JP6182065B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP6182065B2 JP6182065B2 JP2013273035A JP2013273035A JP6182065B2 JP 6182065 B2 JP6182065 B2 JP 6182065B2 JP 2013273035 A JP2013273035 A JP 2013273035A JP 2013273035 A JP2013273035 A JP 2013273035A JP 6182065 B2 JP6182065 B2 JP 6182065B2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
S1,S2 退避空間
1,1A 基板処理装置
2 搬入出ブロック
3 処理ブロック
4 制御装置
13 受渡ステーション
14 処理ステーション
15 第2搬送領域
40,41〜48 処理ユニット
50 第2搬送装置
51 第1搬送アーム
52 第2搬送アーム
53a,53b 支柱部材
54a 第1昇降機構
54b 第2昇降機構
55a 第1駆動源
55b 第2駆動源
56a 第1接続部
56b 第2接続部
57a,57b ガイドレール
58a 連結部材
Claims (6)
- 鉛直方向に並べて配置され、基板を処理する複数の処理ユニットと、
鉛直方向に移動可能であり、前記処理ユニットに対して前記基板の搬入出を行う基板搬送装置と
を備え、
前記基板搬送装置は、
鉛直方向に並べて配置され、かつ、鉛直方向への可動範囲が互いに重複し、独立して鉛直方向へ移動する第1搬送アームと第2搬送アームと、
前記第1搬送アームおよび前記第2搬送アームの両側に配置される2つの支柱部材と、
前記2つの支柱部材のうちの一方の内部に設けられ、前記第1搬送アームを鉛直方向に移動させる第1昇降機構と、
前記2つの支柱部材のうちの他方の内部に設けられ、前記第2搬送アームを鉛直方向に移動させる第2昇降機構と、
前記2つの支柱部材の各々の内部に、前記2つの支柱部材の並び方向と直交する方向に前記第1昇降機構および前記第2昇降機構と並べて設けられ、前記第1搬送アームおよび前記第2搬送アームの鉛直方向への移動を案内する2つのガイドレールと
を備え、
最上段に配置される前記処理ユニットよりも上方に前記第1搬送アームを収容可能な第1退避空間を有するとともに、最下段に配置される前記処理ユニットよりも下方に前記第2搬送アームを収容可能な第2退避空間を有し、
前記第1搬送アームは、
前記第2搬送アームの上方に配置され、前記第2搬送アームを前記第2退避空間まで移動させた場合に、最下段に配置される前記処理ユニットに対する前記基板の搬入出が可能であり、
前記第2搬送アームは、
前記第1搬送アームを前記第1退避空間まで移動させた場合に、最上段に配置される前記処理ユニットに対する前記基板の搬入出が可能であること
を特徴とする基板処理装置。 - 前記基板搬送装置の異常を検出する異常検出部と、
前記第1搬送アームの水平方向への伸縮動作または鉛直軸を中心とする旋回動作の異常が検出された場合に、前記第1搬送アームを前記第1退避空間まで移動させた後、前記第2搬送アームに対して前記第1搬送アームが行うべき作業を行わせ、前記第1搬送アームの鉛直方向への移動動作の異常が検出された場合には、前記第1搬送アームが停止した位置よりも下方の前記処理ユニットに対する前記基板の搬入出を前記第2搬送アームに行わせる制御部と
を備えることを特徴とする請求項1に記載の基板処理装置。 - 前記第1搬送アームおよび前記第2搬送アームの総数よりも前記処理ユニットの総数が多いこと
を特徴とする請求項1または2に記載の基板処理装置。 - 前記第1搬送アームおよび前記第2搬送アームは、割り当てられた前記処理ユニットに対して前記基板の搬入出を行い、
同一の高さに配置される異なる前記処理ユニットが前記第1搬送アームと前記第2搬送アームとにそれぞれ割り当てられること
を特徴とする請求項1〜3のいずれか一つに記載の基板処理装置。 - 前記第1搬送アームおよび前記第2搬送アームは、割り当てられた前記処理ユニットに対して前記基板の搬入出を行い、
割り当てられた前記処理ユニットの処理時間に応じて、前記第1搬送アームと前記第2搬送アームとで前記処理ユニットの割り当て数を異ならせること
を特徴とする請求項1〜4のいずれか一つに記載の基板処理装置。 - 前記複数の処理ユニットと前記基板搬送装置とを含み、互いに連結可能な複数の処理ブロック
を備えることを特徴とする請求項1〜5のいずれか一つに記載の基板処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013273035A JP6182065B2 (ja) | 2013-12-27 | 2013-12-27 | 基板処理装置 |
US14/580,703 US9666463B2 (en) | 2013-12-27 | 2014-12-23 | Substrate processing apparatus |
KR1020140187249A KR102263542B1 (ko) | 2013-12-27 | 2014-12-23 | 기판 처리 장치 |
TW103145387A TWI593615B (zh) | 2013-12-27 | 2014-12-25 | 基板處理裝置 |
CN201410834589.5A CN104752279B (zh) | 2013-12-27 | 2014-12-26 | 基板处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013273035A JP6182065B2 (ja) | 2013-12-27 | 2013-12-27 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015128102A JP2015128102A (ja) | 2015-07-09 |
JP6182065B2 true JP6182065B2 (ja) | 2017-08-16 |
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JP2013273035A Active JP6182065B2 (ja) | 2013-12-27 | 2013-12-27 | 基板処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9666463B2 (ja) |
JP (1) | JP6182065B2 (ja) |
KR (1) | KR102263542B1 (ja) |
CN (1) | CN104752279B (ja) |
TW (1) | TWI593615B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6789384B2 (ja) * | 2017-04-06 | 2020-11-25 | 東京エレクトロン株式会社 | 基板処理装置および基板搬送方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4010985B2 (ja) * | 2003-06-12 | 2007-11-21 | 東京エレクトロン株式会社 | 処理装置 |
US7798764B2 (en) * | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
CN102867764B (zh) * | 2005-04-22 | 2015-06-17 | 应用材料公司 | 笛卡尔机械臂群集工具架构 |
US8267634B2 (en) * | 2005-11-07 | 2012-09-18 | Brooks Automation, Inc. | Reduced capacity carrier, transport, load port, buffer system |
JP4973267B2 (ja) * | 2007-03-23 | 2012-07-11 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送モジュール、基板搬送方法及び記憶媒体 |
JP2009008227A (ja) | 2007-06-29 | 2009-01-15 | Equos Research Co Ltd | 振動制御装置 |
JP5381592B2 (ja) | 2009-10-06 | 2014-01-08 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5616205B2 (ja) * | 2010-11-29 | 2014-10-29 | 東京エレクトロン株式会社 | 基板処理システム、基板処理方法、プログラム及びコンピュータ記憶媒体 |
TWI523134B (zh) * | 2011-09-22 | 2016-02-21 | 東京威力科創股份有限公司 | 基板處理系統、基板搬運方法、及電腦記憶媒體 |
JP2013069874A (ja) * | 2011-09-22 | 2013-04-18 | Tokyo Electron Ltd | 基板処理システム、基板搬送方法、プログラム及びコンピュータ記憶媒体 |
JP5588469B2 (ja) * | 2012-02-09 | 2014-09-10 | 東京エレクトロン株式会社 | 基板処理装置 |
US9446517B2 (en) * | 2013-10-17 | 2016-09-20 | Intuitive Surgical Operations, Inc. | Fault reaction, fault isolation, and graceful degradation in a robotic system |
-
2013
- 2013-12-27 JP JP2013273035A patent/JP6182065B2/ja active Active
-
2014
- 2014-12-23 KR KR1020140187249A patent/KR102263542B1/ko active IP Right Grant
- 2014-12-23 US US14/580,703 patent/US9666463B2/en active Active
- 2014-12-25 TW TW103145387A patent/TWI593615B/zh active
- 2014-12-26 CN CN201410834589.5A patent/CN104752279B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20150077341A (ko) | 2015-07-07 |
CN104752279B (zh) | 2019-04-09 |
TWI593615B (zh) | 2017-08-01 |
JP2015128102A (ja) | 2015-07-09 |
TW201536652A (zh) | 2015-10-01 |
US20150187621A1 (en) | 2015-07-02 |
US9666463B2 (en) | 2017-05-30 |
KR102263542B1 (ko) | 2021-06-10 |
CN104752279A (zh) | 2015-07-01 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |