JP6308676B2 - リソグラフィ用ペリクル容器。 - Google Patents
リソグラフィ用ペリクル容器。 Download PDFInfo
- Publication number
- JP6308676B2 JP6308676B2 JP2014255838A JP2014255838A JP6308676B2 JP 6308676 B2 JP6308676 B2 JP 6308676B2 JP 2014255838 A JP2014255838 A JP 2014255838A JP 2014255838 A JP2014255838 A JP 2014255838A JP 6308676 B2 JP6308676 B2 JP 6308676B2
- Authority
- JP
- Japan
- Prior art keywords
- pellicle
- container
- flatness
- adhesive layer
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Packaging Frangible Articles (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Library & Information Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
実施例1では、図2に示すように、外形サイズが200mm角のポリカーボネート製ペリクル容器1を射出成型によって製作した。また、その中央には、150×116mm、厚み6.35mmの石英製平板7を設置して、ペリクル載置部6とした。この石英製平板7の平坦度は7μmであった。
実施例2でも、実施例1と同様のポリカーボネート製ペリクル容器を使用し、その中央には、同寸法の平坦度が10μの石英製平板7を設置して、ペリクル載置部6とした。この石英製平板7にセパレータ5を貼った粘着剤層4を載置してペリクルを一定期間保管した。その後、このペリクル容器1からペリクルを取り出して、粘着剤層4の表面の平坦度の変化を測定したところ、12μmであった。また、このペリクルを粘着剤層を介してマスクに貼り付けたところ、マスクに変形歪みは殆ど見られなかった。
比較例1では、図4に示すように、外形サイズが200mm角のポリカーボネート製ペリクル容器1を射出成型によって製作した。また、その中央のペリクル載置部6の凹凸を測定したところ、図6に示すように、最大約80μmの凹凸があり、平坦度は悪かった。
2 ペリクル膜
3 ペリクルフレーム
4 粘着剤層
5 セパレータ
6 ペリクル載置部
7 石英製平板
Claims (1)
- ペリクルフレームと、該ペリクルフレームの一の面に張設されたペリクル膜と、前記ペリクルフレームの前記ペリクル膜張設面と対向する他の面に塗布された粘着剤層とで構成されるペリクルを収納する短波長のエキシマレーザを用いるリソグラフィ用ペリクル容器であって、前記ペリクルを載置するペリクル載置部を有し、該ペリクル載置部に平坦度が10μm以下の石英製平板を設けたことを特徴とする短波長のエキシマレーザを用いるリソグラフィ用ペリクル容器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014255838A JP6308676B2 (ja) | 2014-12-18 | 2014-12-18 | リソグラフィ用ペリクル容器。 |
EP15197003.5A EP3043207B1 (en) | 2014-12-18 | 2015-11-30 | A container for storing a pellicle for lithography |
KR1020150175721A KR102619269B1 (ko) | 2014-12-18 | 2015-12-10 | 리소그래피용 펠리클 용기 |
TW104141613A TWI585517B (zh) | 2014-12-18 | 2015-12-11 | Dustproof film module containers for microfilm for incorporating dustproof film modules |
US14/969,226 US10634991B2 (en) | 2014-12-18 | 2015-12-15 | Container for storing a pellicle for lithography |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014255838A JP6308676B2 (ja) | 2014-12-18 | 2014-12-18 | リソグラフィ用ペリクル容器。 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016114905A JP2016114905A (ja) | 2016-06-23 |
JP6308676B2 true JP6308676B2 (ja) | 2018-04-11 |
Family
ID=54707701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014255838A Active JP6308676B2 (ja) | 2014-12-18 | 2014-12-18 | リソグラフィ用ペリクル容器。 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10634991B2 (ja) |
EP (1) | EP3043207B1 (ja) |
JP (1) | JP6308676B2 (ja) |
KR (1) | KR102619269B1 (ja) |
TW (1) | TWI585517B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102172217B1 (ko) | 2018-07-31 | 2020-10-30 | 주식회사 시엠테크놀로지 | 펠리클 수납용기 및 이를 이용한 파티클 제거 방법 |
KR102172218B1 (ko) | 2018-07-31 | 2020-10-30 | 주식회사 시엠테크놀로지 | 펠리클 수납용기 |
KR102172221B1 (ko) | 2018-07-31 | 2020-10-30 | 주식회사 시엠테크놀로지 | Dlc 코팅층을 구비한 펠리클 수납용기 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4511038A (en) * | 1984-01-30 | 1985-04-16 | Ekc Technology, Inc. | Container for masks and pellicles |
