JP6133608B2 - Electronics - Google Patents

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JP6133608B2
JP6133608B2 JP2013016740A JP2013016740A JP6133608B2 JP 6133608 B2 JP6133608 B2 JP 6133608B2 JP 2013016740 A JP2013016740 A JP 2013016740A JP 2013016740 A JP2013016740 A JP 2013016740A JP 6133608 B2 JP6133608 B2 JP 6133608B2
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component mounting
electronic component
fan device
fan
mounting machine
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JP2014150106A (en
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山田　修平
修平 山田
正隆 岩▲崎▼
正隆 岩▲崎▼
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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Description

本発明は、筐体内の空気を該筐体の外側に向けて吹き出すファン装置が該筐体の背面又は側面に設置された電子機器に関する発明である。   The present invention relates to an electronic device in which a fan device that blows out air in a housing toward the outside of the housing is installed on the back surface or side surface of the housing.

一般に、使用時に発熱する電子機器は、筐体内の空気を該筐体の外側に向けて吹き出すファン装置を設けて、筐体内をファン装置により冷却するようにしたものが多い。例えば、電子部品実装機では、特許文献１（特開２０１２−４４１２８号公報）に記載されているように、筐体の背面にファン装置を設けて筐体内を冷却するようにしている。   In general, many electronic devices that generate heat during use are provided with a fan device that blows out air in the housing toward the outside of the housing, and the inside of the housing is cooled by the fan device. For example, in an electronic component mounting machine, as described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2012-44128), a fan device is provided on the back surface of the housing to cool the inside of the housing.

特開２０１２−４４１２８号公報JP2012-44128A

ところで、工場内に２台の電子部品実装機を設置する場合に、２台の電子部品実装機を背面合わせに設置することがある。この場合、電子部品実装機の背面には、ファン装置が設けられているため、２台の電子部品実装機の背面の間には、ファン装置から吹き出された風が該背面に沿って流れる隙間をあける必要があるが、工場内のスペースを効率的に使用するために、２台の電子部品実装機の背面間の隙間寸法をできるだけ狭めることが望ましい。   By the way, when two electronic component mounting machines are installed in a factory, two electronic component mounting machines may be installed back to back. In this case, since the fan device is provided on the back surface of the electronic component mounting machine, a gap between the back surfaces of the two electronic component mounting machines allows the wind blown from the fan device to flow along the back surface. However, in order to efficiently use the space in the factory, it is desirable to narrow the gap dimension between the back surfaces of the two electronic component mounting machines as much as possible.

しかし、ファン装置は電子部品実装機の背面の幅方向の中央に設けられているため、２台の電子部品実装機を背面合わせに設置すると、双方の背面に設けたファン装置が真正面に対向して、双方のファン装置から吹き出される風が真正面から衝突する。これにより、通風抵抗が増大してファン装置のＰＱ特性（図４参照）が悪化して風量が減少して、冷却能力（放熱能力）が低下する。このような冷却能力の低下は、２台の電子部品実装機の背面間の隙間寸法が小さくなるほど顕著に現れるため、冷却に必要な風量を確保するには、２台の電子部品実装機の背面間の隙間寸法をある程度大きく確保しなければならず、電子部品実装機をスペース効率良く設置することができなかった。   However, since the fan device is provided in the center of the back surface of the electronic component mounting machine in the width direction, when two electronic component mounting machines are installed back to back, the fan devices provided on both rear surfaces face the front. Thus, the wind blown from both fan devices collides from the front. Thereby, ventilation resistance increases, the PQ characteristic (refer FIG. 4) of a fan apparatus deteriorates, an air volume reduces, and cooling capacity (heat dissipation capability) falls. Such a decrease in the cooling capacity appears more markedly as the gap between the back surfaces of the two electronic component mounting machines becomes smaller. Therefore, in order to secure the air flow necessary for cooling, the rear surfaces of the two electronic component mounting machines The gap dimension between them must be secured to some extent, and the electronic component mounting machine cannot be installed in a space efficient manner.

このような課題は、電子部品実装機に特有の問題ではなく、ファン装置付きの電子機器に共通する課題である。   Such a problem is not a problem peculiar to an electronic component mounting machine, but a problem common to electronic devices with a fan device.

