JP6108285B2 - 電子デバイスの製造方法 - Google Patents
電子デバイスの製造方法 Download PDFInfo
- Publication number
- JP6108285B2 JP6108285B2 JP2012140519A JP2012140519A JP6108285B2 JP 6108285 B2 JP6108285 B2 JP 6108285B2 JP 2012140519 A JP2012140519 A JP 2012140519A JP 2012140519 A JP2012140519 A JP 2012140519A JP 6108285 B2 JP6108285 B2 JP 6108285B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- sealing material
- sealing
- electronic device
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 35
- 239000011521 glass Substances 0.000 claims description 205
- 239000003566 sealing material Substances 0.000 claims description 99
- 238000007789 sealing Methods 0.000 claims description 92
- 239000000843 powder Substances 0.000 claims description 80
- 239000000758 substrate Substances 0.000 claims description 54
- 239000010410 layer Substances 0.000 claims description 44
- 239000000049 pigment Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 24
- 239000011247 coating layer Substances 0.000 claims description 19
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 17
- 239000012298 atmosphere Substances 0.000 claims description 17
- 239000011230 binding agent Substances 0.000 claims description 17
- 239000000945 filler Substances 0.000 claims description 17
- 238000010304 firing Methods 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 229910020599 Co 3 O 4 Inorganic materials 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 229910052596 spinel Inorganic materials 0.000 claims description 3
- 239000011029 spinel Substances 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 2
- 239000002245 particle Substances 0.000 description 36
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 29
- 239000007789 gas Substances 0.000 description 25
- 238000002844 melting Methods 0.000 description 23
- 230000008018 melting Effects 0.000 description 23
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- 239000010408 film Substances 0.000 description 15
- 238000004031 devitrification Methods 0.000 description 12
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 12
- 230000001105 regulatory effect Effects 0.000 description 11
- 230000009477 glass transition Effects 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 239000012299 nitrogen atmosphere Substances 0.000 description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- 238000004455 differential thermal analysis Methods 0.000 description 7
- 230000001771 impaired effect Effects 0.000 description 7
- 230000031700 light absorption Effects 0.000 description 7
- -1 polyethylene carbonate Polymers 0.000 description 7
- ZUAURMBNZUCEAF-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethanol Chemical compound OCCOCCOC1=CC=CC=C1 ZUAURMBNZUCEAF-UHFFFAOYSA-N 0.000 description 6
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 6
- CUZKCNWZBXLAJX-UHFFFAOYSA-N 2-phenylmethoxyethanol Chemical compound OCCOCC1=CC=CC=C1 CUZKCNWZBXLAJX-UHFFFAOYSA-N 0.000 description 6
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 5
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 239000011164 primary particle Substances 0.000 description 5
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 5
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 5
- 229910018068 Li 2 O Inorganic materials 0.000 description 4
- 241000519995 Stachys sylvatica Species 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 229910052878 cordierite Inorganic materials 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 4
- 238000007561 laser diffraction method Methods 0.000 description 4
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- 229910001887 tin oxide Inorganic materials 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 230000004075 alteration Effects 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000007496 glass forming Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 229910000314 transition metal oxide Inorganic materials 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000006060 molten glass Substances 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 208000013201 Stress fracture Diseases 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- OJLGWNFZMTVNCX-UHFFFAOYSA-N dioxido(dioxo)tungsten;zirconium(4+) Chemical compound [Zr+4].[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O OJLGWNFZMTVNCX-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000379 polypropylene carbonate Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- 229910000500 β-quartz Inorganic materials 0.000 description 1
- 229910052644 β-spodumene Inorganic materials 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
- Joining Of Glass To Other Materials (AREA)
- Glass Compositions (AREA)
Description
A:Li、Na、K、Mg、Ca、Sr、Ba、Zn、Cu、Ni、Mn等
B:Zr、Ti、Sn、Nb、Al、Sc、Y等
M:P、Si、W、Mo等
若しくはこれらの固溶体が使用可能である。
Claims (10)
- レーザー封着により電子デバイスを製造する方法において、
(1)ガラス基板を用意する工程と、
(2)ガラス粉末を含む封着材料と、有機バインダーを含むビークルとを混合して、封
着材料ペーストを作製する工程と、
(3)前記ガラス基板に前記封着材料ペーストを塗布して、塗布層を形成する工程と、
(4)前記塗布層を焼成して、封着材料層付きガラス基板を得る工程と、
(5)前記封着材料層を介して、前記封着材料層付きガラス基板と、封着材料層が形成
されていないガラス基板とを重ね合わせる工程と、
(6)レーザー封着温度が焼成温度以下になるように、レーザー光を照射して、前記封
着材料層付きガラス基板と、前記封着材料層が形成されていないガラス基板とを気密封着
する工程とを備えることを特徴とする電子デバイスの製造方法。 - 前記レーザー封着温度が500℃以下であることを特徴とする請求項1に記載の電子デ
バイスの製造方法。 - 前記封着材料が、ガラス粉末を含む無機粉末 97.5〜100質量%と、顔料 0〜
2.5質量%とを含有することを特徴とする請求項1又は2に記載の電子デバイスの製造
方法。 - 前記ガラス粉末が、ガラス組成として、下記酸化物換算のモル%で、SnO 35〜7
0%、P2O5 10〜30%を含有することを特徴とする請求項1〜3の何れか一項に
記載の電子デバイスの製造方法。 - 前記ガラス粉末が、ガラス組成として、下記酸化物換算のモル%で、Bi2O3 20
〜60%、B2O3 10〜35%、ZnO 5〜40%、CuO+Fe2O3 5〜3
0%を含有することを特徴とする請求項1〜3の何れか一項に記載の電子デバイスの製造
方法。 - 前記顔料が、C(カーボン)、Co3O4、CuO、Cr2O3、Fe2O3、MnO
2、SnO、TinO2n−1(nは整数)、スピネル系複合酸化物から選ばれる一種又
は二種以上であることを特徴とする請求項1〜5の何れか一項に記載の電子デバイスの製
造方法。 - 前記無機粉末が、更に耐火性フィラーを0.1〜60体積%を含むことを特徴とする請
求項1〜6の何れか一項に記載の電子デバイスの製造方法。 - 前記電子デバイスが、有機ELデバイスであることを特徴とする請求項1〜7の何れか
一項に記載の電子デバイスの製造方法。 - 前記有機バインダーが、脂肪族ポリオレフィン系カーボネートであることを特徴とする
請求項1〜8の何れか一項に記載の電子デバイスの製造方法。 - 前記塗布層の焼成を不活性雰囲気で行うことを特徴とする請求項1〜9の何れか一項に
記載の電子デバイスの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012140519A JP6108285B2 (ja) | 2011-08-21 | 2012-06-22 | 電子デバイスの製造方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011180030 | 2011-08-21 | ||
JP2011180030 | 2011-08-21 | ||
JP2012140519A JP6108285B2 (ja) | 2011-08-21 | 2012-06-22 | 電子デバイスの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013062231A JP2013062231A (ja) | 2013-04-04 |
JP6108285B2 true JP6108285B2 (ja) | 2017-04-05 |
Family
ID=48186704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012140519A Expired - Fee Related JP6108285B2 (ja) | 2011-08-21 | 2012-06-22 | 電子デバイスの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6108285B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10358379B2 (en) | 2013-12-11 | 2019-07-23 | Hitachi Chemical Company, Ltd. | Heat-insulating member, low-melting glass composition, and sealing material paste |
CN115305035A (zh) * | 2021-05-08 | 2022-11-08 | 深圳市首骋新材料科技有限公司 | 用于oled密封的玻璃胶、oled元件的封装方法、oled器件 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4900868B2 (ja) * | 2004-12-14 | 2012-03-21 | 日本電気硝子株式会社 | タブレット一体型排気管 |
JP5178204B2 (ja) * | 2005-12-06 | 2013-04-10 | コーニング インコーポレイテッド | フリットで密封されたガラスパッケージおよびその製造方法 |
JP2008166197A (ja) * | 2006-12-28 | 2008-07-17 | Univ Of Tokyo | パネル体の製造方法 |
JP5224102B2 (ja) * | 2008-03-26 | 2013-07-03 | 日本電気硝子株式会社 | 有機elディスプレイ用封着材料 |
JP2010228998A (ja) * | 2009-03-27 | 2010-10-14 | Asahi Glass Co Ltd | 封着材料層付きガラス部材とそれを用いた電子デバイスおよびその製造方法 |
-
2012
- 2012-06-22 JP JP2012140519A patent/JP6108285B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2013062231A (ja) | 2013-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9469562B2 (en) | Glass substrate with sealing material layer, organic EL device using same, and manufacturing method for electronic device | |
KR102200849B1 (ko) | 봉착 재료 | |
WO2011122218A1 (ja) | 封着材料及びこれを用いたペースト材料 | |
JP5224102B2 (ja) | 有機elディスプレイ用封着材料 | |
JP5500079B2 (ja) | 封着材料層付きガラス部材とその製造方法、および電子デバイスとその製造方法 | |
JP6269991B2 (ja) | 封着材料層付きガラス基板 | |
CN111302629B (zh) | 玻璃组合物、玻璃粉末、封接材料、玻璃糊、封接方法、封接封装体和有机电致发光元件 | |
JP6075715B2 (ja) | ビスマス系ガラス及びこれを用いた封着材料 | |
JP5994438B2 (ja) | 封着材料層付きガラス基板の製造方法 | |
CN113745427A (zh) | 密封的封装体和有机电致发光器件 | |
JP6108285B2 (ja) | 電子デバイスの製造方法 | |
JP6079011B2 (ja) | 封着材料層付きガラス基板の製造方法 | |
JP6090703B2 (ja) | 複合封着材料 | |
JP2011225426A (ja) | 封着材料及びこれを用いたペースト材料 | |
JP2019151539A (ja) | ガラス粉末及びそれを用いた封着材料 | |
JP5874250B2 (ja) | レーザ封着用封着材料層付きガラス基板の製造方法 | |
JP6075599B2 (ja) | 封着材料層付きガラス基板の製造方法 | |
JP5489061B2 (ja) | フィラー粉末およびこれを用いた封着材料 | |
JP2018062446A (ja) | ビスマス系ガラス、ビスマス系ガラスの製造方法及び封着材料 | |
JP2012106900A (ja) | 封着材料及びこれを用いたペースト材料 | |
KR102427006B1 (ko) | 비스무트계 유리, 비스무트계 유리의 제조 방법 및 봉착 재료 | |
JP2024019999A (ja) | ガラス組成物、ガラスペースト、封着パッケージおよび有機エレクトロルミネセンス素子 | |
JP6156675B2 (ja) | ガラスパッケージの製造方法 | |
JP2012254906A (ja) | 封着材料層付きガラス基板の製造方法 | |
JP2012162441A (ja) | 封着材料及びこれを用いたペースト材料 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150508 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160322 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160425 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160912 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160914 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170213 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170226 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6108285 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |