film thickness of the silver conductive film was 2.0 μm.

銀導電膜のライン抵抗（図３に示すＤとＥの間の電気抵抗）をテスター（ＣＵＳＴＯＭ社製の型式ＣＤＭ−０３Ｄ）により測定したところ、３３Ωであった。   When the line resistance (electric resistance between D and E shown in FIG. 3) of the silver conductive film was measured by a tester (model CDM-03D manufactured by CUSTOM), it was 33Ω.

銀導電膜の体積抵抗率は、銀導電膜の膜厚、幅（０．５ｍｍ）、長さ（２３７．４ｍｍ）と電気抵抗から求めた。その結果、銀導電膜の体積抵抗率は１４．０μΩ・ｃｍであった。   The volume resistivity of the silver conductive film was determined from the film thickness, width (0.5 mm), length (237.4 mm) and electrical resistance of the silver conductive film. As a result, the volume resistivity of the silver conductive film was 14.0 μΩ · cm.

［実施例２］
表面調整剤に代えてシリコーン消泡剤（信越化学株式会社製のＫＭ−７７５０）を使用し、この消泡剤０．０２ｇ（Ａｇインクに対して０．０１質量％）とｐＨ調整前に得られた上澄み液５．３５ｇを添加した以外は、実施例１と同様の方法により、Ａｇ濃度５９．４質量％の銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で２９５ｍＰａ・ｓ、１０８（１／ｓ）で１２９ｍＰａ・ｓ、１０００（１／ｓ）で８０ｍＰａ・ｓであり、チキソ比は４であった。また、ラメラ長は６回の測定値の平均値が１．１ｍｍ（標準偏差０．１２、変動係数１０．５％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は０ｍｍであった。 [Example 2]
A silicone antifoaming agent (KM-7750 manufactured by Shin-Etsu Chemical Co., Ltd.) is used instead of the surface conditioning agent, and 0.02 g of this antifoaming agent (0.01% by mass with respect to Ag ink) and obtained before pH adjustment. A silver fine particle dispersion having an Ag concentration of 59.4% by mass was prepared in the same manner as in Example 1 except that 5.35 g of the obtained supernatant was added, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. The viscosity of the silver fine particle dispersion is 295 mPa · s at 11.7 (1 / s), 129 mPa · s at 108 (1 / s), and 80 mPa · s at 1000 (1 / s), and the thixo ratio is 4. In addition, the average value of the measurement values of the lamellae was 1.1 mm (standard deviation 0.12, variation coefficient 10.5%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 0 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．３μｍ、ライン抵抗は２９Ω、体積抵抗率は１３．９μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.3 μm, the line resistance was 29Ω, and the volume resistivity was 13.9 μΩ · cm.

［実施例３］
消泡剤の添加量を０．０４ｇ（Ａｇインクに対して０．０２質量％）とし、ｐＨ調整前に得られた上澄み液の添加量を５．３５ｇとした以外は、実施例２と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で３５８ｍＰａ・ｓ、１０８（１／ｓ）で１６９ｍＰａ・ｓ、１０００（１／ｓ）で１０４ｍＰａ・ｓであり、チキソ比は３であった。また、ラメラ長は６回の測定値の平均値が１．０ｍｍ（標準偏差０．０７、変動係数６．９％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は０ｍｍであった。 [Example 3]
The same as in Example 2 except that the addition amount of the antifoaming agent was 0.04 g (0.02% by mass with respect to the Ag ink), and the addition amount of the supernatant obtained before pH adjustment was 5.35 g. By this method, a silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. The viscosity of the silver fine particle dispersion is 358 mPa · s at 11.7 (1 / s), 169 mPa · s at 108 (1 / s), 104 mPa · s at 1000 (1 / s), and the thixo ratio is 3. Moreover, the average value of the measured values of the lamella length was 1.0 mm (standard deviation 0.07, variation coefficient 6.9%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 0 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．３μｍ、ライン抵抗は２９Ω、体積抵抗率は１４．１μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.3 μm, the line resistance was 29Ω, and the volume resistivity was 14.1 μΩ · cm.

［実施例４］
消泡剤の添加量を０．４１ｇ（Ａｇインクに対して０．２０質量％）とし、ｐＨ調整前に得られた上澄み液の添加量を４．９８ｇとした以外は、実施例２と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で３５８ｍＰａ・ｓ、１０８（１／ｓ）で１６９ｍＰａ・ｓ、１０００（１／ｓ）で１０５ｍＰａ・ｓであり、チキソ比は３であった。また、ラメラ長は６回の測定値の平均値が０．９ｍｍ（標準偏差０．１１、変動係数１３．０％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は０ｍｍであった。 [Example 4]
The same as in Example 2 except that the addition amount of the antifoaming agent was 0.41 g (0.20% by mass with respect to the Ag ink), and the addition amount of the supernatant obtained before pH adjustment was 4.98 g. By this method, a silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. The viscosity of the silver fine particle dispersion is 358 mPa · s at 11.7 (1 / s), 169 mPa · s at 108 (1 / s), and 105 mPa · s at 1000 (1 / s), and the thixo ratio is 3. Moreover, the average value of the measured values of the lamellae was 0.9 mm (standard deviation 0.11, variation coefficient 13.0%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 0 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．３μｍ、ライン抵抗は３０Ω、体積抵抗率は１４．４μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.3 μm, the line resistance was 30Ω, and the volume resistivity was 14.4 μΩ · cm.

［実施例５］
表面調整剤に代えてシリコーン消泡剤（信越化学株式会社製のＫＭ−９０）を使用し、この消泡剤０．０２ｇ（Ａｇインクに対して０．０１質量％）とｐＨ調整前に得られた上澄み液５．３５ｇを添加した以外は、実施例１と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で３１１ｍＰａ・ｓ、１０８（１／ｓ）で１３４ｍＰａ・ｓ、１０００（１／ｓ）で８２ｍＰａ・ｓであり、チキソ比は４であった。また、ラメラ長は６回の測定値の平均値が１．３ｍｍ（標準偏差０．１８、変動係数１４．０％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は０ｍｍであった。 [Example 5]
A silicone antifoaming agent (KM-90 manufactured by Shin-Etsu Chemical Co., Ltd.) is used instead of the surface conditioning agent, and 0.02 g (0.01% by mass with respect to Ag ink) of this antifoaming agent and obtained before pH adjustment. A silver fine particle dispersion was prepared in the same manner as in Example 1 except that 5.35 g of the obtained supernatant was added, and the pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. The viscosity of the silver fine particle dispersion is 311 mPa · s at 11.7 (1 / s), 134 mPa · s at 108 (1 / s), 82 mPa · s at 1000 (1 / s), and the thixo ratio is 4. In addition, the average value of the measured values of the lamellae was 1.3 mm (standard deviation 0.18, coefficient of variation 14.0%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 0 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．１μｍ、ライン抵抗は３１Ω、体積抵抗率は１３．８μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.1 μm, the line resistance was 31Ω, and the volume resistivity was 13.8 μΩ · cm.

［実施例６］
消泡剤の添加量を０．０４ｇ（Ａｇインクに対して０．０２質量％）とし、ｐＨ調整前に得られた上澄み液の添加量を５．３５ｇとした以外は、実施例５と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で３４０ｍＰａ・ｓ、１０８（１／ｓ）で１６４ｍＰａ・ｓ、１０００（１／ｓ）で１０３ｍＰａ・ｓであり、チキソ比は３であった。また、ラメラ長は６回の測定値の平均値が１．３ｍｍ（標準偏差０．１３、変動係数９．９％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は０ｍｍであった。 [Example 6]
The same as in Example 5 except that the addition amount of the antifoaming agent was 0.04 g (0.02% by mass with respect to the Ag ink), and the addition amount of the supernatant obtained before pH adjustment was 5.35 g. By this method, a silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. Moreover, the viscosity of the silver fine particle dispersion is 340 mPa · s at 11.7 (1 / s), 164 mPa · s at 108 (1 / s), 103 mPa · s at 1000 (1 / s), and the thixo ratio is 3. Moreover, the average value of the measured values of the lamella length was 1.3 mm (standard deviation 0.13, variation coefficient 9.9%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 0 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は１．８μｍ、ライン抵抗は３５Ω、体積抵抗率は１３．６μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 1.8 μm, the line resistance was 35Ω, and the volume resistivity was 13.6 μΩ · cm.

［実施例７］
消泡剤の添加量を０．４１ｇ（Ａｇインクに対して０．２０質量％）とし、ｐＨ調整前に得られた上澄み液の添加量を４．９８ｇとした以外は、実施例５と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で３０８ｍＰａ・ｓ、１０８（１／ｓ）で１６３ｍＰａ・ｓ、１０００（１／ｓ）で１０８ｍＰａ・ｓであり、チキソ比は３であった。また、ラメラ長は６回の測定値の平均値が１．０ｍｍ（標準偏差０．１０、変動係数９．６％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は０ｍｍであった。 [Example 7]
The same as in Example 5 except that the addition amount of the antifoaming agent was 0.41 g (0.20% by mass with respect to the Ag ink), and the addition amount of the supernatant obtained before pH adjustment was 4.98 g. By this method, a silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. Moreover, the viscosity of the silver fine particle dispersion is 308 mPa · s at 11.7 (1 / s), 163 mPa · s at 108 (1 / s), and 108 mPa · s at 1000 (1 / s), and the thixo ratio is 3. Moreover, the average value of the measured values of the lamella length was 1.0 mm (standard deviation 0.10, coefficient of variation 9.6%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 0 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は１．９μｍ、ライン抵抗は３３Ω、体積抵抗率は１３．４μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 1.9 μm, the line resistance was 33Ω, and the volume resistivity was 13.4 μΩ · cm.

［比較例１］
表面調整剤を添加せず、ｐＨ調整前に得られた上澄み液の添加量を５．３９ｇとした以外は、実施例１と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で４２０ｍＰａ・ｓ、１０８（１／ｓ）で１９１ｍＰａ・ｓ、１０００（１／ｓ）で１１２ｍＰａ・ｓであり、チキソ比は４であった。また、ラメラ長は６回の測定値の平均値が５．３ｍｍ（標準偏差０．０８、変動係数１．６％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は２５ｍｍであった。 [Comparative Example 1]
A silver fine particle dispersion was prepared in the same manner as in Example 1 except that the surface modifier was not added and the amount of the supernatant obtained before pH adjustment was 5.39 g. The lamella length was measured. As a result, the pH of the silver fine particle dispersion was 5.85. The viscosity of the silver fine particle dispersion is 11.7 (1 / s) 420 mPa · s, 108 (1 / s) 191 mPa · s, 1000 (1 / s) 112 mPa · s, and the thixo ratio is 4. Moreover, the average value of the measured values of the lamellae was 5.3 mm (standard deviation 0.08, variation coefficient 1.6%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 25 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．１μｍ、ライン抵抗は３３Ω、体積抵抗率は１４．８μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.1 μm, the line resistance was 33Ω, and the volume resistivity was 14.8 μΩ · cm.

［実施例８］
表面調整剤としてポリエーテル変性ポリジメチルシロキサンとポリエーテルの混合物からなる表面調整剤（ＢＹＫ社製のＢＹＫ３３１）（不揮発成分を９８質量％以上含み、表面張力低下能力が中程度）を使用し、この表面調整剤０．４１ｇ（Ａｇインクに対して０．２０質量％）とｐＨ調整前に得られた上澄み液４．９８ｇを添加した以外は、実施例１と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８３であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で３８４ｍＰａ・ｓ、１０８（１／ｓ）で１５５ｍＰａ・ｓ、１０００（１／ｓ）で１１１ｍＰａ・ｓであり、チキソ比は３であった。また、ラメラ長は６回の測定値の平均値が４．６ｍｍ（標準偏差０．１２、変動係数２．６％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は２．２ｍｍであった。 [Example 8]
As a surface conditioner, a surface conditioner composed of a mixture of polyether-modified polydimethylsiloxane and polyether (BYK331 manufactured by BYK) (containing 98% by mass or more of non-volatile components and having a moderate surface tension reducing ability) is used. A silver fine particle dispersion was prepared in the same manner as in Example 1 except that 0.41 g of the surface conditioner (0.20% by mass with respect to the Ag ink) and 4.98 g of the supernatant obtained before adjusting the pH were added. The pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.83. The viscosity of the silver fine particle dispersion is 384 mPa · s at 11.7 (1 / s), 155 mPa · s at 108 (1 / s), 111 mPa · s at 1000 (1 / s), and the thixo ratio is 3. Moreover, the average value of the measured values of the lamella length was 4.6 mm (standard deviation 0.12, variation coefficient 2.6%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 2.2 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．２μｍ、ライン抵抗は３４Ω、体積抵抗率は１５．４μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.2 μm, the line resistance was 34Ω, and the volume resistivity was 15.4 μΩ · cm.

［実施例９］
表面調整剤の添加量を０．６２ｇ（Ａｇインクに対して０．３０質量％）とし、ｐＨ調整前に得られた上澄み液の添加量を４．７７ｇとした以外は、実施例８と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で７３７ｍＰａ・ｓ、１０８（１／ｓ）で３４１ｍＰａ・ｓ、１０００（１／ｓ）で２００ｍＰａ・ｓであり、チキソ比は４であった。また、ラメラ長は６回の測定値の平均値が４．５ｍｍ（標準偏差０．０９、変動係数２．１％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は４．２ｍｍであった。 [Example 9]
The same as in Example 8 except that the addition amount of the surface conditioner was 0.62 g (0.30 mass% with respect to the Ag ink) and the addition amount of the supernatant obtained before pH adjustment was 4.77 g. By this method, a silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. The viscosity of the silver fine particle dispersion is 1737 (1 / s) at 737 mPa · s, 108 (1 / s) at 341 mPa · s, 1000 (1 / s) at 200 mPa · s, and the thixo ratio is 4. Moreover, the average value of the measured values of the lamella length was 4.5 mm (standard deviation 0.09, variation coefficient 2.1%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 4.2 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．１μｍ、ライン抵抗は３３Ω、体積抵抗率は１４．４μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.1 μm, the line resistance was 33Ω, and the volume resistivity was 14.4 μΩ · cm.

［実施例１０］
表面調整剤の添加量を１．０３ｇ（Ａｇインクに対して０．５０質量％）とし、ｐＨ調整前に得られた上澄み液の添加量を４．３６ｇとした以外は、実施例８と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で５４３４ｍＰａ・ｓ、１０８（１／ｓ）で８９４ｍＰａ・ｓ、１０００（１／ｓ）で２６９ｍＰａ・ｓであり、チキソ比は２０であった。また、ラメラ長は６回の測定値の平均値が４．５ｍｍ（標準偏差０．１０、変動係数２．３％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は３．０ｍｍであった。 [Example 10]
The same as in Example 8 except that the addition amount of the surface conditioner was 1.03 g (0.50 mass% with respect to the Ag ink) and the addition amount of the supernatant obtained before pH adjustment was 4.36 g. By this method, a silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. Further, the viscosity of the silver fine particle dispersion is 5434 mPa · s at 11.7 (1 / s), 894 mPa · s at 108 (1 / s), and 269 mPa · s at 1000 (1 / s), and the thixo ratio is It was 20. In addition, the average value of the measured values of the lamella length was 4.5 mm (standard deviation 0.10, variation coefficient 2.3%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 3.0 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．０μｍ、ライン抵抗は３４Ω、体積抵抗率は１４．０μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.0 μm, the line resistance was 34Ω, and the volume resistivity was 14.0 μΩ · cm.

［比較例２］
表面調整剤の添加量を０．１０ｇ（Ａｇインクに対して０．０５質量％）とし、ｐＨ調整前に得られた上澄み液の添加量を５．２８ｇとした以外は、実施例８と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で３１２ｍＰａ・ｓ、１０８（１／ｓ）で１５８ｍＰａ・ｓ、１０００（１／ｓ）で１０３ｍＰａ・ｓであり、チキソ比は３であった。また、ラメラ長は６回の測定値の平均値が４．９ｍｍ（標準偏差０．１５、変動係数３．１％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は１７ｍｍであった。
また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．１μｍ、ライン抵抗は３３Ω、体積抵抗率は１４．７μΩ・ｃｍであった。 [Comparative Example 2]
The same as in Example 8 except that the addition amount of the surface conditioner was 0.10 g (0.05% by mass with respect to the Ag ink) and the addition amount of the supernatant obtained before pH adjustment was 5.28 g. By this method, a silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. Moreover, the viscosity of the silver fine particle dispersion is 31.7 mPa · s at 11.7 (1 / s), 158 mPa · s at 108 (1 / s), 103 mPa · s at 1000 (1 / s), and the thixo ratio is 3. In addition, the average value of the measured values of 6 times was 4.9 mm (standard deviation 0.15, coefficient of variation 3.1%). Further, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 17 mm.
Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.1 μm, the line resistance was 33Ω, and the volume resistivity was 14.7 μΩ · cm.

［比較例３］
表面調整剤の添加量を０．２１ｇ（Ａｇインクに対して０．１０質量％）とし、ｐＨ調整前に得られた上澄み液の添加量を５．１８ｇとした以外は、実施例８と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で３１２ｍＰａ・ｓ、１０８（１／ｓ）で１７１ｍＰａ・ｓ、１０００（１／ｓ）で１１６ｍＰａ・ｓであり、チキソ比は３であった。また、ラメラ長は６回の測定値の平均値が４．８ｍｍ（標準偏差０．０６、変動係数１．３％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は１０ｍｍであった。 [Comparative Example 3]
The same as in Example 8 except that the addition amount of the surface conditioner was 0.21 g (0.10% by mass with respect to the Ag ink) and the addition amount of the supernatant obtained before pH adjustment was 5.18 g. By this method, a silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. Moreover, the viscosity of the silver fine particle dispersion is 31.7 mPa · s at 11.7 (1 / s), 171 mPa · s at 108 (1 / s), 116 mPa · s at 1000 (1 / s), and the thixo ratio is 3. In addition, the average value of the measured values of the lamella length was 4.8 mm (standard deviation 0.06, coefficient of variation 1.3%). Further, when the silver fine particle dispersion was applied by the same method as in Example 1 and the length L of the webbed thin film was measured, the average value was 10 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．１μｍ、ライン抵抗は３３Ω、体積抵抗率は１４．１μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.1 μm, the line resistance was 33Ω, and the volume resistivity was 14.1 μΩ · cm.

［比較例４］
表面調整剤の添加量を１．５４ｇ（Ａｇインクに対して０．７５質量％）とし、ｐＨ調整前に得られた上澄み液の添加量を３．８５ｇとした以外は、実施例８と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で３０９４０ｍＰａ・ｓ、１０８（１／ｓ）で１８９１ｍＰａ・ｓ、１０００（１／ｓ）で３３５ｍＰａ・ｓであり、粘度が非常に高く、チキソ比は９２であった。また、ラメラ長は、粘度が高過ぎて測定することができなかった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は２．７ｍｍであった。 [Comparative Example 4]
The same as in Example 8 except that the addition amount of the surface conditioner was 1.54 g (0.75% by mass with respect to the Ag ink) and the addition amount of the supernatant obtained before pH adjustment was 3.85 g. By this method, a silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. Further, the viscosity of the silver fine particle dispersion is 30940 mPa · s at 11.7 (1 / s), 1891 mPa · s at 108 (1 / s), and 335 mPa · s at 1000 (1 / s). The thixo ratio was 92. The lamella length could not be measured because the viscosity was too high. Further, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 2.7 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．１μｍ、ライン抵抗は３０Ω、体積抵抗率は１３．３μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.1 μm, the line resistance was 30Ω, and the volume resistivity was 13.3 μΩ · cm.

［実施例１１］
表面調整剤としてポリエーテル変性ポリジメチルシロキサンとポリエーテルの混合物からなる表面調整剤（ＢＹＫ社製のＢＹＫ３３３）（不揮発成分を９７質量％以上含み、表面張力低下能力が高い）を使用し、この表面調整剤０．６２ｇ（Ａｇインクに対して０．３０質量％）とｐＨ調整前に得られた上澄み液４．７７ｇを添加した以外は、実施例１と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８３であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で３９２ｍＰａ・ｓ、１０８（１／ｓ）で１６７ｍＰａ・ｓ、１０００（１／ｓ）で１１５ｍＰａ・ｓであり、チキソ比は３であった。また、ラメラ長は６回の測定値の平均値が３．２ｍｍ（標準偏差０．４０、変動係数１２．５％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は０ｍｍであった。 [Example 11]
This surface adjuster is made of a mixture of polyether-modified polydimethylsiloxane and polyether (BYK333 manufactured by BYK) (containing 97% by mass or more of non-volatile components and has a high surface tension reducing ability). A silver fine particle dispersion was prepared in the same manner as in Example 1 except that 0.62 g of the adjusting agent (0.30% by mass with respect to Ag ink) and 4.77 g of the supernatant obtained before adjusting the pH were added. Prepared and measured pH, viscosity and lamellar length. As a result, the pH of the silver fine particle dispersion was 5.83. Further, the viscosity of the silver fine particle dispersion is 392 mPa · s at 11.7 (1 / s), 167 mPa · s at 108 (1 / s), and 115 mPa · s at 1000 (1 / s), and the thixo ratio is 3. In addition, the average value of the measured values of the lamella length was 3.2 mm (standard deviation 0.40, coefficient of variation 12.5%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 0 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．２μｍ、ライン抵抗は３４Ω、体積抵抗率は１５．９μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.2 μm, the line resistance was 34Ω, and the volume resistivity was 15.9 μΩ · cm.

［実施例１２］
表面調整剤の添加量を１．０３ｇ（Ａｇインクに対して０．５０質量％）とし、ｐＨ調整前に得られた上澄み液の添加量を４．３６ｇとした以外は、実施例１１と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で１５９３ｍＰａ・ｓ、１０８（１／ｓ）で３９７ｍＰａ・ｓ、１０００（１／ｓ）で１８２ｍＰａ・ｓであり、チキソ比は９であった。また、ラメラ長は６回の測定値の平均値が１．９ｍｍ（標準偏差０．０９、変動係数４．６％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は０ｍｍであった。 [Example 12]
The same as in Example 11 except that the addition amount of the surface conditioner was 1.03 g (0.50 mass% with respect to the Ag ink) and the addition amount of the supernatant obtained before pH adjustment was 4.36 g. By this method, a silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. The silver fine particle dispersion has a viscosity of 1593 (1 / s) at 1593 mPa · s, 108 (1 / s) at 397 mPa · s, 1000 (1 / s) at 182 mPa · s, and the thixo ratio is It was 9. Moreover, the average value of the measured values of the lamellae was 1.9 mm (standard deviation 0.09, coefficient of variation 4.6%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 0 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．４μｍ、ライン抵抗は３１Ω、体積抵抗率は１５．６μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.4 μm, the line resistance was 31Ω, and the volume resistivity was 15.6 μΩ · cm.

［比較例５］
表面調整剤の添加量を１．５４ｇ（Ａｇインクに対して０．７５質量％）とし、ｐＨ調整前に得られた上澄み液の添加量を３．８５ｇとした以外は、実施例１１と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８５であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で１８２４０ｍＰａ・ｓ、１０８（１／ｓ）で２０４１ｍＰａ・ｓ、１０００（１／ｓ）で３２９ｍＰａ・ｓであり、粘度が非常に高く、チキソ比は５５であった。また、ラメラ長は、粘度が高過ぎて測定することができなかった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は０ｍｍであった。 [Comparative Example 5]
The same as in Example 11 except that the addition amount of the surface conditioner was 1.54 g (0.75 mass% with respect to the Ag ink) and the addition amount of the supernatant obtained before pH adjustment was 3.85 g. By this method, a silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.85. Moreover, the viscosity of the silver fine particle dispersion is 18240 mPa · s at 11.7 (1 / s), 2041 mPa · s at 108 (1 / s), and 329 mPa · s at 1000 (1 / s). The thixo ratio was 55. The lamella length could not be measured because the viscosity was too high. Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 0 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．１μｍ、ライン抵抗は３１Ω、体積抵抗率は１３．９μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.1 μm, the line resistance was 31Ω, and the volume resistivity was 13.9 μΩ · cm.

［比較例６］
表面調整剤として７６質量％のポリエーテル変性ポリジメチルシロキサンと２４質量％のポリグリコールとからなる表面調整剤（ＢＹＫ社製のＢＹＫ３４８）（不揮発成分を９６質量％以上含み、表面張力低下能力が高い）を使用し、この表面調整剤０．４１ｇ（Ａｇインクに対して０．２０質量％）とｐＨ調整前に得られた上澄み液４．９８ｇを添加した以外は、実施例１と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８４であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で３４７ｍＰａ・ｓ、１０８（１／ｓ）で１２７ｍＰａ・ｓ、１０００（１／ｓ）で９６ｍＰａ・ｓであり、チキソ比は４であった。また、ラメラ長は６回の測定値の平均値が５．１ｍｍ（標準偏差０．１６、変動係数３．２％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は２６ｍｍであった。 [Comparative Example 6]
Surface modifier comprising 76% by mass of polyether-modified polydimethylsiloxane and 24% by mass of polyglycol as a surface modifier (BYK348 manufactured by BYK) (including non-volatile components of 96% by mass or more and having a high surface tension reducing ability) The same method as in Example 1 except that 0.41 g of this surface conditioner (0.20% by mass with respect to Ag ink) and 4.98 g of the supernatant obtained before pH adjustment were added. Thus, a silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.84. The viscosity of the silver fine particle dispersion is 1347 (1 / s) at 347 mPa · s, 108 (1 / s) at 127 mPa · s, 1000 (1 / s) at 96 mPa · s, and the thixo ratio is 4. In addition, the average value of the measured values of the lamella length was 5.1 mm (standard deviation 0.16, coefficient of variation 3.2%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 26 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は２．０μｍ、ライン抵抗は３３Ω、体積抵抗率は１３．９μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 2.0 μm, the line resistance was 33Ω, and the volume resistivity was 13.9 μΩ · cm.

［比較例７］
表面調整剤として８５質量％のポリエーテル変性シロキサンと１５質量％のポリエーテルとからなる表面調整剤（ＢＹＫ社製のＢＹＫ３４９）（不揮発成分を９４質量％以上含み、表面張力低下能力が高い）を使用し、この表面調整剤０．４１ｇ（Ａｇインクに対して０．２０質量％）とｐＨ調整前に得られた上澄み液４．９８ｇを添加した以外は、実施例１と同様の方法により、銀微粒子分散液を作製し、ｐＨ、粘度およびラメラ長を測定した。その結果、銀微粒子分散液のｐＨは５．８４であった。また、銀微粒子分散液の粘度は、１１．７（１／ｓ）で３４７ｍＰａ・ｓ、１０８（１／ｓ）で１３３ｍＰａ・ｓ、１０００（１／ｓ）で９４ｍＰａ・ｓであり、チキソ比は４であった。また、ラメラ長は６回の測定値の平均値が４．９ｍｍ（標準偏差０．１０、変動係数２．１％）であった。また、実施例１と同様の方法により、銀微粒子分散液を塗布して、水かき状の薄膜の長さＬを測定したところ、その平均値は２４ｍｍであった。 [Comparative Example 7]
As a surface conditioner, a surface conditioner composed of 85% by mass polyether-modified siloxane and 15% by mass polyether (BYK349 manufactured by BYK) (containing 94% by mass or more of non-volatile components and having a high surface tension reducing ability) Using the same method as in Example 1, except that 0.41 g of this surface conditioner (0.20% by mass with respect to Ag ink) and 4.98 g of the supernatant obtained before pH adjustment were added. A silver fine particle dispersion was prepared, and pH, viscosity, and lamella length were measured. As a result, the pH of the silver fine particle dispersion was 5.84. The viscosity of the silver fine particle dispersion is 1347 (1 / s) at 347 mPa · s, 108 (1 / s) at 133 mPa · s, 1000 (1 / s) at 94 mPa · s, and the thixo ratio is 4. Moreover, the average value of the lamella length measured six times was 4.9 mm (standard deviation 0.10, coefficient of variation 2.1%). Moreover, when the silver fine particle dispersion was applied and the length L of the web-shaped thin film was measured by the same method as in Example 1, the average value was 24 mm.

また、この銀微粒子分散液を使用して、実施例１と同様の方法により、銀導電膜からなるＲＦＩＤアンテナを作製し、銀導電膜の膜厚および電気抵抗（ライン抵抗）を測定するとともに、銀導電膜の体積抵抗率を算出した。その結果、銀導電膜の膜厚は１．９μｍ、ライン抵抗は３４Ω、体積抵抗率は１３．９μΩ・ｃｍであった。   Further, using this silver fine particle dispersion, an RFID antenna made of a silver conductive film was produced in the same manner as in Example 1, and the film thickness and electrical resistance (line resistance) of the silver conductive film were measured. The volume resistivity of the silver conductive film was calculated. As a result, the film thickness of the silver conductive film was 1.9 μm, the line resistance was 34Ω, and the volume resistivity was 13.9 μΩ · cm.

実施例および比較例の銀微粒子分散液の組成および特性とそれらの銀微粒子分散液を用いて作製した銀導電膜の特性を表１〜表３に示す。   Tables 1 to 3 show the compositions and characteristics of the silver fine particle dispersions of Examples and Comparative Examples and the characteristics of silver conductive films prepared using these silver fine particle dispersions.

Figure 0006355240
Figure 0006355240

Figure 0006355240
Figure 0006355240

Figure 0006355240
Figure 0006355240

本発明による銀微粒子分散液は、プリンテッド・エレクトロニクスに適用することができ、例えば、印刷ＣＰＵ、印刷照明、印刷タグ、オール印刷ディスプレイ、センサ、プリント配線板、有機太陽電池、電子ブック、ナノインプリントＬＥＤ、液晶ディスプレイパネル、プラズマディスプレイパネル、印刷メモリなどの製造に使用することができる。   The silver fine particle dispersion according to the present invention can be applied to printed electronics, for example, printing CPU, printing illumination, printing tag, all printing display, sensor, printed wiring board, organic solar cell, electronic book, nanoimprint LED. It can be used for manufacturing liquid crystal display panels, plasma display panels, print memories, and the like.

１０ ＲＦＩＤアンテナ 10 RFID antenna

Claims (11)

有機酸またはその誘導体で被覆された銀微粒子が水系分散媒中に分散し、アンモニアと硝酸を含む銀微粒子分散液において、ポリエーテル変性ポリジメチルシロキサンとポリ（オキシエチレン）アルキルエーテルを含む表面調整剤またはポリエーテル変性ポリジメチルシロキサンとポリエーテルの混合物からなる表面調整剤が添加され、銀微粒子分散液中の表面調整剤の含有量が０．１５〜０．６質量％であることを特徴とする、銀微粒子分散液。 A surface conditioner containing a polyether-modified polydimethylsiloxane and a poly (oxyethylene) alkyl ether in a silver fine particle dispersion containing ammonia and nitric acid in which silver fine particles coated with an organic acid or a derivative thereof are dispersed in an aqueous dispersion medium. or surface modifier consisting of a mixture of polyether modified polydimethylsiloxane and polyether is added, the content of the surface modifier of the silver particle dispersion liquid and the said 0.15 to 0.6% by mass Rukoto A silver fine particle dispersion. 有機酸またはその誘導体で被覆された銀微粒子が水系分散媒中に分散し、アンモニアと硝酸を含む銀微粒子分散液において、シリコーン消泡剤が添加され、銀微粒子分散液中のシリコーン消泡剤の含有量が０．０１〜０．６質量％であることを特徴とする、銀微粒子分散液。 Silver fine particles coated with an organic acid or a derivative thereof are dispersed in an aqueous dispersion medium. In a silver fine particle dispersion containing ammonia and nitric acid, a silicone antifoam is added , and the silicone antifoam in the silver fine particle dispersion is added. content and wherein 0.01 to 0.6% by mass Rukoto, silver particle dispersion. 前記銀微粒子分散液の液中の前記アンモニアの濃度が０．１〜２．０質量％であることを特徴とする、請求項１または２に記載の銀微粒子分散液。 3. The silver fine particle dispersion according to claim 1, wherein the concentration of the ammonia in the silver fine particle dispersion is 0.1 to 2.0 mass%. 前記銀微粒子分散液の液中の前記硝酸の濃度が０．１〜６．０質量％であることを特徴とする、請求項１乃至３のいずれかに記載の銀微粒子分散液。 Wherein the concentration of the nitric acid in the liquid of the silver particle dispersion is 0.1 to 6.0 mass%, fine silver particle dispersion liquid according to any one of claims 1 to 3. 前記銀微粒子分散液のｐＨが５．３〜８．０であることを特徴とする、請求項１乃至４のいずれかに記載の銀微粒子分散液。 The silver fine particle dispersion according to any one of claims 1 to 4 , wherein the silver fine particle dispersion has a pH of 5.3 to 8.0. 前記水系分散媒が５０質量％以上の水を含む溶媒であることを特徴とする、請求項１乃至５のいずれかに記載の銀微粒子分散液。 Characterized in that the aqueous dispersion medium is a solvent containing 50 mass% or more water, the silver particle dispersion liquid according to any one of claims 1 to 5. 前記銀微粒子分散液中の前記銀微粒子の含有量が３０〜７５質量％であることを特徴とする、請求項１乃至６のいずれかに記載の銀微粒子分散液。 And the content of the silver particles of the silver particle dispersion liquid is 30 to 75 mass%, fine silver particle dispersion liquid according to any one of claims 1 to 6. 前記銀微粒子の平均粒径が１〜１００ｎｍであることを特徴とする、請求項１乃至７のいずれかに記載の銀微粒子分散液。 The silver fine particle dispersion according to any one of claims 1 to 7 , wherein an average particle diameter of the silver fine particles is 1 to 100 nm. 前記有機酸が炭素数５〜８のカルボン酸であることを特徴とする、請求項１乃至８のいずれかに記載の銀微粒子分散液。 The organic acid is characterized in that the carboxylic acid of 5-8 carbon atoms, silver fine particle dispersion liquid according to any one of claims 1 to 8. 前記銀微粒子分散液中の銀に対する前記有機酸またはその誘導体の量が２〜２０質量％であることを特徴とする、請求項１乃至９のいずれかに記載の銀微粒子分散液。 Wherein the amount of organic acid or derivative thereof, characterized in that 2 to 20 wt%, silver fine particle dispersion liquid according to any one of claims 1 to 9 for silver of the silver particle dispersion liquid. 前記銀微粒子分散液のラメラ長の平均値が４．６ｍｍ以下であることを特徴とする、請求項１乃至１０のいずれかに記載の銀微粒子分散液。 Wherein the average value of the lamella length of the silver particle dispersion is 4.6mm or less, the silver particle dispersion according to any one of claims 1 to 10.
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CN108575097B (en) 2016-12-20 2021-08-17 浙江凯盈新材料有限公司 Interdigitated back contact metal-insulator-semiconductor solar cells with printed oxide tunnel junctions
CN108885917B (en) 2016-12-20 2020-06-02 浙江凯盈新材料有限公司 Silicone-containing solar cell metallization paste
CN107745129B (en) * 2017-09-04 2019-09-20 广东风华高新科技股份有限公司 A kind of nano-silver powder, preparation method and application
US11848396B2 (en) * 2017-09-07 2023-12-19 Nutech Ventures, Inc. Surfactant additive for solution coating large area high efficiency perovskite solar cells and other devices
US10622502B1 (en) 2019-05-23 2020-04-14 Zhejiang Kaiying New Materials Co., Ltd. Solar cell edge interconnects
US10749045B1 (en) 2019-05-23 2020-08-18 Zhejiang Kaiying New Materials Co., Ltd. Solar cell side surface interconnects
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Family Cites Families (15)

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CN101480604B (en) * 2009-01-06 2010-11-17 黑龙江大学 Method for preparing silver/carbon nano composite body
CN101569937A (en) * 2009-06-05 2009-11-04 中国乐凯胶片集团公司 Preparation method for high-dispersing silver powder used for conductive silver paste
KR101248447B1 (en) * 2009-12-22 2013-04-02 디아이씨 가부시끼가이샤 Conductive paste for screen printing
CN102120265B (en) * 2010-01-07 2013-04-10 中国科学院化学研究所 Preparation method of colloid of mono-dispersed silver nano particles and nano silver powder and conductive ink thereof
JP5525861B2 (en) * 2010-02-26 2014-06-18 日立マクセル株式会社 Ink composition for forming clear layer and printed matter using the same
KR20180056811A (en) * 2010-08-27 2018-05-29 도와 일렉트로닉스 가부시키가이샤 Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same
US10780402B2 (en) * 2012-04-22 2020-09-22 King Abdullah University Of Science And Technology Methods of membrane modification
JP5934576B2 (en) * 2012-05-18 2016-06-15 三菱製紙株式会社 Method for manufacturing conductive member
JP6039320B2 (en) * 2012-09-03 2016-12-07 石原産業株式会社 Metal fine particle dispersion, production method thereof, electrode formed using the same, wiring pattern, coating film, decorative article formed with the coating film, antibacterial article

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