そこで、本発明が解決しようとする課題は、複数の電子機器をファン装置の設置面どうしが隙間をあけて対向するように設置する場合に、ファン装置から吹き出される風どうしの衝突による通風抵抗を減少させることができ、ファン装置の設置面間の隙間を狭めても、必要とする風量を確保することができる電子機器を提供することである。   Therefore, the problem to be solved by the present invention is that when a plurality of electronic devices are installed so that the installation surfaces of the fan device face each other with a gap, ventilation resistance due to collision of winds blown from the fan device. It is possible to provide an electronic device that can reduce the amount of air flow and reduce the gap between the installation surfaces of the fan device, and can secure the required air volume.

上記課題を解決するために、請求項１に係る発明は、筐体内の空気を該筐体の外側に向けて送風するファン装置が該筐体の背面又は側面に設置された電子機器において、複数の電子機器をファン装置の設置面どうしが隙間をあけて対向するように設置する場合に、前記ファン装置から吹き出される風どうしが正面衝突しないようにするために、ファン装置どうしが対向しないように該ファン装置がその設置面の幅方向の中心からずれた位置に配置したものである。このようにすれば、複数の電子機器をファン装置の設置面どうしが隙間をあけて対向するように設置する場合に、ファン装置から吹き出される風どうしの衝突による通風抵抗を減少させることができるため、ファン装置の設置面間の隙間を狭めても、必要とする風量を確保することができ、複数の電子機器をスペース効率良く設置することができる。 In order to solve the above-described problem, the invention according to claim 1 is directed to an electronic apparatus in which a fan device that blows air inside a casing toward the outside of the casing is installed on a back surface or a side surface of the casing. When installing the electronic equipment of the fan device so that the installation surfaces of the fan device face each other with a gap , the fan devices should not face each other so that the wind blown out from the fan device does not collide head-on. Further, the fan device is arranged at a position shifted from the center of the installation surface in the width direction. In this way, when a plurality of electronic devices are installed so that the installation surfaces of the fan device face each other with a gap, ventilation resistance due to collision of winds blown from the fan device can be reduced. Therefore, even if the gap between the installation surfaces of the fan device is narrowed, the required air volume can be ensured, and a plurality of electronic devices can be installed in a space efficient manner.

更に、請求項２のように、ファン装置から吹き出された風を該ファン装置の設置面に沿った方向に案内する導風板を備えた構成としても良い。このようにしても、ファン装置から吹き出される風どうしが正面衝突しないようにすることができる。 Further , as described in claim 2 , it may be configured to include an air guide plate that guides the air blown from the fan device in a direction along the installation surface of the fan device. Even in this case, it is possible to prevent the winds blown out from the fan device from colliding head-on.

以上説明した請求項１、２に係る発明は、ファン装置を備えた様々な電子機器に適用して実施でき、例えば、請求項３のように、電子部品実装機に適用しても良い。 The inventions according to claims 1 and 2 described above can be applied to various electronic devices including a fan device. For example, the invention according to claim 3 may be applied to an electronic component mounting machine.

図１は本発明の実施例１の電子部品実装機の設置例を示す側面図である。FIG. 1 is a side view showing an installation example of the electronic component mounting machine according to the first embodiment of the present invention. 図２は実施例１の電子部品実装機の背面図である。FIG. 2 is a rear view of the electronic component mounting machine according to the first embodiment. 図３は実施例１の電子部品実装機の設置例を示す平面図である。FIG. 3 is a plan view illustrating an installation example of the electronic component mounting machine according to the first embodiment. 図４はファン装置のＰＱ特性の一例を示す図である。FIG. 4 is a diagram illustrating an example of PQ characteristics of the fan device. 図５は本発明に関連する参考例としての実施例２の電子部品実装機の設置例を示すファン装置周辺の縦断側面図である。FIG. 5 is a longitudinal side view of the periphery of the fan device showing an installation example of the electronic component mounting machine of the second embodiment as a reference example related to the present invention . 図６は本発明に関連する参考例としての実施例３の電子部品実装機の設置例を示すファン装置周辺の縦断側面図である。FIG. 6 is a longitudinal sectional side view of the periphery of the fan device showing an installation example of the electronic component mounting machine of the third embodiment as a reference example related to the present invention .

以下、本発明を実施するための形態を電子部品実装機に適用して具体化した実施例１と本発明に関連する参考例としての実施例２、３を説明する。 Hereinafter, a first embodiment in which a mode for carrying out the present invention is applied to an electronic component mounting machine and a second embodiment as a reference example related to the present invention will be described.

本発明の実施例１を図１乃至図４に基づいて説明する。
図１に示すように、電子部品実装機１１は、ベース台１２上に設置されている。１台のベース台１２上に複数の電子部品実装機１１を並べて設置しても良い。電子部品実装機１１の筐体１３内の構成は図示はしないが、筐体１３内には、回路基板を搬送するコンベアと、フィーダから供給される部品を吸着ノズルで吸着して回路基板に実装する装着ヘッドと、吸着ノズルに吸着した電子部品を撮像する撮像装置と、装着ヘッドをＸＹ方向に移動させるＸＹロボット等の各機能が設けられている。電子部品実装機１１の各機能には、モータ等の駆動源や駆動制御回路等が設けられているため、電子部品実装機１１の稼働中は、各機能への通電により発熱することから、それらの周辺の空気を筐体１３から排出して筐体１３内の温度上昇を抑える必要がある。また、ベース台１２内にも発熱する電気回路が設けられているため、ベース台１２内も排気して温度上昇を抑える必要がある。 A first embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the electronic component mounting machine 11 is installed on a base table 12. A plurality of electronic component mounting machines 11 may be installed side by side on one base table 12. Although the configuration inside the housing 13 of the electronic component mounting machine 11 is not shown, the conveyor 13 that transports the circuit board and the components supplied from the feeder are sucked by the suction nozzle and mounted on the circuit board. Each function is provided such as a mounting head to be picked up, an imaging device for picking up an electronic component sucked by the suction nozzle, and an XY robot for moving the mounting head in the XY direction. Since each function of the electronic component mounting machine 11 is provided with a drive source such as a motor, a drive control circuit, and the like, the electronic component mounting machine 11 generates heat by energizing each function during operation. It is necessary to discharge the surrounding air from the housing 13 to suppress the temperature rise in the housing 13. Further, since an electric circuit for generating heat is also provided in the base table 12, it is necessary to exhaust the inside of the base table 12 to suppress the temperature rise.

このような観点から、電子部品実装機１１の筐体１３の背面とベース台１２の背面には、それぞれ筐体１３内の空気とベース台１２内の空気を排出する１個又は複数個のファン装置１５，１６が設けられている。更に、図３に示すように、工場の床面上に複数の電子部品実装機１１をファン装置１５，１６の設置面である背面どうしが隙間をあけて対向するように背面合わせに設置する場合に、ファン装置１５，１６から吹き出される風どうしが真正面から衝突しないように該ファン装置１５，１６が配置されている。   From this point of view, one or a plurality of fans for discharging the air in the housing 13 and the air in the base table 12 on the back surface of the housing 13 and the back surface of the base table 12 of the electronic component mounting machine 11, respectively. Devices 15 and 16 are provided. Further, as shown in FIG. 3, when a plurality of electronic component mounting machines 11 are installed on the floor of a factory so that the backs, which are the installation surfaces of the fan devices 15 and 16, face each other with a gap therebetween. Further, the fan devices 15 and 16 are arranged so that winds blown from the fan devices 15 and 16 do not collide from the front.

具体的には、複数の電子部品実装機１１を背面どうしが隙間をあけて対向するように背面合わせに設置する場合に、ファン装置１５，１６どうしが対向しないように、該ファン装置１５，１６が背面の幅方向の中心からずれた位置に配置されている（図２，図３参照）。   Specifically, when the plurality of electronic component mounting machines 11 are installed so that the back surfaces face each other with a gap therebetween, the fan devices 15 and 16 do not face each other. Is disposed at a position shifted from the center in the width direction of the back surface (see FIGS. 2 and 3).

前述したように、従来の電子部品実装機は、ファン装置が背面の幅方向の中央に設けられているため、２台の電子部品実装機を背面合わせに設置すると、双方の背面に設けたファン装置が真正面に対向して、双方のファン装置から吹き出される風が正面衝突する。これにより、通風抵抗が増大してファン装置のＰＱ特性（図４参照）が悪化して風量が減少し、冷却能力（放熱能力）が低下する。このような冷却能力の低下は、２台の電子部品実装機の背面間の隙間寸法が小さくなるほど顕著に現れるため、必要な冷却能力を確保するには、２台の電子部品実装機の背面間の隙間寸法をある程度大きく確保しなければならず、電子部品実装機をスペース効率良く設置することができなかった。   As described above, in the conventional electronic component mounting machine, since the fan device is provided at the center in the width direction of the rear surface, when two electronic component mounting machines are installed back to back, the fans provided on both rear surfaces The device faces the front and the wind blown from both fan devices collides front. Thereby, ventilation resistance increases, the PQ characteristic (refer FIG. 4) of a fan apparatus deteriorates, an air volume reduces, and cooling capacity (heat dissipation capability) falls. Such a decrease in the cooling capacity becomes more noticeable as the gap between the back surfaces of the two electronic component mounting machines becomes smaller. Therefore, in order to secure the required cooling capacity, the gap between the rear surfaces of the two electronic component mounting machines. The gap size of the electronic component mounting machine had to be secured to some extent, and the electronic component mounting machine could not be installed in a space efficient manner.

その点、本実施例１では、複数の電子部品実装機１１を背面合わせに設置する場合に、図２、図３に示すように、ファン装置１５，１６どうしが対向しないように該ファン装置１５，１６が背面の幅方向の中心からずれた位置に配置されているため、ファン装置１５，１６から吹き出される風どうしが正面衝突しないようにすることができ、ファン装置１５，１６から吹き出される風どうしの衝突による通風抵抗を減少させることができ、ファン装置１５，１６のＰＱ特性の悪化を防ぐことができる。これにより、電子部品実装機１１の背面間の隙間を狭めても、筐体１３内とベース台１２内の冷却（放熱）に必要な風量を確保することができ、複数の電子部品実装機１１をスペース効率良く設置することができる。   In this regard, in the first embodiment, when a plurality of electronic component mounting machines 11 are installed back to back, as shown in FIGS. 2 and 3, the fan devices 15 and 16 do not face each other. , 16 are arranged at positions shifted from the center in the width direction of the back surface, so that the wind blown out from the fan devices 15, 16 can be prevented from colliding head-on and blown out from the fan devices 15, 16. Ventilation resistance due to collision between winds can be reduced, and deterioration of the PQ characteristics of the fan devices 15 and 16 can be prevented. Thereby, even if the gap between the back surfaces of the electronic component mounting machine 11 is narrowed, it is possible to secure an air flow necessary for cooling (heat radiation) in the housing 13 and the base 12, and a plurality of electronic component mounting machines 11. Can be installed efficiently.

図５に示す本発明に関連する参考例としての実施例２では、複数の電子部品実装機１１を背面どうしが隙間をあけて対向するように背面合わせに設置する場合に、ファン装置１５が電子部品実装機１１の背面に対して斜め上向きに傾けられて取り付けられている。この場合、ファン装置１５は電子部品実装機１１の背面の幅方向の中央に設けられている。また、ファン装置１５の向きが斜め上向きとなっているため、電子部品実装機１１の背面のうちのファン装置１５の上側の部分が風をスムーズに上側に案内できるように湾曲状に形成されている。尚、ベース台１２のファン装置１６についても、電子部品実装機１１のファン装置１５と同様に斜め上向きに設置されている。その他の構成は、前記実施例１と同じである。 In Example 2 as a reference example related to the present invention shown in FIG. 5, when a plurality of electronic component mounting machines 11 are installed back to back so that the backs face each other with a gap, the fan device 15 is electronic. The component mounter 11 is attached so as to be inclined obliquely upward with respect to the rear surface. In this case, the fan device 15 is provided at the center in the width direction on the back surface of the electronic component mounting machine 11. Further, since the direction of the fan device 15 is obliquely upward, the upper part of the fan device 15 in the back surface of the electronic component mounting machine 11 is formed in a curved shape so that the wind can be smoothly guided upward. Yes. Note that the fan device 16 of the base 12 is also installed obliquely upward like the fan device 15 of the electronic component mounting machine 11. Other configurations are the same as those of the first embodiment.

以上説明した本実施例２では、複数の電子部品実装機１１を背面合わせに設置する場合に、ファン装置１５が電子部品実装機１１の背面に対して傾けられて設置されているため、ファン装置１５から吹き出される風どうしが正面衝突しないようにすることができる。これにより、前記実施例１と同様に、ファン装置１５から吹き出される風どうしの衝突による通風抵抗を減少させることができるため、電子部品実装機１１の背面間の隙間を狭めても、筐体１３内の冷却（放熱）に必要な風量を確保することができ、複数の電子部品実装機１１をスペース効率良く設置することができる。   In the second embodiment described above, when the plurality of electronic component mounting machines 11 are installed back to back, the fan device 15 is installed to be inclined with respect to the back surface of the electronic component mounting machine 11, so that the fan device It is possible to prevent the winds blown from 15 from colliding head-on. As a result, as in the first embodiment, the ventilation resistance due to the collision between the wind blown out from the fan device 15 can be reduced. Therefore, even if the gap between the back surfaces of the electronic component mounting machine 11 is narrowed, the housing The air volume required for cooling (heat radiation) in the inside 13 can be ensured, and a plurality of electronic component mounting machines 11 can be installed with high space efficiency.

尚、本実施例２では、ファン装置１５の向きを斜め上向きとしたが、斜め横向きとしても良く、要は、ファン装置１５の向きを電子部品実装機１１の背面に対して傾ければ、同様の効果が得られる。また、本実施例２においても、前記実施例１と同様に、ファン装置１５を電子部品実装機１１の背面の幅方向の中心からずれた位置に配置しても良い。このようにすれば、ファン装置１５から吹き出される風どうしの衝突がより一層少なくなり、風量をより一層増加させることができる。   In the second embodiment, the direction of the fan device 15 is obliquely upward. However, the direction may be obliquely lateral. In short, if the direction of the fan device 15 is inclined with respect to the back surface of the electronic component mounting machine 11, the same applies. The effect is obtained. Also in the second embodiment, the fan device 15 may be disposed at a position shifted from the center in the width direction on the back surface of the electronic component mounting machine 11 as in the first embodiment. In this way, the collision between the winds blown from the fan device 15 is further reduced, and the air volume can be further increased.

本発明者の実験結果によれば、ファン装置１５の向きを電子部品実装機１１の背面に対して傾けることで、ほぼ７％の風量増加が得られた。   According to the experiment result of the present inventor, an increase in the air volume of about 7% was obtained by inclining the direction of the fan device 15 with respect to the back surface of the electronic component mounting machine 11.

図６に示す本発明に関連する参考例としての実施例３では、複数の電子部品実装機１１を背面どうしが隙間をあけて対向するように背面合わせに設置する場合に、前記実施例２と同様に、ファン装置１５が電子部品実装機１１の背面に対して斜め上向きに傾けられて取り付けられている。更に、本実施例３では、電子部品実装機１１の背面側に、ファン装置１５から吹き出された風を該電子部品実装機１１の背面に沿った方向に案内する導風板１８が設けられている。その他の構成は、前記実施例１と同じである。 In Example 3 as a reference example related to the present invention shown in FIG. 6, when a plurality of electronic component mounting machines 11 are installed on the back side so that the backs face each other with a gap therebetween, Similarly, the fan device 15 is attached obliquely upward with respect to the back surface of the electronic component mounting machine 11. Furthermore, in the third embodiment, an air guide plate 18 that guides the air blown from the fan device 15 in the direction along the back surface of the electronic component mounting machine 11 is provided on the back side of the electronic component mounting machine 11. Yes. Other configurations are the same as those of the first embodiment.

以上説明した本実施例３では、複数の電子部品実装機１１を背面合わせに設置する場合に、ファン装置１５から吹き出された風を該電子部品実装機１１の背面に沿った方向に案内する導風板１８が設けられているため、ファン装置１５から吹き出される風どうしが正面衝突しないようにすることができる。これにより、前記実施例１と同様に、ファン装置１５から吹き出される風どうしの衝突による通風抵抗を減少させることができるため、電子部品実装機１１の背面間の隙間を狭めても、筐体１３内の冷却（放熱）に必要な風量を確保することができ、複数の電子部品実装機１１をスペース効率良く設置することができる。   In the third embodiment described above, when a plurality of electronic component mounting machines 11 are installed back to back, the air blown from the fan device 15 is guided in a direction along the back surface of the electronic component mounting machine 11. Since the wind plate 18 is provided, the wind blown out from the fan device 15 can be prevented from colliding frontally. As a result, as in the first embodiment, the ventilation resistance due to the collision between the wind blown out from the fan device 15 can be reduced. Therefore, even if the gap between the back surfaces of the electronic component mounting machine 11 is narrowed, the housing The air volume required for cooling (heat radiation) in the inside 13 can be ensured, and a plurality of electronic component mounting machines 11 can be installed with high space efficiency.

本発明者の実験結果によれば、ファン装置１５の向きを電子部品実装機１１の背面に対して傾け、且つ、導風板１８を設けることで、ほぼ１４％の風量増加が得られた。   According to the experiment results of the present inventor, the direction of the fan device 15 is tilted with respect to the back surface of the electronic component mounting machine 11 and the air guide plate 18 is provided.

尚、本実施例３では、ファン装置１５の向きを電子部品実装機１１の背面に対して傾けるようにしたが、ファン装置１５の向きを傾けない構成としても良い。この場合でも、ファン装置１５から吹き出される風どうしが正面衝突することを導風板１８により防止できるため、ファン装置１５から吹き出される風どうしの衝突による通風抵抗を減少させることができる。   In the third embodiment, the direction of the fan device 15 is inclined with respect to the back surface of the electronic component mounting machine 11. However, the fan device 15 may be configured not to be inclined. Even in this case, it is possible to prevent the wind blown from the fan device 15 from colliding with the front by the air guide plate 18, so that the ventilation resistance due to the collision of the wind blown from the fan device 15 can be reduced.

本発明は、上記実施例のような電子部品実装機１１に限定されず、ファン装置を備えた様々な電子機器に適用して実施できる。また、ファン装置の位置も、電子機器（電子部品実装機１１）の背面に限定されず、側面にファン装置が設けられた電子機器にも本発明を適用して実施できる。   The present invention is not limited to the electronic component mounting machine 11 as in the above-described embodiment, and can be applied to various electronic devices provided with a fan device. Further, the position of the fan device is not limited to the back surface of the electronic device (electronic component mounting machine 11), and the present invention can be applied to an electronic device in which the fan device is provided on the side surface.

その他、本発明は、上記実施例１に限定されず、例えば、電子機器の背面や側面に設置するファン装置の位置、傾き角度、傾き方向を適宜変更しても良い等、要旨を逸脱しない範囲内で種々変更して実施できることは言うまでもない。
In addition, the present invention is not limited to the first embodiment. For example, the position, the tilt angle, and the tilt direction of the fan device installed on the back surface or the side surface of the electronic device may be changed as appropriate. Needless to say, various modifications can be made.

１１…電子部品実装機（電子機器）、１２…ベース台、１３…筐体、１５，１６…ファン装置、１８…導風板   DESCRIPTION OF SYMBOLS 11 ... Electronic component mounting machine (electronic device), 12 ... Base stand, 13 ... Housing | casing, 15, 16 ... Fan apparatus, 18 ... Air guide plate

Claims (3)

筐体内の空気を該筐体の外側に向けて吹き出すファン装置が該筐体の背面又は側面に設置された電子機器において、
複数の前記電子機器を前記ファン装置の設置面どうしが隙間をあけて対向するように設置する場合に、前記ファン装置から吹き出される風どうしが正面衝突しないようにするために、前記ファン装置どうしが対向しないように該ファン装置がその設置面の幅方向の中心からずれた位置に配置されていることを特徴とする記載の電子機器。 In an electronic device in which a fan device that blows out air in the housing toward the outside of the housing is installed on the back surface or side surface of the housing,
When installing a plurality of the electronic devices such that the installation surfaces of the fan devices are opposed to each other with a gap , the fan devices are arranged so that the wind blown from the fan devices does not collide head-on. The electronic device according to claim 1, wherein the fan device is disposed at a position shifted from a center of the installation surface in the width direction so as not to face each other. 前記ファン装置から吹き出された風を該ファン装置の設置面に沿った方向に案内する導風板を備えていることを特徴とする請求項１に記載の電子機器。 The electronic apparatus according to claim 1, further comprising an air guide plate that guides the air blown from the fan device in a direction along an installation surface of the fan device. 前記電子機器は電子部品実装機であることを特徴とする請求項１又は２に記載の電子部品実装機。 The electronic device is an electronic component mounting apparatus according to claim 1 or 2, characterized in that an electronic component mounting apparatus.
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