JP6162827B2 - 基板を分離する方法及び装置 - Google Patents
基板を分離する方法及び装置 Download PDFInfo
- Publication number
- JP6162827B2 JP6162827B2 JP2015561941A JP2015561941A JP6162827B2 JP 6162827 B2 JP6162827 B2 JP 6162827B2 JP 2015561941 A JP2015561941 A JP 2015561941A JP 2015561941 A JP2015561941 A JP 2015561941A JP 6162827 B2 JP6162827 B2 JP 6162827B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- laser beam
- intensity
- laser
- optical system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0619—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams with spots located on opposed surfaces of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Description
Claims (18)
- 光学系を用いて、パルス継続時間(t)を有するパルスレーザー光線(3)により、特に平坦な基板(2)を分離する方法であって、分離線の領域における基板(2)の厚さが2mm以上でなく、基板(2)の基板材料が、レーザー波長に関して、少なくとも部分的に透過性であり、このレーザー光線(3)が、焦点距離(f1)を有する光学系を用いて収束され、このレーザー光線(3)の強度が、レーザー光線(3)の光線軸(Z)に沿った基板(2)の改変を生じさせるが、材料を貫通する浸食を生じさせず、このパルスレーザー光線(3)が、基板(2)の主延長面に対して平行な任意の分離線に沿って動かされ、それにより、その後の切り離しプロセスが、この分離線に沿って行なわれる方法において、
単一パルス(P)のパルス継続時間(t)内における、同じ変更されない光学系を介した非線形自己収束によって、当初の焦点距離(f1)と異なる焦点距離(f2)にレーザー光線(3)を収束させ、このパルスレーザー光線(3)の単一パルス(P)の強度(I)が、単一パルスの時間的な推移に関して、最小値(Ia)から最大値(Ic)にまで上昇した後下降する強度を有し、この最大値(I c )と最小値(I a )に対応する焦点距離の間の間隔が少なくとも分離線の領域における基板(2)の厚さに一致し、この光学系の焦点距離が、その収束光学系により決まる幾何学的な焦点位置に関係無く、この強度に依存して設定可能であることを特徴とする方法。 - 当該の焦点距離(f2)が当初の焦点距離(f1)よりも短いことを特徴とする請求項1に記載の方法。
- 当該の焦点距離(f2)と当初の焦点距離(f1)の間の差が、作成すべき分離線の領域における基板(2)の厚さよりも大きいが、少なくとも20μmであることを特徴とする請求項1又は2に記載の方法。
- レーザー光線(3)のパルス継続時間(t)が、50ps以下、有利には、5ps以下であることを特徴とする請求項1から3までの少なくとも一つに記載の方法。
- 基板(2)が、主な材料成分として、ガラス、サファイア及びシリコンの中の一つ以上を有することを特徴とする請求項1から4までの少なくとも一つに記載の方法。
- 分離線に沿ったその後の切り離しプロセスが、基板(2)の内部応力に基づき行なわれることを特徴とする請求項1から5までの少なくとも一つに記載の方法。
- 当該の内部応力を基板(2)への外部からの力の作用により発生させることを特徴とする請求項6に記載の方法。
- 当該の内部応力を熱応力より、特に、大きな温度差により発生させることを特徴とする請求項6又は7一つに記載の方法。
- その後の切り離しプロセスが、ほぼ分離線に沿った異方性浸食により行なわれることを特徴とする請求項1から8までの少なくとも一つに記載の方法。
- 当該の異方性材料浸食がエッチングにより行なわれることを特徴とする請求項1から9までの少なくとも一つに記載の方法。
- エッチングがフッ化水素酸により行なわれることを特徴とする請求項10に記載の方法。
- 基板(2)が、レーザー照射前に、少なくとも片側にエッチング用レジスト(7)をコーティングされることを特徴とする請求項1から11までの少なくとも一つに記載の方法。
- 基板(2)が、片側に、10μm以下の厚さをそれぞれ有するエッチング用レジスト(7)の一つ又は複数の層を配備されることを特徴とする請求項12に記載の方法。
- レーザー光線(3)が基板(2)に作用している間、基板(2)が、特に、絶え間無く、レーザー光線(3)及び/又はレーザー処理ヘッド(10)に対して相対的に動かされることを特徴とする請求項1から13までの少なくとも一つに記載の方法。
- レーザー光線(3)を基板(2)に偏向するレーザー処理ヘッド(10)を備えた光学系を有する、請求項1から14までの少なくとも一つに記載の方法を実施するための装置において、
このパルスレーザー光線(3)の単一パルス(P)の強度(I)が、単一パルスの時間的な推移に関して、最小値(Ia)から最大値(Ic)にまで上昇した後下降する強度を有し、この最大値(I c )と最小値(I a )に対応する焦点距離の間の間隔が少なくとも分離線の領域における基板(2)の厚さに一致し、この光学系の焦点距離が、その収束光学系により決まる幾何学的な焦点位置に関係無く、この強度に依存して設定可能であり、この光学系の開口数(NA)が0.3以上であることを特徴とする装置。 - レーザー光線(3)が、光学系の強く収束するサブシステムと、空気よりも大きな強度依存屈折率(n2)を有する、光学系のレーザー光線(3)の波長に対する透過性材料とを通過するように偏向されることを特徴とする請求項15に記載の装置。
- 透過性材料として、面平行な円板が使用されることを特徴とする請求項16に記載の装置。
- 当該の透過性材料が、主な材料成分として、サファイアを有することを特徴とする請求項16又は17に記載の装置。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013103370.9 | 2013-04-04 | ||
DE201310103370 DE102013103370A1 (de) | 2013-04-04 | 2013-04-04 | Verfahren zum Einbringen von Durchbrechungen in ein Glassubstrat sowie ein derart hergestelltes Glassubstrat |
DE102013112035 | 2013-10-31 | ||
DE102013112035.0 | 2013-10-31 | ||
PCT/DE2014/100119 WO2014161535A2 (de) | 2013-04-04 | 2014-04-03 | Verfahren und vorrichtung zum trennen eines substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016516296A JP2016516296A (ja) | 2016-06-02 |
JP6162827B2 true JP6162827B2 (ja) | 2017-07-12 |
Family
ID=50771367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015561941A Active JP6162827B2 (ja) | 2013-04-04 | 2014-04-03 | 基板を分離する方法及び装置 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9764978B2 (ja) |
EP (1) | EP2964416B1 (ja) |
JP (1) | JP6162827B2 (ja) |
KR (1) | KR101857336B1 (ja) |
CN (1) | CN105189024B (ja) |
ES (1) | ES2959429T3 (ja) |
WO (1) | WO2014161535A2 (ja) |
Families Citing this family (75)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2011279374A1 (en) | 2010-07-12 | 2013-02-07 | Filaser Usa Llc | Method of material processing by laser filamentation |
WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US9102011B2 (en) | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses |
US9102007B2 (en) * | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
US10017410B2 (en) | 2013-10-25 | 2018-07-10 | Rofin-Sinar Technologies Llc | Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses |
US20150121960A1 (en) * | 2013-11-04 | 2015-05-07 | Rofin-Sinar Technologies Inc. | Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses |
US10005152B2 (en) | 2013-11-19 | 2018-06-26 | Rofin-Sinar Technologies Llc | Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses |
US10252507B2 (en) | 2013-11-19 | 2019-04-09 | Rofin-Sinar Technologies Llc | Method and apparatus for forward deposition of material onto a substrate using burst ultrafast laser pulse energy |
US9517929B2 (en) | 2013-11-19 | 2016-12-13 | Rofin-Sinar Technologies Inc. | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses |
US11053156B2 (en) | 2013-11-19 | 2021-07-06 | Rofin-Sinar Technologies Llc | Method of closed form release for brittle materials using burst ultrafast laser pulses |
US10144088B2 (en) | 2013-12-03 | 2018-12-04 | Rofin-Sinar Technologies Llc | Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses |
US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US9938187B2 (en) | 2014-02-28 | 2018-04-10 | Rofin-Sinar Technologies Llc | Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses |
JP6262039B2 (ja) | 2014-03-17 | 2018-01-17 | 株式会社ディスコ | 板状物の加工方法 |
JP6301203B2 (ja) * | 2014-06-02 | 2018-03-28 | 株式会社ディスコ | チップの製造方法 |
US9815144B2 (en) | 2014-07-08 | 2017-11-14 | Corning Incorporated | Methods and apparatuses for laser processing materials |
WO2016010954A2 (en) * | 2014-07-14 | 2016-01-21 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
EP3536440A1 (en) | 2014-07-14 | 2019-09-11 | Corning Incorporated | Glass article with a defect pattern |
WO2016010949A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for forming perforations |
WO2016010991A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
US9757815B2 (en) | 2014-07-21 | 2017-09-12 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser curved filamentation within transparent materials |
DE102014015951A1 (de) * | 2014-10-20 | 2016-04-21 | 4Jet Technologies Gmbh | Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials |
US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
EP3245166B1 (en) | 2015-01-12 | 2020-05-27 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
JP6734202B2 (ja) | 2015-01-13 | 2020-08-05 | ロフィン−シナール テクノロジーズ エルエルシー | 脆性材料をスクライブして化学エッチングする方法およびシステム |
US10717670B2 (en) | 2015-02-10 | 2020-07-21 | Nippon Sheet Glass Company, Limited | Glass for laser processing and method for producing perforated glass using same |
JP6643263B2 (ja) * | 2015-02-13 | 2020-02-12 | 日本板硝子株式会社 | レーザ加工用ガラス及びそれを用いた孔付きガラスの製造方法 |
EP3848334A1 (en) | 2015-03-24 | 2021-07-14 | Corning Incorporated | Alkaline earth boro-aluminosilicate glass article with laser cut edge |
CN107666983B (zh) | 2015-03-27 | 2020-10-02 | 康宁股份有限公司 | 可透气窗及其制造方法 |
DE102015110422A1 (de) | 2015-06-29 | 2016-12-29 | Schott Ag | Laserbearbeitung eines mehrphasigen transparenten Materials, sowie mehrphasiger Kompositwerkstoff |
EP3319911B1 (en) | 2015-07-10 | 2023-04-19 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
DE102015009622A1 (de) * | 2015-07-29 | 2017-02-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Abtragen von sprödhartem Material mittels Laserstrahlung |
JP6724643B2 (ja) * | 2015-09-04 | 2020-07-15 | Agc株式会社 | ガラス板の製造方法、ガラス物品の製造方法、ガラス板、ガラス物品、およびガラス物品の製造装置 |
JP6673089B2 (ja) * | 2015-12-08 | 2020-03-25 | Agc株式会社 | ガラス板の製造方法およびガラス板 |
CN107922259B (zh) * | 2015-09-04 | 2021-05-07 | Agc株式会社 | 玻璃板的制造方法、玻璃板、玻璃物品的制造方法、玻璃物品以及玻璃物品的制造装置 |
EP3345877B1 (en) * | 2015-09-04 | 2022-03-23 | AGC Inc. | Method for manufacturing glass plate, glass plate, method for manufacturing glass article, glass article |
DE102016102768A1 (de) | 2016-02-17 | 2017-08-17 | Schott Ag | Verfahren zur Kantenbearbeitung von Glaselementen und verfahrensgemäß bearbeitetes Glaselement |
MY194570A (en) | 2016-05-06 | 2022-12-02 | Corning Inc | Laser cutting and removal of contoured shapes from transparent substrates |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
JP7090594B2 (ja) | 2016-07-29 | 2022-06-24 | コーニング インコーポレイテッド | レーザ加工するための装置および方法 |
FR3054856B1 (fr) * | 2016-08-03 | 2018-09-07 | Airbus Operations Sas | Turbomachine comportant un systeme de gestion thermique |
CN110121398B (zh) | 2016-08-30 | 2022-02-08 | 康宁股份有限公司 | 透明材料的激光加工 |
WO2018043016A1 (ja) * | 2016-09-01 | 2018-03-08 | 旭硝子株式会社 | ガラス物品の製造方法およびガラス物品 |
KR102078294B1 (ko) | 2016-09-30 | 2020-02-17 | 코닝 인코포레이티드 | 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법 |
JP7066701B2 (ja) | 2016-10-24 | 2022-05-13 | コーニング インコーポレイテッド | シート状ガラス基体のレーザに基づく加工のための基体処理ステーション |
US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
US20180207748A1 (en) * | 2017-01-23 | 2018-07-26 | Lumentum Operations Llc | Machining processes using a random trigger feature for an ultrashort pulse laser |
US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
WO2018155099A1 (ja) | 2017-02-21 | 2018-08-30 | Agc株式会社 | ガラス板およびガラス板の製造方法 |
EP3587367B1 (en) | 2017-02-21 | 2023-10-18 | AGC Inc. | Glass plate and manufacturing method of glass plate |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
JP6981806B2 (ja) * | 2017-08-09 | 2021-12-17 | 株式会社ディスコ | 分割方法 |
JP6893691B2 (ja) * | 2017-09-29 | 2021-06-23 | 三星ダイヤモンド工業株式会社 | 複層脆性材料基板の作製方法および作製システム |
JP7407499B2 (ja) * | 2017-12-26 | 2024-01-04 | 株式会社ディスコ | 凹部又は貫通孔の形成方法、電極の形成方法 |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
JP7186643B2 (ja) * | 2019-03-15 | 2022-12-09 | 日本碍子株式会社 | 電気加熱型担体、排気ガス浄化装置、電気加熱型担体の製造方法、接合体及び接合体の製造方法 |
JP7230650B2 (ja) | 2019-04-05 | 2023-03-01 | Tdk株式会社 | 無機材料基板の加工方法、デバイス、およびデバイスの製造方法 |
CN112222630A (zh) * | 2019-06-26 | 2021-01-15 | 大族激光科技产业集团股份有限公司 | 激光加工方法 |
DE102019217466A1 (de) * | 2019-11-12 | 2021-05-12 | Lpkf Laser & Electronics Ag | Reaktionsgefäße aus Glas, Herstellungsverfahren und Verfahren zur Analyse |
KR102416900B1 (ko) | 2020-09-02 | 2022-07-06 | (주)삼양세라텍 | 2중 용기를 구비하는 냉간 등방압 성형장치 |
KR102416902B1 (ko) | 2020-09-02 | 2022-07-06 | (주)삼양세라텍 | 감압제어가 가능한 냉간 등방압 성형장치 및 이를 이용한 냉간 등방압 성형방법 |
WO2024104550A1 (de) * | 2022-11-14 | 2024-05-23 | Ev Group E. Thallner Gmbh | Verfahren zum auftrennen einer ersten substratlage, vorrichtung zum durchführen eines solchen auftrennens und substrat mit einer ersten substratlage |
CN116374947B (zh) * | 2023-06-02 | 2023-08-25 | 中国工程物理研究院电子工程研究所 | 一种熔石英悬臂梁-质量块结构及其加工方法 |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0286855A1 (de) | 1987-04-15 | 1988-10-19 | BBC Brown Boveri AG | Verfahren zum Aetzen von Vertiefungen in ein Siliziumsubstrat |
US6114240A (en) | 1997-12-18 | 2000-09-05 | Micron Technology, Inc. | Method for fabricating semiconductor components using focused laser beam |
JP4497147B2 (ja) * | 1998-12-16 | 2010-07-07 | セイコーエプソン株式会社 | 半導体チップの製造方法、半導体装置の製造方法、回路基板の製造方法及び電子機器の製造方法 |
JP3536058B2 (ja) * | 2000-02-28 | 2004-06-07 | 独立行政法人理化学研究所 | 短パルス・レーザー光のパルス幅圧縮方法 |
JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
DE10154361A1 (de) * | 2001-11-06 | 2003-05-15 | Univ Albert Ludwigs Freiburg | Verfahren zum Durchführen eines Rapid-Prototyping-Prozesses zur Herstellung von Mikrostrukturen |
ES2356817T3 (es) | 2002-03-12 | 2011-04-13 | Hamamatsu Photonics K.K. | Método de corte de un objeto procesado. |
WO2003077295A1 (en) | 2002-03-12 | 2003-09-18 | Hamamatsu Photonics K.K. | Method for dicing substrate |
JP3873098B2 (ja) | 2004-03-31 | 2007-01-24 | 国立大学法人 北海道大学 | レーザ加工方法および装置 |
JP4418282B2 (ja) * | 2004-03-31 | 2010-02-17 | 株式会社レーザーシステム | レーザ加工方法 |
US7303977B2 (en) * | 2004-11-10 | 2007-12-04 | Intel Corporation | Laser micromachining method |
US9138913B2 (en) | 2005-09-08 | 2015-09-22 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
JP5221007B2 (ja) * | 2006-05-31 | 2013-06-26 | アイシン精機株式会社 | 発光ダイオードチップ及びウェハ分割加工方法 |
US20070298529A1 (en) * | 2006-05-31 | 2007-12-27 | Toyoda Gosei, Co., Ltd. | Semiconductor light-emitting device and method for separating semiconductor light-emitting devices |
WO2008126742A1 (ja) * | 2007-04-05 | 2008-10-23 | Cyber Laser Inc. | レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法 |
JP4402708B2 (ja) * | 2007-08-03 | 2010-01-20 | 浜松ホトニクス株式会社 | レーザ加工方法、レーザ加工装置及びその製造方法 |
KR100876502B1 (ko) * | 2007-09-21 | 2008-12-31 | 한국정보통신대학교 산학협력단 | 초단파 레이저 빔을 이용한 기판 절단장치 및 그 절단방법 |
JP2009182178A (ja) | 2008-01-31 | 2009-08-13 | Disco Abrasive Syst Ltd | デバイスの製造方法 |
JP4584322B2 (ja) * | 2008-03-24 | 2010-11-17 | 株式会社レーザーシステム | レーザ加工方法 |
US8526473B2 (en) | 2008-03-31 | 2013-09-03 | Electro Scientific Industries | Methods and systems for dynamically generating tailored laser pulses |
JP5692969B2 (ja) * | 2008-09-01 | 2015-04-01 | 浜松ホトニクス株式会社 | 収差補正方法、この収差補正方法を用いたレーザ加工方法、この収差補正方法を用いたレーザ照射方法、収差補正装置、及び、収差補正プログラム |
JP2010158691A (ja) | 2009-01-07 | 2010-07-22 | Disco Abrasive Syst Ltd | レーザー加工装置 |
TW201036508A (en) | 2009-03-17 | 2010-10-01 | High Conduction Scient Co Ltd | Double-faced conductive composite board and manufacturing method thereof |
CN101733551A (zh) | 2009-12-04 | 2010-06-16 | 中国计量学院 | 一种自聚焦激光焊接装置 |
US20120234807A1 (en) * | 2009-12-07 | 2012-09-20 | J.P. Sercel Associates Inc. | Laser scribing with extended depth affectation into a workplace |
JP5600427B2 (ja) | 2009-12-25 | 2014-10-01 | 株式会社フジクラ | 貫通配線基板の材料基板 |
JP5513227B2 (ja) | 2010-04-08 | 2014-06-04 | 株式会社フジクラ | 微細構造の形成方法、レーザー照射装置、及び基板 |
US8642448B2 (en) | 2010-06-22 | 2014-02-04 | Applied Materials, Inc. | Wafer dicing using femtosecond-based laser and plasma etch |
DE102010025966B4 (de) | 2010-07-02 | 2012-03-08 | Schott Ag | Interposer und Verfahren zum Herstellen von Löchern in einem Interposer |
AU2011279374A1 (en) * | 2010-07-12 | 2013-02-07 | Filaser Usa Llc | Method of material processing by laser filamentation |
JP5509332B2 (ja) * | 2010-07-26 | 2014-06-04 | 浜松ホトニクス株式会社 | インターポーザの製造方法 |
JP5758116B2 (ja) * | 2010-12-16 | 2015-08-05 | 株式会社ディスコ | 分割方法 |
WO2012094737A1 (en) * | 2011-01-10 | 2012-07-19 | UNIVERSITé LAVAL | Laser reinforced direct bonding of optical components |
CN102513700B (zh) * | 2011-11-03 | 2015-04-15 | 西安交通大学 | 利用飞秒激光在石英玻璃内部制造三维微螺旋通道的方法 |
US9346706B2 (en) * | 2012-11-29 | 2016-05-24 | Corning Incorporated | Methods of fabricating glass articles by laser damage and etching |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
ES2908956T3 (es) * | 2013-04-04 | 2022-05-04 | Lpkf Laser & Electronics Ag | Procedimiento para introducir rupturas en un sustrato |
US9102007B2 (en) * | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
US9296646B2 (en) | 2013-08-29 | 2016-03-29 | Corning Incorporated | Methods for forming vias in glass substrates |
-
2014
- 2014-04-03 KR KR1020157027413A patent/KR101857336B1/ko active IP Right Grant
- 2014-04-03 WO PCT/DE2014/100119 patent/WO2014161535A2/de active Application Filing
- 2014-04-03 JP JP2015561941A patent/JP6162827B2/ja active Active
- 2014-04-03 ES ES14725604T patent/ES2959429T3/es active Active
- 2014-04-03 EP EP14725604.4A patent/EP2964416B1/de active Active
- 2014-04-03 US US14/781,597 patent/US9764978B2/en active Active
- 2014-04-03 CN CN201480019421.7A patent/CN105189024B/zh active Active
-
2017
- 2017-08-21 US US15/681,464 patent/US11401194B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
ES2959429T3 (es) | 2024-02-26 |
US20170341971A1 (en) | 2017-11-30 |
CN105189024B (zh) | 2018-01-30 |
EP2964416A2 (de) | 2016-01-13 |
KR101857336B1 (ko) | 2018-05-11 |
CN105189024A (zh) | 2015-12-23 |
US20160060156A1 (en) | 2016-03-03 |
KR20150128803A (ko) | 2015-11-18 |
EP2964416C0 (de) | 2023-07-19 |
WO2014161535A2 (de) | 2014-10-09 |
EP2964416B1 (de) | 2023-07-19 |
JP2016516296A (ja) | 2016-06-02 |
WO2014161535A3 (de) | 2014-11-27 |
US9764978B2 (en) | 2017-09-19 |
US11401194B2 (en) | 2022-08-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6162827B2 (ja) | 基板を分離する方法及び装置 | |
JP6186016B2 (ja) | 基板に貫通穴を開ける方法及び装置 | |
JP6782692B2 (ja) | 板状の加工物に少なくとも一つの窪み又は穴を配設する方法 | |
JP6381753B2 (ja) | 超高速のレーザーパルスのバーストによるフィラメンテーションを用いた透明材料の非アブレーション光音響圧縮加工の方法および装置 | |
JP6552503B2 (ja) | サファイア基体をレーザによってレーザ切断する方法、および一続きの欠陥を有するエッジを有するサファイアを含む物品 | |
TWI677394B (zh) | 使用叢發超快雷射脈衝自脆性材料中切割出特定形狀物的方法 | |
US20130209731A1 (en) | Method and devices for creating a multiplicity of holes in workpieces | |
US20130213467A1 (en) | Production of microholes | |
JP2018523291A (ja) | 半導体加工対象物のスクライブ方法 | |
JP7008740B2 (ja) | 最適化されたレーザー切断 | |
JP6744624B2 (ja) | 管状脆性部材の分断方法並びに分断装置 | |
KR101202256B1 (ko) | 극초단 펄스 레이저와 수분 응고를 이용한 절단 장치 및 방법 | |
WO2019156183A1 (ja) | 加工装置、加工方法、及び透明な基板 | |
US9018565B2 (en) | Generation of holes using multiple electrodes | |
JP6238675B2 (ja) | レーザ加工方法及びインクジェットヘッドの製造方法 | |
JP6787617B2 (ja) | 管状脆性部材の分断方法並びに分断装置 | |
JP2001062574A (ja) | 微細加工装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20161014 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161026 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170120 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20170215 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170406 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20170414 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170524 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170615 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6162827 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |