JP6177072B2 - Manufacturing method of touch panel - Google Patents
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本発明は、静電容量式の透明なタッチパネルの製造方法に関する。 The present invention relates to a method for producing a capacitive transparent touch panel.
近年、コンピューターや電子機器において、押しボタンを用いずにディスプレイの表示を利用した操作の開発が盛んであり、その操作のために、ディスプレイの前面に透明のタッチパネルを配置して、タッチ位置を検出している。タッチパネルの種類としては、抵抗膜式、表面弾性波式、赤外線方式などがあり、指のタッチや近接による静電容量の変化で位置を検出する静電容量式もある。例えば、特許文献１には、マトリクス状の電極（Ｘ方向、Ｙ方向の２層構造）の静電容量式タッチスイッチが記載されている。 In recent years, computer and electronic devices have been actively developed for operations that use the display on the display without using push buttons. For this operation, a transparent touch panel is placed on the front of the display to detect the touch position. doing. Types of touch panels include a resistance film type, a surface acoustic wave type, an infrared type, and the like, and there is also a capacitance type that detects a position by a change in capacitance due to a finger touch or proximity. For example, Patent Document 1 describes a capacitive touch switch having matrix electrodes (two-layer structure in the X direction and the Y direction).
従来の静電容量式タッチパネルは、基板の一方面に帯状にパターニングされたインジウム錫酸化物（ＩＴＯ）などからなる透明の第１電極が形成された第１面状体と、基板の一方面に帯状にパターニングされたＩＴＯなどからなる透明の第２電極が形成された第２面状体とを備えており、第１電極及び第２電極が互いに対向するようにして、両面状体が粘着層を介して貼着される。しかしながら、ＩＴＯは抵抗率が高く、２００Ω/□〜１０００Ω/□が一般的である。特に大型のタッチパネルでは、電極の端子間の抵抗値が増加し、これに伴い静電容量検出の感度が低下するため、タッチパネルとして動作させることが困難になる場合がある。 A conventional capacitive touch panel has a first planar body in which a transparent first electrode made of indium tin oxide (ITO) patterned in a strip shape is formed on one surface of a substrate, and one surface of the substrate. A second planar body on which a transparent second electrode made of ITO or the like patterned in a strip shape is formed, and the double-sided body is an adhesive layer so that the first electrode and the second electrode face each other. It is pasted through. However, ITO has a high resistivity, and is generally 200Ω / □ to 1000Ω / □. In particular, in a large-sized touch panel, the resistance value between the terminals of the electrodes increases, and the sensitivity of capacitance detection decreases accordingly, which may make it difficult to operate as a touch panel.
そこで、ＩＴＯを使用しない静電容量式のタッチパネルが提案されている（例えば、特許文献２を参照）。特許文献２のタッチパネルでは、銅又は銅合金からなる金属線を網目状に形成して電極を形成することで、電極の透過率を７０％以上にしており、視認性を維持したまま低抵抗の電極を形成している。 Therefore, a capacitive touch panel that does not use ITO has been proposed (see, for example, Patent Document 2). In the touch panel of Patent Document 2, the electrode is formed by forming a metal wire made of copper or a copper alloy in a mesh shape, so that the transmittance of the electrode is 70% or more, and low resistance is maintained while maintaining visibility. An electrode is formed.
しかしながら、特許文献２のタッチパネルでは、基板の一方面に網目状の第１電極が形成された第１面状体と、基板の一方面に網目状の第２電極が形成された第２面状体とを重ね合わせた構造であるため、タッチパネル全体の厚みが厚くなる。近年、タッチパネルは、薄型・軽量化が求められているところ、特許文献２のタッチパネルでは軽薄の要求に不利であるという問題がある。また、２枚の基板にそれぞれ電極や配線などを形成する必要があるため、タッチパネル製造のための工程が多くなり、タッチパネルを効率よく製造することが困難であるという問題がある。 However, in the touch panel of Patent Document 2, a first planar body in which a mesh-like first electrode is formed on one surface of a substrate and a second planar shape in which a mesh-like second electrode is formed on one surface of the substrate. Since the structure is formed by superimposing the body, the thickness of the entire touch panel is increased. In recent years, the touch panel is required to be thin and light, but the touch panel of Patent Document 2 has a problem that it is disadvantageous for the requirement for lightness and thinness. Moreover, since it is necessary to form an electrode, wiring, etc. on two board | substrates, respectively, the process for touchscreen manufacture increases, and there exists a problem that it is difficult to manufacture a touchscreen efficiently.
本発明は、上記問題に着目してなされたもので、低抵抗な網目状の電極を備えたタッチパネルにおいて、薄型化・軽量化を実現するとともに、効率よくタッチパネルを製造できるタッチパネルの製造方法を提供することを目的とする。 The present invention has been made paying attention to the above problems, and provides a touch panel manufacturing method capable of efficiently manufacturing a touch panel while realizing a reduction in thickness and weight in a touch panel including a low-resistance mesh electrode. The purpose is to do.
本発明の上記目的は、基板の一方面側に配置され、複数の第１導体線を交差させることで形成された複数の第１電極セル及び隣り合う前記第１電極セルの前記第１導体線同士を電気的に接続する少なくとも１本の導体線からなる第１接続線を有する第１電極と、前記基板の一方面側に前記第１電極と交差するように配置され、複数の第２導体線を交差させることで形成された複数の第２電極セル及び隣り合う前記第２電極セルの前記第２導体線同士を電気的に接続する接続部材を有する第２電極と、を備えたタッチパネルの製造方法であって、前記基板の一方面側に、前記第１導体線と、前記第２導体線と、前記第１接続線と、前記第１電極及び前記第２電極をそれぞれ外部回路に電気的に接続する導体線からなる第１配線及び第２配線と、を同時に形成する導体線形成工程、前記第１接続線の上方又は下方に配置される絶縁層を形成する絶縁層形成工程、前記第１接続線との間に前記絶縁層が介される前記接続部材を形成する接続部材形成工程、を備えるタッチパネルの製造方法によって達成される。 The above-mentioned object of the present invention is arranged on one side of the substrate, and is formed by intersecting a plurality of first conductor lines, and the first conductor lines of the adjacent first electrode cells. A first electrode having a first connection line composed of at least one conductor line for electrically connecting each other, and a plurality of second conductors arranged on one surface side of the substrate so as to intersect the first electrode A second electrode having a plurality of second electrode cells formed by intersecting lines and a second electrode having a connection member that electrically connects the second conductor lines of the adjacent second electrode cells. In the manufacturing method, the first conductor line, the second conductor line, the first connection line, the first electrode, and the second electrode are electrically connected to an external circuit on one side of the substrate. A first wiring and a second wiring made of conductive wires connected to each other; A conductor wire forming step formed simultaneously; an insulating layer forming step of forming an insulating layer disposed above or below the first connecting line; and the connecting member having the insulating layer interposed between the first connecting wire and the connecting member. It is achieved by a manufacturing method of a touch panel comprising a connecting member forming step to be formed.
上記構成のタッチパネルの製造方法においては、前記導体線形成工程、前記絶縁層形成工程及び前記接続部材形成工程の順序で行われることが好ましいが、前記接続部材形成工程、前記絶縁層形成工程及び前記導体線形成工程の順序で行われてもよい。 In the touch panel manufacturing method having the above-described configuration, it is preferable that the conductor wire forming step, the insulating layer forming step, and the connecting member forming step are performed in this order, but the connecting member forming step, the insulating layer forming step, and the You may perform in order of a conductor wire formation process.
また、前記第１導体線、前記第２導体線及び前記第１接続線の電気抵抗率は、１．６×１０−８Ω・ｍ〜１．０×１０−４Ω・ｍであることが好ましい。 Moreover, the electrical resistivity of the first conductor line, the second conductor line, and the first connection line is 1.6 × 10 −8 Ω · m to 1.0 × 10 −4 Ω · m. preferable.
また、前記第１導体線、前記第２導体線及び前記第１接続線の線幅は、３μｍ〜５０μｍであることが好ましく、３μｍ〜２５μｍであることがより好ましく、３μｍ〜１０μｍがより好ましい。 The line widths of the first conductor line, the second conductor line, and the first connection line are preferably 3 μm to 50 μm, more preferably 3 μm to 25 μm, and more preferably 3 μm to 10 μm.
また、前記第１導体線、前記第２導体線及び前記第１接続線は、黒化処理により形成された黒化層を有していることが好ましい。 Moreover, it is preferable that the said 1st conductor line, the said 2nd conductor line, and the said 1st connection line have the blackening layer formed of the blackening process.
また、前記接続部材は、少なくとも１本の導体線からなる第２接続線により構成され、前記第１接続線及び前記第２接続線によって網目が形成されていることが好ましい。 Moreover, it is preferable that the said connection member is comprised by the 2nd connection line which consists of an at least 1 conductor line, and the mesh | network is formed by the said 1st connection line and the said 2nd connection line.
また、前記第１接続線の線幅及び／又は前記第２接続線の線幅が、前記第１導体線及び前記第２導体線の線幅と異なることが好ましい。 In addition, it is preferable that a line width of the first connection line and / or a line width of the second connection line is different from a line width of the first conductor line and the second conductor line.
また、前記第１導体線及び前記第２導体線の少なくとも一部の線幅が、前記第２接続線の線幅と同じであることが好ましい。 Moreover, it is preferable that the line width of at least a part of the first conductor line and the second conductor line is the same as the line width of the second connection line.
また、前記第１電極及び前記第２電極セルの隙間に、前記第１導体線及び前記第２導体線同士を電気的に接続しない補助線が設けられ、前記第１導体線、前記第２導体線、前記第１接続線、前記第２接続線及び前記補助線によって網目が形成されていることが好ましい。 An auxiliary line that does not electrically connect the first conductor line and the second conductor line is provided in a gap between the first electrode and the second electrode cell, and the first conductor line and the second conductor are provided. It is preferable that a mesh is formed by the line, the first connection line, the second connection line, and the auxiliary line.
本発明によれば、複数の導体線を交差させることで網目状の第１電極及び第２電極を形成しているので、希少金属であるインジウムの使用を避けることができ、ＩＴＯを用いるよりも基板上に形成される電極パターンの低抵抗化を図ることができ、かつ、電極パターンの視認性も向上させることができるので、静電容量式のタッチパネルとして好適に用いることができる。また、第１電極及び第２電極のいずれもが基板の一方面に形成されているので、タッチパネルの構造の簡略化と全体的な厚み・重さの軽減（薄型化・軽量化）を実現できるという優位性を有する。さらに、第１電極及び第２電極を構成する各導体線や第１接続線、さらには各配線を同時に一括して基板の一方面上に形成しているので、タッチパネル製造のための工程を少なくすることができ、タッチパネルを効率よく製造することができる。 According to the present invention, since the first electrode and the second electrode having a mesh shape are formed by crossing a plurality of conductor wires, it is possible to avoid the use of indium which is a rare metal, rather than using ITO. Since the resistance of the electrode pattern formed on the substrate can be reduced and the visibility of the electrode pattern can be improved, it can be suitably used as a capacitive touch panel. In addition, since both the first electrode and the second electrode are formed on one surface of the substrate, the structure of the touch panel can be simplified and the overall thickness and weight can be reduced (thinning and weight reduction). Has the advantage of. Further, since the conductor lines, the first connection lines, and the wirings constituting the first electrode and the second electrode are simultaneously formed on one surface of the substrate, the number of steps for manufacturing the touch panel is reduced. The touch panel can be manufactured efficiently.
以下、本発明の実態形態について添付図面を参照して説明する。尚、各図面は、構成の理解を容易にするため、実寸比ではなく部分的に拡大又は縮小されている。 Hereinafter, actual forms of the present invention will be described with reference to the accompanying drawings. Each drawing is partially enlarged or reduced to facilitate understanding of the configuration, not the actual size ratio.
図１は、本発明の一実施形態に係る製造方法により製造されたタッチパネルの平面図である。図２及び図３は、図１のタッチパネル１の一部分を拡大して示す概略断面図である。図４は、図１のタッチパネル１の一部分を拡大して示す概略平面図である（第１電極セル３０及び第２電極セル４０の導体線Ｌ１，Ｌ２を一部省略）。図１のタッチパネル１は静電容量式のタッチパネルであり、透明な基板２と、基板２の一方面Ｓ側に設けられた複数の帯状の第１電極３及び複数の帯状の第２電極４と、第１電極３及び第２電極４が交差する部分に設けられる絶縁層７と、を備えている。 FIG. 1 is a plan view of a touch panel manufactured by a manufacturing method according to an embodiment of the present invention. 2 and 3 are schematic cross-sectional views showing a part of the touch panel 1 of FIG. 1 in an enlarged manner. 4 is an enlarged schematic plan view showing a part of the touch panel 1 of FIG. 1 (a part of the conductor lines L1 and L2 of the first electrode cell 30 and the second electrode cell 40 is omitted). A touch panel 1 in FIG. 1 is a capacitive touch panel, and includes a transparent substrate 2, a plurality of strip-shaped first electrodes 3 and a plurality of strip-shaped second electrodes 4 provided on one surface S side of the substrate 2. And an insulating layer 7 provided at a portion where the first electrode 3 and the second electrode 4 intersect.
第１電極３は、基板２の一方面Ｓの第１方向（Ｘ方向）に所定間隔をあけて配置されており、隣接する第１電極３間は電気的に絶縁されている。一方、第２電極４は、基板２の一方面Ｓの前記第１方向（Ｘ方向）と垂直に交差する第２方向（Ｙ方向）に所定間隔をあけて配置されており、隣接する第２電極４間が電気的に絶縁されている。第１電極３及び第２電極４には、線状の第１配線５及び第２配線６がそれぞれ接続されている。各配線５，６は、基板２の端縁まで延びるように配線されており、その先端部が静電容量検出回路（図示省略）に接続されている。各配線５，６は、その距離や幅を考慮して低抵抗とすることが好ましい。なお、本実施形態では、第１方向（Ｘ方向）及び第２方向（Ｙ方向）は直交しているが、直交しない角度で基板２の一方面Ｓ上に第１電極３及び第２電極４を配置することもできる。 The first electrodes 3 are arranged at a predetermined interval in the first direction (X direction) of the one surface S of the substrate 2, and the adjacent first electrodes 3 are electrically insulated. On the other hand, the second electrode 4 is arranged at a predetermined interval in a second direction (Y direction) perpendicularly intersecting the first direction (X direction) of the one surface S of the substrate 2, and is adjacent to the second electrode 4. The electrodes 4 are electrically insulated. A linear first wiring 5 and a second wiring 6 are connected to the first electrode 3 and the second electrode 4, respectively. Each of the wirings 5 and 6 is wired so as to extend to the edge of the substrate 2, and its tip is connected to a capacitance detection circuit (not shown). Each of the wires 5 and 6 is preferably low resistance in consideration of the distance and width. In the present embodiment, the first direction (X direction) and the second direction (Y direction) are orthogonal to each other, but the first electrode 3 and the second electrode 4 on the one surface S of the substrate 2 at an angle that is not orthogonal. Can also be arranged.
基板２は、誘電体基板である。基板２の材料は、ポリエステル、ポリエチレンテレフタレート、ポリカーボネート、ポリメチルメタクリレート、ポリエチレンナフタレートなどの透明材料が挙げられる。基板の厚みは１０μｍ〜２０００μｍ程度が好ましい。また、これらの材料を多層に積層してもよい。また、基板２の表面及び裏面に、表面及び裏面の保護のためのハードコート層や、反射防止層、防汚層、アンチブロッキング層、受容層などの機能層を設けたり、プラズマ処理などを施したりしてもよい。 The substrate 2 is a dielectric substrate. Examples of the material of the substrate 2 include transparent materials such as polyester, polyethylene terephthalate, polycarbonate, polymethyl methacrylate, and polyethylene naphthalate. The thickness of the substrate is preferably about 10 μm to 2000 μm. Further, these materials may be laminated in multiple layers. In addition, a hard coat layer for protecting the front and back surfaces, a functional layer such as an antireflection layer, an antifouling layer, an antiblocking layer, and a receiving layer are provided on the front and back surfaces of the substrate 2, or plasma treatment is performed. Or you may.
第１電極３は、複数の第１電極セル３０と、隣接する第１電極セル３０を電気的に接続する第１接続線３１とを備えている。また、第２電極４は、複数の第２電極セル４０と、第１接続線３１上に絶縁層７が介された状態で配置され、隣接する第２電極セル４０を電気的に接続する接続部材８とを備えている。 The first electrode 3 includes a plurality of first electrode cells 30 and a first connection line 31 that electrically connects the adjacent first electrode cells 30. In addition, the second electrode 4 is arranged with a plurality of second electrode cells 40 in a state where the insulating layer 7 is interposed on the first connection line 31 and electrically connects the adjacent second electrode cells 40. And a member 8.
複数の第１電極セル３０は、基板２の一方面Ｓの第２方向（Ｙ方向）に等間隔で配置されている。第１電極セル３０は、複数の第１導体線Ｌ１を交差させることによって網目状に形成されており、複数の格子Ｋが組み合わされた形状である。格子Ｋは、図示例では正方形状である。第１導体線Ｌ１の線幅は、例えば３μｍ〜５０μｍ程度であり、好ましくは３μｍ〜２５μｍ程度であり、より好ましくは３μｍ〜１０μｍ程度である。また、第１導体線Ｌ１のピッチは、例えば１００μｍ〜１０００μｍ程度である。また、第１導体線Ｌ１の厚みは、例えば０．０１μｍ〜１０μｍ程度であり、さらに好ましくは０．０５μｍ〜５μｍ程度である。このような寸法を有する第１電極セル３０は、第１導体線Ｌ１の線幅が非常に細く、線幅に対するピッチが十分に大きいため目立ちにくい。 The plurality of first electrode cells 30 are arranged at equal intervals in the second direction (Y direction) of the one surface S of the substrate 2. The first electrode cell 30 is formed in a mesh shape by intersecting a plurality of first conductor lines L1, and has a shape in which a plurality of lattices K are combined. The lattice K has a square shape in the illustrated example. The line width of the first conductor line L1 is, for example, about 3 μm to 50 μm, preferably about 3 μm to 25 μm, and more preferably about 3 μm to 10 μm. The pitch of the first conductor lines L1 is, for example, about 100 μm to 1000 μm. Moreover, the thickness of the 1st conductor wire L1 is about 0.01 micrometer-10 micrometers, for example, More preferably, it is about 0.05 micrometer-5 micrometers. The first electrode cell 30 having such dimensions is hardly noticeable because the line width of the first conductor line L1 is very thin and the pitch with respect to the line width is sufficiently large.
複数の第２電極セル４０は、基板２の一方面Ｓの第１方向（Ｘ方向）に等間隔で配置されている。第１電極セル３０及び第２電極セル４０の外形は、本実施形態では菱形状であり、第２電極セル４０は、基板２の一方面Ｓ上に設けられた第１電極セル３０と重ならないように第１電極セル３０が存在しない空いたスペースを埋めるように設けられる。これにより、基板２の一方面Ｓは、複数の第１電極セル３０及び複数の第２電極セル４０が敷き詰められた状態となる。第２電極セル４０も、第１電極セル３０と同様に、複数の第２導体線Ｌ２を交差させることによって網目状に形成されており、第２導体線Ｌ２が第１電極３とは接続されないように隙間をあけて配線されている。この第２導体線Ｌ２は、第１導体線Ｌ１と同じ線幅、ピッチ、厚みであり、第２電極セル４０は、第１電極セル３０と同形状の格子Ｋが複数組み合わされた形状である。第２導体線Ｌ２は、第１導体線Ｌ１と同じ材料で形成されている。これにより、第２導体線Ｌ２を、第１導体線Ｌ１と一括して基板２の一方面Ｓ上に形成できるので、効率よく形成することが可能である。なお、第１電極セル３０及び第２電極セル４０の外形は、必ずしも菱形状である必要はなく、第１電極セル３０と第２電極セル４０との間で絶縁性が確保され、指などの接触ポイントを検出可能である限り、任意の形状とすることができる。 The plurality of second electrode cells 40 are arranged at equal intervals in the first direction (X direction) of the one surface S of the substrate 2. The external shapes of the first electrode cell 30 and the second electrode cell 40 are rhombic in the present embodiment, and the second electrode cell 40 does not overlap the first electrode cell 30 provided on the one surface S of the substrate 2. In this way, the first electrode cell 30 is provided so as to fill a vacant space where there is no existing electrode cell 30. Thereby, the one surface S of the substrate 2 is in a state in which the plurality of first electrode cells 30 and the plurality of second electrode cells 40 are spread. Similarly to the first electrode cell 30, the second electrode cell 40 is also formed in a mesh shape by intersecting a plurality of second conductor lines L 2, and the second conductor line L 2 is not connected to the first electrode 3. So that there is a gap between them. The second conductor line L2 has the same line width, pitch, and thickness as the first conductor line L1, and the second electrode cell 40 has a shape in which a plurality of lattices K having the same shape as the first electrode cell 30 are combined. . The second conductor line L2 is formed of the same material as the first conductor line L1. Thereby, since the 2nd conductor line L2 can be formed on the one surface S of the board | substrate 2 collectively with the 1st conductor line L1, it can be formed efficiently. In addition, the external shape of the 1st electrode cell 30 and the 2nd electrode cell 40 does not necessarily need to be a rhombus shape, insulation is ensured between the 1st electrode cell 30 and the 2nd electrode cell 40, fingers, etc. Any shape can be used as long as the contact point can be detected.
第１接続線３１は、隣り合う第１電極セル３０の第１導体線Ｌ１同士を互いに接続する線状のものであり、隣り合う第１電極セル３０の間に１本又は複数本設けられている。第１接続線３１の形状は、一方向に延びる直線的な形状であってもよいし、１箇所又は複数箇所で屈曲した形状（Ｌ字状、ジグザグ状など）であってもよい。第１接続線３１は、直線的に延びている場合には、第１導体線Ｌ１と同方向（Ｕ方向又はＶ方向）を向いており、屈曲している場合には、それぞれ直線的に延びる構成部分３１Ａが第１導体線Ｌ１と同方向（Ｕ方向又はＶ方向）を向いていることが好ましい。また、第１接続線３１（第１接続線３１が屈曲している場合には、直線的に延びる各構成部分３１Ａ）は、いずれかの第１導体線Ｌ１の延長上に位置して、当該第１導体線Ｌ１と１本の線状となっていることが好ましい。第１接続線３１は、第１導体線Ｌ１及び第２導体線Ｌ２と同じ材料で形成されている。これにより、第１接続線３１を、第１導体線Ｌ１及び第２導体線Ｌ２と一括して基板２の一方面Ｓ上に形成できるので、効率よく形成することが可能である。 The first connection line 31 is a linear line that connects the first conductor lines L1 of the adjacent first electrode cells 30 to each other, and one or a plurality of the first connection lines 31 are provided between the adjacent first electrode cells 30. Yes. The shape of the first connection line 31 may be a linear shape extending in one direction, or may be a shape bent at one place or a plurality of places (L shape, zigzag shape, etc.). The first connection line 31 faces the same direction (U direction or V direction) as the first conductor line L1 when extending linearly, and extends linearly when bent. It is preferable that 31 A of component parts have faced the same direction (U direction or V direction) as the 1st conductor line L1. In addition, the first connection line 31 (in the case where the first connection line 31 is bent, each component 31A that extends linearly) is located on the extension of any one of the first conductor lines L1, and It is preferable that the first conductor line L1 and one line are formed. The first connection line 31 is formed of the same material as the first conductor line L1 and the second conductor line L2. Thereby, since the 1st connection line 31 can be formed on the one surface S of the board | substrate 2 collectively with the 1st conductor line L1 and the 2nd conductor line L2, it can be formed efficiently.
基板２の一方面Ｓ上には、少なくとも第１接続線３１を覆うようにして、絶縁層７が設けられている。絶縁層７は、透明でかつ導電性がない絶縁材料であれば、材料は特に限定されないが、その下方及び上方に配置される第１接続線３１及び接続部材８との密着性が高いものが望まれ、エポキシ系やアクリル系などの一般的な熱硬化性透明樹脂や光硬化性透明樹脂などを用いることができる。このような透明樹脂を公知のコーティング法やスクリーン印刷法、インクジェット印刷法などで第１接続線３１を覆うように塗布することで、絶縁層７を形成できる。また、酸化珪素などの無機絶縁材料を用いて、スパッタリング法、真空蒸着法、イオンプレーティング法などのＰＶＤ法や、ＣＶＤ法などにより、絶縁層７を形成することができる。また、感光性を有する透明な絶縁材料を用い、フォトリソグラフィによっても絶縁層７を形成できる。その他、ポリエステル系樹脂の透明性フィルムなどを少なくとも第１接続線３１を覆うように基板２の一方面Ｓ上に貼り付けることによっても、絶縁層７を形成できる。絶縁層７の厚みは、特に限定されるものではなく、例えば０．１μｍ〜５０μｍ程度とすることができる。また、絶縁層７の外形は、図４では矩形状であるが、これに限られることなく、例えば多角形状や円形状など、種々の形状とすることができる。 On the one surface S of the substrate 2, an insulating layer 7 is provided so as to cover at least the first connection line 31. The insulating layer 7 is not particularly limited as long as the insulating layer 7 is a transparent and non-conductive insulating material. However, the insulating layer 7 has high adhesion to the first connecting line 31 and the connecting member 8 disposed below and above the insulating layer 7. Desirably, a general thermosetting transparent resin such as epoxy or acrylic, a photocurable transparent resin, or the like can be used. The insulating layer 7 can be formed by applying such a transparent resin so as to cover the first connection line 31 by a known coating method, screen printing method, ink jet printing method, or the like. Further, the insulating layer 7 can be formed using an inorganic insulating material such as silicon oxide by a PVD method such as a sputtering method, a vacuum evaporation method, or an ion plating method, a CVD method, or the like. Further, the insulating layer 7 can be formed by photolithography using a transparent insulating material having photosensitivity. In addition, the insulating layer 7 can also be formed by sticking a transparent film of polyester resin or the like on the one surface S of the substrate 2 so as to cover at least the first connection line 31. The thickness of the insulating layer 7 is not particularly limited, and can be, for example, about 0.1 μm to 50 μm. Moreover, although the external shape of the insulating layer 7 is rectangular in FIG. 4, it is not restricted to this, For example, it can be set as various shapes, such as polygonal shape and circular shape.
接続部材８は、絶縁層７の上面を横切るようにして、隣り合う第２電極セル４０の第２導体線Ｌ２同士を電気的に接続している。よって、第１接続線３０と接続部材８とは、間に絶縁層７が配置されることで、基板２の一方面Ｓ上で交差する際に互いに絶縁されている。本実施形態の接続部材８は、線状の第２接続線４１により構成され、第２接続線４１が隣り合う第２電極セル４０の間に１本又は複数本設けられている。第２接続線４１の形状は、第１接続線３１と同様に、一方向に延びる直線的な形状であってもよいし、屈曲した形状（Ｌ字状、ジグザグ状など）であってもよい。第２接続線４１は、直線的に延びている場合には、第２導体線Ｌ２と同方向（Ｕ方向又はＶ方向）を向いており、屈曲している場合には、それぞれ直線的に延びる構成部分４１Ａが第２導体線Ｌ２と同方向（Ｕ方向又はＶ方向）を向いていることが好ましい。また、第２接続線４１（第２接続線４１が屈曲している場合には、直線的に延びる各構成部分４１Ａ）は、いずれかの第２導体線Ｌ２の延長上に位置して、当該第２導体線Ｌ２と１本の線状となっていることが好ましい。第２接続線４１は、第１導体線Ｌ１及び第２導体線Ｌ２、第１接続線３１と同じ材料で形成されていても異なる材料で形成されていてもよい。 The connecting member 8 electrically connects the second conductor lines L2 of the adjacent second electrode cells 40 so as to cross the upper surface of the insulating layer 7. Therefore, the first connection line 30 and the connection member 8 are insulated from each other when intersecting on the one surface S of the substrate 2 by disposing the insulating layer 7 therebetween. The connection member 8 of the present embodiment is configured by a linear second connection line 41, and one or more second connection lines 41 are provided between adjacent second electrode cells 40. Similarly to the first connection line 31, the shape of the second connection line 41 may be a linear shape extending in one direction, or may be a bent shape (L shape, zigzag shape, etc.). . The second connection line 41 faces the same direction (U direction or V direction) as the second conductor line L2 when extending linearly, and extends linearly when bent. It is preferable that the constituent portion 41A faces the same direction (U direction or V direction) as the second conductor line L2. Further, the second connection line 41 (each component 41A that extends linearly when the second connection line 41 is bent) is positioned on the extension of any one of the second conductor lines L2, and It is preferable that the second conductor line L2 and one line are formed. The second connection line 41 may be formed of the same material as the first conductor line L1, the second conductor line L2, and the first connection line 31, or may be formed of a different material.
本実施形態では、第１接続線３１及び第２接続線４１は、タッチパネル１を上方又は下方から見た場合に、交差することによって複数の格子Ｋが組み合わされた網目を形成するように配線されている。第１接続線３１は絶縁層７の下方に、第２接続線４１は絶縁層７の上方に、それぞれ形成されているために互いに非接触であるが、見かけ上、網目状となるように配線されることにより、第１電極３と第２電極４とが交差する部分に、周りの第１電極セル３０及び第２電極セル４０を構成する格子Ｋと同形状の複数の格子Ｋが一様に配置される。これにより、基板２の一方面Ｓ上に、第１電極セル３０、第２電極セル、第１接続線３１及び第２接続線４１により見た目が全体的に均一な網目状パターンが形成されるので、第１電極３及び第２電極４のパターン形状を目立ちにくくすることができ、タッチパネル１の視認性を向上させることができる。 In the present embodiment, the first connection line 31 and the second connection line 41 are wired so as to form a mesh in which a plurality of lattices K are combined by intersecting when the touch panel 1 is viewed from above or below. ing. Since the first connection line 31 is formed below the insulating layer 7 and the second connection line 41 is formed above the insulating layer 7, the first connection line 31 is not in contact with each other. As a result, a plurality of lattices K having the same shape as the lattices K constituting the surrounding first electrode cell 30 and second electrode cell 40 are uniformly formed at the intersection of the first electrode 3 and the second electrode 4. Placed in. Thereby, on the one surface S of the substrate 2, a net-like pattern having a uniform appearance as a whole is formed by the first electrode cell 30, the second electrode cell, the first connection line 31, and the second connection line 41. The pattern shapes of the first electrode 3 and the second electrode 4 can be made inconspicuous, and the visibility of the touch panel 1 can be improved.
さらに、本実施形態では、第１電極セル３０の４つの辺部のうち、第２電極セル４０と対向する辺部に、対向する第２電極セル４０に向けて第１導体線Ｌ１が張り出す張出部３２が複数設けられているとともに、第２電極セル３０の４つの辺部のうち、第１電極セル３０と対向する辺部にも、対向する第１電極セル３０に向けて第２導体線Ｌ２が張り出す張出部４２が複数設けられている。これらの張出部３２，４２は、互い違いとなるよう交互に設けられるのが好ましいが、必ずしも互い違いである必要はない。これらの張出部３２，４２が、第１電極セル３０及び第２電極セル４０の第１導体線Ｌ及び第２導体線Ｌ２と格子Ｋを形成することで、第１電極セル３０及び第２電極セル４０の隙間が格子Ｋで敷き詰められる。よって、第１電極セル３０及び第２電極セル４０の境界が目立たなくなるので、タッチパネル１の視認性をより一層向上させることができる。 Furthermore, in the present embodiment, the first conductor line L <b> 1 projects toward the second electrode cell 40 facing the side facing the second electrode cell 40 among the four sides of the first electrode cell 30. A plurality of overhang portions 32 are provided, and among the four sides of the second electrode cell 30, the side facing the first electrode cell 30 is also second toward the first electrode cell 30 facing the second electrode cell 30. A plurality of overhang portions 42 from which the conductor line L2 projects are provided. These overhang portions 32 and 42 are preferably provided alternately so as to be alternated, but are not necessarily alternate. These overhang portions 32 and 42 form a grid K with the first conductor line L and the second conductor line L2 of the first electrode cell 30 and the second electrode cell 40, so that the first electrode cell 30 and the second electrode cell The gaps between the electrode cells 40 are spread with a lattice K. Therefore, since the boundary between the first electrode cell 30 and the second electrode cell 40 becomes inconspicuous, the visibility of the touch panel 1 can be further improved.
なお、上記した説明及び以下の説明において、網目状とは、第１導体線Ｌ１、第２導体線Ｌ２、第１接続線３１、第２接続線４１などの線と線とが見かけ上も含め交点を有するように交差していることに加えて、線が交わる部分において少なくとも一方の線が断続しているために線と線とが交点を有さないが交差していることも含んでいる。 In the above description and the following description, the mesh shape includes apparently lines and lines such as the first conductor line L1, the second conductor line L2, the first connection line 31, and the second connection line 41. In addition to intersecting so as to have an intersection, it also includes that the line does not have an intersection but intersects because at least one line is interrupted at the intersection of the line .
次に、上記構成のタッチパネル１を製造する方法を説明する。まず、基板２を洗浄などし、第１電極３や第２電極４が形成できるように準備する。基板２は、必要に応じて所望の形状にカットする。 Next, a method for manufacturing the touch panel 1 having the above configuration will be described. First, the substrate 2 is cleaned and prepared so that the first electrode 3 and the second electrode 4 can be formed. The substrate 2 is cut into a desired shape as necessary.
そして、図５に示すように、基板２の一方面Ｓ上に、第１電極セル３０の第１導体線Ｌ１及び第１接続線３１と、第２電極セル４０の第２導体線Ｌ２とを形成する（導体線形成工程）。第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２の形成方法としては、フォトリソグラフィを使用することができる。例えば、基板２の一方面Ｓ上に銅や銀などの金属薄膜を成膜した後、金属薄膜の表面に感光性レジストを薄く塗布し加熱する。レジストの塗布面にパターンマスクを配置し、その上から紫外線を所定時間照射して露光することで、露光された部分と露光されていない部分からなるパターンを作製する。そして、現像液を用いて未露光の部分のレジストを除去してレジストパターンを形成し、金属薄膜の露出部分に対してエッチングを行って基板２上から除去し、基板２上に第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２の配線パターンを形成する。その後、金属薄膜上の余分なレジストを除去することで、第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２が形成される。金属薄膜の成膜は、スパッタリングや真空蒸着などの成膜方法で行われる。また、エッチングは、酸や酸化剤などによる湿式エッチング、又は、レーザーアブレーションや腐食性ガスを用いた乾式エッチングで行われる。 Then, as shown in FIG. 5, the first conductor line L <b> 1 and the first connection line 31 of the first electrode cell 30 and the second conductor line L <b> 2 of the second electrode cell 40 are disposed on the one surface S of the substrate 2. Form (conductor wire forming step). As a method of forming the first conductor line L1, the first connection line 31, and the second conductor line L2, photolithography can be used. For example, after forming a metal thin film such as copper or silver on one surface S of the substrate 2, a photosensitive resist is thinly applied to the surface of the metal thin film and heated. A pattern mask is arranged on the resist coating surface, and a pattern composed of an exposed portion and an unexposed portion is produced by irradiating with ultraviolet rays for a predetermined time from above. Then, a resist pattern is formed by removing the unexposed portion of the resist using a developing solution, and etching is performed on the exposed portion of the metal thin film to remove it from the substrate 2, and the first conductor line is formed on the substrate 2. A wiring pattern of L1, the first connection line 31, and the second conductor line L2 is formed. Then, the 1st conductor line L1, the 1st connection line 31, and the 2nd conductor line L2 are formed by removing the excess resist on a metal thin film. The metal thin film is formed by a film forming method such as sputtering or vacuum evaporation. Etching is performed by wet etching using an acid or an oxidizing agent, or dry etching using laser ablation or corrosive gas.
なお、第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２の形成時には、第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２の経年劣化を防止するために防錆層を表面に設けることが好ましい。防錆層は、例えば、基板２の一方面Ｓ上に金属薄膜を形成する際に、金属薄膜の表面にニッケル銅（ＮｉＣｕ）などの防錆作用を有する金属を薄膜として堆積させることで、形成することができる。 In forming the first conductor line L1, the first connection line 31, and the second conductor line L2, rust prevention is performed to prevent the first conductor line L1, the first connection line 31, and the second conductor line L2 from aging. It is preferable to provide a layer on the surface. For example, when forming a metal thin film on one surface S of the substrate 2, the rust preventive layer is formed by depositing a metal having a rust preventive action such as nickel copper (NiCu) as a thin film on the surface of the metal thin film. can do.
また、第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２の形成時には、メッシュ状にパターニングされる第１、第２電極セル３０，４０（第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２）のインビジブル性（電極有無の差異が不可視）を悪化させる金属光沢を抑えるために黒化処理を行うことが好ましい。この黒化処理は、例えば、基板２の一方面Ｓ上に金属薄膜を形成する際に、基板２の一方面Ｓ又は基板２の一方面Ｓに成膜された金属薄膜の表面を、黒色などの光の反射を抑制可能な低反射色に変色させることで行うことができる。基板２の一方面Ｓや金属薄膜の表面は、例えば金属薄膜をスパッタリングや真空蒸着などで基板２の一方面Ｓに成膜する時に、酸素や窒素などのガスをチャンバー内に流し、金属の酸化や窒化により生成される生成物質を薄膜として、金属薄膜の最下層又は最表層に堆積させることで、黒色などの低反射色に変色させることができる。これにより、エッチング及びレジスト除去後の第１導体線Ｌ１、第２導体線Ｌ２及び第１接続線３１は、黒化処理により形成された黒化層を、その表面又は裏面（基板２との境界面）に有する。その結果、第１導体線Ｌ１、第２導体線Ｌ２及び第１接続線３１の金属光沢を抑えることができるので、第１導体線Ｌ１、第２導体線Ｌ２及び第１接続線３１のインビジブル性を良好とすることができる。なお、金属薄膜を基板２の一方面Ｓに成膜する時に、光反射率の低い金属を金属薄膜の表面又は裏面（基板２との境界面）に堆積することで、基板２の一方面Ｓや金属薄膜の表面を黒色などの低反射色に変色させてもよい。 In addition, when the first conductor line L1, the first connection line 31, and the second conductor line L2 are formed, the first and second electrode cells 30, 40 (first conductor line L1, first connection line) patterned in a mesh shape. It is preferable to perform a blackening treatment in order to suppress the metallic luster that deteriorates the invisible property of 31 and the second conductor line L2) (the difference between the presence and absence of electrodes is invisible). In this blackening process, for example, when a metal thin film is formed on one surface S of the substrate 2, the surface of the metal thin film formed on the one surface S of the substrate 2 or the one surface S of the substrate 2 is blackened. This can be done by changing the color to a low reflection color that can suppress the reflection of light. One surface S of the substrate 2 or the surface of the metal thin film is formed by flowing a gas such as oxygen or nitrogen into the chamber when the metal thin film is formed on the one surface S of the substrate 2 by sputtering or vacuum deposition, for example. By depositing the product produced by nitriding or nitriding as a thin film on the lowermost layer or the outermost layer of the metal thin film, the color can be changed to a low reflection color such as black. As a result, the first conductor line L1, the second conductor line L2, and the first connection line 31 after etching and resist removal have the blackened layer formed by the blackening treatment applied to the front surface or the back surface (the boundary with the substrate 2). Surface). As a result, the metallic luster of the first conductor line L1, the second conductor line L2, and the first connection line 31 can be suppressed, so that the first conductor line L1, the second conductor line L2, and the first connection line 31 are invisible. Can be good. Note that when the metal thin film is formed on the one surface S of the substrate 2, a metal having low light reflectivity is deposited on the front surface or the back surface (boundary surface with the substrate 2) of the metal thin film, whereby the one surface S of the substrate 2 is obtained. Alternatively, the surface of the metal thin film may be changed to a low reflection color such as black.
また、第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２の形成後、もしくは、後述する第２接続線４１の形成後、硫酸や水酸化ナトリウム水溶液などの薬液に各導体線Ｌ１，Ｌ２及び各接続線３１，４１の表面を浸漬させて、黒色などの低反射色に変色させることでも、黒化処理を行うことができる。その他、めっきなどにより、各導体線Ｌ１，Ｌ２及び各接続線３１，４１上に、酸化銅などの光反射率が低い酸化物などを堆積させることでも、黒化処理を行うことができる。 In addition, after the formation of the first conductor line L1, the first connection line 31, and the second conductor line L2, or after the formation of the second connection line 41 described later, each conductor line L1 is applied to a chemical solution such as sulfuric acid or a sodium hydroxide aqueous solution. , L2 and the surfaces of the connection lines 31 and 41 can be dipped to change the color to a low reflection color such as black. In addition, the blackening treatment can also be performed by depositing an oxide having a low light reflectance such as copper oxide on the conductor lines L1 and L2 and the connection lines 31 and 41 by plating or the like.
なお、第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２の形成方法としては、上記以外のフォトリソグラフィを使用してもよい。例えば、銀インクのような感光性を有する導電性インクを用いたフォトリソグラフィによっても、第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２を形成することができる。また、フォトリソグラフィによる方法に限定されず、銀、金、白金、パラジウム、銅、カーボンなどの極微細な導電性粒子を含む導電性インクや、ＰＥＤＯＴ・ＰＳＳのような透明導電性樹脂を基板２上にスクリーン印刷やグラビア印刷、インクジェット印刷などの公知の印刷方法を用いて細線パターン状に印刷することでも、第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２を形成することもできる。 In addition, as a formation method of the 1st conductor line L1, the 1st connection line 31, and the 2nd conductor line L2, you may use photolithography other than the above. For example, the first conductor line L1, the first connection line 31, and the second conductor line L2 can be formed also by photolithography using conductive ink having photosensitivity such as silver ink. Further, the method is not limited to photolithography, and a conductive ink containing extremely fine conductive particles such as silver, gold, platinum, palladium, copper, and carbon, or a transparent conductive resin such as PEDOT / PSS is used for the substrate 2. The first conductor line L1, the first connection line 31, and the second conductor line L2 may be formed by printing in a fine line pattern using a known printing method such as screen printing, gravure printing, and ink jet printing. it can.
各配線５，６は、第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２と一緒に上記方法で基板２の一方面Ｓ上に形成してもよいし、第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２を形成した後、配線印刷用の導電インクを例えばスクリーン印刷などの公知の印刷方法を用いて基板２の一方面Ｓ上に細線状に印刷することで形成してもよい。ただし、各配線５，６を、第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２と同じ材料で一括して基板２の一方面Ｓ上に形成すれば、効率よく形成することが可能である。 The wirings 5 and 6 may be formed on the one surface S of the substrate 2 together with the first conductor line L1, the first connection line 31, and the second conductor line L2 by the above method, or the first conductor line L1. After forming the first connection line 31 and the second conductor line L2, the conductive ink for wiring printing is printed on the one surface S of the substrate 2 in a thin line shape using a known printing method such as screen printing. May be formed. However, if the wirings 5 and 6 are collectively formed on the one surface S of the substrate 2 with the same material as the first conductor line L1, the first connection line 31, and the second conductor line L2, they can be efficiently formed. Is possible.
導体線形成工程の後、図６に示すように、絶縁層７を、基板２の一方面Ｓの少なくとも第１接続線３１を覆うようにして設ける（絶縁層形成工程）。絶縁層７の形成方法としては、上記したスクリーン印刷やフォトリソグラフィなどによる方法を用いることができる。 After the conductor wire forming step, as shown in FIG. 6, the insulating layer 7 is provided so as to cover at least the first connection line 31 on the one surface S of the substrate 2 (insulating layer forming step). As a method for forming the insulating layer 7, the above-described methods such as screen printing and photolithography can be used.
絶縁層形成工程の後、図４に示すように、絶縁層７の表面に接続部材８として第２接続線４１を形成する（接続部材形成工程）。第２接続線４１の形成方法としては、銀、金、白金、パラジウム、銅、カーボンなどの極微細な導電性粒子を含む導電性インクや、ＰＥＤＯＴ・ＰＳＳなどのような透明導電性樹脂を、例えばスクリーン印刷やグラビア印刷、インクジェット印刷などの公知の印刷方法を用いて細線パターン状に印刷することで形成できる。その他、銀インクのような感光性を有する導電性インクを用いたフォトリソグラフィによっても第２接続線４１を形成することができる。また、カーボンナノチューブやカーボンナノホーン、カーボンナノワイヤ、カーボンナノファイバー、グラファイトフィブリルなどの極細導電炭素繊維、あるいは、Ａｇナノワイヤーなどの極細導電繊維をバインダーとして機能するポリマー材料に分散させた複合材を塗布することによっても第２接続線４１を形成することができる。 After the insulating layer forming step, as shown in FIG. 4, the second connection line 41 is formed as the connecting member 8 on the surface of the insulating layer 7 (connecting member forming step). As a method for forming the second connection line 41, a conductive ink containing extremely fine conductive particles such as silver, gold, platinum, palladium, copper, and carbon, or a transparent conductive resin such as PEDOT / PSS, For example, it can be formed by printing in a fine line pattern using a known printing method such as screen printing, gravure printing, and ink jet printing. In addition, the second connection line 41 can also be formed by photolithography using conductive ink having photosensitivity such as silver ink. Also, a composite material in which ultrafine conductive carbon fibers such as carbon nanotubes, carbon nanohorns, carbon nanowires, carbon nanofibers, and graphite fibrils, or ultrafine conductive fibers such as Ag nanowires are dispersed in a polymer material that functions as a binder is applied. Thus, the second connection line 41 can be formed.
以上のように製造されるタッチパネル１において、タッチ位置の検出方法は、従来の静電容量式のタッチパネルと同様であり、第１電極セル３０及び第２電極セル４０の接触位置において人体の静電容量に基づく電圧等の変化を検出することによって、接触位置の座標が演算される。 In the touch panel 1 manufactured as described above, the touch position detection method is the same as that of the conventional capacitive touch panel, and the human body electrostatics at the contact position of the first electrode cell 30 and the second electrode cell 40. By detecting a change in voltage or the like based on the capacitance, the coordinates of the contact position are calculated.
本実施形態に係るタッチパネル１の製造方法においては、複数の導体線Ｌ１，Ｌ２を交差させることで網目状の電極３，４を形成しているので、希少金属であるインジウムの使用を避けることができ、ＩＴＯを用いるよりも基板２上に形成される電極パターンの低抵抗化を図ることができ、かつ、電極パターンの視認性も向上させることができるので、静電容量式のタッチパネルとして好適に用いることができる。また、第１電極３及び第２電極４のいずれもが基板２の一方面Ｓに形成されているので、タッチパネル１の構造の簡略化と全体的な厚み・重さの軽減（薄型化・軽量化）を実現できるという優位性を有する。 In the manufacturing method of the touch panel 1 according to the present embodiment, since the mesh-like electrodes 3 and 4 are formed by intersecting a plurality of conductor lines L1 and L2, use of indium which is a rare metal is avoided. It is possible to reduce the resistance of the electrode pattern formed on the substrate 2 rather than using ITO, and the visibility of the electrode pattern can be improved, so that it is suitable as a capacitive touch panel. Can be used. In addition, since both the first electrode 3 and the second electrode 4 are formed on the one surface S of the substrate 2, the structure of the touch panel 1 is simplified and the overall thickness and weight are reduced (thinning and light weight). It has the advantage that it can be realized.
さらに、各電極３，４を構成する第１導体線Ｌ１、第１接続線３１及び第２導体線Ｌ２に加えて、各電極３，４を静電容量検出回路（図示省略）に接続する各配線５，６を同時に一括して基板２の一方面Ｓ上に形成しているので、タッチパネル製造のための工程を少なくすることができ、タッチパネル１を効率よく製造することができる。 Further, in addition to the first conductor line L1, the first connection line 31, and the second conductor line L2 constituting each electrode 3, 4, each electrode 3, 4 is connected to a capacitance detection circuit (not shown). Since the wirings 5 and 6 are simultaneously formed on the one surface S of the substrate 2, the steps for manufacturing the touch panel can be reduced, and the touch panel 1 can be manufactured efficiently.
以上、本発明の一実施形態について説明したが、本発明の具体的な態様は上記実施形態に限定されない。例えば、上記実施形態においては、導体線形成工程、絶縁層形成工程及び接続部材形成工程の順序で行われている、つまり、基板２の一方面Ｓ上に、第１電極セル３０及び第２電極セル４０の第１導体線Ｌ１及び第２導体線Ｌ２と第１接続線３１とを形成した後、絶縁層７、第２接続線４１を順次設けている。これに対して、基板２の一方面Ｓ上に、第２接続線４１を設けた後、第２接続線４１上に絶縁層７を設け、絶縁層７上に第１接続線３１が位置するとともに、第２接続線４１により隣り合う第２電極セル４０の第２導体線Ｌ２同士が電気的に接続されるように、第１電極セル３０及び第２電極セル４０の第１導体線Ｌ１及び第２導体線Ｌ２と第１接続線３１とを形成する、つまりは、接続部材形成工程、絶縁層形成工程及び導体線形成工程の順序で行うようにしてもよい。 As mentioned above, although one Embodiment of this invention was described, the specific aspect of this invention is not limited to the said embodiment. For example, in the above embodiment, the conductor electrode forming step, the insulating layer forming step, and the connecting member forming step are performed in the order, that is, the first electrode cell 30 and the second electrode on the one surface S of the substrate 2. After the first conductor line L1 and the second conductor line L2 of the cell 40 and the first connection line 31 are formed, the insulating layer 7 and the second connection line 41 are sequentially provided. On the other hand, after providing the second connection line 41 on the one surface S of the substrate 2, the insulating layer 7 is provided on the second connection line 41, and the first connection line 31 is located on the insulating layer 7. In addition, the first conductor lines L1 of the first electrode cell 30 and the second electrode cell 40 and the second conductor lines L2 of the second electrode cells 40 adjacent to each other by the second connection line 41 are electrically connected. The second conductor line L2 and the first connection line 31 may be formed, that is, the connection member forming step, the insulating layer forming step, and the conductor line forming step may be performed in this order.
また、上記実施形態においては、第２接続線４１は、接続する第２電極セル４０の第２導体線Ｌ２の延長上に位置して、当該第２導体線Ｌ２と１本の線状となるように配置されているが、隣り合う第２電極セル４０の第２導体線Ｌ２同士が接続され、また、絶縁層７上に設けられて第１電極セル３０の第１導体線Ｌ１や第１接続線３１と絶縁されていれば、多少、ずれた位置に配置されたとしても動作上の問題は生じない。また、第２接続線４１は第２電極セル４０の各第２導体線Ｌ２と同方向（Ｕ方向又はＶ方向）が好ましいが、動作上又は視認性に問題ない範囲で角度が多少ずれていても構わない。 Moreover, in the said embodiment, the 2nd connection line 41 is located on the extension of the 2nd conductor line L2 of the 2nd electrode cell 40 to connect, and becomes the said 2nd conductor line L2 and one line shape. However, the second conductor lines L2 of the adjacent second electrode cells 40 are connected to each other, and are provided on the insulating layer 7 so that the first conductor lines L1 and the first conductor lines L1 of the first electrode cells 30 are connected to each other. As long as it is insulated from the connection line 31, there is no problem in operation even if it is arranged at a slightly shifted position. Further, the second connection line 41 is preferably in the same direction (U direction or V direction) as each second conductor line L2 of the second electrode cell 40, but the angle is slightly shifted within a range that does not cause any problem in operation or visibility. It doesn't matter.
また、上記実施形態においては、第１導体線Ｌ１、第２導体線Ｌ２、第１接続線３１及び第２接続線４１の線幅が同じに形成されているが、第１接続線３１や第２接続線４１の線幅を、第１導体線Ｌ１及び第２導体線Ｌ２の線幅と異なるように形成されてもよい。例えば、第２接続線４１の線幅が第１導体線Ｌ１及び第２導体線Ｌ２の線幅よりも太く形成される場合に、第１接続線３１の線幅を第１導体線Ｌ１及び第２導体線Ｌ２の線幅よりも細くしてもよい。この実施形態によると、電極パターンの電極セル部分の網目領域と、電極セル３，４を接続する接続部分の網目領域との光線透過率の差を小さくすることができるので、より一層、電極のパターン形状を目立ちにくくすることができ、タッチパネル１の視認性を向上させることができる。なお、第２接続線４１の線幅が第１導体線Ｌ１及び第２導体線Ｌ２の線幅よりも細く形成される場合は、第１接続線３１の線幅を第１導体線Ｌ１及び第２導体線Ｌ２の線幅よりも太くすることで、上記と同様に視認性を向上することができる。 In the above embodiment, the first conductor line L1, the second conductor line L2, the first connection line 31, and the second connection line 41 are formed to have the same line width. The line width of the two connection lines 41 may be different from the line widths of the first conductor line L1 and the second conductor line L2. For example, when the line width of the second connection line 41 is formed thicker than the line widths of the first conductor line L1 and the second conductor line L2, the line width of the first connection line 31 is set to the first conductor line L1 and the second conductor line L1. You may make it narrower than the line | wire width of 2 conductor line L2. According to this embodiment, the difference in light transmittance between the mesh area of the electrode cell portion of the electrode pattern and the mesh area of the connection portion connecting the electrode cells 3 and 4 can be reduced. The pattern shape can be made inconspicuous, and the visibility of the touch panel 1 can be improved. When the line width of the second connection line 41 is formed to be narrower than the line widths of the first conductor line L1 and the second conductor line L2, the line width of the first connection line 31 is set to the first conductor line L1 and the second conductor line L1. Visibility can be improved similarly to the above by making it thicker than the line width of the two conductor lines L2.
さらに、例えば、第２接続線４１の線幅が第１導体線Ｌ１及び第２導体線Ｌ２の線幅よりも太く(細く)形成された場合において、第１導体線Ｌ１及び第２導体線Ｌ２の少なくとも一部（所々）の線幅を、第２接続線４１の線幅と同じく太く(細く)するようにしてもよい。これにより、線幅が太く（細く）なった箇所が均一に配置されると、電極パターンの電極セル部分の網目領域と、電極セル３，４を接続する接続部分の網目領域との光線透過率の差を小さくしたうえで、見た目もより均一にできるため、より一層、電極のパターン形状を目立ちにくくすることができ、タッチパネル１の視認性を向上させることができる。第１接続線３１の線幅が第１導体線Ｌ１及び第２導体線Ｌ２の線幅と異なる場合も同様の構成が可能である。なお、第１電極セル３０の第１導体線Ｌ１の線幅と第２電極セル４０の第２導体線Ｌ２の線幅は厳密に同一でなくてもよいが、見た目の均一性の観点から略等しい線幅とすることが望ましい。 Furthermore, for example, when the line width of the second connection line 41 is formed thicker (thinner) than the line widths of the first conductor line L1 and the second conductor line L2, the first conductor line L1 and the second conductor line L2 are formed. The line width of at least a part (location) of the second connection line 41 may be made as thick (thin) as the line width of the second connection line 41. Thus, when the portions where the line width is thick (thin) are uniformly arranged, the light transmittance between the mesh region of the electrode cell portion of the electrode pattern and the mesh region of the connection portion connecting the electrode cells 3 and 4 In addition, since the appearance can be made more uniform, the pattern shape of the electrode can be made less conspicuous and the visibility of the touch panel 1 can be improved. The same configuration is possible when the line width of the first connection line 31 is different from the line widths of the first conductor line L1 and the second conductor line L2. The line width of the first conductor line L1 of the first electrode cell 30 and the line width of the second conductor line L2 of the second electrode cell 40 do not have to be exactly the same, but are approximately from the viewpoint of visual uniformity. It is desirable to have the same line width.
また、上記実施形態においては、接続部材８を線状の第２接続線４１で構成しているが、図７に示すように、透明導電膜８０で構成してもよい。接続部材８を透明導電膜８０で構成する場合には、図８に示すように、第１電極セル３０の第１導体線Ｌ１及び第１接続線３１と、第２電極セル４０の第２導体線Ｌ２とを基板２の一方面Ｓ上に形成した後（導体線形成工程）、図９に示すように、絶縁層７を、基板２の一方面Ｓの少なくとも第１接続線３１を覆うようにして設け（絶縁層形成工程）、図７に示すように、絶縁層７上を横切るようにして絶縁層７よりも幅は短いが長さが長い透明導電膜８０を設けることで、透明導電膜８０により隣り合う第２電極セル４０の第２導体線Ｌ２同士を電気的に接続している（接続部材形成工程）。第１接続線３１及び透明導電膜８０は、間に絶縁層７が配置されることで、基板２の一方面Ｓ上で交差する際に互いに絶縁されている。 Moreover, in the said embodiment, although the connection member 8 is comprised by the linear 2nd connection line 41, you may comprise by the transparent conductive film 80, as shown in FIG. When the connection member 8 is formed of the transparent conductive film 80, as shown in FIG. 8, the first conductor line L1 and the first connection line 31 of the first electrode cell 30 and the second conductor of the second electrode cell 40 are used. After forming the line L2 on the one surface S of the substrate 2 (conductor line forming step), as shown in FIG. 9, the insulating layer 7 covers at least the first connection line 31 on the one surface S of the substrate 2. 7 (insulating layer forming step). As shown in FIG. 7, a transparent conductive film 80 having a width shorter than that of the insulating layer 7 but longer than that of the insulating layer 7 is provided so as to cross over the insulating layer 7. The second conductor lines L2 of the adjacent second electrode cells 40 are electrically connected by the film 80 (connection member forming step). The first connection line 31 and the transparent conductive film 80 are insulated from each other when intersecting on the one surface S of the substrate 2 by disposing the insulating layer 7 therebetween.
接続部材８として透明導電膜８０を用いる場合には、隣り合う第１電極セル３０の第１導体線Ｌ同士を電気的に接続する複数の第１接続線３１が、複数の格子Ｋが組み合わされた網目を形成するように配線されるのが好ましい。すなわち、第１電極３及び第２電極４が交差する部分に、周りの第１電極セル３０及び第２電極セル４０を構成する格子Ｋと同形状の複数の格子Ｋが一様に配置されるのが好ましい。これにより、基板２の一方面Ｓ上に、第１電極セル３０及び第２電極セル４０と、第１接続線３１とにより見た目が全体的に均一な網目状パターンが形成される。よって、第１電極３及び第２電極４のパターン形状を目立ちにくくすることができ、タッチパネル１の視認性を向上させることができる。 When the transparent conductive film 80 is used as the connection member 8, a plurality of first connection lines 31 that electrically connect the first conductor lines L of the adjacent first electrode cells 30 are combined with a plurality of grids K. Wiring is preferably performed so as to form a mesh. That is, a plurality of lattices K having the same shape as the lattices K constituting the surrounding first electrode cell 30 and the second electrode cell 40 are uniformly arranged at a portion where the first electrode 3 and the second electrode 4 intersect. Is preferred. As a result, on the one surface S of the substrate 2, a mesh pattern having a uniform appearance as a whole is formed by the first electrode cell 30, the second electrode cell 40, and the first connection line 31. Therefore, the pattern shape of the 1st electrode 3 and the 2nd electrode 4 can be made not conspicuous, and the visibility of the touch panel 1 can be improved.
なお、第１接続線３１の網目パターンは、図７に示すように、第１接続線３１と第２電極セル４０の第２導体線Ｌ２との隙間がまとまって現れるように形成すると、隙間が集中して目立ってしまい、タッチパネル１の視認性の悪影響を与える。よって、第１接続線３１と第２電極セル４０の第２導体線Ｌ２との隙間が集中せず、より目立ちにくいように多少ばらけて現れるように第１接続線３１の網目パターンを形成することが好ましい。 As shown in FIG. 7, when the mesh pattern of the first connection line 31 is formed so that the gap between the first connection line 31 and the second conductor line L2 of the second electrode cell 40 appears together, the gap is not formed. Concentrating and conspicuous, adversely affecting the visibility of the touch panel 1. Therefore, the mesh pattern of the first connection lines 31 is formed so that the gaps between the first connection lines 31 and the second conductor lines L2 of the second electrode cells 40 do not concentrate and appear somewhat scattered so as to be less noticeable. It is preferable.
透明導電膜８０の材料としては、インジウム錫酸化物（ＩＴＯ）、酸化インジウム、アンチモン添加酸化錫、フッ素添加酸化錫、アルミニウム添加酸化亜鉛、カリウム添加酸化亜鉛、シリコン添加酸化亜鉛や、酸化亜鉛−酸化錫系、酸化インジウム−酸化錫系、酸化亜鉛−酸化インジウム−酸化マグネシウム系、酸化亜鉛、スズ酸化膜などの透明導電材料、あるいは、スズ、銅、アルミニウム、ニッケル、クロムなどの金属材料、金属酸化物材料を例示することができ、これら２種以上を複合して形成してもよい。また、酸やアルカリに弱い金属単体でも透明導電膜８０の材料として採用することができる。また、カーボンナノチューブやカーボンナノホーン、カーボンナノワイヤ、カーボンナノファイバー、グラファイトフィブリルなどの極細導電炭素繊維、あるいは、銀素材からなる極細導電繊維をバインダーとして機能するポリマー材料に分散させた複合材を、透明導電膜８０の材料として用いることもできる。ここでポリマー材料としては、ポリアニリン、ポリピロール、ポリアセチレン、ポリチオフェン、ポリフェニレンビニレン、ポリフェニレンスルフィド、ポリｐ−フェニレン、ポリ複素環ビニレン、ＰＥＤＯＴ・ＰＳＳなどのような導電性ポリマーを採用することができる。また、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）、ポリエーテルサルフォン（ＰＥＳ）、ポリエーテルエーテルケトン（ＰＥＥＫ）、ポリカーボネート（ＰＣ）、ポリプロピレン（ＰＰ）、ポリアミド（ＰＡ）、アクリル、ポリイミド、エポキシ樹脂、フェノール樹脂、脂肪族環状ポリオレフィン、ノルボルネン系の熱可塑性透明樹脂などの非導電性ポリマーを採用することができる。 Examples of the material for the transparent conductive film 80 include indium tin oxide (ITO), indium oxide, antimony-added tin oxide, fluorine-added tin oxide, aluminum-added zinc oxide, potassium-added zinc oxide, silicon-added zinc oxide, and zinc oxide-oxide. Transparent conductive materials such as tin, indium oxide-tin oxide, zinc oxide-indium oxide-magnesium oxide, zinc oxide, tin oxide film, or metal materials such as tin, copper, aluminum, nickel, chromium, metal oxide Physical materials can be exemplified, and two or more of these materials may be combined to form. Further, a simple metal weak against acid or alkali can be used as the material of the transparent conductive film 80. In addition, a transparent conductive material can be prepared by dispersing ultrafine conductive carbon fibers such as carbon nanotubes, carbon nanohorns, carbon nanowires, carbon nanofibers, and graphite fibrils, or a composite material in which ultrafine conductive fibers made of silver are dispersed in a polymer material that functions as a binder. It can also be used as a material for the film 80. Here, as the polymer material, a conductive polymer such as polyaniline, polypyrrole, polyacetylene, polythiophene, polyphenylene vinylene, polyphenylene sulfide, poly p-phenylene, polyheterocyclic vinylene, PEDOT / PSS or the like can be employed. In addition, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polyetheretherketone (PEEK), polycarbonate (PC), polypropylene (PP), polyamide (PA), acrylic, polyimide, Non-conductive polymers such as epoxy resins, phenol resins, aliphatic cyclic polyolefins, norbornene-based thermoplastic transparent resins can be employed.
透明導電膜８０の形成方法は、スパッタリング法、真空蒸着法、イオンプレーティング法などのＰＶＤ法や、ＣＶＤ法、塗工法、公知の印刷法などを例示することができる。また、透明導電膜８０の厚みは、材料や形成方法により異なるが、塗工法や印刷法などを用いた場合は５０μｍ以下であることが好ましく、１０μｍ以下であることがより好ましい。 Examples of the method for forming the transparent conductive film 80 include PVD methods such as sputtering, vacuum deposition, and ion plating, CVD, coating, and known printing methods. Moreover, although the thickness of the transparent conductive film 80 changes with materials and a formation method, when using a coating method, a printing method, etc., it is preferable that it is 50 micrometers or less, and it is more preferable that it is 10 micrometers or less.
なお、上記した説明では、導体線形成工程、絶縁層形成工程及び接続部材形成工程の順序で行われている、つまり、基板２の一方面Ｓ上に、第１電極セル３０の第１導体線Ｌ１及び第１接続線３１と、第２電極セル４０の第２導体線Ｌ２とを形成した後、絶縁層７及び透明導電膜８０を設けているが、接続部材形成工程、絶縁層形成工程及び導体線形成工程の順序で行われてもよい。具体的には、基板２の一方面Ｓ上に、透明導電膜８０を設けた後、透明導電膜８０上に絶縁層７を設け、絶縁層７上に第１接続線３１が位置するとともに、透明導電膜８０により隣り合う第２電極セル４０の第２導体線Ｌ２同士が電気的に接続されるように、第１電極セル３０の第１導体線Ｌ１及び第１接続線３１と、第２電極セル４０の第２導体線Ｌ２とを形成するようにしてもよい。 In the above description, the conductor wire forming step, the insulating layer forming step, and the connecting member forming step are performed in this order, that is, on the one surface S of the substrate 2, the first conductor wire of the first electrode cell 30. After forming L1 and the first connection line 31 and the second conductor line L2 of the second electrode cell 40, the insulating layer 7 and the transparent conductive film 80 are provided, but the connection member forming step, the insulating layer forming step, You may perform in order of a conductor wire formation process. Specifically, after providing the transparent conductive film 80 on the one surface S of the substrate 2, the insulating layer 7 is provided on the transparent conductive film 80, and the first connection line 31 is positioned on the insulating layer 7, The second conductor lines L2 of the second electrode cells 40 adjacent to each other by the transparent conductive film 80 are electrically connected to each other, the first conductor lines L1 and the first connection lines 31 of the first electrode cells 30, and the second The second conductor line L2 of the electrode cell 40 may be formed.
この図７に示す実施形態においても、第１導体線Ｌ１及び第２導体線Ｌ２の線幅と、第１接続線３１の線幅とを、同じに形成してもよいし、異なるように形成してもよい。 Also in the embodiment shown in FIG. 7, the line widths of the first conductor line L1 and the second conductor line L2 and the line width of the first connection line 31 may be formed the same or different from each other. May be.
また、第１接続線３１の線幅を第１導体線Ｌ１及び第２導体線Ｌ２の線幅よりも太く又は細く形成した場合において、第１導体線Ｌ１及び第２導体線Ｌ２の少なくとも一部（所々）の線幅を、第１接続線３１の線幅と同じく太く又は細くするようにしてもよい。また、第１電極セル３０の第１導体線Ｌ１の線幅と第２電極セル４０の第２導体線Ｌ２の線幅も厳密に同一でなくてもよいが、見た目の均一性の観点から略等しい線幅とすることが望ましい。 Further, when the line width of the first connection line 31 is formed to be thicker or narrower than the line width of the first conductor line L1 and the second conductor line L2, at least a part of the first conductor line L1 and the second conductor line L2 The line width of (some places) may be as thick or narrow as the line width of the first connection line 31. Further, the line width of the first conductor line L1 of the first electrode cell 30 and the line width of the second conductor line L2 of the second electrode cell 40 may not be exactly the same. It is desirable to have the same line width.
また、上記した図４及び図７のいずれの実施形態においても、絶縁層７を、基板２の一方面Ｓの少なくとも第１接続線３１を覆うようにして設けているが、図１０に示すように、基板２の一方面Ｓのほぼ全面に絶縁層７を設けるようにしてもよい。図１０の例では、基板２の一方面Ｓ上に、第１電極セル３０の第１導体線Ｌ１及び第１接続線３１と、第２電極セル４０の第２導体線Ｌ２とを形成した後（図１１）、絶縁層７を第１接続線３１を含めた基板２の一方面Ｓのほぼ全面を覆うようにして設ける。ただし、この際には、第２電極セル４０のＸ方向両側の一部分、つまり、隣り合う第２電極セル４０と接続される側の一部分については第２導体線Ｌ２が露出するように、絶縁層７に開口Ｈを設ける（図１２）。そして、絶縁層７上に透明導電膜８０を配備し、開口Ｈを介して透明導電膜８０により隣り合う第２電極セル４０の第２導体線Ｌ２同士を電気的に接続する。この実施形態によると、基板２の一方面Ｓのほぼ全面に透明な絶縁層７を形成することで、タッチパネル１の色目の均一化を図ることができるので、より視認性が向上したタッチパネル１を形成することができる。なお、図１０の例では、透明導電膜８０により、隣り合う第２電極セル４０の第２導体線Ｌ２同士を電気的に接続しているが、第２接続線４１により第２電極セル４０同士を接続してもよい。 4 and 7, the insulating layer 7 is provided so as to cover at least the first connection line 31 on the one surface S of the substrate 2, as shown in FIG. In addition, the insulating layer 7 may be provided on almost the entire one surface S of the substrate 2. In the example of FIG. 10, after the first conductor line L1 and the first connection line 31 of the first electrode cell 30 and the second conductor line L2 of the second electrode cell 40 are formed on the one surface S of the substrate 2. (FIG. 11) The insulating layer 7 is provided so as to cover almost the entire one surface S of the substrate 2 including the first connection line 31. However, in this case, the insulating layer is formed so that the second conductor line L2 is exposed at a part on both sides in the X direction of the second electrode cell 40, that is, a part on the side connected to the adjacent second electrode cell 40. 7 is provided with an opening H (FIG. 12). Then, a transparent conductive film 80 is provided on the insulating layer 7, and the second conductor lines L <b> 2 of the adjacent second electrode cells 40 are electrically connected to each other through the opening H through the transparent conductive film 80. According to this embodiment, since the transparent insulating layer 7 is formed almost on the entire surface of the one surface S of the substrate 2, the color of the touch panel 1 can be made uniform, so that the touch panel 1 with improved visibility can be obtained. Can be formed. In the example of FIG. 10, the second conductive lines L <b> 2 of the adjacent second electrode cells 40 are electrically connected by the transparent conductive film 80, but the second electrode cells 40 are connected by the second connection line 41. May be connected.
また、上記した図４、図７及び図１０のいずれの実施形態においても、第１電極セル３０及び第２電極セル４０の各導体線Ｌ１，Ｌ２や各接続線３１，４１は、真っ直ぐな直線状であるが、波のような形の波形状や、のこぎりの歯のような形の鋸歯状などの繰り返し形状や、ランダムな線状など、種々の形状とすることができる。 In any of the embodiments shown in FIGS. 4, 7 and 10, the conductor lines L1 and L2 and the connection lines 31 and 41 of the first electrode cell 30 and the second electrode cell 40 are straight lines. However, various shapes such as a wave shape like a wave, a repetitive shape such as a sawtooth shape like a sawtooth, and a random linear shape can be used.
また、上記した図４、図７及び図１０のいずれの実施形態においても、各電極３，４の両端部間での導通性を阻害しない範囲で、各電極セル３０，４０の各導体線Ｌ１，Ｌ２に対して、導体線Ｌ１，Ｌ２を切断する切断部を部分的に設けてもよい。導体線Ｌ１，Ｌ２同士、第１接続線３１及び導体線Ｌ２の間には隙間が形成されているため、各電極セル３０，４０の各導体線Ｌ１，Ｌ２に切断部を設けることにより、電極パターン全体に対して一様に導体線Ｌ１，Ｌ２が途切れる断続部（空白部）が発生する。よって、光線透過率が向上するとともに、電極パターンの見た目をより均一にできるので、視認性をさらに向上させることができる。 Further, in any of the above-described embodiments of FIGS. 4, 7, and 10, each conductor line L1 of each electrode cell 30, 40 is within a range that does not hinder the conductivity between both ends of each electrode 3, 4. , L2 may be partially provided with cutting portions for cutting the conductor lines L1 and L2. Since gaps are formed between the conductor lines L1 and L2, and between the first connection line 31 and the conductor line L2, by providing a cut portion in each conductor line L1 and L2 of each electrode cell 30 and 40, the electrode Intermittent portions (blank portions) in which the conductor lines L1 and L2 are interrupted uniformly occur with respect to the entire pattern. Therefore, the light transmittance is improved and the appearance of the electrode pattern can be made more uniform, so that the visibility can be further improved.
また、上記した図４、図７及び図１０のいずれの実施形態においても、第１電極セル３０と第２電極セル４０との隙間に、電極パターンとは電気的に独立した補助線を設けることができる。補助線は、第１導体線Ｌ１及び第２導体線Ｌ２同士を電気的に接続しないが、第１導体線Ｌ１、第２導体線Ｌ２、第１接続線３１、第２接続線４１及び補助線によって網目が形成されるように配線され、均一な網目状となるように第１電極セル３０と第２電極セル４０との隙間を補完されることで、第１電極３及び第２電極４のパターン形状を目立ちにくくすることができる。 In any of the embodiments shown in FIGS. 4, 7, and 10, an auxiliary line that is electrically independent of the electrode pattern is provided in the gap between the first electrode cell 30 and the second electrode cell 40. Can do. The auxiliary line does not electrically connect the first conductor line L1 and the second conductor line L2, but the first conductor line L1, the second conductor line L2, the first connection line 31, the second connection line 41, and the auxiliary line. By wiring the first electrode cell 30 and the second electrode cell 4 so as to form a mesh, and the gap between the first electrode cell 30 and the second electrode cell 40 is complemented so as to form a uniform mesh shape. The pattern shape can be made inconspicuous.
１ タッチパネル
２ 基板
３ 第１電極
４ 第２電極
５ 第１配線
６ 第２配線
７ 絶縁層
８ 接続部材
３０ 第１電極セル
３１ 第１接続線
４０ 第２電極セル
４１ 第２接続線
８０ 透明導電膜
Ｌ１ 第１導体線
Ｌ２ 第２導体線
DESCRIPTION OF SYMBOLS 1 Touch panel 2 Board | substrate 3 1st electrode 4 2nd electrode 5 1st wiring 6 2nd wiring 7 Insulating layer 8 Connection member 30 1st electrode cell 31 1st connection line 40 2nd electrode cell 41 2nd connection line 80 Transparent conductive film L1 1st conductor wire L2 2nd conductor wire
Claims (7)
前記基板の一方面側に前記第１電極と交差するように配置され、複数の第２導体線を交差させることで形成された複数の第２電極セル及び隣り合う前記第２電極セルの前記第２導体線同士を電気的に接続する接続部材を有する第２電極と、を備えたタッチパネルの製造方法であって、
前記基板の一方面側に、
前記第１導体線と、前記第２導体線と、前記第１接続線と、前記第１電極及び前記第２電極をそれぞれ外部回路に電気的に接続する導体線からなる第１配線及び第２配線と、を同時に形成する導体線形成工程、
前記第１接続線の上方又は下方に配置される絶縁層を形成する絶縁層形成工程、
前記第１接続線との間に前記絶縁層が介される前記接続部材を形成する接続部材形成工程、を備え、
前記接続部材は、少なくとも１本の導体線からなる第２接続線により構成され、前記第１接続線及び前記第２接続線によって網目が形成され、
前記第１接続線の線幅及び前記第２接続線のうち、一方の接続線の線幅が前記第１導体線及び前記第２導体線の線幅よりも太く、他方の接続線の線幅が前記第１導体線及び前記第２導体線の線幅よりも細いタッチパネルの製造方法。 A plurality of first electrode cells arranged on one side of the substrate and formed by intersecting a plurality of first conductor lines and the first conductor lines of the adjacent first electrode cells are electrically connected to each other. A first electrode having a first connection line comprising at least one conductor line;
A plurality of second electrode cells arranged on one surface side of the substrate so as to intersect the first electrode and formed by intersecting a plurality of second conductor lines and the second electrode cells adjacent to each other. A second electrode having a connecting member for electrically connecting two conductor wires, and a manufacturing method of a touch panel,
On one side of the substrate,
A first wiring comprising a first conductor line, a second conductor line, a first connection line, and a first wiring and a second wiring comprising a conductor line electrically connecting the first electrode and the second electrode to an external circuit, respectively; A conductor wire forming step for simultaneously forming wiring;
An insulating layer forming step of forming an insulating layer disposed above or below the first connection line;
A connecting member forming step of forming the connecting member through which the insulating layer is interposed between the first connecting line,
The connection member is constituted by a second connection line made of at least one conductor line, and a mesh is formed by the first connection line and the second connection line,
Of the line width of the first connection line and the second connection line, the line width of one connection line is larger than the line width of the first conductor line and the second conductor line, and the line width of the other connection line Is a manufacturing method of a touch panel thinner than the line width of the first conductor line and the second conductor line .
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| JP6577846B2 (en) * | 2015-11-25 | 2019-09-18 | 株式会社ジャパンディスプレイ | Detection device and display device |
| JP2017207906A (en) * | 2016-05-18 | 2017-11-24 | 日立化成株式会社 | Capacitance touch panel and manufacture method therefor |
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| WO2021196082A1 (en) * | 2020-04-01 | 2021-10-07 | 京东方科技集团股份有限公司 | Touch structure, touch display panel, and electronic device |
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