JP6216789B2 - デバイス構造体 - Google Patents
デバイス構造体 Download PDFInfo
- Publication number
- JP6216789B2 JP6216789B2 JP2015527835A JP2015527835A JP6216789B2 JP 6216789 B2 JP6216789 B2 JP 6216789B2 JP 2015527835 A JP2015527835 A JP 2015527835A JP 2015527835 A JP2015527835 A JP 2015527835A JP 6216789 B2 JP6216789 B2 JP 6216789B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- metal structure
- cavity
- electronic device
- device structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/102—Varistor boundary, e.g. surface layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Led Device Packages (AREA)
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
この別のデバイス15はチップとして形成されていてよく、具体的には発光ダイオードチップとして形成されていてよい。
1 デバイス構造体
2 基板
3 構造体
3a 第一部分領域
3b 第二部分領域
3c 第三部分領域
3d 第四部分領域
4 基板の第一外面
5 キャビティ
5a 第一キャビティ
5b 第二キャビティ
5c 第三キャビティ
6 電子デバイス
6a 第一電子デバイス
6b 第二電子デバイス
6c 第三電子デバイス
7 ビア
8 接続面
9 基板の第二外面
10 貫通孔
11 絶縁部
11a 第一絶縁部
11b 第二絶縁部
12 薄層
13 保護材料
14 チップ
15 別のデバイス
16 第二の別のデバイス
17 別の構造体
17a,17b 別の構造体の部分領域
18 側面
19 表面
20 基体
t キャビティの深さ
h1 部分領域の高さ
h2 電子デバイスの高さ
Claims (15)
- 少なくとも一つのキャビティ(5,5a,5b,5c,5d)を備える金属構造体(3,17)を有する基板(2)と、少なくとも部分的に前記キャビティ(5,5a,5b,5c,5d)に配設されている少なくとも一つの電子デバイス(6,6a,6b,6c)と、を備えるデバイス構造体であって、
前記金属構造体(3,17)が少なくとも二つの互いに分離された部分領域(3a,3b,3c,3d)を備え、前記部分領域(3a,3b,3c,3d)の間に前記キャビティ(5,5a,5b,5c,5d)があり、
前記基板(2)上には、前記電子デバイス(6,6a,6b,6c)の電気的接続のための接続面(8)が設けられており、前記接続面(8)上に前記電子デバイス(6,6a,6b,6c)及び前記金属構造体(3,17)が配設されている
ことを特徴とするデバイス構造体。 - 前記電子デバイス(6,6a,6b,6c)が完全に前記キャビティ(5,5a,5b,5c,5d)内に沈み込んでいることを特徴とする、請求項1に記載のデバイス構造体。
- 前記部分領域(3a,3b,3c,3d)が平坦な表面(19)を備えることを特徴とする、請求項1または2に記載のデバイス構造体。
- 前記少なくとも一つの電子デバイス(6,6a,6b,6c)が、サーミスタ素子、バリスタ素子、TVSダイオード、または発光ダイオードとして形成されていることを特徴とする、請求項1乃至3のいずれか一項に記載のデバイス構造体。
- 前記少なくとも一つの電子デバイス(6,6a,6b,6c)が、チップ(14)として形成されていることを特徴とする、請求項1乃至4のいずれか一項に記載のデバイス構造体。
- 前記金属構造体(3,17)が少なくともひとつ電気的接続部と接続されていることを特徴とする、請求項1乃至5のいずれか一項に記載のデバイス構造体。
- 前記金属構造体(3,17)が電気的接続部と接続されていないことを特徴とする、請求項1乃至5のいずれか一項に記載のデバイス構造体。
- 前記金属構造体(3,17)が、前記基板を貫通する少なくとも一つのビア(7)と接続されていることを特徴とする、請求項1乃至7のいずれか一項に記載のデバイス構造体。
- 前記金属構造体(3,17)が複数のキャビティ(5,5a,5b,5c,5d)を備え、各キャビティ(5,5a,5b,5c,5d)に少なくとも一つの電子デバイス(6,6a,6b,6c)が配設されていることを特徴とする、請求項1乃至8のいずれか一項に記載のデバイス構造体。
- 一つのキャビティ(5,5a,5b,5c,5d)に複数の電子デバイス(6,6a,6b,6c)が配設されていることを特徴とする、請求項1乃至9のいずれか一項に記載のデバイス構造体。
- キャビティ(5,5a,5b,5c,5d)が少なくとも部分的に、別のデバイス(15,16)に覆われることを特徴とする、請求項1乃至10のいずれか一項に記載のデバイス構造体。
- 前記別のデバイス(15,16)は、別の電子デバイスおよび/または別の基板として形成されていることを特徴とする、請求項11に記載のデバイス構造体。
- 前記金属構造体(3,17)が、前記別のデバイス(15,16)を電気的に接続するように形成されていることを特徴とする、請求項11または12に記載のデバイス構造体。
- 前記金属構造体(3,17)が、前記別のデバイス(15,16)を前記基板(2)に固定するように形成されていることを特徴とする、請求項11乃至13のいずれか一項に記載のデバイス構造体。
- 前記基板(2)が、セラミック材料または有機材料を含む絶縁性の基体を備えることを特徴とする、請求項1乃至14のいずれか一項に記載のデバイス構造体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012107668.5 | 2012-08-21 | ||
DE102012107668.5A DE102012107668A1 (de) | 2012-08-21 | 2012-08-21 | Bauelementanordnung |
PCT/EP2013/066326 WO2014029602A1 (de) | 2012-08-21 | 2013-08-02 | Elektrische bauelementanordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015534715A JP2015534715A (ja) | 2015-12-03 |
JP6216789B2 true JP6216789B2 (ja) | 2017-10-18 |
Family
ID=48916062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015527835A Active JP6216789B2 (ja) | 2012-08-21 | 2013-08-02 | デバイス構造体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10278285B2 (ja) |
EP (1) | EP2888745B1 (ja) |
JP (1) | JP6216789B2 (ja) |
KR (1) | KR20150046235A (ja) |
CN (1) | CN104541335B (ja) |
DE (1) | DE102012107668A1 (ja) |
WO (1) | WO2014029602A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012102021A1 (de) * | 2012-03-09 | 2013-09-12 | Epcos Ag | Mikromechanisches Messelement und Verfahren zur Herstellung eines mikromechanischen Messelements |
DE102013114006A1 (de) * | 2013-12-13 | 2015-06-18 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Leiterplatte |
DE102015111307A1 (de) * | 2015-07-13 | 2017-01-19 | Epcos Ag | Bauelement mit verbesserter Wärmeableitung |
US10061363B2 (en) * | 2015-09-04 | 2018-08-28 | Apple Inc. | Combination parallel path heatsink and EMI shield |
DE102016100585A1 (de) | 2016-01-14 | 2017-07-20 | Epcos Ag | Bauelementsubstrat mit Schutzfunktion und Verfahren zur Herstellung |
DE112019002877T5 (de) * | 2018-06-06 | 2021-03-11 | Avx Corporation | Hochfrequenz- und Hochleistungsdünnschichtkomponente |
US10561011B1 (en) | 2018-08-24 | 2020-02-11 | Loon Llc | Combined heat sink and photon harvestor |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57138392U (ja) | 1981-02-23 | 1982-08-30 | ||
JPS60200596A (ja) | 1984-03-23 | 1985-10-11 | 富士通株式会社 | 印刷配線板の接続方法 |
JP2828753B2 (ja) | 1990-08-31 | 1998-11-25 | 三洋電機株式会社 | 混成集積回路装置 |
JPH06260736A (ja) | 1993-03-08 | 1994-09-16 | Nippon Cement Co Ltd | Icモジュ−ルの組立体及びicモジュ−ルの取付け方法 |
JPH07142627A (ja) * | 1993-11-18 | 1995-06-02 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JPH09162320A (ja) * | 1995-12-08 | 1997-06-20 | Shinko Electric Ind Co Ltd | 半導体パッケージおよび半導体装置 |
US6214525B1 (en) * | 1996-09-06 | 2001-04-10 | International Business Machines Corp. | Printed circuit board with circuitized cavity and methods of producing same |
JPH10163400A (ja) * | 1996-11-28 | 1998-06-19 | Nitto Denko Corp | 半導体装置及びそれに用いる2層リードフレーム |
US6064116A (en) * | 1997-06-06 | 2000-05-16 | Micron Technology, Inc. | Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications |
DE19746893B4 (de) * | 1997-10-23 | 2005-09-01 | Siemens Ag | Optoelektronisches Bauelement mit Wärmesenke im Sockelteil und Verfahren zur Herstellung |
US6111324A (en) * | 1998-02-05 | 2000-08-29 | Asat, Limited | Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package |
