JP6112013B2 - バンプ電極付き半導体装置製造用接着剤シートおよび半導体装置の製造方法 - Google Patents
バンプ電極付き半導体装置製造用接着剤シートおよび半導体装置の製造方法 Download PDFInfo
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- JP6112013B2 JP6112013B2 JP2013528861A JP2013528861A JP6112013B2 JP 6112013 B2 JP6112013 B2 JP 6112013B2 JP 2013528861 A JP2013528861 A JP 2013528861A JP 2013528861 A JP2013528861 A JP 2013528861A JP 6112013 B2 JP6112013 B2 JP 6112013B2
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Description
まず、合成により得られたポリマーの赤外吸収スペクトルを測定し、ポリイミドに起因するイミド構造の吸収ピーク(1780cm−1付近、1377cm−1付近)の存在を確認した。次に、そのポリマーについて、350℃で1時間熱処理した後、再度、赤外吸収スペクトルを測定し、熱処理前と熱処理後の1377cm−1付近のピーク強度を比較した。熱処理後のポリマーのイミド化率を100%として、熱処理前のポリマーのイミド化率を求めた。
水酸化テトラメチルアンモニウムの2.38%水溶液100gに対して、合成したポリイミド粉体が、25℃で0.1g以上溶解したものをアルカリ可溶性と評価し、それ以外をアルカリ不溶性と評価した。
合成したポリイミドをN−メチル−2−ピロリドン(以下、NMPとする)に溶解して固形分濃度0.1重量%の溶液を調整して、測定サンプルとした。下に示す構成のGPC装置Waters2690(Waters(株)製)を用いて、ポリスチレン換算の重量平均分子量を算出した。GPC測定条件は、移動層をLiClとリン酸をそれぞれ濃度0.05mol/Lで溶解したNMPとし、流量を0.4mL/分とした。また、カラムはカラムオーブンを用いて40℃に加温した。
検出器:Waters996
システムコントローラー:Waters2690
カラム:TOSOH TSK−GEL α−4000
カラム:TOSOH TSK−GEL α−2500。
アルカリ可溶性接着剤フィルムのエッチングレートの評価は、以下のようにして行った。各実施例および比較例で作製した接着剤シートから保護フィルムを剥離した後、ベアシリコン基板上に、ラミネート装置((株)名機製作所製、MVLP600)を用いて、熱盤温度80℃、真空引き時間20秒、プレス圧力:0.5MPa、プレス時間60秒の条件でラミネートした。その際、接着剤シートのアルカリ可溶性接着剤フィルムがシリコン基板に接するようにした。
以下の式
エッチングレート(μm/分)=(T1−T2)÷0.5
によってエッチングレートを算出した。
各実施例および比較例で作製した接着剤シートの保護フィルムを剥離し、該剥離面を、Cuピラーハンダバンプ(Cu高さ:20μm、ハンダキャップ高さ:20μm、バンプ径:50μm、バンプピッチ:100μm)が形成されたデイジーチェーンシリコン基板上に、ラミネート装置((株)名機製作所製、MVLP600)を用いて、熱盤温度80℃、真空引き時間20秒、プレス圧力:0.5MPa、プレス時間60秒の条件でラミネートした。
上記のようにして接着剤被膜が形成されたシリコン基板をテープフレームに張られたダイシングテープに固定した。固定は、ウェハマウンター装置(テクノビジョン(株)製、FM−114)を用い、バンプ電極とは反対側のウェハ基板面にダイシングテープ(リンテック(株)製、D−650)を貼り合わせることによって行った。次いで、以下のような切削条件でブレードダイシングを行い、個片の半導体チップ(7.3mm角)を得た。
ダイシング装置:DAD−3350(DISCO(株)製)
半導体チップサイズ:7.5×7.5mm
ブレード:NBC−ZH2040−SE27HDEF
スピンドル回転数:30000rpm
切削速度:25mm/s
切削深さ:ダイシングテープの深さ10μmまで切り込む
カット:ワンパスフルカット
カットモード:ダウンカット
切削水量:3.7L/分
切削水および冷却水:温度23℃、電気伝導度0.5MΩ・cm(超純水に炭酸ガスを注入)。
合成例1
乾燥窒素気流下、2,2−ビス(3−アミノ−4−ヒドロキシフェニル)ヘキサフルオロプロパン(以下、BAHFとする)30.95g(0.0845モル)、および、1,3−ビス(3−アミノプロピル)テトラメチルジシロキサン1.24g(0.005モル)をN−メチル−2−ピロリドン(以下、NMPとする)100gに溶解させた。ここにビス(3,4−ジカルボキシフェニル)エーテル二無水物(以下、ODPAとする)31.02g(0.1モル)をNMP30gとともに加えて、20℃で1時間攪拌し、次いで50℃で4時間攪拌した。ここに、3−アミノフェノール2.5g(0.02モル)を加え、50℃で2時間攪拌後、180℃で5時間攪拌して樹脂溶液を得た。次に、樹脂溶液を水3Lに投入して白色沈殿を得た。この沈殿をろ過で集めて、水で3回洗浄した後、80℃の真空乾燥機で5時間乾燥した。得られた樹脂粉体のイミド化率は94%であり、アルカリ可溶性であった。また、得られた樹脂の重量平均分子量は25600であった。
乾燥窒素気流下、4,4’−ジアミノジフェニルエーテル11.41g(0.057モル)、1,3−ビス(3−アミノプロピル)テトラメチルジシロキサン1.24g(0.005モル)および末端封止剤として、アニリン6.98g(0.075モル)をNMP100gに溶解させた。ここに、ODPA31.02g(0.1モル)をNMP30gとともに加えて、20℃で1時間攪拌し、次いで50℃で4時間攪拌した。その後、キシレンを15g添加し、水をキシレンとともに共沸しながら、180℃で5時間攪拌した。攪拌終了後、溶液を水3Lに投入して白色沈殿を得た。この沈殿をろ過で集めて、水で3回洗浄した後、80℃の真空乾燥機で5時間乾燥した。得られた樹脂粉体のイミド化率は94%でありアルカリ不溶性であった。また、得られた樹脂の重量平均分子量は11000であった。
EP−4000S:PO変性ビスフェノールA型エポキシ(商品名、(株)ADEKA製)
835−LV:ビスフェノールF型エポキシ(商品名、DIC(株)製)
N−865:変性ノボラック型エポキシ(商品名、DIC(株)製)
2MAOK−PW:イミダゾール系硬化促進剤粒子(商品名、四国化成工業(株)製)
HX−3941:マイクロカプセル型硬化促進剤粒子(商品名、旭化成イーマテリアルズ(株)製)
SE−2050KNK:シリカスラリー(商品名、アドマテックス(株)製、平均粒子径0.5μm、球状シリカ、シリカ70重量%のメチルイソブチルケトン分散液)。
(A)成分として合成例1で得られたポリイミド30g、(B)成分としてEP−4000Sが50g、N865が15g、(C)成分として2MAOK−PW 5gおよび(D)成分を含む分散液としてSE−2050−KNKが214g(シリカ粒子の量は214×0.7=150(g))、有機溶剤としてメチルイソブチルケトン19gを調合し、溶媒以外の添加物を固形分として、固形分濃度が75%であるアルカリ可溶性接着剤組成物を得た。得られた接着剤組成物を、コンマロールコーター(塗工機)を用いて、支持体上に塗布し、90℃で10分間乾燥を行って、接着剤シートを得た。支持体としては、EVA/PET(商品名、タカラインコーポレーション(株)製)を用いて、EVA面に接着剤組成物を塗布した。EVA/PETは、軟質フィルムである厚さ30μmのEVAフィルムと、硬質フィルムである厚さ75μmのPETフィルムが積層された軟質層付支持体であり、EVAとPETを合わせた厚みは105μmである。乾燥後のアルカリ可溶性接着剤フィルムの厚みは30μmとした。アルカリ可溶性接着剤フィルムの上に、保護フィルムとして厚さ25μmのポリエチレンテレフタレートフィルムSR−1(商品名、大槻工業(株)製)をラミネートし、保護フィルム付き接着剤シートを得た。得られた接着剤シートを用いて、前記のように、バンプトップの観察および信頼性試験を実施した。結果を表2に示す。
軟質層付支持体の厚みおよび(A)〜(D)成分の配合量を表1に記載のように変更した以外は実施例1と同様にして、接着剤シートを作製し、バンプトップの観察および信頼性試験を行った。結果を表2に示す。
軟質層付支持体にPE/PET(商品名、フジモリ産業(株)製)を用い、PE面に接着剤組成物を塗布した以外は実施例1と同様にして、接着剤シートを作製し、バンプトップの観察および信頼性試験を行った。結果を表2に示す。なお、PE/PETは軟質フィルムである厚さ50μmのPEフィルムと、硬質フィルムである厚さ75μmのPETフィルムが積層された軟質層付支持体であり、PEとPETを合わせた厚みは125μmである。
合成例1のポリイミドの代わりに合成例2のポリイミドを用いた以外は実施例1と同様にして、接着剤シートを作製し、バンプトップの観察および信頼性試験を行った。結果を表2に示す。
軟質層付支持体の代わりにPETのみからなる支持体を用いた以外は実施例1と同様にして、接着剤シートを作製し、バンプトップの観察および信頼性試験を行った。結果を表2に示す。
101 銅ピラー
102 ハンダバンプ
103 アルカリ可溶性接着剤フィルム
104 軟質フィルム
105 バンプトップ上に残存したアルカリ可溶性接着剤
Claims (8)
- 40〜80℃において、1〜300MPaの引張り弾性率を有する軟質フィルム上にアルカリ可溶性接着剤フィルムが形成された接着剤シートであって、前記アルカリ可溶性接着剤フィルムが、(A)アルカリ可溶性樹脂、(B)エポキシ化合物、(C)硬化促進剤および(D)無機粒子を含有し、該(D)無機粒子の含有量が、溶剤および無機粒子を除いたアルカリ可溶性接着剤フィルムの有機物全量100重量部に対し、40重量部以上、400重量部以下であるバンプ電極付き半導体装置製造用接着剤シート。
- 前記軟質フィルムが、ポリエチレンフィルムまたはエチレン酢酸ビニル共重合体フィルムである請求項1に記載のバンプ電極付き半導体装置製造用接着剤シート。
- 前記(A)アルカリ可溶性樹脂がアルカリ可溶性ポリイミドである請求項1に記載のバンプ電極付き半導体装置製造用接着剤シート。
- 前記アルカリ可溶性ポリイミドが下記一般式(1)で表される構造単位を有し、かつ主鎖末端の少なくとも一方に下記一般式(2)および/または(3)で表される構造を有する請求項3に記載のバンプ電極付き半導体装置製造用接着剤シート:
- 前記アルカリ可溶性ポリイミドがフェノール性水酸基を含有する請求項3または4に記載のバンプ電極付き半導体装置製造用接着剤シート。
- 前記アルカリ可溶性接着剤フィルムの、23℃の水酸化テトラメチルアンモニウム2.38%水溶液に対するエッチングレートが、0.5〜100μm/分である請求項1〜5のいずれかに記載のバンプ電極付き半導体装置製造用接着剤シート。
- バンプ電極を有する第一の回路部材のバンプ電極面に、請求項1〜6のいずれかに記載のバンプ電極付き半導体装置製造用接着剤シートのアルカリ可溶性接着剤フィルム側の面を貼り合わせる工程、
該接着剤シートのアルカリ可溶性接着剤フィルムのみを前記回路部材上に残し、該接着剤シートに含まれる他のフィルムを剥離する工程、
該アルカリ可溶性接着剤フィルムをアルカリ水溶液でエッチングしてバンプ電極上の該接着剤を除去する工程、および、
加熱加圧により前記第一の回路部材とパッド電極を有する第二の回路部材を電気的に接続する工程をこの順に有する半導体装置の製造方法。 - 前記アルカリ可溶性接着剤フィルムをエッチングする工程におけるエッチングレートが、0.5〜100μm/分である請求項7に記載の半導体装置の製造方法。
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