JPS63305359A (ja) * | 1987-06-05 | 1988-12-13 | Nec Yamagata Ltd | 半導体用ペリクル膜保管ケ−ス |
JP3200776B2 (ja) * | 1992-08-06 | 2001-08-20 | 大日本印刷株式会社 | 基板保持用ケース |
US5344677A (en) * | 1992-08-27 | 1994-09-06 | Hong Gilbert H | Photochemically stable deep ultraviolet pellicles for excimer lasers |
JP3404140B2 (ja) * | 1994-08-26 | 2003-05-06 | 三井化学株式会社 | マスク保護装置の収納ケース |
JP3143337B2 (ja) * | 1994-10-12 | 2001-03-07 | 信越ポリマー株式会社 | ペリクル収納容器 |
US6317479B1 (en) * | 1996-05-17 | 2001-11-13 | Canon Kabushiki Kaisha | X-ray mask, and exposure method and apparatus using the same |
US5820950A (en) * | 1996-10-30 | 1998-10-13 | Micro Lithography, Inc. | Optical pellicle and package |
JP2000019721A (ja) * | 1998-07-03 | 2000-01-21 | Canon Inc | レチクル容器、露光方法及びデバイス製造方法 |
US6264773B1 (en) * | 1998-09-01 | 2001-07-24 | Mark Damian Cerio | Apparatus and method for temporary and permanent attachment of pellicle frame to photomask substrate |
US6639650B2 (en) * | 1999-12-21 | 2003-10-28 | Shin-Etsu Chemical Co., Ltd. | Light exposure method, light exposure apparatus, pellicle and method for relieving warpage of pellicle membrane |
ATE296763T1 (de) * | 2000-04-26 | 2005-06-15 | Asahi Glass Co Ltd | Behälter mit gasundurchlässiger beschichtung für optischen gegenstand |
JP2003043670A (ja) * | 2001-07-30 | 2003-02-13 | Asahi Glass Co Ltd | ペリクル |
US7205074B2 (en) * | 2002-12-31 | 2007-04-17 | Intel Corporation | Venting of pellicle cavity for a mask |
US6834549B2 (en) * | 2003-04-03 | 2004-12-28 | Intel Corporation | Characterizing in-situ deformation of hard pellicle during fabrication and mounting with a sensor array |
JP2005265876A (ja) * | 2004-03-16 | 2005-09-29 | Renesas Technology Corp | 半導体装置の製造方法 |
JP4391435B2 (ja) * | 2005-03-22 | 2009-12-24 | 信越化学工業株式会社 | ペリクル収納容器 |
CN101321674B (zh) * | 2005-09-27 | 2010-10-13 | 诚实公司 | 掩模盒 |
JP2007128030A (ja) * | 2005-10-07 | 2007-05-24 | Shin Etsu Polymer Co Ltd | ペリクル用収納容器 |
JP4963041B2 (ja) * | 2006-06-16 | 2012-06-27 | 旭化成イーマテリアルズ株式会社 | ペリクル収納容器 |
JP2008083618A (ja) * | 2006-09-29 | 2008-04-10 | Asahi Kasei Electronics Co Ltd | ペリクル収納容器の補強材 |
JP2008215846A (ja) * | 2007-02-28 | 2008-09-18 | Denso Corp | 温度センサの取付構造 |
JP2008216846A (ja) * | 2007-03-07 | 2008-09-18 | Asahi Kasei Electronics Co Ltd | ペリクル収納容器 |
JP2008256925A (ja) * | 2007-04-04 | 2008-10-23 | Shin Etsu Chem Co Ltd | ペリクル |
JP4931717B2 (ja) * | 2007-07-19 | 2012-05-16 | 信越化学工業株式会社 | リソグラフィー用ペリクルの製造方法 |
JP5051840B2 (ja) * | 2007-11-22 | 2012-10-17 | 信越化学工業株式会社 | ペリクル収納容器内にペリクルを保管する方法 |
US7851109B2 (en) * | 2008-03-31 | 2010-12-14 | Intel Corporation | Low stress pellicle frames and reticle pellicle assemblies |
US8159654B2 (en) * | 2009-06-03 | 2012-04-17 | Matsushita Seiki Co., Ltd. | Pressure body and pellicle mounting apparatus |
KR101306352B1 (ko) * | 2009-10-07 | 2013-09-09 | 미쓰이 가가쿠 가부시키가이샤 | 펠리클 및 그의 마스크 접착제 |
JP5693836B2 (ja) * | 2009-10-09 | 2015-04-01 | 旭化成イーマテリアルズ株式会社 | ペリクル収納ケースの梱包体及びペリクル収納ケースの梱包方法 |
JP2011164259A (ja) * | 2010-02-08 | 2011-08-25 | Shin-Etsu Chemical Co Ltd | リソグラフィー用ペリクル |
JP5528190B2 (ja) * | 2010-04-23 | 2014-06-25 | 信越化学工業株式会社 | ペリクル収納容器 |
WO2012004951A1 (ja) * | 2010-07-09 | 2012-01-12 | 三井化学株式会社 | ペリクル及びそれに用いるマスク接着剤 |
JP2012093595A (ja) * | 2010-10-28 | 2012-05-17 | Shin Etsu Chem Co Ltd | ペリクルフレームおよびペリクル |
JP5478463B2 (ja) * | 2010-11-17 | 2014-04-23 | 信越化学工業株式会社 | リソグラフィー用ペリクル |
JP5411200B2 (ja) * | 2011-04-26 | 2014-02-12 | 信越化学工業株式会社 | リソグラフィ用ペリクル |
US8888086B2 (en) * | 2011-05-11 | 2014-11-18 | Sematech, Inc. | Apparatus with surface protector to inhibit contamination |
JP5638693B2 (ja) * | 2011-05-18 | 2014-12-10 | 旭化成イーマテリアルズ株式会社 | ペリクル、ペリクル付フォトマスク及び半導体素子の製造方法 |
JP2013109007A (ja) * | 2011-11-17 | 2013-06-06 | Toshiba Corp | フォトマスクの製造方法、半導体装置の製造方法及びプログラム |
JP5684752B2 (ja) * | 2012-03-29 | 2015-03-18 | 信越化学工業株式会社 | ペリクル収納容器 |
JP5984187B2 (ja) * | 2013-04-22 | 2016-09-06 | 信越化学工業株式会社 | ペリクルとフォトマスクのアセンブリ |
-
2014
- 2014-12-18 JP JP2014255838A patent/JP6308676B2/ja active Active
-
2015
- 2015-11-30 EP EP15197003.5A patent/EP3043207B1/en active Active
- 2015-12-10 KR KR1020150175721A patent/KR102619269B1/ko active IP Right Grant
- 2015-12-11 TW TW104141613A patent/TWI585517B/zh active
- 2015-12-15 US US14/969,226 patent/US10634991B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20160178998A1 (en) | 2016-06-23 |
EP3043207A1 (en) | 2016-07-13 |
KR20160074402A (ko) | 2016-06-28 |
EP3043207B1 (en) | 2017-02-15 |
TW201632987A (zh) | 2016-09-16 |
KR102619269B1 (ko) | 2023-12-28 |
US10634991B2 (en) | 2020-04-28 |
TWI585517B (zh) | 2017-06-01 |
JP2016114905A (ja) | 2016-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5189614B2 (ja) | ペリクル及びその取り付け方法、並びにペリクル付マスク及びマスク | |
TWI440970B (zh) | 光刻用防塵薄膜組件 | |
US7901841B2 (en) | Pellicle for photolithography | |
TWI411874B (zh) | 防塵薄膜組件 | |
JP5285185B2 (ja) | フォトマスクユニット及びその製造方法 | |
TWI815825B (zh) | 防護薄膜框架及防護薄膜組件 | |
JP2008256925A (ja) | ペリクル | |
TWI409581B (zh) | 防塵薄膜組件之製造方法、微影用防塵薄膜組件框架及微影用防塵薄膜組件 | |
JP2009025562A (ja) | ペリクルフレーム | |
JP6308676B2 (ja) | リソグラフィ用ペリクル容器。 | |
JP2011164259A (ja) | リソグラフィー用ペリクル | |
JP5822401B2 (ja) | リソグラフィ用ペリクル | |
JP5252984B2 (ja) | 半導体リソグラフィー用ペリクルおよびその製造方法 | |
JP2022010209A (ja) | ペリクル | |
JP2015001683A (ja) | 高平坦リソグラフィ用ペリクル | |
US8960928B2 (en) | Pellicle frame | |
JP2007293036A (ja) | リソグラフィー用ペリクル | |
JP6293045B2 (ja) | リソグラフィー用ペリクルの作製方法 | |
JP2021073536A (ja) | Euv用ペリクルフレームの通気構造、euv用ペリクル、euv用ペリクル付露光原版、露光方法、半導体の製造方法及び液晶ディスプレイの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20161128 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170830 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170906 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171031 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180312 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180312 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6308676 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |