JP6250273B2 - 光起電力素子及びその製造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 239000004065 semiconductor Substances 0.000 claims description 239
- 239000000758 substrate Substances 0.000 claims description 141
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 129
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 94
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 94
- 229910052710 silicon Inorganic materials 0.000 claims description 67
- 239000010703 silicon Substances 0.000 claims description 67
- 229910052757 nitrogen Inorganic materials 0.000 claims description 65
- 239000000203 mixture Substances 0.000 claims description 63
- 238000002161 passivation Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 21
- 239000002253 acid Substances 0.000 claims 4
- 239000010410 layer Substances 0.000 description 195
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 49
- 238000005530 etching Methods 0.000 description 15
- 229910021417 amorphous silicon Inorganic materials 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 230000002265 prevention Effects 0.000 description 10
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 9
- 239000002019 doping agent Substances 0.000 description 8
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000012670 alkaline solution Substances 0.000 description 7
- 239000000969 carrier Substances 0.000 description 7
- 239000012535 impurity Substances 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005215 recombination Methods 0.000 description 6
- 230000006798 recombination Effects 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 4
- 239000003929 acidic solution Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 230000031700 light absorption Effects 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- -1 regions Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- YBCVMFKXIKNREZ-UHFFFAOYSA-N acoh acetic acid Chemical compound CC(O)=O.CC(O)=O YBCVMFKXIKNREZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
- H01L31/0682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Microelectronics & Electronic Packaging (AREA)
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- Crystallography & Structural Chemistry (AREA)
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- Photovoltaic Devices (AREA)
Description
110,510,610 半導体基板
120,620 パッシベーション膜
130,630 反射防止膜
130”,630” 第1半導体構造
131,631 第1真性半導体層
132,632 第1導電型半導体層
133,633 第1透明導電層
140”,640” 第2半導体構造
141,641 第2真性半導体層
142,642 第2導電型半導体層
143,643 第2透明導電層
151,651 第1電極
152,652 第2電極
160,660 ギャップ絶縁層
161 第1ギャップ絶縁層(第1シリコン窒化膜)
162 第2ギャップ絶縁層(第2シリコン窒化膜)
560 シリコン窒化膜
Claims (18)
- 第1面及び前記第1面の反対側に備わった第2面を含む半導体基板と、
前記半導体基板の前記第1面上に配置されるギャップ絶縁層と、
前記半導体基板の前記第1面上に配置された半導体構造と、
前記半導体構造上に配置された電極と、を含み、
前記ギャップ絶縁層は、シリコン窒化膜であり、前記半導体基板に近接する側部の窒素の含量は、前記半導体基板から遠い側部の窒素の含量よりも小さく、前記半導体基板から遠い側部は、耐酸性が弱く、前記半導体基板に近接する側部は、耐酸性が強く、
前記ギャップ絶縁層において、前記半導体基板に近接する側部の屈折率は、2.0以上であり、
前記ギャップ絶縁層において、前記半導体基板から遠い側部の屈折率は、1.96以下である、
光起電力素子。 - 前記ギャップ絶縁層において、前記半導体基板に近接する側部のシリコンと窒素との組成比は、前記ギャップ絶縁層において、前記半導体基板から遠い側部のシリコンと窒素との組成比より大きいことを特徴とする請求項1に記載の光起電力素子。
- 前記ギャップ絶縁層において、前記半導体基板に近接する側部のシリコンと窒素との組成比は、0.75以上であり、
前記ギャップ絶縁層において、前記半導体基板から遠い側部のシリコンと窒素との組成比は、0.75未満であることを特徴とする請求項2に記載の光起電力素子。 - 前記ギャップ絶縁層のシリコンと窒素との組成比は、前記ギャップ絶縁層の厚み方向に沿って、濃度勾配的に連続して変化することを特徴とする請求項2に記載の光起電力素子。
- 前記ギャップ絶縁層は、
前記半導体基板の前記第1面上に配置される第1ギャップ絶縁層と、
前記第1ギャップ絶縁層上に形成される第2ギャップ絶縁層と、を含み、
前記第1ギャップ絶縁層は、前記半導体基板と、前記第2ギャップ絶縁層との間に介在されることを特徴とする請求項1に記載の光起電力素子。 - 第1ギャップ絶縁層のシリコンと窒素との組成比は、前記第2ギャップ絶縁層のシリコンと窒素との組成比より大きいことを特徴とする請求項5に記載の光起電力素子。
- 前記第1ギャップ絶縁層のシリコンと窒素との組成比は、0.75以上であり、
前記第2ギャップ絶縁層のシリコンと窒素との組成比は、0.75未満であることを特徴とする請求項6に記載の光起電力素子。 - 前記第1ギャップ絶縁層の屈折率は、1.98以上であり、
前記第2ギャップ絶縁層の屈折率は、1.96以下であることを特徴とする請求項5〜7のいずれか一つに記載の光起電力素子。 - 前記半導体基板の第2面上に配置されるパッシベーション膜及び反射防止膜のうち少なくとも一つをさらに含むことを特徴とする請求項1〜8のいずれか一つに記載の光起電力素子。
- 半導体基板を提供する段階と、
前記半導体基板の第1面上に、ギャップ絶縁層を形成する段階と、を含み、
前記ギャップ絶縁層を形成する段階において、前記ギャップ絶縁層は、シリコン窒化膜であり、前記半導体基板に近接する側部の窒素の含量は、前記半導体基板から遠い側部の窒素の含量よりも小さく、前記半導体基板から遠い側部は、耐酸性が弱く、前記半導体基板に近接する側部は、耐酸性が強く、
前記ギャップ絶縁層において、前記半導体基板に近接する側部の屈折率は、2.0以上であり、
前記ギャップ絶縁層において、前記半導体基板から遠い側部の屈折率は、1.96以下である、
光起電力素子の製造方法。 - 前記ギャップ絶縁層において、前記半導体基板に近接する側部のシリコンと窒素との組成比は、前記ギャップ絶縁層において、前記半導体基板から遠い側部のシリコンと窒素との組成比より大きいことを特徴とする請求項10に記載の光起電力素子の製造方法。
- 前記ギャップ絶縁層において、前記半導体基板に近接する側部のシリコンと窒素との組成比は、0.75以上であり、
前記ギャップ絶縁層において、前記半導体基板から遠い側部のシリコンと窒素との組成比は、0.75未満であることを特徴とする請求項11に記載の光起電力素子の製造方法。 - 前記ギャップ絶縁層のシリコンと窒素との組成比は、前記ギャップ絶縁層の厚み方向に沿って、濃度勾配的に連続して変化することを特徴とする請求項11に記載の光起電力素子の製造方法。
- 前記ギャップ絶縁層を形成する段階は、
前記半導体基板の前記第1面上に配置される第1ギャップ絶縁層を形成する段階と、
前記第1ギャップ絶縁層上に形成される第2ギャップ絶縁層を形成する段階と、を含み、
前記第1ギャップ絶縁層は、前記半導体基板と、前記第2ギャップ絶縁層との間に介在されることを特徴とする請求項10に記載の光起電力素子の製造方法。 - 第1ギャップ絶縁層のシリコンと窒素との組成比は、前記第2ギャップ絶縁層のシリコンと窒素との組成比より大きいことを特徴とする請求項14に記載の光起電力素子の製造方法。
- 前記第1ギャップ絶縁層のシリコンと窒素との組成比は、0.75以上であり、
前記第2ギャップ絶縁層のシリコンと窒素との組成比は、0.75未満であることを特徴とする請求項15に記載の光起電力素子の製造方法。 - 前記ギャップ絶縁層において、前記半導体基板に近接する側部の屈折率は、1.98以上であり、
前記ギャップ絶縁層において、前記半導体基板から遠い側部の屈折率は、1.96以下であることを特徴とする請求項14〜16のいずれか一つに記載の光起電力素子の製造方法。 - 前記半導体基板の第1面の反対側に備わった第2面上に、パッシベーション膜及び反射防止膜のうち少なくとも一つをさらに形成する段階をさらに含むことを特徴とする請求項10〜17のいずれか一つに記載の光起電力素子の製造方法。
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Application Number | Priority Date | Filing Date | Title |
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US201161569956P | 2011-12-13 | 2011-12-13 | |
US61/569956 | 2011-12-13 | ||
US13/587,393 US20130146136A1 (en) | 2011-12-13 | 2012-08-16 | Photovoltaic device and method of manufacturing the same |
US13/587393 | 2012-08-16 |
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JP2013125964A JP2013125964A (ja) | 2013-06-24 |
JP6250273B2 true JP6250273B2 (ja) | 2017-12-20 |
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US (1) | US20130146136A1 (ja) |
EP (1) | EP2605287A3 (ja) |
JP (1) | JP6250273B2 (ja) |
KR (1) | KR101897723B1 (ja) |
CN (1) | CN103165685A (ja) |
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FR2988908B1 (fr) * | 2012-04-03 | 2015-03-27 | Commissariat Energie Atomique | Procede de fabrication d'une cellule photovoltaique a contacts interdigites en face arriere |
WO2015118740A1 (ja) * | 2014-02-06 | 2015-08-13 | パナソニックIpマネジメント株式会社 | 太陽電池 |
US9337369B2 (en) * | 2014-03-28 | 2016-05-10 | Sunpower Corporation | Solar cells with tunnel dielectrics |
JP6692797B2 (ja) * | 2015-03-31 | 2020-05-13 | 株式会社カネカ | 太陽電池及びその製造方法 |
CN105185849B (zh) * | 2015-07-14 | 2017-09-15 | 苏州阿特斯阳光电力科技有限公司 | 一种背接触太阳能电池及其制备方法 |
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KR20070102764A (ko) * | 2006-04-17 | 2007-10-22 | 주식회사 엘지화학 | Pecvd 법에 기반한 다층 박막 구조의 제조방법 |
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JP5117770B2 (ja) * | 2007-06-12 | 2013-01-16 | シャープ株式会社 | 太陽電池の製造方法 |
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JP2010258043A (ja) * | 2009-04-21 | 2010-11-11 | Sanyo Electric Co Ltd | 太陽電池 |
DE102009044052A1 (de) * | 2009-09-18 | 2011-03-24 | Schott Solar Ag | Kristalline Solarzelle, Verfahren zur Herstellung einer solchen sowie Verfahren zur Herstellung eines Solarzellenmoduls |
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EP2530729B1 (en) | 2010-01-26 | 2019-10-16 | Panasonic Intellectual Property Management Co., Ltd. | Solar cell and method for producing same |
CN102130185A (zh) * | 2011-01-26 | 2011-07-20 | 欧贝黎新能源科技股份有限公司 | 一种用于晶体硅太阳电池的双层氮化硅薄膜及其制备方法 |
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- 2012-08-24 KR KR1020120093288A patent/KR101897723B1/ko active IP Right Grant
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- 2012-12-11 CN CN2012105340693A patent/CN103165685A/zh active Pending
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KR20130067208A (ko) | 2013-06-21 |
EP2605287A3 (en) | 2014-08-06 |
US20130146136A1 (en) | 2013-06-13 |
CN103165685A (zh) | 2013-06-19 |
EP2605287A2 (en) | 2013-06-19 |
JP2013125964A (ja) | 2013-06-24 |
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