JP6142508B2 - コンデンサホルダ - Google Patents
コンデンサホルダ Download PDFInfo
- Publication number
- JP6142508B2 JP6142508B2 JP2012248605A JP2012248605A JP6142508B2 JP 6142508 B2 JP6142508 B2 JP 6142508B2 JP 2012248605 A JP2012248605 A JP 2012248605A JP 2012248605 A JP2012248605 A JP 2012248605A JP 6142508 B2 JP6142508 B2 JP 6142508B2
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- JP
- Japan
- Prior art keywords
- capacitor
- cylindrical
- cylindrical portion
- projecting
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003990 capacitor Substances 0.000 title claims description 85
- 239000002184 metal Substances 0.000 claims description 43
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/106—Fixing the capacitor in a housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/10—Multiple hybrid or EDL capacitors, e.g. arrays or modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10628—Leaded surface mounted device
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
次に、本発明の実施形態を図面と共に説明する。図1は、本発明が適用されたコンデンサホルダ1の構成を表す図であり、(A)は平面図、(B)は正面図、(C)は底面図、(D)は左側面図、(E)は右側面図、(F)は斜視図である。
ここで、突設部5Bの突出量が大きすぎると、コンデンサホルダ1を、図2に示すように円筒部5同士が互いに接触し合うように密集して配置することができなくなる。そこで、本願出願人は、突設部5Bの形状及び突出量を種々に変更して実験を繰り返した結果、突設部の突出量を適切な範囲内とすることで、突設部5Bで金属ピン7を安定して支持しつつコンデンサホルダ1を前述のように密集して配置できることを発見した。以下の表1に、実験結果を示す。なお、図1(A)に示すように、表1におけるXは円筒部5の内径であり、Yは突設部5Bの外周と前記軸との距離である。また、表1において、判定が「OK」とは、突設部5Bの形状を若干修正する必要はあっても、その突設部5Bで金属ピン7を安定して支持しつつコンデンサホルダ1を前述のように密集して配置できたことを示している。逆に、判定が「NG」とは、コンデンサホルダ1を前述のように密集して配置できなかったことを示している。
5…円筒部 5A…平面部 5B…突設部 7…金属ピン
Claims (3)
- 円筒状に構成されてコンデンサに外嵌される樹脂製の円筒部と、
前記円筒部と一体成形され、前記円筒部の軸を挟んで対向する位置から前記円筒部の外周方向に突設された一対の突設部と、
前記各突設部の前記軸方向の一端側端面から前記軸に沿って突設され、前記円筒部及び前記各突設部をプリント配線基板にハンダ付けするための一対の金属ピンと、
を備え、
前記突設部の外周と前記軸との距離が、前記円筒部の内径の0.76倍未満であり、
前記円筒部の外周の前記突設部と重ならない位置に、外面が前記円筒部の半径方向に垂直な平面状に構成された平面部と、
前記円筒部の外周の前記突設部及び前記平面部と重ならない位置に設けられた穴部と、
前記各金属ピンの突設方向と同じ側の前記円筒部の端面に、前記円筒部と一体成形された底部と、をさらに備え、
前記底部における前記穴部に隣接する部分は、前記円筒部の内側に向かって窪んでいることを特徴とするコンデンサホルダ。 - 前記平面部は、前記一対の突設部が設けられた位置から前記軸回りに90°ずれた位置に一対設けられていることを特徴とする請求項1に記載のコンデンサホルダ。
- 前記各金属ピンの突設方向と同じ側の前記円筒部の端面に、前記円筒部と一体成形され、前記コンデンサのリードが貫通可能なリード孔を有する底部を、
更に備えたことを特徴する請求項1又は請求項2に記載のコンデンサホルダ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012248605A JP6142508B2 (ja) | 2012-11-12 | 2012-11-12 | コンデンサホルダ |
EP13852402.0A EP2919243B1 (en) | 2012-11-12 | 2013-11-11 | Capacitor holder |
US14/442,314 US9508489B2 (en) | 2012-11-12 | 2013-11-11 | Capacitor holder |
CN201380059155.6A CN104781893B (zh) | 2012-11-12 | 2013-11-11 | 电容器保持件 |
PCT/JP2013/080438 WO2014073681A1 (ja) | 2012-11-12 | 2013-11-11 | コンデンサホルダ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012248605A JP6142508B2 (ja) | 2012-11-12 | 2012-11-12 | コンデンサホルダ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014096536A JP2014096536A (ja) | 2014-05-22 |
JP6142508B2 true JP6142508B2 (ja) | 2017-06-07 |
Family
ID=50684772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012248605A Active JP6142508B2 (ja) | 2012-11-12 | 2012-11-12 | コンデンサホルダ |
Country Status (5)
Country | Link |
---|---|
US (1) | US9508489B2 (ja) |
EP (1) | EP2919243B1 (ja) |
JP (1) | JP6142508B2 (ja) |
CN (1) | CN104781893B (ja) |
WO (1) | WO2014073681A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10143115B2 (en) * | 2015-03-20 | 2018-11-27 | Hanon Systems | Device for radiating heat of capacitor of an inverter in an electric compressor |
JP7021589B2 (ja) * | 2018-03-30 | 2022-02-17 | 日本ケミコン株式会社 | 蓄電デバイスモジュール及び蓄電デバイスホルダー |
US10716232B2 (en) * | 2018-08-22 | 2020-07-14 | Raytheon Company | Low profile, nesting capacitor collars |
EP4174887A1 (en) * | 2021-11-02 | 2023-05-03 | CapXon Electronic (Shenzhen) Co., Ltd | Capacitor seat plate assembly |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0317663U (ja) * | 1989-07-04 | 1991-02-21 | ||
JPH04256287A (ja) | 1991-02-08 | 1992-09-10 | Canon Inc | 撮影装置 |
WO1997001263A1 (fr) * | 1995-06-20 | 1997-01-09 | Matsushita Electric Industrial Co., Ltd. | Dispositif de maintien de piece, substrat dote de ce dispositif et son procede de fabrication |
JPH09260181A (ja) * | 1996-03-27 | 1997-10-03 | Fujitsu Denso Ltd | 被柱体状支持体の支持方法及び固定方法、並びに剛性筒状支持体 |
JP2000501572A (ja) * | 1996-09-24 | 2000-02-08 | ベーセー コンポネンツ ホールディングス ベー ヴェー | 受動素子 |
JPH11283868A (ja) * | 1998-03-31 | 1999-10-15 | Nec Home Electron Ltd | 部品取付装置 |
JP2000269081A (ja) * | 1999-03-12 | 2000-09-29 | Elna Co Ltd | 表面実装用コンデンサ |
DE10016864A1 (de) * | 2000-04-05 | 2001-11-15 | Epcos Ag | Montagemittel, Montageanordnung mit dem Montagemittel und Verwendung des Montagemittels |
JP2004221182A (ja) * | 2003-01-10 | 2004-08-05 | Matsushita Electric Ind Co Ltd | コンデンサ装置およびその製造方法 |
DE102005034659B3 (de) * | 2005-07-25 | 2007-04-12 | Lenze Drive Systems Gmbh | Halteeinrichtung für einen Becherkondensator |
DE102006012402A1 (de) * | 2006-03-17 | 2007-05-31 | Siemens Ag | Kondensatorbefestigung |
US7532484B1 (en) * | 2008-02-11 | 2009-05-12 | Delphi Technologies, Inc. | Electronic component assembly |
JP2011187627A (ja) * | 2010-03-08 | 2011-09-22 | Kitagawa Ind Co Ltd | 保持具 |
JP5540254B2 (ja) * | 2010-08-25 | 2014-07-02 | 北川工業株式会社 | コンデンサ保持具 |
-
2012
- 2012-11-12 JP JP2012248605A patent/JP6142508B2/ja active Active
-
2013
- 2013-11-11 US US14/442,314 patent/US9508489B2/en active Active
- 2013-11-11 EP EP13852402.0A patent/EP2919243B1/en active Active
- 2013-11-11 CN CN201380059155.6A patent/CN104781893B/zh active Active
- 2013-11-11 WO PCT/JP2013/080438 patent/WO2014073681A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN104781893B (zh) | 2017-07-14 |
WO2014073681A1 (ja) | 2014-05-15 |
EP2919243B1 (en) | 2019-10-23 |
EP2919243A1 (en) | 2015-09-16 |
US9508489B2 (en) | 2016-11-29 |
US20160284470A1 (en) | 2016-09-29 |
EP2919243A4 (en) | 2016-08-10 |
JP2014096536A (ja) | 2014-05-22 |
CN104781893A (zh) | 2015-07-15 |
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