JP6324898B2 - Conductive composition, electrode, plasma display panel and touch panel - Google Patents
Conductive composition, electrode, plasma display panel and touch panel Download PDFInfo
- Publication number
- JP6324898B2 JP6324898B2 JP2014543218A JP2014543218A JP6324898B2 JP 6324898 B2 JP6324898 B2 JP 6324898B2 JP 2014543218 A JP2014543218 A JP 2014543218A JP 2014543218 A JP2014543218 A JP 2014543218A JP 6324898 B2 JP6324898 B2 JP 6324898B2
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- Prior art keywords
- resin
- conductive composition
- acid
- electrode
- bisphenol
- Prior art date
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- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical class OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229960004274 stearic acid Drugs 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- KCNSDMPZCKLTQP-UHFFFAOYSA-N tetraphenylen-1-ol Chemical compound C12=CC=CC=C2C2=CC=CC=C2C2=CC=CC=C2C2=C1C=CC=C2O KCNSDMPZCKLTQP-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- UVZICZIVKIMRNE-UHFFFAOYSA-N thiodiacetic acid Chemical compound OC(=O)CSCC(O)=O UVZICZIVKIMRNE-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 210000002700 urine Anatomy 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/22—Electrodes, e.g. special shape, material or configuration
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
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- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials Engineering (AREA)
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- Dispersion Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Plasma & Fusion (AREA)
- Conductive Materials (AREA)
- Materials For Photolithography (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Insulated Conductors (AREA)
Description
本発明は導電性組成物、電極、プラズマディスプレイパネル（以下、「ＰＤＰ」とも言う。）及びタッチパネルに関し、詳しくは、アルミニウム粒子を含有し、焼成後の導電性、耐酸性、基材との密着性に優れた導電性組成物、この組成物を用いた電極、及びこの電極を有するＰＤＰ、タッチパネルに関する。 The present invention relates to a conductive composition, an electrode, a plasma display panel (hereinafter also referred to as “PDP”), and a touch panel, and more specifically, contains aluminum particles, and is electrically conductive after baking, acid resistance, and adhesion to a substrate. The present invention relates to a conductive composition having excellent properties, an electrode using the composition, a PDP having the electrode, and a touch panel.
アルミニウムを含有する導電性組成物、いわゆる導電性ペーストは、ＰＤＰ、太陽電池、セラミックコンデンサ等における電極材料として使用されてきており、コスト面などから金や銀といった貴金属を含む導電性組成物に代替するものとして検討されてきた。 Conductive compositions containing aluminum, so-called conductive pastes, have been used as electrode materials in PDPs, solar cells, ceramic capacitors, etc., and are replaced by conductive compositions containing noble metals such as gold and silver in terms of cost. Has been considered as something to do.
太陽電池においては、発生した電力を効率よく取り出すために、シリコンウェハの裏面、即ち、受光面と反対側全面に、アルミニウムを含有する導電性組成物が塗布される。これを高温で焼成すると、アルミニウム・シリコン合金層が形成され、さらにその下に、アルミニウムが拡散したｐ＋層が形成される。In a solar cell, in order to efficiently extract generated electric power, a conductive composition containing aluminum is applied to the back surface of the silicon wafer, that is, the entire surface opposite to the light receiving surface. When this is fired at a high temperature, an aluminum-silicon alloy layer is formed, and a p + layer in which aluminum is diffused is formed thereunder.
ＰＤＰにおいては、前面ガラス基板上の表示電極中のバス電極、および、後面ガラス基板上のアドレス電極を構成するためにアルミウニムを含有する導電性組成物が用いられている。バス電極、アドレス電極は、それぞれのガラス基板上にストライプ状に、かつ、互いに直交するように形成される。また、いずれの電極も数百μｍ程度のファインピッチで形成されるが、特にアドレス電極には高精細性が要求される。 In the PDP, a conductive composition containing aluminum urine is used to form bus electrodes in display electrodes on a front glass substrate and address electrodes on a rear glass substrate. The bus electrode and the address electrode are formed in a stripe shape on each glass substrate and orthogonal to each other. Each of the electrodes is formed with a fine pitch of about several hundreds of μm, but the address electrode is required to have high definition.
ＰＤＰ用の電極において、導電性は、電極パターンの微細化や薄膜化、消費電力の低減等において重要な特性である。しかしながら、アルミニウムは銀や金と比べて導電性が低い。さらにアルミニウムは酸化し易く、焼成等における酸化によって導電性が低下してしまう問題があるため、その解決方法がこれまでに種々提案されてきた。例えば、特許文献１では、ガラス粉末の量が比較的多い、アルミニウム含有感光性導電ペーストが開示されている。 In an electrode for a PDP, conductivity is an important characteristic for miniaturizing and thinning an electrode pattern, reducing power consumption, and the like. However, aluminum is less conductive than silver or gold. Furthermore, since aluminum easily oxidizes and there is a problem that the conductivity is reduced by oxidation during firing or the like, various solutions have been proposed so far. For example, Patent Document 1 discloses an aluminum-containing photosensitive conductive paste in which the amount of glass powder is relatively large.
アルミニウムは酸化されやすいことから、アルミニウム粒子の表面は自然酸化された被膜で覆われている。このため、導電性組成物は通常、焼成によって有機分を焼失させることで導電性が発現するが、アルミニウム粒子を含む導電性樹脂組成物では、焼成後もアルミニウム粒子界面同士の融合、結着が起こらず、所望の導電性が得られないことがあった。 Since aluminum is easily oxidized, the surface of aluminum particles is covered with a naturally oxidized film. For this reason, the conductive composition usually develops conductivity by burning off the organic component by firing. However, in the conductive resin composition containing aluminum particles, the fusion and binding between the aluminum particle interfaces are still performed after firing. In some cases, the desired conductivity could not be obtained.
一方、プラズマディスプレイ背面板の製造工程では、アドレス電極の上に誘電体層が塗布され、焼成が行われた後に、隔壁材（バリアリブ）が構成される。この隔壁材は、酸を利用した化学エッチングにより形状加工されるのが一般的であり、エッチング剤が浸透してアドレス電極に至るおそれがあることから、アドレス電極に用いられる導電性組成物には高い耐酸性が要求される。また、電極と基材との密着性が悪いと電極の剥がれなどが生じ、製品不良の原因となりうることから、導電性組成物は基材との密着性に優れることが求められる。 On the other hand, in the manufacturing process of the plasma display back plate, a dielectric layer is applied on the address electrodes, and after firing, a partition material (barrier rib) is formed. The partition material is generally processed by chemical etching using an acid, and the etching agent may permeate to reach the address electrode. Therefore, the conductive composition used for the address electrode includes: High acid resistance is required. In addition, if the adhesion between the electrode and the substrate is poor, the electrode may be peeled off, which may cause a product defect. Therefore, the conductive composition is required to have excellent adhesion with the substrate.
そこで本発明の目的は、アルミニウム粒子を含有し、焼成後の導電性、耐酸性、基材との密着性に優れた導電性組成物、この組成物を用いた電極、ＰＤＰ及びタッチパネルを提供することにある。 Accordingly, an object of the present invention is to provide a conductive composition containing aluminum particles and having excellent conductivity after baking, acid resistance and adhesion to a substrate, and an electrode, PDP and touch panel using this composition. There is.
本発明者は上記課題を解決すべく鋭意検討した結果、アルミニウム粒子を含む導電性組成物において、熱分解終了点が特定の温度範囲内にある樹脂を用いることで上記課題を解決しうることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above problems, the present inventors have found that the conductive composition containing aluminum particles can solve the above problems by using a resin whose thermal decomposition end point is within a specific temperature range. The headline and the present invention were completed.
即ち、本発明の導電性組成物は、（Ａ）アルミニウム粒子と、（Ｂ）熱分解終了点が５００〜６５０℃の範囲内である樹脂とを含有することを特徴とするものである。 That is, the conductive composition of the present invention is characterized by containing (A) aluminum particles and (B) a resin having a thermal decomposition end point in the range of 500 to 650 ° C.
本発明の導電性組成物は、前記（Ｂ）熱分解終了点が５００〜６５０℃の範囲内である樹脂が、ビスフェノール構造を有する樹脂、ポリビニルアセタール樹脂、フェノールノボラック構造を有する樹脂、及びクレゾールノボラック構造を有する樹脂のいずれか１種であることが好ましい。 In the conductive composition of the present invention, the resin (B) whose thermal decomposition end point is in the range of 500 to 650 ° C. is a resin having a bisphenol structure, a polyvinyl acetal resin, a resin having a phenol novolac structure, and a cresol novolac. Any one of the resins having a structure is preferable.
また、本発明の導電性組成物は、さらに、感光性モノマー、および、光重合開始剤を含有することが好ましい。 Moreover, it is preferable that the electrically conductive composition of this invention contains a photosensitive monomer and a photoinitiator further.
本発明の電極は、上記いずれかの導電性組成物を焼成してなることを特徴とするものである。 The electrode of the present invention is obtained by firing any one of the above conductive compositions.
本発明のプラズマディスプレイパネルは、上記の電極を有することを特徴とするものである。 The plasma display panel of the present invention has the above-mentioned electrode.
本発明のタッチパネルは、上記の電極を有することを特徴とするものである。 The touch panel of this invention has said electrode, It is characterized by the above-mentioned.
本発明により、アルミニウム粒子を含有し、焼成後の導電性、耐酸性、基材との密着性に優れた導電性組成物、この組成物を用いた電極、及びこの電極を有するＰＤＰ、タッチパネルを提供することが可能となる。
さらに、本発明の導電性組成物を用いてラインを形成した場合、そのラインの幅の大小によって抵抗値がぶれることを抑えることができる。このようなラインの幅の大小によって抵抗値がぶれにくい導電性組成物は、大型のＰＤＰの電極に好適である。According to the present invention, a conductive composition containing aluminum particles and having excellent conductivity after baking, acid resistance, and adhesion to a substrate, an electrode using the composition, and a PDP and a touch panel having the electrode are provided. It becomes possible to provide.
Furthermore, when a line is formed using the conductive composition of the present invention, it is possible to prevent the resistance value from being shifted depending on the width of the line. Such a conductive composition whose resistance value is less likely to fluctuate due to the width of the line is suitable for an electrode of a large PDP.
本発明の導電性組成物は、アルミニウム粒子および熱分解終了点が５００〜６５０℃の範囲内である樹脂を含むことを特徴とするものである。金属粉や金属粒子を含む導電性組成物は、焼成することにより樹脂成分を焼失させ、金属同士を結着させることにより導電性を発現させるのが一般的である。焼成工程後に、樹脂成分や、炭化した樹脂成分（以下、残炭という。）が残存すると、気泡や膨張の発生、無機物層の特性への悪影響が生じうる。従って、導電性組成物に用いられる樹脂としては、揮発性の高いものや、焼成後に残炭が発生しにくいものが選択的に用いられてきた。それに対して、本発明の（Ｂ）成分である樹脂は熱分解終了点が５００〜６５０℃という比較的高い温度域にあるものである。これにより、本発明の（Ｂ）成分である樹脂は、例えば６００℃程度の焼成工程では、組成物中に少なくとも一部が残存することになるものと考えられる。上記のように、残炭は従来の導電性組成物においては好ましくない性質であるとみなされてきた。ところが、本発明者は、熱分解終了点が５００〜６５０℃の範囲内にある樹脂を含む導電性組成物が、焼成後の導電性、耐酸性、基材との密着性に優れることを見出した。詳細な機構は必ずしも明らかではないが、アルミニウム粒子に対しては、残炭により粒子表面を被覆することで、アルミニウムを酸から保護することにより耐酸性を向上させるということが、本発明の効果を説明する理由のひとつとして考えられる。また、残炭が、基材との密着性にも寄与するものと考えられる。さらに、残炭によって、アルミニウム粒子を覆う酸化膜の成長を抑えるため、導電性が向上するとも考えられる。
以下、各成分について詳細に説明する。The conductive composition of the present invention is characterized by containing aluminum particles and a resin having a thermal decomposition end point in the range of 500 to 650 ° C. In general, a conductive composition containing metal powder or metal particles burns away a resin component and develops conductivity by binding metals together. If a resin component or a carbonized resin component (hereinafter referred to as residual charcoal) remains after the firing step, bubbles and expansion may occur, and the properties of the inorganic layer may be adversely affected. Therefore, as the resin used for the conductive composition, one having high volatility or one that hardly generates residual carbon after firing has been selectively used. On the other hand, the resin which is the component (B) of the present invention has a thermal decomposition end point in a relatively high temperature range of 500 to 650 ° C. Thereby, it is considered that at least a part of the resin which is the component (B) of the present invention remains in the composition in a baking step of about 600 ° C., for example. As mentioned above, residual charcoal has been regarded as an undesirable property in conventional conductive compositions. However, the present inventors have found that a conductive composition containing a resin having a thermal decomposition end point in the range of 500 to 650 ° C. is excellent in conductivity after baking, acid resistance, and adhesion to a substrate. It was. Although the detailed mechanism is not necessarily clear, the effect of the present invention is to improve the acid resistance of aluminum particles by protecting the aluminum from acid by covering the particle surface with residual carbon. It can be considered as one of the reasons to explain. Moreover, it is thought that residual charcoal contributes also to adhesiveness with a base material. Furthermore, it is considered that the conductivity is improved in order to suppress the growth of the oxide film covering the aluminum particles by the remaining carbon.
Hereinafter, each component will be described in detail.
［アルミニウム粒子］
（Ａ）アルミニウム粒子は、導電性組成物に用いられるものであれば特に制限されず、公知のものをいずれも用いることができる。（Ａ）アルミニウム粒子の平均粒径（Ｄ５０）は、１〜６μｍであることが好ましく、２〜５μｍであることがより好ましい。アルミニウム粒子の平均粒径が上記範囲内にあると、アルミニウム粒子と樹脂との体積バランスがとれ、（Ｂ）成分による被覆が充分に及び、本発明の効果が良好に得られる。また、アルミニウム粒子の比表面積が適切な範囲となり、アルミニウムの酸化の影響を抑えることができる。
アルミニウムの平均粒径は、例えば、レーザー回析式粒度分布測定装置により測定した重量分布曲線におけるＤ５０として、測定することができる。
（Ａ）アルミニウム粒子の含有量は、（Ｂ）成分を１００質量部としたとき、７０〜５２０質量部であることが好ましく、１００〜４００質量部であることがさらに好ましい。
（Ａ）アルミニウム粒子としては、窒素ガスアトマイズ法により製造されたアルミニウム粒子が好ましい。窒素ガスアトマイズ法は、窒素雰囲気中で、金属（アルミニウム）の溶湯に流体として窒素ガスを吹き付けることによって、溶湯を細かく粉砕して液滴とし、これを凝固させて金属粉末を得る方法であれば、特に限定されない。[Aluminum particles]
(A) Aluminum particle will not be restrict | limited especially if it is used for an electroconductive composition, All can use a well-known thing. (A) The average particle diameter (D50) of the aluminum particles is preferably 1 to 6 μm, and more preferably 2 to 5 μm. When the average particle diameter of the aluminum particles is within the above range, the volume balance between the aluminum particles and the resin can be achieved, the coating with the component (B) is sufficiently achieved, and the effects of the present invention can be obtained satisfactorily. Further, the specific surface area of the aluminum particles is in an appropriate range, and the influence of aluminum oxidation can be suppressed.
The average particle diameter of aluminum can be measured, for example, as D50 in a weight distribution curve measured by a laser diffraction particle size distribution measuring apparatus.
The content of (A) aluminum particles is preferably 70 to 520 parts by mass, more preferably 100 to 400 parts by mass, when the component (B) is 100 parts by mass.
(A) As aluminum particle, the aluminum particle manufactured by the nitrogen gas atomizing method is preferable. The nitrogen gas atomization method is a method in which a molten metal is blown into fine particles by blowing nitrogen gas as a fluid to a molten metal (aluminum) in a nitrogen atmosphere to obtain a metal powder by solidifying the droplets. There is no particular limitation.
［熱分解終了点が５００〜６５０℃の範囲内である樹脂］
本発明の（Ｂ）成分にかかる樹脂は、熱分解終了点が５００〜６５０℃の範囲内である樹脂である。好ましくは、５５０〜６５０℃である。
本発明の（Ｂ）成分にかかる樹脂は、バインダーとして機能する。熱分解終了点は、ＴＧ測定装置（熱重量測定装置）、または、ＴＧ−ＤＴＡ測定装置（熱重量−示唆熱同時測定装置）を用いて、温度の上昇による樹脂試料の重量変化を測定し、重量変化を時間（温度）に対してプロットしたＴＧ曲線を作成し、加熱による重量減少が見られなくなる温度として定義される。
また、樹脂の重量平均分子量は、樹脂骨格により異なるが、一般的に２，０００〜１５０，０００、さらには５，０００〜１００，０００の範囲にあるものが好ましい。重量平均分子量が上記範囲内であると、タックフリー性能の劣化、露光後の塗膜の耐湿性の悪化、現像時の膜減り、および、解像度の劣化を抑制することができる。また、現像性や貯蔵安定性の悪化を抑えることができる。[Resin whose thermal decomposition end point is in the range of 500 to 650 ° C.]
The resin according to the component (B) of the present invention is a resin having a thermal decomposition end point in the range of 500 to 650 ° C. Preferably, it is 550-650 degreeC.
The resin according to the component (B) of the present invention functions as a binder. The thermal decomposition end point is measured using a TG measuring device (thermogravimetric measuring device) or a TG-DTA measuring device (thermogravimetric-suggested simultaneous thermal measuring device) to measure the weight change of the resin sample due to the temperature rise, A TG curve in which weight change is plotted against time (temperature) is prepared, and is defined as a temperature at which weight loss due to heating is not observed.
Moreover, although the weight average molecular weight of resin changes with resin frame | skeleton, what is generally in the range of 2,000-150,000, Furthermore, 5,000-100,000 is preferable. When the weight average molecular weight is within the above range, it is possible to suppress deterioration of tack-free performance, deterioration of moisture resistance of the coated film after exposure, film reduction during development, and deterioration of resolution. Moreover, the deterioration of developability and storage stability can be suppressed.
（Ｂ）成分として使用可能な樹脂としては、例えば、ビスフェノールＡ型フェノキシ樹脂、ビスフェノールＦ型フェノキシ樹脂、ビスフェノールＡ／ビスフェノ−ルＦの共重合型フェノキシ樹脂等のフェノキシ系樹脂、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡ／ビスフェノ−ルＦの共重合型等のエポキシ樹脂、前記エポキシ樹脂の末端をアクリル変性して得られるエポキシアクリレート系樹脂、ポリビニルブチラール系樹脂などのポリビニルアセタール系樹脂、ポリエステル系樹脂、ブロック共重合体等が挙げられる。（Ｂ）成分にかかる樹脂は１種を単独で用いてもよく、２種以上のものを併用してもよい。
（Ｂ）成分としては、主鎖にビスフェノール構造を有する樹脂、ポリビニルアセタール樹脂、フェノールノボラック型樹脂、及びクレゾールノボラック型樹脂のいずれか１種が好ましい。また、導電性組成物を光硬化性組成物とすることができることから、エチレン性不飽和二重結合を有する樹脂が好ましい。また、本発明の樹脂は、アルカリ現像可能とするために、側鎖をカルボン酸変性したカルボキシル基含有樹脂としてもよい。Examples of the resin that can be used as the component (B) include phenoxy resins such as bisphenol A type phenoxy resin, bisphenol F type phenoxy resin, bisphenol A / bisphenol F copolymer phenoxy resin, and bisphenol A type epoxy resin. Bisphenol F type epoxy resin, bisphenol A / bisphenol F copolymer type epoxy resin, epoxy acrylate resin obtained by acrylic modification of the end of the epoxy resin, polyvinyl acetal resin such as polyvinyl butyral resin , Polyester resins, block copolymers and the like. (B) The resin concerning a component may be used individually by 1 type, and may use 2 or more types together.
As the component (B), any one of a resin having a bisphenol structure in the main chain, a polyvinyl acetal resin, a phenol novolac resin, and a cresol novolac resin is preferable. Moreover, since an electroconductive composition can be made into a photocurable composition, resin which has an ethylenically unsaturated double bond is preferable. Further, the resin of the present invention may be a carboxyl group-containing resin having a side chain modified with a carboxylic acid in order to enable alkali development.
上記フェノキシ樹脂とは、２価のフェノール化合物とエピハロヒドリンとの反応から得られる、または、２価のエポキシ化合物と２価のフェノール化合物とを反応させて得られる、ポリヒドロキシポリエーテルである。２価のフェノール化合物としてはビスフェノール類が挙げられる。フェノキシ樹脂としては、例えば、ビスフェノールＡ構造（骨格）を有するフェノキシ樹脂、ビスフェノールＦ構造を有するフェノキシ樹脂、ビスフェノールＳ構造を有するフェノキシ樹脂、ビスフェノールＭ構造を有するフェノキシ樹脂、ビスフェノールＰ構造を有するフェノキシ樹脂、ビスフェノールＺ構造を有するフェノキシ樹脂等ビスフェノール構造を有するフェノキシ樹脂等を挙げることができる。その他、ノボラック構造、アントラセン構造、フルオレン構造、ジシクロペンタジエン構造、ノルボルネン構造、ナフタレン構造、ビフェニル構造、アダマンタン構造等の骨格構造を有するフェノキシ樹脂等が挙げられる。上記の骨格構造として、複数種を有するものであってもよい。上記のうち、好ましくはビスフェノール構造を有するものが好ましい。 The phenoxy resin is a polyhydroxy polyether obtained from a reaction between a divalent phenol compound and an epihalohydrin, or obtained by reacting a divalent epoxy compound with a divalent phenol compound. Examples of the divalent phenol compound include bisphenols. Examples of the phenoxy resin include a phenoxy resin having a bisphenol A structure (skeleton), a phenoxy resin having a bisphenol F structure, a phenoxy resin having a bisphenol S structure, a phenoxy resin having a bisphenol M structure, a phenoxy resin having a bisphenol P structure, Examples thereof include a phenoxy resin having a bisphenol structure, such as a phenoxy resin having a bisphenol Z structure. In addition, a phenoxy resin having a skeleton structure such as a novolak structure, an anthracene structure, a fluorene structure, a dicyclopentadiene structure, a norbornene structure, a naphthalene structure, a biphenyl structure, an adamantane structure, or the like can be given. As said skeleton structure, you may have multiple types. Of the above, those having a bisphenol structure are preferred.
上記エポキシ樹脂は、１分子中に２個以上のエポキシ基（オキシラン環）を有する多官能エポキシ化合物、または該多官能エポキシ化合物を重合して得られる樹脂である。前記多官能エポキシ化合物としては、エポキシ化植物油；ビスフェノールＡ型エポキシ樹脂；ハイドロキノン型エポキシ樹脂、ビスフェノール型エポキシ樹脂、チオエーテル型エポキシ樹脂；ブロム化エポキシ樹脂；ノボラック型エポキシ樹脂；ビフェノールノボラック型エポキシ樹脂；ビスフェノールＦ型エポキシ樹脂；水添ビスフェノールＡ型エポキシ樹脂；グリシジルアミン型エポキシ樹脂；ヒダントイン型エポキシ樹脂；脂環式エポキシ樹脂；トリヒドロキシフェニルメタン型エポキシ樹脂；ビキシレノール型もしくはビフェノール型エポキシ樹脂またはそれらの混合物；ビスフェノールＳ型エポキシ樹脂；ビスフェノールＡノボラック型エポキシ樹脂；テトラフェニロールエタン型エポキシ樹脂；複素環式エポキシ樹脂；ジグリシジルフタレート樹脂；テトラグリシジルキシレノイルエタン樹脂；ナフタレン基含有エポキシ樹脂；ジシクロペンタジエン骨格を有するエポキシ樹脂；グリシジルメタアクリレート共重合系エポキシ樹脂；シクロヘキシルマレイミドとグリシジルメタアクリレートの共重合エポキシ樹脂；エポキシ変性のポリブタジエンゴム誘導体、ＣＴＢＮ変性エポキシ樹脂等が挙げられるが、これらに限られるものではない。これらのエポキシ樹脂は、単独でまたは２種以上を組み合わせて用いることができる。これらの中でも特にビスフェノール型エポキシ樹脂が好ましい。 The epoxy resin is a polyfunctional epoxy compound having two or more epoxy groups (oxirane rings) in one molecule, or a resin obtained by polymerizing the polyfunctional epoxy compound. Examples of the polyfunctional epoxy compounds include epoxidized vegetable oils; bisphenol A type epoxy resins; hydroquinone type epoxy resins, bisphenol type epoxy resins, thioether type epoxy resins; brominated epoxy resins; novolac type epoxy resins; biphenol novolac type epoxy resins; F type epoxy resin; hydrogenated bisphenol A type epoxy resin; glycidylamine type epoxy resin; hydantoin type epoxy resin; alicyclic epoxy resin; trihydroxyphenylmethane type epoxy resin; bixylenol type or biphenol type epoxy resin or a mixture thereof Bisphenol S type epoxy resin; bisphenol A novolac type epoxy resin; tetraphenylol ethane type epoxy resin; heterocyclic epoxy resin; Tetraglycidyl xylenoyl ethane resin; Naphthalene group-containing epoxy resin; Epoxy resin having dicyclopentadiene skeleton; Glycidyl methacrylate copolymer epoxy resin; Copolymer epoxy resin of cyclohexyl maleimide and glycidyl methacrylate; Examples thereof include, but are not limited to, polybutadiene rubber derivatives and CTBN-modified epoxy resins. These epoxy resins can be used alone or in combination of two or more. Among these, bisphenol type epoxy resins are particularly preferable.
上記エポキシアクリレート系樹脂は、上記エポキシ樹脂と、分子中にエチレン性不飽和基とカルボキシル基とを有する（メタ）アクリル酸もしくはその誘導体とを反応させて得られる樹脂である。また、多塩基酸無水物を反応させて、カルボキシル基を付加させたカルボキシル基含有樹脂であってもよい。例えば、ビスフェノールＡやビスフェノールＦといったビスフェノール構造を有するエポキシ樹脂を（メタ）アクリル酸変性して得られる、ビスフェノール構造を有するエポキシアクリレート系樹脂である。 The epoxy acrylate resin is a resin obtained by reacting the epoxy resin with (meth) acrylic acid or a derivative thereof having an ethylenically unsaturated group and a carboxyl group in the molecule. Moreover, the carboxyl group-containing resin which made the polybasic acid anhydride react and added the carboxyl group may be sufficient. For example, it is an epoxy acrylate resin having a bisphenol structure obtained by modifying (meth) acrylic acid an epoxy resin having a bisphenol structure such as bisphenol A or bisphenol F.
カルボキシル基含有樹脂の具体例としては、以下のような化合物（オリゴマーおよびポリマーのいずれでもよい）を挙げることができる。
（１）１分子中に複数のフェノール性水酸基を有する化合物とエチレンオキシド、プロピレンオキシド等のアルキレンオキシドとを反応させて得られる反応生成物に不飽和基含有モノカルボン酸を反応させ、得られる反応生成物に多塩基酸無水物を反応させて得られるカルボキシル基含有感光性樹脂。Specific examples of the carboxyl group-containing resin include the following compounds (any of oligomers and polymers).
(1) Reaction product obtained by reacting a reaction product obtained by reacting a compound having a plurality of phenolic hydroxyl groups in one molecule with an alkylene oxide such as ethylene oxide or propylene oxide, with an unsaturated group-containing monocarboxylic acid. A carboxyl group-containing photosensitive resin obtained by reacting a product with a polybasic acid anhydride.
（２）２官能またはそれ以上の多官能（固形）エポキシ樹脂に（メタ）アクリル酸を反応させ、側鎖に存在する水酸基に２塩基酸無水物を付加させたカルボキシル基含有感光性樹脂。 (2) A carboxyl group-containing photosensitive resin obtained by reacting a bifunctional or higher polyfunctional (solid) epoxy resin with (meth) acrylic acid and adding a dibasic acid anhydride to a hydroxyl group present in the side chain.
（３）２官能（固形）エポキシ樹脂の水酸基をさらにエピクロロヒドリンでエポキシ化した多官能エポキシ樹脂に（メタ）アクリル酸を反応させ、生じた水酸基に２塩基酸無水物を付加させたカルボキシル基含有感光性樹脂。 (3) A carboxyl obtained by reacting (meth) acrylic acid with a polyfunctional epoxy resin obtained by epoxidizing the hydroxyl group of a bifunctional (solid) epoxy resin with epichlorohydrin and adding a dibasic acid anhydride to the resulting hydroxyl group Group-containing photosensitive resin.
（４）２官能オキセタン樹脂にアジピン酸、フタル酸、ヘキサヒドロフタル酸等のジカルボン酸を反応させ、生じた１級の水酸基に無水フタル酸、テトラヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸等の２塩基酸無水物を付加させたカルボキシル基含有非感光性ポリエステル樹脂。 (4) Two bases such as phthalic anhydride, tetrahydrophthalic anhydride, and hexahydrophthalic anhydride are reacted with a dicarboxylic acid such as adipic acid, phthalic acid, and hexahydrophthalic acid by reacting the bifunctional oxetane resin. A carboxyl group-containing non-photosensitive polyester resin to which an acid anhydride is added.
（５）上記（１）〜（４）の樹脂にさらに１分子内に１つのエポキシ基と１つ以上の（メタ）アクリロイル基を有する化合物を付加してなるカルボキシル基含有感光性樹脂。
なお、本明細書において、（メタ）アクリレートとは、アクリレート、メタクリレートおよびそれらの混合物を総称する用語で、他の類似の表現についても同様である。(5) A carboxyl group-containing photosensitive resin obtained by adding a compound having one epoxy group and one or more (meth) acryloyl groups in one molecule to the resins (1) to (4).
In addition, in this specification, (meth) acrylate is a term which generically refers to acrylate, methacrylate and a mixture thereof, and the same applies to other similar expressions.
前記のようなカルボキシル基含有樹脂は、バックボーン・ポリマーの側鎖に多数のカルボキシル基を有するため、希アルカリ水溶液による現像が可能になる。
また、前記カルボキシル基含有樹脂の酸価は、４０〜２００ｍｇＫＯＨ／ｇの範囲が適当であり、より好ましくは４５〜１２０ｍｇＫＯＨ／ｇの範囲である。カルボキシル基含有樹脂の酸価が４０ｍｇＫＯＨ／ｇ以上であるとアルカリ現像性が良好となり、一方、２００ｍｇＫＯＨ／ｇ以下であると現像液による露光部の溶解が抑制され、ラインが必要以上に痩せたり、露光部と未露光部の区別なく現像液で溶解剥離する、といった現象の発生を抑えることができ、正常な電極パターンの描画を容易にすることが可能となる。Since the carboxyl group-containing resin as described above has a large number of carboxyl groups in the side chain of the backbone polymer, development with a dilute alkaline aqueous solution becomes possible.
The acid value of the carboxyl group-containing resin is suitably in the range of 40 to 200 mgKOH / g, more preferably in the range of 45 to 120 mgKOH / g. When the acid value of the carboxyl group-containing resin is 40 mgKOH / g or more, the alkali developability is good, while when it is 200 mgKOH / g or less, dissolution of the exposed portion by the developer is suppressed, and the line becomes thinner than necessary. Occurrence of a phenomenon such as dissolution and peeling with a developer without distinction between an exposed part and an unexposed part can be suppressed, and a normal electrode pattern can be easily drawn.
上記ポリビニルアセタール系樹脂は、ポリビニルアルコール樹脂をアルデヒドでアセタール化することで得られる。上記アルデヒドとしては、特に限定されず、例えば、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド、ブチルアルデヒド、アミルアルデヒド、ヘキシルアルデヒド、ヘプチルアルデヒド、２−エチルヘキシルアルデヒド、シクロヘキシルアルデヒド、フルフラール、ベンズアルデヒド、２−メチルベンズアルデヒド、３−メチルベンズアルデヒド、４−メチルベンズアルデヒド、ｐ−ヒドロキシベンズアルデヒド、ｍ−ヒドロキシベンズアルデヒド、フェニルアセトアルデヒド、β−フェニルプロピオンアルデヒドなどが挙げられ、ブチルアルデヒドが好ましい。これらのアルデヒドは１種類を単独で用いてもよく、２種類以上を併用してもよい。ポリビニルアセタール系樹脂としては、ポリビニルブチラール系樹脂が好ましい。 The polyvinyl acetal resin is obtained by acetalizing a polyvinyl alcohol resin with an aldehyde. The aldehyde is not particularly limited, and examples thereof include formaldehyde, acetaldehyde, propionaldehyde, butyraldehyde, amylaldehyde, hexylaldehyde, heptylaldehyde, 2-ethylhexylaldehyde, cyclohexylaldehyde, furfural, benzaldehyde, 2-methylbenzaldehyde, 3- Examples include methylbenzaldehyde, 4-methylbenzaldehyde, p-hydroxybenzaldehyde, m-hydroxybenzaldehyde, phenylacetaldehyde, β-phenylpropionaldehyde, and the like, butyraldehyde is preferred. These aldehydes may be used alone or in combination of two or more. As the polyvinyl acetal resin, polyvinyl butyral resin is preferable.
上記ポリエステル系樹脂は、高分子型の共重合芳香族ポリエステル樹脂が好ましい。
上記ブロック共重合体としてはＡ−Ｂ−Ａ、あるいはＡ−Ｂ−Ａ’型ブロック共重合体が好ましい。Ａ又はＡ’として、ポリメチル（メタ）アクリレート（ＰＭＭＡ）、ポリスチレン（ＰＳ）などを含むことが好ましく、Ｂとしてポリｎ−ブチルアクリレート（ＰＢＡ）、ポリブタジエン（ＰＢ）などを含むことが好ましい。The polyester resin is preferably a polymer-type copolymerized aromatic polyester resin.
The block copolymer is preferably an ABA or ABA ′ type block copolymer. A or A ′ preferably includes polymethyl (meth) acrylate (PMMA), polystyrene (PS), or the like, and B preferably includes poly n-butyl acrylate (PBA), polybutadiene (PB), or the like.
（Ｂ）成分は、芳香環を有する樹脂が好ましく、特に、ビスフェノール構造を有する樹脂、フェノールノボラック構造を有する樹脂、及びクレゾールノボラック構造を有する樹脂が好ましい。また、（Ｂ）成分は、フェノキシ系樹脂、ポリビニルアセタール系樹脂、ポリエステル系樹脂、ブロック共重合体が好ましい。これらのうち、フェノキシ系樹脂、ポリビニルアセタール系樹脂、ポリエステル系樹脂がより好ましい。 The component (B) is preferably a resin having an aromatic ring, and particularly preferably a resin having a bisphenol structure, a resin having a phenol novolak structure, and a resin having a cresol novolak structure. The component (B) is preferably a phenoxy resin, a polyvinyl acetal resin, a polyester resin, or a block copolymer. Of these, phenoxy resins, polyvinyl acetal resins, and polyester resins are more preferable.
（その他の樹脂）
本発明の導電性組成物は、本発明の効果を損なわない範囲で、上記（Ｂ）成分にかかる樹脂以外の、その他の樹脂を含有していてもよい。その他の樹脂としては、例えば、これまで導電性組成物において、有機バインダーとして用いられてきた樹脂で、熱分解終了点が、５００〜６５０℃の範囲外にある樹脂が挙げられる。
このような有機バインダーとしては、例えば、ポリエステル樹脂、ウレタン変性ポリエステル樹脂、エポキシ変性ポリエステル樹脂、アクリル変性ポリエステル樹脂などの各種変性ポリエステル樹脂、ポリエーテルウレタン樹脂、ポリカーボネートウレタン樹脂、アクリルウレタン樹脂、塩化ビニル・酢酸ビニル共重合体、エポキシ樹脂、フェノール樹脂、アクリル樹脂、ポリビニルブチラール樹脂、ポリアミドイミド、ポリイミド、ポリアミド、ニトロセルロース、セルロース・アセテート・ブチレート（ＣＡＢ）、セルロース・アセテート・プロピオネート（ＣＡＰ）などの変性セルロース類などが挙げられる。(Other resins)
The electrically conductive composition of this invention may contain other resin other than resin concerning the said (B) component in the range which does not impair the effect of this invention. Examples of the other resin include resins that have been used as an organic binder in conductive compositions so far and have a thermal decomposition end point outside the range of 500 to 650 ° C.
Examples of such organic binders include various modified polyester resins such as polyester resins, urethane-modified polyester resins, epoxy-modified polyester resins, and acrylic-modified polyester resins, polyether urethane resins, polycarbonate urethane resins, acrylic urethane resins, vinyl chloride, Vinyl acetate copolymer, epoxy resin, phenolic resin, acrylic resin, polyvinyl butyral resin, polyamideimide, polyimide, polyamide, nitrocellulose, cellulose acetate butyrate (CAB), modified cellulose such as cellulose acetate propionate (CAP) And the like.
（感光性モノマー）
本発明の導電性組成物は、組成物に光硬化性を付与し、現像によるパターン形成を可能とするために、感光性モノマーを含むことが好ましい。感光性モノマーは、分子中にエチレン性不飽和結合を有する化合物であり、粘度調整、光硬化性の促進や現像性の向上の為に用いられる。このような化合物としては、慣用公知のポリエステル（メタ）アクリレート、ポリエーテル（メタ）アクリレート、ウレタン（メタ）アクリレート、カーボネート（メタ）アクリレート、エポキシ（メタ）アクリレート、ウレタン（メタ）アクリレートが使用でき、具体的には、２−ヒドロキシエチルアクリレート、２−ヒドロキシプロピルアクリレートなどのヒドロキシアルキルアクリレート類；エチレングリコール、メトキシテトラエチレングリコール、ポリエチレングリコール、プロピレングリコールなどのグリコールのジアクリレート類；Ｎ，Ｎ−ジメチルアクリルアミド、Ｎ−メチロールアクリルアミド、Ｎ，Ｎ−ジメチルアミノプロピルアクリルアミドなどのアクリルアミド類；Ｎ，Ｎ−ジメチルアミノエチルアクリレート、Ｎ，Ｎ−ジメチルアミノプロピルアクリレートなどのアミノアルキルアクリレート類；ヘキサンジオール、トリメチロールプロパン、ペンタエリスリトール、ジペンタエリスリトール、トリス−ヒドロキシエチルイソシアヌレートなどの多価アルコールまたはこれらのエチレンオキサイド付加物、プロピレンオキサイド付加物、もしくはε−カプロラクトン付加物などの多価アクリレート類；フェノキシアクリレート、ビスフェノールＡジアクリレート、およびこれらのフェノール類のエチレンオキサイド付加物もしくはプロピレンオキサイド付加物などの多価アクリレート類；グリセリンジグリシジルエーテル、グリセリントリグリシジルエーテル、トリメチロールプロパントリグリシジルエーテル、トリグリシジルイソシアヌレートなどのグリシジルエーテルの多価アクリレート類；上記に限らず、ポリエーテルポリオール、ポリカーボネートジオール、水酸基末端ポリブタジエン、ポリエステルポリオールなどのポリオールを直接アクリレート化、もしくは、ジイソシアネートを介してウレタンアクリレート化したアクリレート類およびメラミンアクリレート、および上記アクリレートに対応する各メタクリレート類の少なくとも何れか１種などが挙げられる。
配合する場合の好適な配合量は、（Ｂ）成分１００質量部あたり５〜２００質量部が好ましい。 (Photosensitive monomer)
The conductive composition of the present invention preferably contains a photosensitive monomer in order to impart photocurability to the composition and enable pattern formation by development. The photosensitive monomer is a compound having an ethylenically unsaturated bond in the molecule, and is used for viscosity adjustment, acceleration of photocurability and improvement of developability. As such a compound, conventionally known polyester (meth) acrylate, polyether (meth) acrylate, urethane (meth) acrylate, carbonate (meth) acrylate, epoxy (meth) acrylate, urethane (meth) acrylate can be used, Specifically, hydroxyalkyl acrylates such as 2-hydroxyethyl acrylate and 2-hydroxypropyl acrylate; diacrylates of glycols such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol, and propylene glycol; N, N-dimethylacrylamide , N-methylolacrylamide, N, N-dimethylaminopropylacrylamide and other acrylamides; N, N-dimethylaminoethyl acrylate, N Aminoalkyl acrylates such as N-dimethylaminopropyl acrylate; polyhydric alcohols such as hexanediol, trimethylolpropane, pentaerythritol, dipentaerythritol, tris-hydroxyethyl isocyanurate, or ethylene oxide adducts thereof, propylene oxide adducts Or polyhydric acrylates such as ε-caprolactone adduct; polyhydric acrylates such as phenoxy acrylate, bisphenol A diacrylate, and ethylene oxide adduct or propylene oxide adduct of these phenols; glycerin diglycidyl ether, glycerin Such as triglycidyl ether, trimethylolpropane triglycidyl ether, triglycidyl isocyanurate Polyacid acrylates of lysidyl ether; not limited to the above, acrylates and melamine acrylates obtained by directly acrylated polyols such as polyether polyols, polycarbonate diols, hydroxyl-terminated polybutadienes, polyester polyols, or urethane acrylates via diisocyanates , And at least one of each methacrylate corresponding to the acrylate.
As for the suitable compounding quantity in the case of mix | blending, 5-200 mass parts is preferable per 100 mass parts of (B) component.
（光重合開始剤）
本発明の導電性組成物は、組成物に感光性を付与し、現像によるパターン形成を可能とするために、光重合開始剤を含むことが好ましい。光重合開始剤としては、公知のいずれのものも用いることができるが、中でも、オキシムエステル基を有するオキシムエステル系光重合開始剤、α−アミノアセトフェノン系光重合開始剤、アシルホスフィンオキサイド系光重合開始剤、チタノセン系光重合開始剤が好ましい。光重合開始剤は１種を単独で用いてもよく、２種以上を併用して用いてもよい。(Photopolymerization initiator)
The conductive composition of the present invention preferably contains a photopolymerization initiator in order to impart photosensitivity to the composition and enable pattern formation by development. As the photopolymerization initiator, any known photopolymerization initiator can be used. Among them, an oxime ester photopolymerization initiator having an oxime ester group, an α-aminoacetophenone photopolymerization initiator, an acylphosphine oxide photopolymerization initiator, among others. Initiators and titanocene photopolymerization initiators are preferred. A photoinitiator may be used individually by 1 type and may be used in combination of 2 or more type.
オキシムエステル系光重合開始剤は下記一般式（Ｉ）で表される部分構造（オキシムエステル基）を有する光重合開始剤である。
オキシムエステル系光重合開始剤としては、市販品として、ＢＡＳＦジャパン社製のＣＧＩ−３２５、イルガキュア（登録商標）ＯＸＥ０１、イルガキュアＯＸＥ０２、ＡＤＥＫＡ社製のＮ−１９１９、アデカアークルズ（登録商標）ＮＣＩ−８３１などが挙げられる。 Examples of commercially available oxime ester photopolymerization initiators include CGI-325, Irgacure (registered trademark) OXE01, Irgacure OXE02 manufactured by BASF Japan, N-1919 manufactured by ADEKA, and Adeka Arcles (registered trademark) NCI- 831 etc. are mentioned.
オキシムエステル系光重合開始剤を使用する場合の配合量は、（Ｂ）成分１００質量部に対して、０．０１〜５質量部とすることが好ましい。０．０１質量部以上であれば光硬化性が十分となり、硬化物の剥離や耐薬品性などの硬化物特性の低下を抑えることができる。一方、５質量部以下であれば、硬化物表面での光吸収が過剰になることが避けられ、深部硬化性を確保することができる。より好ましくは、（Ｂ）成分１００質量部に対して０．５〜３質量部である。 The amount of the oxime ester photopolymerization initiator used is preferably 0.01 to 5 parts by mass with respect to 100 parts by mass of component (B). If it is 0.01 mass part or more, photocurability will become enough and the fall of cured | curing material characteristics, such as peeling of cured | curing material and chemical resistance, can be suppressed. On the other hand, if it is 5 parts by mass or less, excessive light absorption on the surface of the cured product can be avoided, and deep curability can be ensured. More preferably, it is 0.5-3 mass parts with respect to 100 mass parts of (B) component.
α−アミノアセトフェノン系光重合開始剤としては、具体的には、２−メチル−１−［４−（メチルチオ）フェニル］−２−モルホリノプロパノン−１、２−ベンジル−２−ジメチルアミノ−１−（４−モルホリノフェニル）−ブタン−１−オン、２−（ジメチルアミノ）−２−［（４−メチルフェニル）メチル］−１−［４−（４−モルホリニル）フェニル］−１−ブタノン、Ｎ，Ｎ−ジメチルアミノアセトフェノンなどが挙げられる。市販品としては、ＢＡＳＦジャパン社製のイルガキュア９０７、イルガキュア３６９、イルガキュア３７９などが挙げられる。 As the α-aminoacetophenone photopolymerization initiator, specifically, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1, 2-benzyl-2-dimethylamino-1 -(4-morpholinophenyl) -butan-1-one, 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone, N, N-dimethylaminoacetophenone and the like can be mentioned. Examples of commercially available products include Irgacure 907, Irgacure 369, and Irgacure 379 manufactured by BASF Japan.
アシルホスフィンオキサイド系光重合開始剤としては、具体的には２，４，６−トリメチルベンゾイルジフェニルホスフィンオキサイド、ビス（２，４，６−トリメチルベンゾイル）−フェニルホスフィンオキサイド、ビス（２，６−ジメトキシベンゾイル）−２，４，４−トリメチル−ペンチルホスフィンオキサイドなどが挙げられる。市販品としては、ＢＡＳＦジャパン社製のルシリン（登録商標）ＴＰＯ、イルガキュア８１９などが挙げられる。 Specific examples of the acylphosphine oxide photopolymerization initiator include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, and bis (2,6-dimethoxy). And benzoyl) -2,4,4-trimethyl-pentylphosphine oxide. Examples of commercially available products include Lucillin (registered trademark) TPO, Irgacure 819 manufactured by BASF Japan.
α−アミノアセトフェノン系光重合開始剤またはアシルホスフィンオキサイド系光重合開始剤を用いる場合のそれぞれの配合量は、（Ｂ）成分１００質量部に対して、０．０１〜１５質量部であることが好ましい。０．０１質量部以上であれば光硬化性が十分となり、硬化物の剥離や耐薬品性などの硬化物特性の低下を抑えることができる。一方、１５質量部以下であれば、アウトガスの低減効果が十分となり、さらに硬化物表面での光吸収が過剰になることが避けられ、深部硬化性を確保することができる。より好ましくは（Ｂ）成分１００質量部に対して０．５〜１０質量部である。 Each compounding amount in the case of using an α-aminoacetophenone photopolymerization initiator or an acylphosphine oxide photopolymerization initiator is 0.01 to 15 parts by mass with respect to 100 parts by mass of the component (B). preferable. If it is 0.01 mass part or more, photocurability will become enough and the fall of cured | curing material characteristics, such as peeling of cured | curing material and chemical resistance, can be suppressed. On the other hand, if it is 15 parts by mass or less, the effect of reducing outgas is sufficient, and further, light absorption on the surface of the cured product can be avoided, and deep curability can be ensured. More preferably, it is 0.5-10 mass parts with respect to 100 mass parts of (B) component.
また、光重合開始剤としてはＢＡＳＦジャパン社製のイルガキュアー３８９、チタノセン系光重合開始剤であるイルガキュアー７８４も好適に用いることができる。 As the photopolymerization initiator, Irgacure 389 manufactured by BASF Japan Ltd. and Irgacure 784 which is a titanocene photopolymerization initiator can also be suitably used.
光重合開始剤の他、光開始助剤または増感剤を好適に用いることができる。光開始助剤または増感剤としては、ベンゾイン化合物、アセトフェノン化合物、アントラキノン化合物、チオキサントン化合物、ケタール化合物、ベンゾフェノン化合物、３級アミン化合物、及びキサントン化合物などを挙げることができる。これらの化合物は、光重合開始剤として用いることができる場合もあるが、光重合開始剤と併用して用いることが好ましい。また、光開始助剤または増感剤は１種類を単独で用いてもよく、２種以上を併用してもよい。 In addition to the photopolymerization initiator, a photoinitiator assistant or sensitizer can be suitably used. Examples of the photoinitiation assistant or sensitizer include benzoin compounds, acetophenone compounds, anthraquinone compounds, thioxanthone compounds, ketal compounds, benzophenone compounds, tertiary amine compounds, and xanthone compounds. These compounds may be used as a photopolymerization initiator in some cases, but are preferably used in combination with a photopolymerization initiator. Moreover, a photoinitiator auxiliary or a sensitizer may be used individually by 1 type, and may use 2 or more types together.
（ガラスフリット）
本発明の導電性組成物は、ガラスフリットを含まなくとも基材に対する密着性に優れるため、ガラスフリットの含有量を低減できる。ただし、少量であれば、ガラスフリットを含んでいてもよい。高い導電性が得られることから、ガラスフリットを含まない方が好ましい。
ガラスフリットとしては、特に限定されないが、酸化鉛、酸化ビスマス、酸化亜鉛、酸化リチウム、またはアルカリホウケイ酸塩を主成分とするものが用いられる。(Glass frit)
Since the conductive composition of the present invention is excellent in adhesiveness to a substrate without containing glass frit, the content of glass frit can be reduced. However, the glass frit may be included in a small amount. Since high electroconductivity is obtained, it is preferable not to include glass frit.
Although it does not specifically limit as glass frit, The thing which has lead oxide, bismuth oxide, zinc oxide, lithium oxide, or an alkali borosilicate as a main component is used.
ガラス粒子の平均粒径（Ｄ５０）は、レーザー回折・散乱法で測定することができ、好ましくは０．３〜５．０μｍ、より好ましくは０．５〜３．０μｍである。平均粒径が０．３μｍ以上であると、収率が確保されコスト高となることを避けることができ、一方、５．０μｍ以下であれば、薄膜の形成や、焼成時の均一な収縮を容易とすることができ、ライン形状や緻密性の劣化を抑制することが可能となる。 The average particle diameter (D50) of the glass particles can be measured by a laser diffraction / scattering method, and is preferably 0.3 to 5.0 μm, more preferably 0.5 to 3.0 μm. If the average particle size is 0.3 μm or more, the yield can be secured and the cost can be avoided. On the other hand, if the average particle size is 5.0 μm or less, formation of a thin film and uniform shrinkage during firing can be prevented. It is possible to easily reduce the deterioration of the line shape and the denseness.
ガラスフリットの軟化点は、例えば、５５０℃以下であることにより、導電性に優れる。 The softening point of a glass frit is excellent in electroconductivity by being 550 degrees C or less, for example.
ガラスフリットを含む場合の配合量は特に限定されないが、好ましくは組成物全体中１５質量％以下、より好ましくは４質量％以下、最も好ましくは０％である。軟化点の高いガラスフリットの量が過剰にならないようにすれば、密着性の低下を抑制することができる。 The amount of glass frit is not particularly limited, but is preferably 15% by mass or less, more preferably 4% by mass or less, and most preferably 0% in the entire composition. If the amount of the glass frit having a high softening point is not excessive, a decrease in adhesion can be suppressed.
更に、ガラスフリットを導電性組成物に均一に分散するために、分散剤を添加してもよい。分散剤は、ガラスフリットを均一に導電性組成物に分散できるものであれば特に限定されるものではない。分散剤としては、ポリカルボン酸型高分子界面活性剤、変性アクリル系ブロック共重合体、顔料親和性基を有するアクリル共重合物、塩基性あるいは酸性の顔料吸着基を有するブロック共重合物、顔料親和性基を有する変性ポリアルコキシレート、ポリアミノアマイド塩とポリエステルの組合せ、又は極性酸エステルと高分子アルコールの組合せ、酸性ポリマーのアルキルアンモニウム塩、顔料親和性基を有する高分子量ブロック共重合体、特殊変性ウレア等が挙げられる。上記分散剤は、１種類を単独で用いてもよく、２種類以上を併用してもよい。 Furthermore, in order to disperse | distribute glass frit uniformly to an electroconductive composition, you may add a dispersing agent. The dispersant is not particularly limited as long as the glass frit can be uniformly dispersed in the conductive composition. Dispersants include polycarboxylic acid type polymer surfactants, modified acrylic block copolymers, acrylic copolymers having pigment affinity groups, block copolymers having basic or acidic pigment adsorbing groups, pigments Modified polyalkoxylate having affinity group, combination of polyaminoamide salt and polyester, or combination of polar acid ester and high molecular alcohol, alkyl ammonium salt of acidic polymer, high molecular weight block copolymer having pigment affinity group, special Examples include modified urea. The said dispersing agent may be used individually by 1 type, and may use 2 or more types together.
（脂肪酸）
本発明の導電性組成物は、脂肪酸を含有していてもよい。脂肪酸を含有することにより、保存安定性の向上が期待できる。脂肪酸としては、飽和脂肪酸、不飽和脂肪酸いずれでもよいが、好ましくは不飽和結合を２つ以上有する不飽和脂肪酸である。脂肪酸の具体例としては、ベヘン酸、オレイン酸、リノレン酸、ステアリン酸、チオ二酢酸などが挙げられる。脂肪酸を配合する場合の配合量は、（Ｂ）成分１００質量部に対して、好ましくは０．１〜５である。(fatty acid)
The conductive composition of the present invention may contain a fatty acid. By containing a fatty acid, an improvement in storage stability can be expected. The fatty acid may be either a saturated fatty acid or an unsaturated fatty acid, but is preferably an unsaturated fatty acid having two or more unsaturated bonds. Specific examples of fatty acids include behenic acid, oleic acid, linolenic acid, stearic acid, thiodiacetic acid and the like. When the fatty acid is blended, the blending amount is preferably 0.1 to 5 with respect to 100 parts by mass of the component (B).
（安定剤）
本発明の導電性組成物は、組成物の保存安定性を向上させ、ゲル化や流動性の低下による塗布作業性の悪化を抑制するために、上記脂肪酸以外の安定剤を添加することもできる。安定剤としては、導電性組成物中のアルミニウムとの錯体化あるいは塩形成などの効果のある化合物を用いることができる。具体的には、例えば、硝酸、硫酸、塩酸、ホウ酸等の各種無機酸；ギ酸、酢酸、アセト酢酸、クエン酸、フタル酸、ベンゼンスルホン酸、スルファミン酸等の各種有機酸；リン酸、亜リン酸、次亜リン酸、リン酸メチル、リン酸エチル、リン酸ブチル、リン酸フェニル、亜リン酸エチル、亜リン酸ジフェニル、モノ（２−メタクリロイルオキシエチル）アシッドホスフェート、ジ（２−メタクリロイルオキシエチル）アシッドホスフェート等の各種リン酸化合物（無機リン酸、有機リン酸）などの酸が挙げられ、リン酸、リン酸エステル、有機酸が好ましい。市販品としては、ライトエステルＰ−１Ｍ（共栄社化学社製）等が挙げられる。上記安定剤は、１種類を単独で用いてもよく、２種類以上を併用してもよい。(Stabilizer)
The conductive composition of the present invention can be added with a stabilizer other than the above fatty acid in order to improve the storage stability of the composition and to suppress the deterioration of the coating workability due to the gelation and fluidity deterioration. . As the stabilizer, a compound having an effect of complexing with aluminum or forming a salt in the conductive composition can be used. Specifically, for example, various inorganic acids such as nitric acid, sulfuric acid, hydrochloric acid, boric acid; various organic acids such as formic acid, acetic acid, acetoacetic acid, citric acid, phthalic acid, benzenesulfonic acid, sulfamic acid; phosphoric acid, nitrous acid Phosphoric acid, hypophosphorous acid, methyl phosphate, ethyl phosphate, butyl phosphate, phenyl phosphate, ethyl phosphite, diphenyl phosphite, mono (2-methacryloyloxyethyl) acid phosphate, di (2-methacryloyl) Examples thereof include acids such as various phosphoric acid compounds (inorganic phosphoric acid, organic phosphoric acid) such as oxyethyl) acid phosphate, and phosphoric acid, phosphoric acid ester and organic acid are preferable. As a commercial item, light ester P-1M (made by Kyoeisha Chemical Co., Ltd.) etc. are mentioned. The said stabilizer may be used individually by 1 type, and may use 2 or more types together.
安定剤の配合量は（Ｂ）成分１００質量部に対して、好ましくは０．０５〜１０質量部、より好ましくは０．１〜５質量部である。 The blending amount of the stabilizer is preferably 0.05 to 10 parts by mass, more preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the component (B).
（溶剤）
本発明の導電性組成物は、組成物の粘度を調整するために有機溶剤を含んでいてもよい。有機溶剤としては、（Ｂ）成分にかかる樹脂を溶解できるものであれば公知慣用のものが使用可能である。例えば、トルエン、キシレン、酢酸エチル、酢酸ブチル、メタノール、エタノール、イソプロピルアルコール、イソブチルアルコール、１−ブタノール、ジアセトンアルコール、エチレングリコールモノブチルエーテル、プロピレングリコールモノエチルエーテル、プロピレングリコールモノメチルエーテルアセテート、テルピネオール、メチルエチルケトン、カルビトール、カルビトールアセテート、ブチルカルビトール、ブチルカルビトールアセテート等が挙げられる。必要に応じてこれらの２種以上が含まれていてもよい。(solvent)
The conductive composition of the present invention may contain an organic solvent in order to adjust the viscosity of the composition. Any known organic solvent can be used as long as it can dissolve the resin of component (B). For example, toluene, xylene, ethyl acetate, butyl acetate, methanol, ethanol, isopropyl alcohol, isobutyl alcohol, 1-butanol, diacetone alcohol, ethylene glycol monobutyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether acetate, terpineol, methyl ethyl ketone Carbitol, carbitol acetate, butyl carbitol, butyl carbitol acetate and the like. Two or more of these may be included as necessary.
（その他の添加剤）
本発明の導電性組成物には、本発明の効果を損なわない限り、電極や電気配線の形成に用いられるアルミニウム含有導電性組成物に一般に配合される成分を配合することができる。そのような成分としては、バインダー、着色剤、表面処理剤、消泡剤、レベリング剤、表面張力低下剤、希釈剤、可塑化剤、フィラー、カップリング剤、酸化防止剤、分散剤等が挙げられる。また、銀粒子、銅粒子などアルミニウム以外の導電粉を含んでいてもよい。
なお、本発明の感光性導電性組成物は、３本ロールミルなどにより練肉してペースト化することができる。(Other additives)
As long as the effects of the present invention are not impaired, the conductive composition of the present invention can be blended with components generally blended in the aluminum-containing conductive composition used for forming electrodes and electrical wiring. Examples of such components include binders, colorants, surface treatment agents, antifoaming agents, leveling agents, surface tension reducing agents, diluents, plasticizers, fillers, coupling agents, antioxidants, and dispersants. It is done. Moreover, electroconductive powder other than aluminum, such as silver particles and copper particles, may be included.
The photosensitive conductive composition of the present invention can be paste-formed by kneading with a three-roll mill or the like.
＜電極＞
本発明の電極は、本発明の導電性組成物を用いて形成されたものである。電極の形成方法の例を下記する。但し、これに限られない。<Electrode>
The electrode of the present invention is formed using the conductive composition of the present invention. An example of an electrode forming method will be described below. However, it is not limited to this.
本発明の導電性組成物を、スクリーン印刷によって、例えばＰＤＰの前面基板となるガラス基板に、所定のパターンで塗布した後、焼成を行なってＰＤＰ用電極を形成することができる。 The conductive composition of the present invention can be applied by screen printing, for example, to a glass substrate serving as a front substrate of a PDP in a predetermined pattern, and then baked to form a PDP electrode.
また、本発明の導電性組成物に感光性が付与されている場合には、フォトリソグラフィー法でパターン形成することもできる。例えば、本発明の導電性組成物を、スクリーン印刷法、バーコーダー、ブレードコーターなど適宜の塗布方法で、ガラス基板に塗布し、塗膜を形成する。次いで、得られた塗膜を、指触乾燥性を得るために、熱風循環式乾燥炉、遠赤外線乾燥炉等で例えば約７０〜１２０℃で５〜４０分程度乾燥させ、有機溶剤を蒸発させ、タックフリーの塗膜（乾燥塗膜）を形成する。このとき、予め導電性組成物をフィルム上に塗布、乾燥して、ドライフィルムを形成した場合には、ドライフィルムを基板上にラミネートしてもよい。 Moreover, when photosensitivity is provided to the conductive composition of the present invention, a pattern can be formed by a photolithography method. For example, the conductive composition of the present invention is applied to a glass substrate by an appropriate application method such as a screen printing method, a bar coder, or a blade coater to form a coating film. Next, in order to obtain a touch-drying property, the obtained coating film is dried, for example, at about 70 to 120 ° C. for about 5 to 40 minutes in a hot air circulation drying oven, a far infrared drying oven, etc. A tack-free coating (dry coating) is formed. At this time, when the conductive composition is previously applied on the film and dried to form a dry film, the dry film may be laminated on the substrate.
そして、得られた乾燥塗膜をパターン露光する。露光方法としては、所定の露光パターンを有するネガマスクを用いた接触露光および非接触露光が可能である。露光光源としては、ハロゲンランプ、高圧水銀灯、レーザー光、メタルハライドランプ、ブラックランプ、無電極ランプなどが使用される。露光量としては１００〜８００ｍＪ／ｃｍ２程度が好ましい。また、最大波長が３５０〜４２０ｎｍのレーザー発振光源を用いた直接描画装置も用いて露光することもできる。The resulting dried coating film is subjected to pattern exposure. As an exposure method, contact exposure and non-contact exposure using a negative mask having a predetermined exposure pattern are possible. As the exposure light source, a halogen lamp, a high-pressure mercury lamp, a laser beam, a metal halide lamp, a black lamp, an electrodeless lamp, or the like is used. The exposure amount is preferably about 100 to 800 mJ / cm 2 . Moreover, it can also expose using the direct drawing apparatus using the laser oscillation light source whose maximum wavelength is 350-420 nm.
さらに、所定パターンに露光された塗膜を現像する。現像方法としてはスプレー法、浸漬法等が用いられる。現像液としては、例えば、水酸化ナトリウム、水酸化カリウム、炭酸ナトリウム、炭酸カリウム、珪酸ナトリウムなどの金属アルカリ水溶液や、モノエタノールアミン、ジエタノールアミン、トリエタノールアミンなどのアミン水溶液、特に約１．５ｗｔ％以下の濃度の希アルカリ水溶液が好適に用いられる。また、現像後に不要な現像液の除去のため、水洗や酸中和を行うことが好ましい。 Furthermore, the coating film exposed to a predetermined pattern is developed. As a developing method, a spray method, a dipping method or the like is used. As the developer, for example, a metal alkali aqueous solution such as sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium silicate, or an amine aqueous solution such as monoethanolamine, diethanolamine, or triethanolamine, particularly about 1.5 wt%. A dilute alkaline aqueous solution having the following concentration is preferably used. Moreover, it is preferable to perform washing with water and acid neutralization in order to remove an unnecessary developer after development.
焼成工程においては、本発明の導電性組成物がパターン形成されたガラス基板を、空気雰囲気下または窒素雰囲気下で好ましくは６５０℃以下、より好ましくは約４００〜６５０℃、更に好ましくは約５００〜６００℃で加熱処理し、所望の電極を形成する。なお、このとき、昇温速度は、２０℃／分以下に設定することが好ましい。焼成温度が６５０℃以下であることにより、残炭の消失を防ぐことができる。
本発明の電極は、ＰＤＰ用又はタッチパネル用として好適に用いることができるが、これらに限られない。タッチパネル用電極としては、引き出し配線電極が挙げられる。In the firing step, the glass substrate on which the conductive composition of the present invention is patterned is preferably 650 ° C. or less, more preferably about 400 to 650 ° C., and still more preferably about 500 to 500 ° C. in an air atmosphere or a nitrogen atmosphere. Heat treatment is performed at 600 ° C. to form a desired electrode. At this time, the temperature rising rate is preferably set to 20 ° C./min or less. When the firing temperature is 650 ° C. or lower, the disappearance of residual charcoal can be prevented.
The electrode of the present invention can be suitably used for a PDP or a touch panel, but is not limited thereto. As the electrode for the touch panel, a lead-out wiring electrode can be mentioned.
以下、本発明を実施例により具体的に説明するが、本発明は以下の実施例、比較例によっては限定されない。 EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited by a following example and a comparative example.
（ＴＧ−ＤＴＡ）
下記表１に記載のそれぞれの樹脂について、ＴＧ−ＤＴＡ測定装置（セイコーインスツル社製）を用いて、温度上昇に伴う樹脂試料の重量変化を測定した。
測定温度条件は室温〜６００℃であり、到達温度において３０分間保持した。また、昇温条件は、２０℃／ｍｉｎとした。重量減少が見られなくなった温度を熱分解終了点とした。得られた結果を下記表１に示す。また、樹脂Ｃについては、得られたチャート図を図３に示す。(TG-DTA)
About each resin of following Table 1, the weight change of the resin sample accompanying a temperature rise was measured using the TG-DTA measuring apparatus (made by Seiko Instruments Inc.).
The measurement temperature condition was room temperature to 600 ° C., and the temperature was maintained at the ultimate temperature for 30 minutes. The temperature raising condition was 20 ° C./min. The temperature at which no weight reduction was observed was defined as the end point of thermal decomposition. The obtained results are shown in Table 1 below. For the resin C, the obtained chart is shown in FIG.
※２：ビスフェノールＦ型エポキシアクリレートのカルボン酸変性カルボキシル基含有樹脂
※３：ビスフェノールＦ型エポキシアクリレートのカルボン酸変性カルボキシル基含有樹脂
※４：ポリビニルブチラール樹脂
※５：ビスフェノールＡ型フェノキシ樹脂
※６：ビスフェノールＡ型ポリエステル樹脂
※７：ブチルアクリレートとメチルメタクリレートの共重合樹脂
※８：メタクリレートとＢＧメタクリレートの共重合にＨＨＰＡ付加（ヘキサヒドロフタル酸無水物）したカルボキシル基含有樹脂
（実施例１〜９、参考例１、比較例１）
（導電性組成物の調製）
下記表２に示す割合で、各成分を混合し、三本ロールミルで練肉して、導電性組成物を作製した。表中の配合量の単位は質量部である。
(Examples 1 to 9, Reference Example 1, Comparative Example 1)
(Preparation of conductive composition)
Each component was mixed in the ratio shown in Table 2 below, and kneaded with a three-roll mill to prepare a conductive composition. The unit of the blending amount in the table is part by mass.
※２：平均粒径４μｍ、Ｎ２アトマイズ法により製造
※３：平均粒径６μｍ、Ｎ２アトマイズ法により製造
※４：平均粒径２μｍ、大気中アトマイズ法により製造
※５：平均粒径２．５μｍ
※６：トリスフェニルメタン系エポキシアクリレートのＴＨＰＡ（１，２，３，６−テトラヒドロフタル酸無水物）変性カルボキシル基含有樹脂、熱分解終了温度＝５９１℃
※７：ビスフェノールＦ型エポキシアクリレートのカルボン酸変性カルボキシル基含有樹脂、熱分解終了温度＝５９２℃
※８：ビスフェノールＦ型エポキシアクリレートのカルボン酸変性カルボキシル基含有樹脂、熱分解終了温度＝５９２℃
※９：ポリビニルブチラール樹脂、熱分解終了温度＝５９５℃
※１０：ビスフェノールＡ型フェノキシ樹脂、熱分解終了温度＝５９７℃
※１１：ビスフェノールＡ型ポリエステル樹脂、熱分解終了温度＝６０３℃
※１２：ブチルアクリレートとメチルメタクリレートの共重合樹脂、熱分解終了温度＝５９４℃
※１３：メタクリレートとＢＧ（ブチルグリシジル）メタクリレートの共重合にＨＨＰＡ付加（ヘキサヒドロフタル酸無水物）したカルボキシル基含有樹脂、熱分解終了温度＝４７４℃
※１４：アミノアセトフェノン系光重合開始剤
※１５：３官能ＥＯ変性トリメチロールプロパントリアクリレート
※１６：ポリエステルアクリレート
※１７：炭化水素芳香族系溶剤
* 6: THPA (1,2,3,6-tetrahydrophthalic anhydride) modified carboxyl group-containing resin of trisphenylmethane epoxy acrylate, thermal decomposition end temperature = 591 ° C.
* 7: Carboxylic acid-modified carboxyl group-containing resin of bisphenol F type epoxy acrylate, thermal decomposition end temperature = 592 ° C.
* 8: Carboxylic acid-modified carboxyl group-containing resin of bisphenol F type epoxy acrylate, thermal decomposition end temperature = 592 ° C.
* 9: Polyvinyl butyral resin, thermal decomposition end temperature = 595 ° C
* 10: Bisphenol A type phenoxy resin, thermal decomposition end temperature = 597 ° C
* 11: Bisphenol A type polyester resin, thermal decomposition end temperature = 603 ° C.
* 12: Copolymerized resin of butyl acrylate and methyl methacrylate, thermal decomposition end temperature = 594 ° C
* 13: Carboxyl group-containing resin obtained by adding HHPA (hexahydrophthalic anhydride) to copolymerization of methacrylate and BG (butyl glycidyl) methacrylate, thermal decomposition end temperature = 474 ° C.
* 14: Aminoacetophenone photopolymerization initiator * 15: Trifunctional EO-modified trimethylolpropane triacrylate * 16: Polyester acrylate * 17: Hydrocarbon aromatic solvent
（実施例１〜３、８〜９、参考例１、比較例１、２の試験片の作製）
ガラス基材上に、評価用の各導電性組成物を２００メッシュのポリエステルスクリーンを用いて全面に塗布し、次いで、熱風循環式乾燥炉にて８０℃で２０分間乾燥して指触乾燥性の良好な塗膜を形成した。その後、光源としてメタルハライドランプを用いて、組成物上の積算光量が３００ｍＪ／ｃｍ２となるように露光した。最後に、５８０〜６００℃で３０分間焼成し、電極を形成した試験片を作製した。
(Production of test pieces of Examples 1 to 3 and 8 to 9, Reference Example 1 and Comparative Examples 1 and 2)
Each conductive composition for evaluation was applied on the entire surface of a glass substrate using a 200-mesh polyester screen, and then dried at 80 ° C. for 20 minutes in a hot-air circulating drying oven to provide a touch-drying property. A good coating film was formed. Thereafter, using a metal halide lamp as a light source, exposure was performed so that the integrated light amount on the composition was 300 mJ / cm 2 . Finally, it baked for 30 minutes at 580-600 degreeC, and produced the test piece which formed the electrode.
（実施例４〜７の試験片の作製）
ガラス基材上に、評価用の各導電性組成物を２００メッシュのポリエステルスクリーンを用いて全面に塗布し、次いで、熱風循環式乾燥炉に８０℃で２０分間乾燥して指触乾燥性の良好な塗膜を形成した。その後、５８０〜６００℃で３０分間焼成し、電極を形成した試験片を作製した。(Production of test pieces of Examples 4 to 7)
Each conductive composition for evaluation was applied on the entire surface of a glass substrate using a 200-mesh polyester screen, and then dried in a hot-air circulating drying oven at 80 ° C. for 20 minutes for good touch drying properties. A good coating was formed. Then, it baked for 30 minutes at 580-600 degreeC, and produced the test piece which formed the electrode.
比抵抗値：
上記試験片（０．１ｃｍ×４０ｃｍ）について、三菱化学アナリティック製のロレスタＧＰに微小サンプル用四探針プローブ（ＰＳＰ）を装着し四探針法により測定を行なった。試料の膜厚はミツトヨ製デジマチックマイクロメータ（ＭＤＣ‐２５ＭＪ）を用いて測定した。Specific resistance value:
The test piece (0.1 cm × 40 cm) was measured by a four-probe method by attaching a four-probe probe (PSP) for a micro sample to a Loresta GP manufactured by Mitsubishi Chemical Analytic. The thickness of the sample was measured using a Mitutoyo Digimatic Micrometer (MDC-25MJ).
密着性：
試験片（２ｃｍ×５ｃｍ）について、クロスカット法（ＪＩＳ Ｋ−５６００）に準拠して、１ｍｍ間隔の格子状に塗膜を２５個に切り込んだ。その上にテープを貼り、剥がした時の状態により密着性の評価を行った。なお、比較例２については、耐酸性が得られなかったため、評価しなかった。
全く剥がれない：◎、
表層の一部が剥がれる：〇、
表層全体がはがれる：△、
全体が基材界面から剥がれる：×Adhesion:
About the test piece (2 cm x 5 cm), based on the cross-cut method (JIS K-5600), the coating film was cut | disconnected to 25 pieces at the grid | lattice form of 1 mm space | interval. Adhesion was evaluated according to the state when a tape was applied and peeled off. Comparative Example 2 was not evaluated because acid resistance was not obtained.
Not peeled at all: ◎,
Part of the surface layer is peeled off: 〇,
The entire surface peels off: △,
The whole peels off from the substrate interface: ×
耐酸性：
試験片を、０．３質量％の硝酸水溶液に１０分浸漬した。その後、上記密着性の評価と同様にして、耐酸性を評価した。
全く剥がれない：◎、
表層の一部が剥がれる：〇、
表層全体がはがれる：△、
全体が基材界面から剥がれる：×Acid resistance:
The test piece was immersed in a 0.3% by mass nitric acid aqueous solution for 10 minutes. Thereafter, the acid resistance was evaluated in the same manner as the evaluation of adhesion.
Not peeled at all: ◎,
Part of the surface layer is peeled off: 〇,
The entire surface peels off: △,
The whole peels off from the substrate interface: ×
解像性：
（実施例１〜３、実施例８〜９、参考例１、比較例１、２の試験片の作製）
ガラス基材上に、評価用の各導電性組成物を２００メッシュのポリエステルスクリーンを用いて全面に塗布し、次いで、熱風循環式乾燥炉にて８０℃で２０分間乾燥して指触乾燥性の良好な塗膜を形成した。その後、光源としてメタルハライドランプを用いて、ライン幅４０μｍおよび２０μｍのネガマスクを用いて、組成物上の積算光量が３００ｍＪ／ｃｍ２となるように露光した後、液温３０℃の０．４ｗｔ％Ｎａ２ＣＯ３水溶液を用いて現像時間を１０秒または２０秒として現像を行い、水洗を経て、エアーナイフで乾燥した。その後、５８０〜６００℃で３０分間焼成した。
試験片について、４０μｍラインおよび２０μｍラインの形成の可否を観察し、最小ライン幅を選んだ。なお、比較例２については、耐酸性が得られなかったため、評価しなかった。
Resolution:
(Production of test pieces of Examples 1 to 3, Examples 8 to 9, Reference Example 1, and Comparative Examples 1 and 2)
Each conductive composition for evaluation was applied on the entire surface of a glass substrate using a 200-mesh polyester screen, and then dried at 80 ° C. for 20 minutes in a hot-air circulating drying oven to provide a touch-drying property. A good coating film was formed. Thereafter, using a metal halide lamp as a light source and using a negative mask having a line width of 40 μm and 20 μm, exposure was performed so that the integrated light amount on the composition was 300 mJ / cm 2, and then 0.4 wt% Na at a liquid temperature of 30 ° C. Development was performed using a 2 CO 3 aqueous solution at a development time of 10 seconds or 20 seconds, washed with water, and dried with an air knife. Then, it baked for 30 minutes at 580-600 degreeC.
Regarding the test piece, whether or not a 40 μm line and a 20 μm line could be formed was observed, and the minimum line width was selected. Comparative Example 2 was not evaluated because acid resistance was not obtained.
（実施例１１、１２）
上記実施例と同様にして下記表４に記載のように各成分を配合して感光性導電性樹脂組成物を作製し、評価した。得られた結果を下記表５に示す。(Examples 11 and 12)
In the same manner as in the above examples, each component was blended as shown in Table 4 below to prepare and evaluate a photosensitive conductive resin composition. The obtained results are shown in Table 5 below.
※２：ビスフェノールＦ型エポキシアクリレートのカルボン酸変性カルボキシル基含有樹脂、熱分解終了温度＝５９２℃
※３：アミノアセトフェノン系光重合開始剤
※４：３官能ＥＯ変性トリメチロールプロパントリアクリレート
※５：ポリエステルアクリレート
※６：軟化点５１５℃、有機溶剤と揺変剤混合
※７：軟化点５９５℃、有機溶剤と揺変剤混合
* 3: Aminoacetophenone photopolymerization initiator * 4: Trifunctional EO-modified trimethylolpropane triacrylate * 5: Polyester acrylate * 6: Softening point 515 ° C, organic solvent and thixotropic agent mixture * 7: Softening point 595 ° C, Mixing organic solvent and thixotropic agent
（実施例１３，１４）
上記実施例と同様にして下記表６に記載のように各成分を配合して感光性導電性組成物を作製し、評価した。得られた結果を下記表７に示す。(Examples 13 and 14)
In the same manner as in the above Examples, each component was blended as shown in Table 6 below, and a photosensitive conductive composition was prepared and evaluated. The obtained results are shown in Table 7 below.
※２：ビスフェノールＦ型エポキシアクリレートのカルボン酸変性カルボキシル基含有樹脂、熱分解終了温度＝５９２℃
※３：軟化点５１５℃、有機溶剤と揺変剤混合
※４：アミノアセトフェノン系光重合開始剤
※５：３官能ＥＯ変性トリメチロールプロパントリアクリレート
※６：ポリエステルアクリレート
※７：炭化水素芳香族系溶剤
* 3: Softening point 515 ° C, organic solvent and thixotropic agent mixture * 4: Aminoacetophenone photopolymerization initiator * 5: Trifunctional EO-modified trimethylolpropane triacrylate * 6: Polyester acrylate * 7: Hydrocarbon aromatic solvent
（各ライン幅における抵抗値の測定方法）
（実施例１５）
ガラス基材上に、実施例３の導電性組成物を２００メッシュのポリエステルスクリーンを用いて全面に塗布し、次いで、熱風循環式乾燥炉にて８０℃で２０分間乾燥して指触乾燥性の良好な塗膜を形成した。その後、光源としてメタルハライドランプを用いて、ライン幅７０、８０、９０、１００、１１０、１２０μｍのネガマスクを用いて、組成物上の積算光量が３００ｍＪ／ｃｍ２となるように露光した後、液温３０℃の０．４ｗｔ％Ｎａ２ＣＯ３水溶液を用いて現像時間を１０秒または２０秒として現像を行い、水洗を経て、エアーナイフで乾燥した。その後、６００℃で３０分間焼成した。
各ライン幅のパターンにおいて、長さ１００ｃｍの抵抗値を測定した。その時の抵抗値を下記実施例１６〜１９の抵抗値と併せて図２に示す。
（実施例１６）
実施例３の組成に、組成物全体量の３％となるようにガラスフリットＡ（軟化点５１５℃、有機溶剤と揺変剤混合）を配合して導電性組成物を調製した以外は、実施例１５と同様とした。
（実施例１７）
ガラスフリットＡの含有量を組成物全体量の７％とした以外は、実施例１６と同様とした。
（実施例１８）
実施例３の組成に、組成物全体量の３％となるようにガラスフリットＢ（軟化点５９５℃、有機溶剤と揺変剤混合）を配合して導電性組成物を調製した以外は、実施例１５と同様とした。
（実施例１９）
ガラスフリットＢの含有量を組成物全体量の７％とした以外は、実施例１８と同様とした。(Measurement method of resistance value in each line width)
(Example 15)
On the glass substrate, the conductive composition of Example 3 was applied to the entire surface using a 200-mesh polyester screen, and then dried at 80 ° C. for 20 minutes in a hot-air circulating drying oven to provide a touch-drying property. A good coating film was formed. Then, using a metal halide lamp as a light source, using a negative mask with a line width of 70, 80, 90, 100, 110, and 120 μm, exposure was performed so that the integrated light amount on the composition was 300 mJ / cm 2, and then the liquid temperature Development was performed using a 0.4 wt% Na 2 CO 3 aqueous solution at 30 ° C. with a development time of 10 seconds or 20 seconds, washed with water, and dried with an air knife. Then, it baked for 30 minutes at 600 degreeC.
In each line width pattern, a resistance value of 100 cm in length was measured. The resistance value at that time is shown in FIG. 2 together with the resistance values of Examples 16 to 19 below.
(Example 16)
Except that the composition of Example 3 was mixed with glass frit A (softening point 515 ° C., mixed with organic solvent and thixotropic agent) so as to be 3% of the total amount of the composition, and the conductive composition was prepared. Same as Example 15.
(Example 17)
Example 16 was the same as Example 16 except that the content of the glass frit A was 7% of the total amount of the composition.
(Example 18)
Except that the composition of Example 3 was mixed with glass frit B (softening point 595 ° C., mixed with organic solvent and thixotropic agent) so as to be 3% of the total amount of the composition, and the conductive composition was prepared. Same as Example 15.
(Example 19)
Example 18 was the same as Example 18 except that the content of the glass frit B was 7% of the total amount of the composition.
（比較例３）
実施例３に代えて比較例１の導電性組成物を用いたことを除き、実施例１５と同様に抵抗値を測定した。抵抗値を下記比較例４〜７の抵抗値と併せて図３に示す。
（比較例４）
比較例１の組成に、組成物全体量の３％となるようにガラスフリットＡ（軟化点５１５℃、有機溶剤と揺変剤混合）を配合して導電性組成物を調製した以外は、比較例３と同様とした。
（比較例５）
ガラスフリットＡの含有量を組成物全体量の６％とした以外は、比較例４と同様とした。
（比較例６）
比較例１の組成に、組成物全体量の３％となるようにガラスフリットＢ（軟化点５９５℃、有機溶剤と揺変剤混合）を配合して導電性組成物を調製した以外は、比較例３と同様とした。
（比較例７）
ガラスフリットＢの含有量を組成物全体量の６％とした以外は、比較例６と同様とした。(Comparative Example 3)
The resistance value was measured in the same manner as in Example 15 except that the conductive composition of Comparative Example 1 was used instead of Example 3. The resistance values are shown in FIG. 3 together with the resistance values of Comparative Examples 4 to 7 below.
(Comparative Example 4)
Comparative Example 1 except that the composition of Comparative Example 1 was mixed with glass frit A (softening point 515 ° C., mixed with organic solvent and thixotropic agent) so as to be 3% of the total amount of the composition. Same as Example 3.
(Comparative Example 5)
It was the same as Comparative Example 4 except that the content of glass frit A was 6% of the total amount of the composition.
(Comparative Example 6)
Comparative Example 1 except that the composition of Comparative Example 1 was mixed with glass frit B (softening point 595 ° C., mixed with organic solvent and thixotropic agent) so as to be 3% of the total amount of the composition. Same as Example 3.
(Comparative Example 7)
It was the same as Comparative Example 6 except that the content of glass frit B was 6% of the total amount of the composition.
（比較例８〜１０、実施例２０〜２２）
上記実施例と同様にして下記表８に記載のように各成分を配合して感光性導電性樹脂組成物を作製し、上記実施例１５と同様にライン幅のパターンを形成した試験片を用いて耐酸性を評価した。得られた結果を下記表９に示す。なお、ガラスフリットの配合量のカッコ内の数値は、組成物全体に対する質量％である。(Comparative Examples 8-10, Examples 20-22)
In the same manner as in the above example, each component was blended as shown in Table 8 below to prepare a photosensitive conductive resin composition, and a test piece on which a line width pattern was formed in the same manner as in the above example 15 was used. The acid resistance was evaluated. The obtained results are shown in Table 9 below. In addition, the numerical value in the parenthesis of the blending amount of the glass frit is mass% with respect to the whole composition.
※２：平均粒径２．５μｍ
※３：ビスフェノールＦ型エポキシアクリレートのカルボン酸変性カルボキシル基含有樹脂、熱分解終了温度＝５９２℃
※４：メタクリレートとＢＧメタクリレートの共重合にＨＨＰＡ付加（ヘキサヒドロフタル酸無水物）したカルボキシル基含有樹脂、熱分解終了温度＝４７４℃
※５：アミノアセトフェノン系光重合開始剤
※６：３官能ＥＯ変性トリメチロールプロパントリアクリレート
※７：ポリエステルアクリレート
※８：軟化点５１５℃、有機溶剤と揺変剤混合
※９：軟化点５９５℃、有機溶剤と揺変剤混合
* 3: Carboxylic acid-modified carboxyl group-containing resin of bisphenol F type epoxy acrylate, thermal decomposition end temperature = 592 ° C.
* 4: Carboxyl group-containing resin obtained by adding HHPA (hexahydrophthalic anhydride) to the copolymerization of methacrylate and BG methacrylate, thermal decomposition end temperature = 474 ° C
* 5: Aminoacetophenone photopolymerization initiator * 6: Trifunctional EO-modified trimethylolpropane triacrylate * 7: Polyester acrylate * 8: Softening point 515 ° C, organic solvent and thixotropic agent mixture * 9: Softening point 595 ° C, Mixing organic solvent and thixotropic agent
Claims (6)
（Ｂ）熱分解終了点が５００〜６５０℃の範囲内である樹脂と、
を含有し、５８０℃〜６００℃、１０〜３０分間の焼成条件において残炭が生じることを特徴とする導電性組成物。 (A) aluminum particles produced by a nitrogen gas atomization method;
(B) a resin having a thermal decomposition end point in the range of 500 to 650 ° C .;
And a charcoal is produced under firing conditions of 580 ° C. to 600 ° C. for 10 to 30 minutes .
A touch panel comprising the electrode according to claim 4.
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| JP2012232903 | 2012-10-22 | ||
| JP2012232903 | 2012-10-22 | ||
| PCT/JP2013/077317 WO2014065112A1 (en) | 2012-10-22 | 2013-10-08 | Conductive composition, electrode, plasma display panel and touch panel |
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| JP2011064864A (en) * | 2009-09-16 | 2011-03-31 | Jsr Corp | Photosensitive composition, method of forming pattern, and method of manufacturing electrode for fpd |
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