US6081037A (en) | 1998-06-22 | 2000-06-27 | Motorola, Inc. | Semiconductor component having a semiconductor chip mounted to a chip mount |
TW483074B (en) * | 1999-05-14 | 2002-04-11 | Seiko Epson Corp | Semiconductor apparatus, its manufacturing method, circuit board and electronic machine |
WO2001048821A1 (en) | 1999-12-27 | 2001-07-05 | Mitsubishi Denki Kabushiki Kaisha | Integrated circuit |
JP3502014B2 (ja) * | 2000-05-26 | 2004-03-02 | シャープ株式会社 | 半導体装置および液晶モジュール |
US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
JP2003124595A (ja) | 2001-10-11 | 2003-04-25 | Alps Electric Co Ltd | 電子回路ユニット |
JP3492348B2 (ja) * | 2001-12-26 | 2004-02-03 | 新光電気工業株式会社 | 半導体装置用パッケージの製造方法 |
DE10353139B4 (de) * | 2003-11-14 | 2008-12-04 | Fachhochschule Stralsund | Stapelbares modulares Gehäusesystem und ein Verfahren zu dessen Herstellung |
DE102004031685A1 (de) * | 2004-06-30 | 2006-01-19 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement und optoelektronisches Bauelement |
WO2006035528A1 (ja) | 2004-09-29 | 2006-04-06 | Murata Manufacturing Co., Ltd. | スタックモジュール及びその製造方法 |
US20090002969A1 (en) * | 2007-06-27 | 2009-01-01 | Rf Micro Devices, Inc. | Field barrier structures within a conformal shield |
DE202006020926U1 (de) * | 2005-10-27 | 2011-02-10 | Kromberg & Schubert Gmbh & Co. Kg | Leuchte |
JP5082321B2 (ja) * | 2006-07-28 | 2012-11-28 | 大日本印刷株式会社 | 多層プリント配線板及びその製造方法 |
JP5064768B2 (ja) | 2006-11-22 | 2012-10-31 | 新光電気工業株式会社 | 電子部品および電子部品の製造方法 |
US8058098B2 (en) | 2007-03-12 | 2011-11-15 | Infineon Technologies Ag | Method and apparatus for fabricating a plurality of semiconductor devices |
CN201104378Y (zh) | 2007-04-04 | 2008-08-20 | 华为技术有限公司 | 屏蔽和散热装置 |
CN101296566B (zh) * | 2007-04-29 | 2011-06-22 | 鸿富锦精密工业(深圳)有限公司 | 电气元件载板及其制造方法 |
US8324723B2 (en) * | 2008-03-25 | 2012-12-04 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump |
KR101486420B1 (ko) * | 2008-07-25 | 2015-01-26 | 삼성전자주식회사 | 칩 패키지, 이를 이용한 적층형 패키지 및 그 제조 방법 |
US8018032B2 (en) * | 2008-12-31 | 2011-09-13 | Unimicron Technology Corp. | Silicon substrate and chip package structure with silicon base having stepped recess for accommodating chip |
JP5312223B2 (ja) * | 2009-06-25 | 2013-10-09 | 京セラ株式会社 | 配線基板 |
US8390083B2 (en) | 2009-09-04 | 2013-03-05 | Analog Devices, Inc. | System with recessed sensing or processing elements |
DE102010012042A1 (de) | 2010-03-19 | 2011-09-22 | Epcos Ag | Bauelement mit einem Chip in einem Hohlraum und einer spannungsreduzierten Befestigung |
DE102012101560B4 (de) | 2011-10-27 | 2016-02-04 | Epcos Ag | Leuchtdiodenvorrichtung |
US8803185B2 (en) * | 2012-02-21 | 2014-08-12 | Peiching Ling | Light emitting diode package and method of fabricating the same |
US9564387B2 (en) * | 2014-08-28 | 2017-02-07 | UTAC Headquarters Pte. Ltd. | Semiconductor package having routing traces therein |
-
2012
- 2012-08-21 DE DE102012107668.5A patent/DE102012107668A1/de not_active Ceased
-
2013
- 2013-08-02 EP EP13745086.2A patent/EP2888745B1/de active Active
- 2013-08-02 KR KR20157007170A patent/KR20150046235A/ko active IP Right Grant
- 2013-08-02 JP JP2015527835A patent/JP6216789B2/ja active Active
- 2013-08-02 CN CN201380044371.3A patent/CN104541335B/zh active Active
- 2013-08-02 US US14/422,676 patent/US10278285B2/en active Active
- 2013-08-02 WO PCT/EP2013/066326 patent/WO2014029602A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2015534715A (ja) | 2015-12-03 |
WO2014029602A1 (de) | 2014-02-27 |
DE102012107668A1 (de) | 2014-03-20 |
EP2888745B1 (de) | 2020-01-15 |
US10278285B2 (en) | 2019-04-30 |
US20150245481A1 (en) | 2015-08-27 |
KR20150046235A (ko) | 2015-04-29 |
CN104541335A (zh) | 2015-04-22 |
CN104541335B (zh) | 2018-09-11 |
EP2888745A1 (de) | 2015-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6216789B2 (ja) | デバイス構造体 | |
US9812621B2 (en) | Semiconductor device and fabrication method for same | |
US7863639B2 (en) | Light-emitting diode lamp with low thermal resistance | |
KR101360732B1 (ko) | 발광 다이오드 패키지 | |
KR102037866B1 (ko) | 전자장치 | |
JP2009048915A (ja) | Ledランプおよびledランプモジュール | |
JP2014086630A (ja) | 発光素子搭載用部品および発光装置 | |
JP6736260B2 (ja) | 半導体発光装置 | |
US20100213810A1 (en) | Light emitting device package | |
US8461614B2 (en) | Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device | |
TWI769337B (zh) | 發光裝置 | |
US8841172B2 (en) | Method for forming package substrate | |
JP2004228413A (ja) | 発光素子収納用パッケージおよび発光装置 | |
JP2012109352A (ja) | 半導体発光装置及び半導体発光装置の製造方法 | |
JP2006073699A (ja) | 発光素子収納用パッケージ | |
JP6626735B2 (ja) | 電子部品搭載用基板、電子装置および電子モジュール | |
JP2013219071A (ja) | 発光素子搭載用部品および発光装置 | |
JP2010283063A (ja) | 発光装置および発光モジュール | |
JP2012195464A (ja) | セラミック多層基板及びその製造方法 | |
JP6269356B2 (ja) | 発光装置 | |
KR101492522B1 (ko) | 소자 패키지 | |
JP2006173196A (ja) | 発光素子及びこれを用いた発光ダイオード | |
JP2015050313A (ja) | 配線基板および電子装置 | |
JP2022182250A (ja) | 配線基板、電子装置および配線基板の製造方法 | |
TW201038109A (en) | LED package |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160314 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160413 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160711 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161116 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20170214 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20170411 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170509 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170830 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170925 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6216789 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |