JP6172796B2 - Led発光装置 - Google Patents
Led発光装置 Download PDFInfo
- Publication number
- JP6172796B2 JP6172796B2 JP2013120609A JP2013120609A JP6172796B2 JP 6172796 B2 JP6172796 B2 JP 6172796B2 JP 2013120609 A JP2013120609 A JP 2013120609A JP 2013120609 A JP2013120609 A JP 2013120609A JP 6172796 B2 JP6172796 B2 JP 6172796B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- light
- main body
- peripheral surface
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005989 resin Polymers 0.000 claims description 49
- 239000011347 resin Substances 0.000 claims description 49
- 230000002093 peripheral effect Effects 0.000 claims description 39
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 13
- 238000009792 diffusion process Methods 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 238000007789 sealing Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 gallium nitride compound Chemical class 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
Description
12 LED本体
13 遮光カバー
14 基板
14a,14b 電極パターン
15 発光素子
16 蛍光体板
16a 上面
17 封止樹脂(封止体)
17a 上面
17b 外周面
18 拡散樹脂
18a 上面
19 周辺素子
20 発光面
21 凹部
22 載置面
23 内周面
24 窓部
25 空隙部
26 反射部
27 第1空隙部
28 第2空隙部
29 周縁部
30 切欠き部
31 マーキング部
32 側壁部
33 接着剤
Claims (5)
- 基板上に発光素子が実装され、樹脂体によって封止されるLED本体と、
該LED本体に装着され、前記発光素子と対向する窓部と前記LED本体の外周面を被覆する側壁部とを有する遮光カバーとを備えたLED発光装置であって、
前記LED本体は、前記発光素子の上面に載置される蛍光体板と、該蛍光体板の上面が露出するように前記基板上を満たす白色系の樹脂体と、前記蛍光体板の上面及び樹脂体の上面を覆う拡散樹脂とを備え、
前記遮光カバーは、少なくとも前記窓部の周縁部が前記LED本体の上面に密接した状態で装着され、前記側壁部の内周面が前記LED本体の外周面に接着されていることを特徴とするLED発光装置。 - 前記遮光カバーは、前記LED本体が収納される凹部と、この凹部と連通する窓部とを備え、
前記凹部には、LED本体が収納された状態で、LED本体の外周面と遮光カバーの側壁部の内周面との間に接着剤が充填される空隙部が形成されている請求項1に記載のLED発光装置。 - 前記空隙部は、前記LED本体の外周面に遮光カバーの内周面が近接している第1空隙部と、前記LED本体の外周面と遮光カバーの内周面との空隙幅が前記第1空隙部より大きい第2空隙部とを備える請求項2に記載のLED発光装置。
- 前記空隙部は、凹部に収納されたLED本体の外周面に沿って設けられ、第1空隙部がLED本体の側面に対応した位置に設けられ、第2空隙部がLED本体の角部に対応した位置に設けられている請求項2又は3に記載のLED発光装置。
- 前記窓部の上方には内周面が外方に傾斜する反射部が形成されている請求項1に記載のLED発光装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013120609A JP6172796B2 (ja) | 2013-06-07 | 2013-06-07 | Led発光装置 |
CN201420301215.2U CN204118127U (zh) | 2013-06-07 | 2014-06-06 | 发光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013120609A JP6172796B2 (ja) | 2013-06-07 | 2013-06-07 | Led発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014239140A JP2014239140A (ja) | 2014-12-18 |
JP6172796B2 true JP6172796B2 (ja) | 2017-08-02 |
Family
ID=52136079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013120609A Active JP6172796B2 (ja) | 2013-06-07 | 2013-06-07 | Led発光装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6172796B2 (ja) |
CN (1) | CN204118127U (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102023133332A1 (de) | 2022-12-15 | 2024-06-20 | Nichia Corporation | Lichtemittierende vorrichtung |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005321428A (ja) * | 2004-05-06 | 2005-11-17 | Nec Tokin Corp | 光学素子固定部品およびそれを用いた光アイソレータ |
US8029152B2 (en) * | 2005-03-24 | 2011-10-04 | Kyocera Corporation | Package for light-emitting device, light-emitting apparatus, and illuminating apparatus |
JP2008130823A (ja) * | 2006-11-21 | 2008-06-05 | Sanyo Electric Co Ltd | 照明装置およびそれを備えた電子機器 |
US8097894B2 (en) * | 2009-07-23 | 2012-01-17 | Koninklijke Philips Electronics N.V. | LED with molded reflective sidewall coating |
JP5730680B2 (ja) * | 2011-06-17 | 2015-06-10 | シチズン電子株式会社 | Led発光装置とその製造方法 |
JP5797945B2 (ja) * | 2011-06-21 | 2015-10-21 | シチズン電子株式会社 | Ledランプ |
JP2013098194A (ja) * | 2011-10-28 | 2013-05-20 | Citizen Electronics Co Ltd | 発光装置 |
-
2013
- 2013-06-07 JP JP2013120609A patent/JP6172796B2/ja active Active
-
2014
- 2014-06-06 CN CN201420301215.2U patent/CN204118127U/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN204118127U (zh) | 2015-01-21 |
JP2014239140A (ja) | 2014-12-18 |
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