JP6322255B2 - ウェーハ保持装置及びウェーハ処理装置 - Google Patents
ウェーハ保持装置及びウェーハ処理装置 Download PDFInfo
- Publication number
- JP6322255B2 JP6322255B2 JP2016207021A JP2016207021A JP6322255B2 JP 6322255 B2 JP6322255 B2 JP 6322255B2 JP 2016207021 A JP2016207021 A JP 2016207021A JP 2016207021 A JP2016207021 A JP 2016207021A JP 6322255 B2 JP6322255 B2 JP 6322255B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- clamp
- follower
- processing apparatus
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000007246 mechanism Effects 0.000 claims description 26
- 230000005540 biological transmission Effects 0.000 claims description 23
- 238000004140 cleaning Methods 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 143
- 239000007788 liquid Substances 0.000 description 16
- 239000000126 substance Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000008155 medical solution Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
尚、保持されて、処理されるウェーハについては、特に限定されないが、例えば、シリコンウェーハ、SiCウェーハ、GaNウェーハ、石英基板等が挙げられる。
図1に示すような、本発明のウェーハ保持装置を備えたスピン洗浄処理装置を用いて、100枚の直径300mmのシリコンウェーハを、枚葉式で混酸を用いてスピン洗浄した。
図6のような従来のウェーハ保持装置を備えたスピン洗浄処理装置を用いたこと以外、実施例と同様な条件で100枚のシリコンウェーハを、枚葉式でスピン洗浄した。
4…テーブル、 5…クランプピン、 7…動力伝達ギア、 8…クランプ駆動ギア、
9…テーブル支持軸、
11…クランプ従動部、 12…従動側の磁石、 13…クランプ駆動部、
14…駆動側の磁石、
20…制動機構、 21…穴、 22…制動ピン、 23…突き上げピン、
24…シリンダー、
30…ウェーハ処理装置、 31…チャンバ、 32…ノズル、
W…ウェーハ。
Claims (4)
- ウェーハを水平に保持し、該保持したウェーハを回転させることが可能なウェーハ保持装置であって、
上方に前記ウェーハを保持する上テーブルと該上テーブルを下方から支持するテーブル本体とから成るテーブルと、
前記上テーブルの上面に前記ウェーハを囲繞するように配置され、前記ウェーハの側面に接触して、前記ウェーハを側面から保持することが可能な複数のクランプピンと、
前記テーブルを下方から支持し、前記テーブルを回転させることが可能なテーブル支持軸と、を具備し、
前記クランプピンが、前記上テーブルの内部に格納され、内部に磁石が収納された回転可能なクランプ従動部上に、その回転軸に対して偏心して立設されており、
前記クランプ従動部は、前記テーブル本体内の前記クランプ従動部の下方に対応する位置に前記クランプ従動部に非接触で格納され、内部に磁石が収納されたクランプ駆動部の回転に従い、磁石間の引力によって追従して回転するものであり、
前記クランプ従動部が前記クランプ駆動部の回転に追従して回転することで、前記クランプ従動部に偏心して立設された複数のクランプピンが前記ウェーハの側面に接触するように前記クランプ従動部の回転軸周りに公転移動して、前記ウェーハを側面から保持可能なものであり、
さらに、前記テーブル内に前記クランプ駆動部の回転を制動することが可能な制動機構を具備し、
前記クランプ駆動部が、前記テーブル本体内に配設された動力伝達ギアに噛合するクランプ駆動ギアを有し、前記動力伝達ギアの回転によって前記クランプ駆動ギアが回転し、前記クランプ駆動部が回転するものであり、
前記動力伝達ギアが穴を有し、前記制動機構が、前記動力伝達ギアの穴に制動ピンが嵌まることで、前記動力伝達ギアを固定し、前記クランプ駆動部の回転を制動することが可能なものであり、
さらに、前記制動ピンを前記動力伝達ギアの穴の下方から突き上げることで穴から外すことが可能な突き上げピンを有し、該突き上げピンによって、前記ウェーハのクランプ及びアンクランプ時に、前記制動ピンを前記動力伝達ギアの穴から外すことで、前記クランプピンの固定を解除することが可能なものであることを特徴とするウェーハ保持装置。 - 請求項1に記載のウェーハ保持装置の前記テーブルが内部に収容されたチャンバを具備するものであることを特徴とするウェーハ処理装置。
- 前記ウェーハ処理装置は、枚葉スピン式のウェット処理装置であることを特徴とする請求項2に記載のウェーハ処理装置。
- 前記ウェーハ処理装置は、ウェーハの洗浄処理装置、スピンエッチング処理装置、スピンコート処理装置、レジスト剥離処理装置、ポリマー除去処理装置のいずれかのものであることを特徴とする請求項2又は請求項3に記載のウェーハ処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016207021A JP6322255B2 (ja) | 2016-10-21 | 2016-10-21 | ウェーハ保持装置及びウェーハ処理装置 |
KR1020170135837A KR20180044204A (ko) | 2016-10-21 | 2017-10-19 | 웨이퍼유지장치 및 웨이퍼처리장치 |
CN201710974346.5A CN107978551A (zh) | 2016-10-21 | 2017-10-19 | 晶圆支承装置以及晶圆处理装置 |
TW106135802A TW201826439A (zh) | 2016-10-21 | 2017-10-19 | 晶圓支承裝置以及晶圓處理裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016207021A JP6322255B2 (ja) | 2016-10-21 | 2016-10-21 | ウェーハ保持装置及びウェーハ処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018067683A JP2018067683A (ja) | 2018-04-26 |
JP6322255B2 true JP6322255B2 (ja) | 2018-05-09 |
Family
ID=62012499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016207021A Active JP6322255B2 (ja) | 2016-10-21 | 2016-10-21 | ウェーハ保持装置及びウェーハ処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6322255B2 (ja) |
