JP6319762B2 - 光電気混載基板およびその製法 - Google Patents
光電気混載基板およびその製法 Download PDFInfo
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- JP6319762B2 JP6319762B2 JP2013227369A JP2013227369A JP6319762B2 JP 6319762 B2 JP6319762 B2 JP 6319762B2 JP 2013227369 A JP2013227369 A JP 2013227369A JP 2013227369 A JP2013227369 A JP 2013227369A JP 6319762 B2 JP6319762 B2 JP 6319762B2
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Images
Classifications
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- G—PHYSICS
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
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- G—PHYSICS
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- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
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- G—PHYSICS
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
図1に示す構成の光電気混載基板を、前記の製法の記載にしたがって作製した。なお、帯状に延びる基板21の一方側に、発光素子として、ULM社製のULM850−10−TT−C0104Uを実装し、反対側に、受光素子として、Albis optoelectronics 社製のPDCA04−70−GSを実装した。そして、補強層25を接合する際の加熱温度は160℃とし、プレス圧力は3MPaとした。
図7に示す、従来の光電気混載基板を、前記の製法の記載にしたがって作製した。ただし、各部材の材質や厚み等については、上記実施例1の構成にしたがった。なお、補強層13の基板1への接合は、両面テープ(日東電工社製、No.5601)を用い、これを人の手で基板1に貼り付けた。
上記実施例1品と比較例1品の、補強層25、13の接合強度を評価するために、そのピール強度を、今田製作所社製の引張圧縮試験機(SV−52NA−2L)を用いて測定した。その結果、実施例1品のピール強度は1.3N/mmであり、比較例1品のピール強度は0.3N/mmであった。したがって、実施例1品の方がはるかに優れた接合強度であることがわかる。
上記実施例1品は、全体厚みのうち最大厚みが0.9mmであるのに対し、比較例1品の最大厚みは、1.1mmであり、実施例1品の方が薄く、省スペース化への要求に応えるものであることがわかる。
22 電気配線
24 光素子
25 補強層
26 接着層
36 コネクタパッド部
W 光導波路
Claims (6)
- 基板の一方の面に、電気配線と、この電気配線に電気接続される光素子とが設けられ、上記基板の他方の面に、上記光素子と光結合される光導波路が設けられた光電気混載基板であって、上記基板の、電気配線と光素子とが設けられた面に、基板を補強するための補強層が、接着層を介して一体的に取り付けられているとともに、上記基板の、光導波路が設けられた面に、上記電気配線を外部に電気接続するためのコネクタパッド部が設けられていることを特徴とする光電気混載基板。
- 上記補強層が、接着層を介して基板面に一体的に取り付けられる部分と、光素子側に延びて光素子上面を覆うカバー部分とを備えている請求項1記載の光電気混載基板。
- 上記光素子が、電気配線の所定部分に、超音波フリップチップ接合により実装されている請求項1または2記載の光電気混載基板。
- 請求項1記載の光電気混載基板を製造する方法であって、基板の一方の面に電気配線を形成する工程と、上記基板の他方の面に、上記電気配線を外部に電気接続するためのコネクタパッド部を形成する工程と、上記基板の他方の面に光導波路を形成する工程とを備え、上記電気配線とコネクタパッド部と光導波路とが設けられた基板の、電気配線が設けられた面に、基板を補強するための補強層を、接着層を介して加圧下で取り付けた後、上記基板の電気配線部分に光素子を実装することを特徴とする光電気混載基板の製法。
- 請求項1または2記載の光電気混載基板を製造する方法であって、基板の一方の面に電気配線を形成する工程と、上記基板の他方の面に、上記電気配線を外部に電気接続するためのコネクタパッド部を形成する工程と、上記基板の他方の面に光導波路を形成する工程とを備え、上記基板の電気配線部分に光素子を実装した後、上記電気配線とコネクタパッド部と光導波路とが設けられた基板の、電気配線が設けられた面に、基板を補強するための補強層を、接着層を介して加圧下で取り付けることを特徴とする光電気混載基板の製法。
- 上記光素子を、電気配線の所定部分に、超音波フリップチップ接合によって実装するようにした請求項4または5記載の光電気混載基板の製法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013227369A JP6319762B2 (ja) | 2013-10-31 | 2013-10-31 | 光電気混載基板およびその製法 |
US15/029,016 US9632263B2 (en) | 2013-10-31 | 2014-09-11 | Opto-electric hybrid board and method of manufacturing same |
KR1020167009589A KR102267523B1 (ko) | 2013-10-31 | 2014-09-11 | 광전기 혼재 기판 및 그 제법 |
TW103131379A TWI629522B (zh) | 2013-10-31 | 2014-09-11 | Photoelectric hybrid substrate and preparation method thereof |
EP14857140.9A EP3048462A1 (en) | 2013-10-31 | 2014-09-11 | Opto-electric hybrid board and method for manufacturing same |
PCT/JP2014/074027 WO2015064225A1 (ja) | 2013-10-31 | 2014-09-11 | 光電気混載基板およびその製法 |
CN201480056198.3A CN105637395B (zh) | 2013-10-31 | 2014-09-11 | 光电混载基板和其制造方法 |
Applications Claiming Priority (1)
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EP (1) | EP3048462A1 (ja) |
JP (1) | JP6319762B2 (ja) |
KR (1) | KR102267523B1 (ja) |
CN (1) | CN105637395B (ja) |
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US8401399B2 (en) | 2009-05-28 | 2013-03-19 | Freedom Photonics, Llc. | Chip-based advanced modulation format transmitter |
US9344196B1 (en) | 2009-05-28 | 2016-05-17 | Freedom Photonics, Llc. | Integrated interferometric optical transmitter |
US10320152B2 (en) | 2017-03-28 | 2019-06-11 | Freedom Photonics Llc | Tunable laser |
JP6941460B2 (ja) * | 2017-03-31 | 2021-09-29 | 日東電工株式会社 | 光電気混載基板および光電気混載基板アセンブリ |
US10497846B2 (en) * | 2017-07-11 | 2019-12-03 | Lg Innotek Co., Ltd. | Light emitting device package |
KR20190009515A (ko) * | 2017-07-19 | 2019-01-29 | 삼성전자주식회사 | 반도체 장치 |
KR102671977B1 (ko) * | 2019-04-08 | 2024-06-05 | 삼성전기주식회사 | 인쇄회로기판 |
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US6935792B2 (en) * | 2002-10-21 | 2005-08-30 | General Electric Company | Optoelectronic package and fabrication method |
JP2004294857A (ja) * | 2003-03-27 | 2004-10-21 | Fujitsu Ltd | 光結合器及び光素子内蔵基板 |
JP2007201108A (ja) * | 2006-01-25 | 2007-08-09 | Sharp Corp | 電子部品接合装置および電子部品接合方法 |
WO2008035466A1 (fr) * | 2006-09-21 | 2008-03-27 | Hitachi Chemical Co., Ltd. | Substrat de guide d'ondes optique et substrat supportant un circuit hybride photoélectrique |
JP4404141B2 (ja) * | 2008-01-07 | 2010-01-27 | オムロン株式会社 | 光伝送モジュールの基板を補強する補強部品を備えた光伝送モジュールおよび該光伝送モジュールを備えた電子機器 |
JP4934070B2 (ja) * | 2008-01-24 | 2012-05-16 | 日東電工株式会社 | 光電気混載基板の製造方法 |
JP5106348B2 (ja) * | 2008-10-28 | 2012-12-26 | 日東電工株式会社 | 光電気混載モジュールの製造方法およびそれによって得られた光電気混載モジュール |
JP5277874B2 (ja) * | 2008-11-05 | 2013-08-28 | 住友ベークライト株式会社 | 光電気混載基板および電子機器 |
JP2010286777A (ja) * | 2009-06-15 | 2010-12-24 | Toshiba Corp | 光電気配線フィルム及び光電気配線モジュール |
JP5493626B2 (ja) * | 2009-09-15 | 2014-05-14 | 住友ベークライト株式会社 | 光電気混載基板および電子機器 |
JP2012042731A (ja) * | 2010-08-19 | 2012-03-01 | Toshiba Corp | フレキシブル光電配線板及びフレキシブル光電配線モジュール |
CN103119486A (zh) * | 2010-10-01 | 2013-05-22 | 住友电木株式会社 | 光波导、光波导的制造方法、光波导模块、光波导模块的制造方法以及电子设备 |
JP5692581B2 (ja) * | 2011-02-07 | 2015-04-01 | 日立金属株式会社 | 光電変換モジュール、及び、光電変換モジュールの製造方法 |
JP5522076B2 (ja) * | 2011-02-16 | 2014-06-18 | 日立金属株式会社 | フレキシブルフラット光ケーブル |
JP5840988B2 (ja) * | 2012-03-16 | 2016-01-06 | 日東電工株式会社 | 光電気混載基板およびその製法 |
JP5877749B2 (ja) * | 2012-03-29 | 2016-03-08 | 日東電工株式会社 | 光電気混載基板の製法 |
JP6202566B2 (ja) * | 2013-10-29 | 2017-09-27 | 日東電工株式会社 | 光電気混載基板およびその製法 |
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US9632263B2 (en) | 2017-04-25 |
US20160231520A1 (en) | 2016-08-11 |
TW201516501A (zh) | 2015-05-01 |
TWI629522B (zh) | 2018-07-11 |
JP2015087634A (ja) | 2015-05-07 |
KR102267523B1 (ko) | 2021-06-18 |
CN105637395B (zh) | 2019-03-29 |
WO2015064225A1 (ja) | 2015-05-07 |
EP3048462A1 (en) | 2016-07-27 |
CN105637395A (zh) | 2016-06-01 |
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