JP6271836B2 - 分散したパターンを有するマスクを介したレーザーアブレーションツール - Google Patents
分散したパターンを有するマスクを介したレーザーアブレーションツール Download PDFInfo
- Publication number
- JP6271836B2 JP6271836B2 JP2012529790A JP2012529790A JP6271836B2 JP 6271836 B2 JP6271836 B2 JP 6271836B2 JP 2012529790 A JP2012529790 A JP 2012529790A JP 2012529790 A JP2012529790 A JP 2012529790A JP 6271836 B2 JP6271836 B2 JP 6271836B2
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- JP
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- Prior art keywords
- mask
- substrate
- pattern
- openings
- dispersed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/18—Sheet panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
図1は、実質的に平坦な基材上にレーザーアブレーションを行うためのシステム10の図である。システム10は、レーザー光14を提供するレーザー12と、光学体16と、マスク18と、結像光学系20と、載物台24上の基材22とを含む。マスク18はレーザー光14をパターン化し、結像光学系20は、基材上の材料をアブレーションするために、パターン化された光線の焦点を基材22上に合わせる。載物台24は、典型的には、相互に直交するx方向及びy方向(当該方向は共にレーザー光14に対しても直角する)及びレーザー光14に対して平行なz方向に基材を、載物台24を介して移動させるx−y−zステージを実装する。したがって、x方向及びy方向への移動は、基材22全域にわたるアブレーションを可能にし、z方向への移動は、基材22の表面上へのマスクの像形成に焦点を合わせるのを支援することができる。
連続構造を生成するための1つのアプローチは、マスク内の1つのパターンの一末端を他の末端に接続させるマスクを作製することを含む。例えば、四角柱のアレイを生成するために、図3に示したように、構造の連続アレイが生成され得る。図3中のマスク42は、非透過区域46によって囲まれた透過区域44の連続アレイを含む。透過区域44によって形成されたパターンを繰り返し像形成する工程を通して基材のアブレーションが発生し、基材上に四角柱を生成する。しかしながら、このパターンがアブレーションされる場合に、マスク42の左端52及び上縁54が、右端56及び底縁58に合併する場所で、スティッチング効果が生じるであろう。
像形成パターンへの改善されたアプローチは、完成パターンの分散した部分を通して、スティッチングパターンをより広範囲にマスク上に分散させる。例えば、図3で用いられたマスクパターンが、図6で示したように分散させ得た。図6中のマスク68は、非透過区域72によって囲まれた透過区域70の連続アレイを含む。透過区域70によって形成されたパターンを繰り返し像形成する工程を通して基材のアブレーションが発生し、基材上に四角柱を生成する。マスク68は、種々の長さの構造から形成された底73及び右端75はもとより、左端69及び上縁71もまた含む。パターン内で種々の長さ構造を備えたこれら端部は、像形成したパターンの様々な領域内で合併し、分散したスティッチング線を使用して基材上に完成パターンを生成する。様々な領域内の合併構造は、共通するいくつかのオーバーラップ領域を有することができる。合併構造の分布は、スティッチング線が様々な位置で発生し、それらの分布を生じることを意味する。
Claims (1)
- 基材上へレーザー光を像形成するための、分散型パターンを有するマスクであって、
レーザー光を透過させる複数の開口と、前記開口の周囲の複数の非透過区域と、を備え、
前記複数の開口は、その全てを互いに組み合わせることで完成パターンの一部分としての分散部分を形成するようになる形状を、それぞれに有し、
前記複数の開口を透過したレーザー光が前記基材上に繰り返し像形成されるときに、1つの前記開口が形成する像と、他の1つの前記開口が形成する像とを、前記分散部分に対応する前記基材上の領域内で部分的に重なるように結合でき、それら前記開口の縁に対応する互いにずれたスティッチ線を含む前記完成パターンの像を、前記基材上に生成することができる、マスク。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/562,369 US20110070398A1 (en) | 2009-09-18 | 2009-09-18 | Laser ablation tooling via distributed patterned masks |
US12/562,369 | 2009-09-18 | ||
PCT/US2010/047475 WO2011034728A2 (en) | 2009-09-18 | 2010-09-01 | Laser ablation tooling via distributed patterned masks |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016092574A Division JP2016190270A (ja) | 2009-09-18 | 2016-05-02 | 分散したパターンを有するマスクを介したレーザーアブレーションツール |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013505136A JP2013505136A (ja) | 2013-02-14 |
JP2013505136A5 JP2013505136A5 (ja) | 2013-10-10 |
JP6271836B2 true JP6271836B2 (ja) | 2018-01-31 |
Family
ID=43756870
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012529790A Expired - Fee Related JP6271836B2 (ja) | 2009-09-18 | 2010-09-01 | 分散したパターンを有するマスクを介したレーザーアブレーションツール |
JP2016092574A Pending JP2016190270A (ja) | 2009-09-18 | 2016-05-02 | 分散したパターンを有するマスクを介したレーザーアブレーションツール |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016092574A Pending JP2016190270A (ja) | 2009-09-18 | 2016-05-02 | 分散したパターンを有するマスクを介したレーザーアブレーションツール |
Country Status (4)
Country | Link |
---|---|
US (2) | US20110070398A1 (ja) |
EP (1) | EP2478418A4 (ja) |
JP (2) | JP6271836B2 (ja) |
WO (1) | WO2011034728A2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110070398A1 (en) * | 2009-09-18 | 2011-03-24 | 3M Innovative Properties Company | Laser ablation tooling via distributed patterned masks |
CN104570611B (zh) * | 2013-10-21 | 2016-06-08 | 合肥京东方光电科技有限公司 | 掩膜板及其改善拼接曝光姆拉现象的方法 |
CN106163386B (zh) * | 2014-01-14 | 2019-08-06 | 火山公司 | 用于评估血液透析动静脉瘘管成熟的***和方法 |
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-
2009
- 2009-09-18 US US12/562,369 patent/US20110070398A1/en not_active Abandoned
-
2010
- 2010-09-01 WO PCT/US2010/047475 patent/WO2011034728A2/en active Application Filing
- 2010-09-01 EP EP10817660.3A patent/EP2478418A4/en not_active Withdrawn
- 2010-09-01 JP JP2012529790A patent/JP6271836B2/ja not_active Expired - Fee Related
-
2012
- 2012-09-13 US US13/613,427 patent/US20130003030A1/en not_active Abandoned
-
2016
- 2016-05-02 JP JP2016092574A patent/JP2016190270A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2011034728A3 (en) | 2011-07-14 |
JP2016190270A (ja) | 2016-11-10 |
EP2478418A4 (en) | 2017-10-18 |
US20110070398A1 (en) | 2011-03-24 |
JP2013505136A (ja) | 2013-02-14 |
WO2011034728A2 (en) | 2011-03-24 |
US20130003030A1 (en) | 2013-01-03 |
EP2478418A2 (en) | 2012-07-25 |
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