JP6166185B2 - Ｍｅｍｓセンサ - Google Patents

Ｍｅｍｓセンサ Download PDF

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Publication number
JP6166185B2
JP6166185B2 JP2014000093A JP2014000093A JP6166185B2 JP 6166185 B2 JP6166185 B2 JP 6166185B2 JP 2014000093 A JP2014000093 A JP 2014000093A JP 2014000093 A JP2014000093 A JP 2014000093A JP 6166185 B2 JP6166185 B2 JP 6166185B2
Authority
JP
Japan
Prior art keywords
wiring layer
substrate
mems sensor
layer
connection wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014000093A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015129643A (ja
Inventor
田中　健一
健一 田中
尚信 大川
尚信 大川
矢澤　久幸
久幸 矢澤
宏行 朝比奈
宏行 朝比奈
学 臼井
学 臼井
昌彦 石曽根
昌彦 石曽根
梅津　英治
英治 梅津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP2014000093A priority Critical patent/JP6166185B2/ja
Priority to CN201410806304.7A priority patent/CN104760923B/zh
Priority to KR1020150000652A priority patent/KR101633027B1/ko
Publication of JP2015129643A publication Critical patent/JP2015129643A/ja
Application granted granted Critical
Publication of JP6166185B2 publication Critical patent/JP6166185B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H33/00—Other toys
    • A63H33/04—Building blocks, strips, or similar building parts
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H33/00—Other toys
    • A63H33/04—Building blocks, strips, or similar building parts
    • A63H33/046—Building blocks, strips, or similar building parts comprising magnetic interaction means, e.g. holding together by magnetic attraction
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H33/00—Other toys
    • A63H33/04—Building blocks, strips, or similar building parts
    • A63H33/06—Building blocks, strips, or similar building parts to be assembled without the use of additional elements
    • A63H33/08—Building blocks, strips, or similar building parts to be assembled without the use of additional elements provided with complementary holes, grooves, or protuberances, e.g. dovetails
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H33/00—Other toys
    • A63H33/04—Building blocks, strips, or similar building parts
    • A63H33/10—Building blocks, strips, or similar building parts to be assembled by means of additional non-adhesive elements
    • A63H33/101—Building blocks, strips, or similar building parts to be assembled by means of additional non-adhesive elements with clip or snap mechanism
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H33/00—Other toys
    • A63H33/04—Building blocks, strips, or similar building parts
    • A63H33/10—Building blocks, strips, or similar building parts to be assembled by means of additional non-adhesive elements
    • A63H33/108—Building blocks, strips, or similar building parts to be assembled by means of additional non-adhesive elements with holes

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Micromachines (AREA)
  • Measuring Fluid Pressure (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
JP2014000093A 2014-01-06 2014-01-06 Ｍｅｍｓセンサ Active JP6166185B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014000093A JP6166185B2 (ja) 2014-01-06 2014-01-06 Ｍｅｍｓセンサ
CN201410806304.7A CN104760923B (zh) 2014-01-06 2014-12-22 Mems传感器
KR1020150000652A KR101633027B1 (ko) 2014-01-06 2015-01-05 Mems 센서

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014000093A JP6166185B2 (ja) 2014-01-06 2014-01-06 Ｍｅｍｓセンサ

Publications (2)

Publication Number Publication Date
JP2015129643A JP2015129643A (ja) 2015-07-16
JP6166185B2 true JP6166185B2 (ja) 2017-07-19

Family

ID=53643094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014000093A Active JP6166185B2 (ja) 2014-01-06 2014-01-06 Ｍｅｍｓセンサ

Country Status (3)

Country Link
JP (1) JP6166185B2 (ko)
KR (1) KR101633027B1 (ko)
CN (1) CN104760923B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101928264B1 (ko) 2017-02-28 2018-12-13 주식회사 필옵틱스 레이저빔 성형 장치
JP6919964B2 (ja) * 2018-01-29 2021-08-18 ミネベアミツミ株式会社 センサチップ及び力覚センサ装置
DE102021211561A1 (de) * 2020-11-19 2022-05-19 Vitesco Technologies USA, LLC Mems-druckerfassungselement mit spannungsjustierern

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62291072A (ja) * 1986-06-10 1987-12-17 Toshiba Corp 半導体圧センサ
JP3873454B2 (ja) * 1998-05-29 2007-01-24 株式会社デンソー 半導体圧力センサ
US20040016981A1 (en) * 2002-07-26 2004-01-29 Matsushita Electric Works, Ltd. Semiconductor acceleration sensor using doped semiconductor layer as wiring
US7538401B2 (en) * 2005-05-03 2009-05-26 Rosemount Aerospace Inc. Transducer for use in harsh environments
JP4740678B2 (ja) * 2005-07-27 2011-08-03 Ｏｋｉセミコンダクタ株式会社 半導体装置
JP2007171040A (ja) * 2005-12-22 2007-07-05 Matsushita Electric Works Ltd 物理量センサ
JP5092462B2 (ja) * 2006-06-13 2012-12-05 株式会社デンソー 力学量センサ
JP2010139496A (ja) * 2008-11-13 2010-06-24 Yamaha Corp Ｍｅｍｓセンサおよびｍｅｍｓセンサの固定方法
JP5200919B2 (ja) * 2008-12-25 2013-06-05 株式会社デンソー センサチップおよびその製造方法並びに圧力センサ
JP2010210402A (ja) * 2009-03-10 2010-09-24 Alps Electric Co Ltd Ｍｅｍｓセンサ
WO2011010571A1 (ja) * 2009-07-24 2011-01-27 ローム株式会社 半導体圧力センサ、圧力センサ装置、電子機器、および半導体圧力センサの製造方法
FR2983955B1 (fr) * 2011-12-09 2014-10-03 Openfield Capteur de pression pour fluide
KR101288338B1 (ko) * 2012-02-10 2013-07-22 대양전기공업 주식회사 반도체 압력소자와 금속 다이아프램 구조를 이용한 압력센서 제조방법

Also Published As

Publication number Publication date
KR101633027B1 (ko) 2016-06-23
JP2015129643A (ja) 2015-07-16
CN104760923A (zh) 2015-07-08
KR20150082119A (ko) 2015-07-15
CN104760923B (zh) 2017-01-11

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