KR (1) | KR20180044204A (ja) |
CN (1) | CN107978551A (ja) |
TW (1) | TW201826439A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102649391B1 (ko) * | 2019-05-20 | 2024-03-22 | 주식회사 제우스 | 기판처리장치 |
JP7370201B2 (ja) * | 2019-09-20 | 2023-10-27 | 株式会社Screenホールディングス | 基板処理装置 |
CN114290563A (zh) * | 2021-12-15 | 2022-04-08 | 江士英 | 一种应用于塑料薄膜制造的原料处理工艺 |
CN114653660B (zh) * | 2022-05-20 | 2022-09-16 | 智程半导体设备科技(昆山)有限公司 | 一种磁性夹块及半导体基材清洗装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3695772B2 (ja) * | 1994-03-31 | 2005-09-14 | エム・セテック株式会社 | ドライスクラバ |
JPH11233474A (ja) * | 1997-10-22 | 1999-08-27 | Hitachi Ltd | 板状部品の流体処理装置 |
JP2001250859A (ja) * | 2000-03-03 | 2001-09-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2002367947A (ja) * | 2001-06-08 | 2002-12-20 | Rix Corp | ウエーハのフラックスおよび異物洗浄方法および装置 |
JP3956350B2 (ja) * | 2002-03-25 | 2007-08-08 | 東京エレクトロン株式会社 | 位置決め機能を有する基板処理装置及び位置決め機能を有する基板処理方法 |
JP2010073825A (ja) * | 2008-09-17 | 2010-04-02 | Realize Advanced Technology Ltd | ウェハステージ |
TWI591757B (zh) * | 2009-03-31 | 2017-07-11 | 蘭研究公司 | 用以處理盤狀物品的裝置 |
US9147593B2 (en) * | 2012-10-10 | 2015-09-29 | Lam Research Ag | Apparatus for liquid treatment of wafer shaped articles |
JP6400977B2 (ja) * | 2013-09-25 | 2018-10-03 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
-
2016
- 2016-10-21 JP JP2016207021A patent/JP6322255B2/ja active Active
-
2017
- 2017-10-19 KR KR1020170135837A patent/KR20180044204A/ko unknown
- 2017-10-19 CN CN201710974346.5A patent/CN107978551A/zh active Pending
- 2017-10-19 TW TW106135802A patent/TW201826439A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW201826439A (zh) | 2018-07-16 |
KR20180044204A (ko) | 2018-05-02 |
JP2018067683A (ja) | 2018-04-26 |
CN107978551A (zh) | 2018-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6322255B2 (ja) | ウェーハ保持装置及びウェーハ処理装置 | |
KR101017654B1 (ko) | 기판 척킹 부재, 이를 갖는 기판 처리 장치 및 이를 이용한기판 처리 방법 | |
US10854479B2 (en) | Substrate processing method and substrate processing device | |
CN100517633C (zh) | 旋转头及使用该旋转头的基底处理方法 | |
KR20100044912A (ko) | 판 형상 물체 습식 처리 장치 | |
JP2011093054A (ja) | シーミングスピンドルからのスリーブ取り外し装置 | |
JPH1059540A (ja) | 基板把持装置 | |
JP6322256B2 (ja) | ウェーハ保持装置及びウェーハ処理装置 | |
KR100952035B1 (ko) | 매엽식 기판처리장치의 스핀척 장치 및 척핀 작동 방법 | |
CN114649233A (zh) | 晶圆清洗装置及清洗晶圆的方法 | |
KR101099733B1 (ko) | 기판 처리 장치 | |
JP4112996B2 (ja) | 基板処理装置 | |
KR20010054424A (ko) | 웨이퍼를 스피닝하기 위한 웨이퍼 척 | |
KR100855737B1 (ko) | 웨이퍼 스핀 척 | |
JP2009105145A (ja) | 基板処理装置 | |
JP3962717B2 (ja) | 円筒研削盤用ワークドライブ装置 | |
KR20100048407A (ko) | 기판 지지 부재 및 이를 구비하는 기판 처리 장치 | |
KR102637363B1 (ko) | 매엽식 세정장치의 기판 고정용 클램핑 장치 | |
KR102647933B1 (ko) | 매엽식 세정장치용 스핀척 장치 | |
CN110323159B (zh) | 基板处理装置 | |
WO2023120016A1 (ja) | 半導体ウェーハの洗浄方法および半導体ウェーハの製造方法 | |
JP2011086659A (ja) | スピン洗浄装置 | |
JP5184209B2 (ja) | ウェハ搬送装置とウェハ保持装置とを備えた装置 | |
JPH02209731A (ja) | スピンナー装置 | |
WO2020129483A1 (ja) | 基板処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180124 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180313 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180406 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6322255 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |