JP6294360B2 - 光硬化性および熱硬化性を有する樹脂組成物およびドライフィルムソルダレジスト - Google Patents
光硬化性および熱硬化性を有する樹脂組成物およびドライフィルムソルダレジスト Download PDFInfo
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- JP6294360B2 JP6294360B2 JP2015560129A JP2015560129A JP6294360B2 JP 6294360 B2 JP6294360 B2 JP 6294360B2 JP 2015560129 A JP2015560129 A JP 2015560129A JP 2015560129 A JP2015560129 A JP 2015560129A JP 6294360 B2 JP6294360 B2 JP 6294360B2
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- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- KGGOIDKBHYYNIC-UHFFFAOYSA-N ditert-butyl 4-[3,4-bis(tert-butylperoxycarbonyl)benzoyl]benzene-1,2-dicarboperoxoate Chemical compound C1=C(C(=O)OOC(C)(C)C)C(C(=O)OOC(C)(C)C)=CC=C1C(=O)C1=CC=C(C(=O)OOC(C)(C)C)C(C(=O)OOC(C)(C)C)=C1 KGGOIDKBHYYNIC-UHFFFAOYSA-N 0.000 description 1
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- 125000000623 heterocyclic group Chemical group 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 235000019239 indanthrene blue RS Nutrition 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical compound C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- JAOPKYRWYXCGOQ-UHFFFAOYSA-N n,n-dimethyl-1-(4-methylphenyl)methanamine Chemical compound CN(C)CC1=CC=C(C)C=C1 JAOPKYRWYXCGOQ-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical class C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- TVRGPOFMYCMNRB-UHFFFAOYSA-N quinizarine green ss Chemical compound C1=CC(C)=CC=C1NC(C=1C(=O)C2=CC=CC=C2C(=O)C=11)=CC=C1NC1=CC=C(C)C=C1 TVRGPOFMYCMNRB-UHFFFAOYSA-N 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000001052 yellow pigment Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/062—Copolymers with monomers not covered by C09D133/06
- C09D133/068—Copolymers with monomers not covered by C09D133/06 containing glycidyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
- C08L2312/06—Crosslinking by radiation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
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- Chemical & Material Sciences (AREA)
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- Spectroscopy & Molecular Physics (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polymerisation Methods In General (AREA)
- Epoxy Resins (AREA)
Description
また、2−メチル−1−[4−(メチルチオ)フェニル]−2−モルフォリノプロパノン−1,2−ベンジル−2−ジメチルアミノ−1−(4−モルホリノフェニル)−ブタン−1−オン、2−(ジメチルアミノ)−2−[(4−メチルフェニル)メチル]−1−[4−(4−モルホリニル)フェニル]−1−ブタノン、N,N−ジメチルアミノアセトフェノン(市販品としてはチバスペシャルティケミカルズ社(現チバジャパン社)製のイルガキュア(登録商標)907、イルガキュア369、イルガキュア379など)などのε−アミノアセトフェノン類、2,4,6−トリメチルベンゾイルジフェニルホスフィンオキシド、ビス(2,4,6−トリメチルベンゾイル)−フェニルホスフィンオキシド、ビス(2,6−ジメトキシベンゾイル)−2,4,4−トリメチル−ペンチルホスフィンオキシド(市販品としては、BASF社製のルシリン(登録商標)TPO、チバスペシャルティケミカルズ社製のイルガキュア819など)などのアシルホスフィンオキシド類が好ましい光開始剤として言及され得る。
実施例1〜2および比較例1
下記表1に示された成分を混合して樹脂組成物を製造した。この時、酸変性オリゴマーとしては、クレゾールノボラック由来のエポキシ(メタ)アクリレート化合物およびビスフェノールF由来のエポキシ(メタ)アクリレート化合物を3:1の重量比で混合して用いた。
下記表2に示された成分を混合して樹脂組成物を製造した。この時、酸変性オリゴマーとしては、クレゾールノボラック由来のエポキシ(メタ)アクリレート化合物およびビスフェノールA由来のエポキシ(メタ)アクリレート化合物を3:1の重量比で混合して用いた。
実施例および比較例で製造したドライフィルムおよび印刷回路基板の物性を次の方法で測定した
三井金属社製の3EC−M3−VLP 12μmの銅薄積層板を横×縦=5cm×5cmの大きさに切断し、化学的エッチングで銅薄表面に微細粗度を形成した。前記実施例および比較例で製造されたドライフィルムの離型フィルムを除去した後、粗度が形成された銅薄積層板(基板)の上に前記フィルム層を真空ラミネータ(名機製作所製のMV LP−500)で真空積層した。
1:断面がストレート(straight)形状であり、フロアにフィルム残渣が残っていない
2:断面がストレート形状でなく、ホール形状内にアンダーカット(under cut)またはオーバーハング(overhang)が存在する
3:未現像状態と観察される
4:過現象でパターン形成が不可である
銅薄積層板(厚さ:0.1mm、銅薄厚さ:12μm、LG化学社製のLG−T−500GA)を横×縦=5cm×5cmの大きさに切断し、化学的エッチングで銅薄表面に微細粗度を形成した。前記実施例および比較例で製造されたドライフィルムの離型フィルムを除去した後、粗度が形成された銅薄積層板(基板)の上に前記フィルム層を真空ラミネータ(名機製作所製のMVLP−500)で真空積層した。
1:DFSRの剥離がなく、変色がない
2:DFSRの肉眼で観察される剥離/変色が発生し始める
3:DFSRの剥離/変色が激しく発生する
ILJIN MATERIALS社製のICS−25umの銅薄を横×縦=11cm×11cmの大きさに切断して質量を測定した後、実施例および比較例で製造されたドライフィルムを横×縦=10cm×10cmの大きさに切断して離型フィルム除去した後、PCT耐熱性測定サンプルと同様な方法で試片を製造し質量を測定した。
1)吸湿率(%)=(吸湿質量/サンプル質量)×100
2)吸湿質量=(恒温恒湿処理後の試片質量)−(恒温恒湿処理前の試片質量)
3)サンプル質量=(恒温恒湿処理前の試片質量)−(銅薄質量)
前記実験例2[耐酸性測定]と同様な方法で試片を製作し、11cm×11cmの大きさに切断した。硬度測定用鉛筆セット(Mitsu−Bishi)と鉛筆硬度測定器(CK商社製)を用い、100gの荷重下で一定の速度で前記試片が擦られる程度を測定した。前記鉛筆セットのB〜9Hの硬度を有する鉛筆を用いて塗膜が剥離されない鉛筆の硬度を確認した。
真空ラミネータ(名機製作所製のMVLP−500)を用いて実施例および比較例で製造されたドライフィルムをIPC規格Bパターンの櫛形電極が形成されたFR−4基板上に真空積層した。
12μmの銅薄積層板(三井金属社製の3EC−M3−VLP)横×縦=15cm×15cmの大きさに切断し、真空ラミネータ(名機製作所製のMVLP−500)を用いて実施例および比較例で製造されたドライフィルムを前記所定の大きさに準備された銅薄積層板に数回真空積層して約100μmの厚さになるようにした。
Claims (20)
- 酸変性オリゴマー、光重合性モノマー、熱硬化性バインダー樹脂、光開始剤、互いに異なる粒径を有する2種以上の球状アルミナ粒子、熱伝導性セラミック化合物で表面がコーティングされた炭素化合物および有機溶媒を含み、
前記熱伝導性セラミック化合物で表面がコーティングされた炭素化合物は、熱伝導性セラミック化合物0.5重量%〜20重量%と、炭素化合物80重量%〜99.5重量%とを含み、
前記熱伝導性セラミック化合物で表面がコーティングされた炭素化合物は、0.5μm〜4μmの平均粒径を有し、
酸変性オリゴマー5〜75重量%と、
光重合性モノマー1〜40重量%と、
熱硬化性バインダー樹脂0.5〜40重量%と、
光開始剤0.1〜20重量%と、
互いに異なる粒径を有する2種以上の球状アルミナ粒子1〜75重量%と、
熱伝導性セラミック化合物で表面がコーティングされた炭素化合物0.2重量%〜1.0重量%と、
有機溶媒1〜90重量%と、を含む、
光硬化性および熱硬化性を有する樹脂組成物。 - 前記球状アルミナ粒子のうちの少なくとも1種の粒径が0.1μm以下である、請求項1に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 前記球状アルミナ粒子のうちの少なくとも1種の粒径が0.2μm〜0.7μmである、請求項1に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 前記光硬化性および熱硬化性を有する樹脂組成物は、前記熱伝導性セラミック化合物で表面がコーティングされた炭素化合物を1.1重量%以下含む、請求項1に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 前記熱伝導性セラミック化合物は、アルミナ(Al2O3)、窒化ホウ素(BN)、窒化アルミニウム(AlN)、炭化ケイ素(SiC)、酸化マグネシウム(MgO)、酸化亜鉛(ZnO)および水酸化アルミニウム(Al(OH)3)からなる群より選択された1種以上を含む、請求項1に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 前記炭素化合物は、グラファイト、グラフェンおよび炭素ナノチューブからなる群より選択された1種以上を含む、請求項1に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 前記酸変性オリゴマーは、エポキシ(メタ)アクリレート系化合物を含む、請求項1に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 前記エポキシ(メタ)アクリレート系化合物は、5,000〜50,000の重量平均分子量を有する、請求項7に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 前記光重合性モノマーは、分子内に2個以上のビニル基を有する多官能化合物および分子内に2個以上の(メタ)アクリロイル基を有する多官能(メト)アクリレート化合物からなる群より選択された1種以上の化合物を含む、請求項1に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 前記光開始剤は、ベンゾイン系化合物、アセトフェノン系化合物、アントラキノン系化合物、チオキサントン化合物、ケタール化合物、ベンゾフェノン系化合物、α−アミノアセトフェノン化合物、アシルホスフィンオキシド化合物、オキシムエステル化合物、ビイミダゾール系化合物およびトリアジン系化合物からなる群より選択された1種以上を含む、請求項1に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 前記熱硬化性バインダー樹脂は、エポキシ基、オキセタニル基、環状エーテル基および環状チオエーテル基からなる群より選択される1種以上の官能基を含む、請求項1に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 前記熱硬化性バインダー樹脂は、2個以上のエポキシ基を有する多官能エポキシ樹脂、2個以上のオキセタニル基を有する多官能オキセタン樹脂および2個以上のチオエーテル基を有するエピスルフィド樹脂からなる群より選択された1種以上の樹脂を含む、請求項1に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 硫酸バリウム、チタン酸バリウム、無定形シリカ、結晶性シリカ、溶融シリカ、球状シリカ、タルク、クレー、炭酸マグネシウム、炭酸カルシウム、酸化アルミニウム、水酸化アルミニウムおよびマイカからなる群より選択された1種以上の無機フィラーをさらに含む、請求項1に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 前記互いに異なる粒径を有する2種以上の球状アルミナ粒子および無機フィラーの含有量の合計が前記有機溶媒を除いた固形分中の30重量%〜60重量%である、請求項13に記載の光硬化性および熱硬化性を有する樹脂組成物。
- 請求項1に記載の感光性樹脂組成物を用いて製造されるドライフィルムソルダレジスト。
- 前記感光性樹脂組成物の硬化物または乾燥物を含む、請求項15に記載のドライフィルムソルダレジスト。
- 印刷回路基板用保護フィルムとして用いられる、請求項15に記載のドライフィルムソルダレジスト。
- 10μm〜150μmの厚さを有し、1.10W/mK以上の熱伝導度を有する、請求項15に記載のドライフィルムソルダレジスト。
- 10.0×1011Ω以下の絶縁抵抗を有する、請求項18に記載のドライフィルムソルダレジスト。
- 請求項15に記載のドライフィルムソルダレジストを含む回路基板。
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